CN113407017A - Control method of semiconductor heat sink, semiconductor heat sink and storage medium - Google Patents
Control method of semiconductor heat sink, semiconductor heat sink and storage medium Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005057 refrigeration Methods 0.000 claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 claims abstract description 43
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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Abstract
The invention discloses a control method of a semiconductor heat dissipation device, the semiconductor heat dissipation device and a storage medium, and belongs to the field of heat dissipation. The method comprises the following steps: presetting an input duty ratio curve and an output duty ratio curve, and acquiring a dew point temperature; the method comprises the steps of obtaining cold end temperature, comparing the cold end temperature with dew point temperature, reducing PWM (pulse width modulation) of the semiconductor refrigeration sheet and PWM (pulse width modulation) of a fan if the cold end temperature is lower than the dew point temperature, obtaining input duty ratio if the cold end temperature is higher than the dew point temperature, and obtaining the PWM of the fan and the PWM of the semiconductor refrigeration sheet through the relation between the input duty ratio and an output duty ratio curve. The invention solves the problems that the cold end of the semiconductor refrigeration piece is easy to condense and dew, the fan has high noise but poor heat dissipation performance, and the fan and the semiconductor refrigeration piece can not work well in a coordinated manner, so that the noise is high or the energy consumption is caused in the prior art.
Description
Technical Field
The invention belongs to the field of semiconductor heat dissipation, and particularly relates to a control method of a semiconductor heat dissipation device applied to CPU heat dissipation, the semiconductor heat dissipation device and a storage medium.
Background
In the information society, people have higher and higher requirements on the use of computers, the temperature is continuously increased along with the increase of the power consumption of a CPU (central processing unit), a large amount of heat can be generated, if the heat is not timely dissipated, the operation of the computers is unstable, the computers are halted if the heat is not timely dissipated, and the CPU is possibly burnt out if the heat is not timely dissipated. The existing mainstream heat dissipation solution is air-cooled heat dissipation and water-cooled heat dissipation, the heat dissipation effect of the air-cooled heat dissipation device is poor, the noise is large, the heat dissipation effect of the water-cooled heat dissipation device is good, but the structure is complex, once the leakage problem occurs, the CPU can be damaged, the heat-clearing capacity of the CPU in the two current schemes is already reached to a certain technical bottleneck, the heat-clearing capacity is greatly improved difficultly, and the CPU at a higher temperature cannot be well adapted.
In the prior art, the thermoelectric effect of a semiconductor is utilized, the heat dissipation performance is enhanced by adding a semiconductor refrigerating sheet on a conventional radiator, and the cold end of the semiconductor heat dissipation device is tightly attached to a heating source to relieve the heat of the heating source.
The cold end of a semiconductor refrigeration piece of the existing semiconductor heat dissipation device is tightly attached to a heating source, when the semiconductor refrigeration piece operates, the temperature of the cold end is reduced to be lower than dew point temperature to separate out water drops, and the water drops easily drop on the heating source or components near the heating source to cause short circuit of a circuit board, so that the semiconductor refrigeration piece is difficult to be applied to heating electronic components such as a CPU (central processing unit) or a GPU (graphic processing unit).
In the prior art, the fan and the semiconductor refrigerating sheet cannot give consideration to high heat dissipation performance, low noise or other personalized requirements by self-defining the rotating speed of the fan and the refrigerating power of the semiconductor refrigerating sheet according to the heating power.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a control method of a semiconductor cooling device, the semiconductor cooling device and a storage medium, which solve the problems that in the prior art, the cold end of a semiconductor refrigeration piece is easy to condense and dew, the noise of a fan is high but the cooling performance is poor, and the fan and the semiconductor refrigeration piece cannot work well in a coordinated manner, so that the noise is high or the energy consumption is caused.
In order to achieve the above object, the present invention provides a method for controlling a semiconductor heat sink, comprising:
presetting an input duty ratio curve and an output duty ratio curve, and acquiring a dew point temperature;
the method comprises the steps of obtaining cold end temperature, comparing the cold end temperature with dew point temperature, reducing PWM (pulse width modulation) of the semiconductor refrigeration sheet and PWM (pulse width modulation) of a fan if the cold end temperature is lower than the dew point temperature, obtaining input duty ratio if the cold end temperature is higher than the dew point temperature, and obtaining the PWM of the fan and the PWM of the semiconductor refrigeration sheet through the relation between the input duty ratio and an output duty ratio curve.
Further, the input duty ratio is the collected fan PWM, and the output duty ratio comprises the fan PWM and the semiconductor refrigeration piece PWM.
Further, the input duty ratio curve and the output duty ratio curve comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor refrigeration piece PWM curve.
Further, three operating modes are included: mode one, mode two and mode three;
the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the first mode are lower than those in the second mode; and the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the second mode are lower than those in the third mode.
Further, the fan PWM and the semiconductor refrigeration sheet PWM in the third mode are both 100%.
Further, the input duty cycle and output duty cycle curves include an input duty cycle and output duty cycle curve in mode one and an input duty cycle and output duty cycle curve in mode two.
Further, the dew point temperature is calculated by collecting the ambient temperature and the ambient humidity in real time.
The invention also provides a semiconductor heat dissipation device which comprises a temperature and humidity acquisition module, a PWM control module and an MCU, wherein the temperature and humidity acquisition module and the PWM control module are respectively connected with the MCU;
the temperature and humidity acquisition module is used for acquiring the temperature of the cold end and the ambient temperature and humidity and sending the acquired data to the MCU;
the PWM control module comprises a PWM acquisition module, a data storage module and a PWM output module; the PWM acquisition module is used for acquiring an input duty ratio; the data storage module is used for storing preset input duty ratio and output duty ratio curves; the PWM output module is used for controlling the output of the fan PWM and the semiconductor refrigerating sheet PWM;
the MCU is used for acquiring the dew point temperature according to the data of the temperature and humidity acquisition module and comparing the dew point temperature with the cold end temperature; if the temperature of the cold end is lower than the dew point temperature, sending a command for reducing the PWM of the semiconductor refrigeration sheet and the PWM of the fan to the PWM output module; and if the temperature of the cold end is higher than the dew point temperature, calculating the PWM of the fan and the PWM of the semiconductor refrigeration sheet according to the input duty ratio and the output duty curve, and sending a calculation result to the PWM output module.
Further, the input duty ratio is the collected fan PWM, and the output duty ratio comprises the fan PWM and the semiconductor refrigeration piece PWM.
Further, the input duty ratio curve and the output duty ratio curve comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor refrigeration piece PWM curve.
Further, the device also comprises a button used for switching among three working modes of a mode I, a mode II and a mode III;
the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the first mode are lower than those in the second mode; and the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the second mode are lower than those in the third mode.
Further, the fan PWM and the semiconductor refrigeration sheet PWM in the third mode are both 100%.
Further, the input duty cycle and output duty cycle curves include an input duty cycle and output duty cycle curve in mode one and an input duty cycle and output duty cycle curve in mode two.
Further, humiture collection module still is used for gathering ambient temperature and ambient humidity in real time, MCU can calculate dew point temperature according to ambient temperature and ambient humidity.
Furthermore, the cooling system further comprises a fan and a semiconductor refrigeration piece, wherein the fan is arranged on the side edge of the CPU and used for blowing air to the lateral direction of the CPU, and the cold end of the semiconductor refrigeration piece is arranged to absorb heat emitted by the CPU.
The present invention also provides a storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the control method according to the semiconductor heat dissipating apparatus described above.
The control method of the semiconductor heat dissipation device, the semiconductor heat dissipation device and the storage medium provided by the invention have the following beneficial effects:
1. according to the invention, the power of the radiator is controlled, and the temperature of the cold end of the semiconductor refrigeration sheet is controlled to be above the dew point temperature, so that the cold end of the semiconductor refrigeration sheet does not frost and dew, and the normal work and operation of a heat dissipation system are ensured.
2. The invention can automatically control the power of the radiator in real time, so that the radiator has low noise and the heat radiation performance meets the heat removal requirement of electronic components.
3. The invention is provided with three working modes, can provide personalized selection modes for users, and is suitable for more scenes.
Drawings
Fig. 1 is a flowchart of a method for controlling a semiconductor heat dissipation device according to the present invention.
Fig. 2 is a schematic view of a semiconductor heat dissipation device of the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in fig. 1, a method for controlling a semiconductor heat dissipation device controls heat dissipation by controlling a fan PWM (Pulse width modulation) and a semiconductor cooling fin PWM. The semiconductor refrigerating sheet utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials (an N-type semiconductor material and a P-type semiconductor material) in series, heat can be absorbed and released at two ends of the couple respectively, the purpose of refrigeration can be realized, one end of the couple for absorbing heat is a cold end, and one end of the couple for releasing heat is a hot end.
The method specifically comprises the following steps:
s1: presetting an input duty ratio and an output duty ratio curve, wherein the input duty ratio can be acquired fan PWM which can be acquired from a mainboard; the output duty cycle comprises a fan PWM and a semiconductor chilling plate PWM, and therefore, the curve can comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor chilling plate PWM curve. Through the curve, the relation between the collected fan PWM and the actually output fan PWM and the semiconductor refrigerating sheet PWM can be established, and then the frequency conversion control of the semiconductor heat dissipation device is realized.
Generally, the fan speed changes with the temperature change of the CPU when the computer is running, the fan speed increases when the CPU temperature increases, and the fan speed decreases when the CPU temperature decreases, which is called fan PWM control, and the stored CPU temperature-PWM curve relationship can be seen in the BIOS (Basic Input Output System). Through the mode, a temperature sensor does not need to be arranged on the CPU, and because the bottom of the radiator needs to be grooved, the process requirement is high, and the cost is increased.
S2: and collecting the ambient temperature and the ambient humidity in real time in unit time, and calculating the dew point temperature.
Wherein, the calculation formula of the dew point temperature is as follows:
wherein T is the ambient temperature, TdDew point temperature, T and TdHas a unit of DEG CRH is the ambient humidity; a is 17.27 and b is 237.7 ℃.
S3: collecting cold end temperature of a semiconductor of the heat dissipation device, comparing the cold end temperature with dew point temperature, if the cold end temperature is lower than the dew point temperature, performing step S4, and if the cold end temperature is higher than the dew point temperature, performing step S5.
S4: and reducing the PWM of the semiconductor refrigerating sheet and the PWM of the fan, so that the temperature of the cold end is higher than the dew point temperature.
S5: acquiring an input duty ratio, calculating according to the relationship between the input duty ratio and the output duty ratio curve in the step S1 to obtain an output duty ratio, specifically, acquiring fan PWM from a mainboard, contrasting the acquired fan PWM-fan PWM curve and the acquired fan PWM-semiconductor refrigeration piece PWM curve to obtain corresponding fan PWM and semiconductor refrigeration piece PWM, further controlling the rotating speed of the fan and the power of the semiconductor refrigeration piece, and preventing the temperature of a cold end from being lower than the dew point temperature.
In the embodiment of the present invention, the PWM is in the form of a duty ratio of the collected/actually output power and the total power, for example, a PWM of 20% for the fan means that the power of the fan is 20% of the total power of the fan.
Furthermore, in an embodiment of the present invention, three modes may be included according to the selection of the user: mode one, mode two and mode three. The three working modes can be switched through keys and also can be switched through instructions of an upper computer. In these three modes, the input duty cycle and the output duty cycle curves preset in step S1 are not the same.
The first mode is as follows: the input duty ratio and the output duty ratio curve in the mode are curves obtained by acquiring PWM signals through experiments under the condition that the fan can meet the heat dissipation requirements of the semiconductor refrigeration piece and the CPU (including the acquired fan PWM-fan PWM curve and the acquired fan PWM-semiconductor refrigeration piece PWM curve). Under the curve, the output power of the semiconductor refrigerating sheet is lower, the rotating speed of the fan is lower, and the mute energy-saving effect is achieved on the premise of sacrificing the heat dissipation performance.
And a second mode: under the curve, the output power of the semiconductor refrigerating sheet is moderate, the rotating speed of the fan is moderate (both are higher than the PWM of the semiconductor refrigerating sheet and the PWM of the fan under the first mode), so that the temperature of a CPU is maintained in a range (not higher than the ambient temperature by 30 ℃), the noise is low, and the heat dissipation performance is good.
And a third mode: the input duty ratio and the output duty ratio curve in this mode are constant value curves, and no matter what the CPU temperature is, the highest output of the fan PWM and the semiconductor cooling sheet PWM (both higher than the semiconductor cooling sheet PWM and the fan PWM in the first mode and the second mode) is always maintained in step S5, and the full power mode is adopted, that is, the fan PWM and the semiconductor cooling sheet PWM are both 100%, so that the heat dissipation performance is the best.
In actual use, the temperature of the CPU can be obtained by collecting the PWM of the fan and contrasting the curve relation of the temperature of the CPU and the PWM of the fan, and the output duty ratio can be calculated by the MCU to obtain the corresponding output PWM, which is specifically divided into the actually output PWM of the fan and the actually output PWM of the semiconductor refrigerating sheet.
In one embodiment of the present invention, the input duty cycle and the output duty cycle curves preset in step S1 are exemplified as follows:
in the mode:
the collected fan PWM-actual output fan PWM curve is as follows:
wherein, x is the collected fan PWM, and y is the actually output fan PWM.
The collected PWM-actual output PWM curve of the fan is as follows:
wherein, x is the collected fan PWM, and y is the semiconductor refrigeration piece PWM of actual output.
Therefore, in the mode, the automatic control of the frequency conversion for the temperature of the CPU can be realized through the curve.
In mode two:
the collected fan PWM-actual output fan PWM curve is as follows:
wherein, x is the collected fan PWM, and y is the actually output fan PWM.
The collected PWM-actual output PWM curve of the fan is as follows:
wherein, x is the collected fan PWM, and y is the semiconductor refrigeration piece PWM of actual output.
Therefore, in the second mode, the automatic control of the frequency conversion of the CPU temperature can be realized through the curve.
In mode three:
no matter how many fan PWM that gather is, the fan PWM of actual output and the semiconductor refrigeration piece PWM of actual output are 100%, and heat dispersion is the best.
The method can monitor the dew point temperature of the heat dissipation equipment and the cold end temperature of the semiconductor refrigeration piece in real time through the steps, compares the dew point temperature with the cold end temperature, calculates the output fan PWM and the semiconductor refrigeration piece PWM through the MCU according to the collected fan PWM when the cold end temperature is higher than the dew point temperature, and performs variable frequency control on the rotating speed of the fan and the power of the semiconductor refrigeration piece.
As shown in fig. 2, an embodiment of the present invention further provides a semiconductor heat dissipation device using the above method, which is disposed on a CPU and includes a fan 100 and a semiconductor cooling plate 200 for dissipating heat from the CPU. In the embodiment shown in fig. 2, 2 fans 100 and 1 semiconductor refrigeration sheet 200 are adopted, wherein the fans 100 are disposed on the side of the CPU for blowing air to the side of the CPU, and the cold end of the semiconductor refrigeration sheet 200 is disposed to absorb heat dissipated by the CPU, specifically, the cold end of the semiconductor refrigeration sheet may be connected to the CPU through a cold conducting component for absorbing heat of the CPU, and the hot end of the semiconductor refrigeration sheet is connected to a heat absorbing component for dissipating heat.
The semiconductor heat sink further includes: the power supply module 300, the temperature and humidity acquisition module 400, the PWM (Pulse width modulation) control module 500 and the MCU (micro controller Unit) 600 are disposed on the PCB, and the power supply module 300, the temperature and humidity acquisition module 400 and the PWM control module 500 are connected to the MCU 600 respectively.
The power supply module 300: and the SATA 15pin port is connected with a case power supply and used for supplying power to the PCB of the radiator. The PCB is further provided with a fan power supply port and a semiconductor refrigeration piece power supply port, and the fan power supply port and the semiconductor refrigeration piece power supply port are used for supplying power to the fan and the semiconductor refrigeration piece.
Temperature and humidity acquisition module 400: including 1 SHT31 temperature and humidity sensor and 1K type thermocouple temperature sensor, be used for gathering ambient temperature humidity and semiconductor refrigeration piece's cold junction temperature respectively to data transmission to MCU that will gather. The K-type thermocouple temperature sensor is arranged at the cold end of the semiconductor refrigerating sheet and used for collecting and monitoring the temperature of the cold end; the temperature and humidity sensor is used for collecting the ambient temperature and the ambient humidity so as to calculate the dew point temperature.
The PWM control module 500 includes a PWM acquisition module 501, a data storage module 502, and a PWM output module 503, wherein the PWM control module 500 is connected to the MCU.
The PWM acquisition module 501: for collecting the input duty cycle, i.e. collecting the fan PWM. Generally, when a computer operates, the rotation speed of a fan changes along with the temperature change of a CPU, when the temperature of the CPU increases, the rotation speed of the fan increases, and when the temperature of the CPU decreases, the rotation speed of the fan decreases, which is called fan PWM control, and a stored relationship between the CPU temperature and the PWM curve can be seen in a BIOS (Basic Input Output System), so that the CPU temperature at that time can be obtained by collecting a fan PWM signal through a PWM collection module 201.
The data storage module 502: an AT24C02 storage chip is adopted for storing preset input duty ratio and output duty ratio curves, and the curves are obtained through experiments and approximate to the relationship between the CPU temperature and the fan PWM and the semiconductor refrigeration chip PWM. The input duty ratio curve and the output duty ratio curve comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor refrigeration piece PWM curve. In one embodiment of the present invention, the semiconductor heat dissipation device includes three modes: mode one, mode two and mode three. In these three modes, the input duty cycle and the output duty cycle stored in the data storage module 502 are not the same.
The PWM output module 503: and receiving an instruction of the MCU, controlling the output of the fan PWM and the semiconductor refrigerating sheet PWM, and further controlling the output power of the semiconductor refrigerating sheet and the rotating speed of the fan through the power supply module.
The MCU 600: and the cold end temperature is compared with the dew point temperature acquired by the K-type thermocouple temperature sensor. When the temperature of the cold end is lower than the dew point temperature, the output power of the fan and the semiconductor refrigerating sheet is limited, and the risk of condensation is avoided; when the temperature of the cold end is higher than the dew point temperature, the input duty ratio and the output duty ratio stored by the data storage module are read for calculation according to the input duty ratio acquired by the PWM acquisition module to obtain the corresponding PWM of the fan and the PWM of the semiconductor refrigeration piece, and the rotating speed of the fan and the power of the semiconductor refrigeration piece are controlled by the PWM output module.
In an embodiment of the present invention, the semiconductor heat sink may further include a button 700 disposed on the PCB for a user to switch between three operation modes, i.e., a mode one, a mode two and a mode three. In addition, the invention can also adopt an upper computer to control the working mode to be switched among the mode one, the mode two and the mode three.
In an embodiment of the present invention, the semiconductor heat dissipation device is further provided with an interface, which is used for connecting with a motherboard of a computer, an upper computer, and other devices, and sending the acquired information to the upper computer for testing, regulating, and the like.
Based on the same inventive concept, an embodiment of the present invention further provides a non-transitory computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the control method of the semiconductor heat dissipation device according to the above embodiment.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The invention is explained in detail herein using specific examples, and the above description of the embodiments is only used to help understanding the core idea of the invention. It should be understood that any obvious modifications, equivalents and other improvements made by those skilled in the art without departing from the spirit of the present invention are included in the scope of the present invention.
Claims (16)
1. A control method of a semiconductor heat dissipation device is characterized by comprising the following steps:
presetting an input duty ratio curve and an output duty ratio curve, and acquiring a dew point temperature;
the method comprises the steps of obtaining cold end temperature, comparing the cold end temperature with dew point temperature, reducing PWM (pulse width modulation) of the semiconductor refrigeration sheet and PWM (pulse width modulation) of a fan if the cold end temperature is lower than the dew point temperature, obtaining input duty ratio if the cold end temperature is higher than the dew point temperature, and obtaining the PWM of the fan and the PWM of the semiconductor refrigeration sheet through the relation between the input duty ratio and an output duty ratio curve.
2. The method for controlling the semiconductor cooling device according to claim 1, wherein the input duty ratio is the collected fan PWM, and the output duty ratio comprises the fan PWM and the semiconductor cooling plate PWM.
3. The method for controlling the semiconductor cooling device according to claim 2, wherein the input duty cycle curve and the output duty cycle curve comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor cooling fin PWM curve.
4. The method for controlling a semiconductor heat sink according to claim 1, comprising three operation modes: mode one, mode two and mode three;
the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the first mode are lower than those in the second mode; and the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the second mode are lower than those in the third mode.
5. The method for controlling the semiconductor cooling device according to claim 4, wherein the fan PWM and the semiconductor cooling plate PWM in the mode three are both 100%.
6. The method of claim 4, wherein the input duty cycle and output duty cycle curve comprises an input duty cycle and output duty cycle curve in a mode one and an input duty cycle and output duty cycle curve in a mode two.
7. The method for controlling a semiconductor heat sink according to claim 1, wherein the dew point temperature is calculated by collecting the ambient temperature and the ambient humidity in real time.
8. A semiconductor heat dissipation device is characterized by comprising a temperature and humidity acquisition module, a PWM control module and an MCU, wherein the temperature and humidity acquisition module and the PWM control module are respectively connected with the MCU;
the temperature and humidity acquisition module is used for acquiring the temperature of the cold end and the ambient temperature and humidity and sending the acquired data to the MCU;
the PWM control module comprises a PWM acquisition module, a data storage module and a PWM output module; the PWM acquisition module is used for acquiring an input duty ratio; the data storage module is used for storing preset input duty ratio and output duty ratio curves; the PWM output module is used for controlling the output of the fan PWM and the semiconductor refrigerating sheet PWM;
the MCU is used for acquiring the dew point temperature according to the data of the temperature and humidity acquisition module and comparing the dew point temperature with the cold end temperature; if the temperature of the cold end is lower than the dew point temperature, sending a command for reducing the PWM of the semiconductor refrigeration sheet and the PWM of the fan to the PWM output module; and if the temperature of the cold end is higher than the dew point temperature, calculating the PWM of the fan and the PWM of the semiconductor refrigeration sheet according to the input duty ratio and the output duty curve, and sending a calculation result to the PWM output module.
9. The semiconductor heat dissipation device of claim 8, wherein the input duty cycle is the collected fan PWM, and the output duty cycle comprises the fan PWM and the semiconductor chilling plate PWM.
10. The semiconductor heat sink device according to claim 9, wherein the input duty cycle and output duty cycle curves comprise a collected fan PWM-fan PWM curve and a collected fan PWM-semiconductor chilling plate PWM curve.
11. The semiconductor heat sink of claim 8, further comprising a button for switching between three modes of operation, mode one, mode two and mode three;
the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the first mode are lower than those in the second mode; and the PWM of the semiconductor refrigerating sheet and the PWM of the fan in the second mode are lower than those in the third mode.
12. The semiconductor heat sink device as claimed in claim 11, wherein the fan PWM and the semiconductor cooling plate PWM in the mode three are both 100%.
13. The semiconductor heat sink of claim 11, wherein the input duty cycle and output duty cycle curves comprise an input duty cycle and output duty cycle curve in mode one and an input duty cycle and output duty cycle curve in mode two.
14. The semiconductor heat dissipation device of claim 8, wherein the temperature and humidity acquisition module is further configured to acquire an ambient temperature and an ambient humidity in real time, and the MCU is configured to calculate a dew point temperature according to the ambient temperature and the ambient humidity.
15. The semiconductor heat dissipation device of claim 8, further comprising a fan and a semiconductor refrigeration sheet, wherein the fan is disposed at a side of the CPU for blowing air to a side of the CPU, and a cold end of the semiconductor refrigeration sheet is disposed to absorb heat dissipated by the CPU.
16. A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the method for controlling a semiconductor heat sink according to any one of claims 1-7.
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| CN202110676482.2A CN113407017B (en) | 2021-06-18 | Control method of semiconductor heat sink, semiconductor heat sink and storage medium |
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| CN202110676482.2A CN113407017B (en) | 2021-06-18 | Control method of semiconductor heat sink, semiconductor heat sink and storage medium |
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