WO2017197963A1

WO2017197963A1 - Speed regulation method, apparatus and system for fan of device

Info

Publication number: WO2017197963A1
Application number: PCT/CN2017/076007
Authority: WO
Inventors: 张萌
Original assignee: 中兴通讯股份有限公司
Priority date: 2016-05-18
Filing date: 2017-03-08
Publication date: 2017-11-23
Also published as: CN107401520A

Abstract

Speed regulation method, apparatus and system for a fan of a device. The speed regulation method comprises: obtaining temperature information of each heat radiating area of a device; calculating rotation control information of each sub-fan under the obtained temperature information according to positional correspondence relationships of the heat radiating areas and the sub-fans; and regulating the rotational speeds of the sub-fans according to the rotation control information. The method reduces noises generated by a fan and power consumption of the fan by controlling rotational speeds of sub-fans according to temperature information of each heat radiating area.

Description

Device fan speed control method, device and system

Technical field

This document relates to, but is not limited to, the field of heat dissipation technology, and in particular, to a device fan speed control method, device and system.

Background technique

In the field of communication technology, digital signals are mainly transmitted, and digital signals are encapsulated into a specific format according to hardware devices, and then these signals are collected into a bearer network for transmission through optical fibers; as the user's business demands continue to increase, in order to adapt to the user's The data transmission capacity of the board needs to be expanded. As the amount of data transmitted by the board increases, and the power consumption of the device increases, the heat dissipation of the device becomes a concern.

In the related art, the heat dissipation of the device is basically a relatively simple manner. FIG. 1 is a structural diagram of a packet transport network (PTN) device in the related art, as shown in FIG. Fan 1, after the power is turned on, the fan 1 directly runs through the air inlet 2 of the device to pump the cold air outside the device into the device, and then the heat emitted by the device is discharged out of the device through the fan 1. When the heat is dissipated by the fan, the device generates corresponding noise. Therefore, in order to balance the relationship between heat dissipation and noise, the related art improves the type of fan used and the operating speed of the fan; FIG. 2 is a frame diagram of the speed control processing of the device fan in the related art, as shown in FIG. The sensing unit 21 detects the overall temperature value of the device in real time, and the control unit 22 performs unified control of the rotational speed of the fan through the fan control unit 23 according to the overall temperature value. Although the improved fan speed regulation method can improve the heat dissipation performance, the method uses the same speed value to adjust the speed, and does not consider the position of the fan itself. For the fan set in some areas of the equipment, when the rotation speed reaches a certain speed After the value, not only does it not bring a substantial effect on the heat dissipation of the device, but also causes the noise of the device to be too large, and also increases the power consumption of the device.

Summary of invention

The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.

Embodiments of the present invention provide a device fan speed adjustment method, device, and system, which can reduce a fan Noise that occurs during heat dissipation.

The embodiment of the invention provides a device fan speed adjustment method, including:

Obtaining temperature information of each heat dissipation area in the device;

Calculating rotation control information of each of the sub-fans under the acquired temperature information according to a positional relationship between the heat dissipation area and the sub-fan;

Adjusting the rotational speed of the sub-fan according to the rotation control information.

Optionally, the device fan speed adjustment method further includes:

Obtaining, respectively, location information of each of the heat dissipation regions and position information of each sub-fan that dissipates the heat dissipation region;

And establishing, according to the obtained location information of the heat dissipation area and the position information of the sub-fan, the position correspondence relationship between each of the heat dissipation areas and the sub-fan that dissipates heat from the heat dissipation area.

Optionally, each of the heat dissipation regions includes a corresponding one or more temperature detecting units, and the obtaining temperature information of each heat dissipation region includes:

Determining a heat dissipation area of the sub-fan according to the position correspondence relationship, querying a temperature detecting unit included in the heat dissipation area of the sub-fan, and acquiring a temperature value detected by the temperature detecting unit.

Optionally, the obtaining the temperature information of each heat dissipation area further includes: acquiring location information of the temperature detection unit, and determining a location of the temperature detection unit according to the sub-fan corresponding to the temperature detected by the temperature detection unit in the heat dissipation area. Correspondence between information and location information of sub-fans;

The calculating, by the temperature detecting unit, the rotation control information of each of the sub-fans under the acquired temperature information, according to the determined relationship between the position information of the determined temperature detecting unit and the position information of the sub-fan The temperature value calculates rotational control information of the sub-fan at the temperature value.

Optionally, the calculating the rotation control information of each of the sub-fans under the acquired temperature information includes:

Comparing the obtained temperature value included in the temperature information of the heat dissipation area with a preset temperature threshold;

When the temperature value is greater than the temperature threshold, calculating the rotation control of the sub-fan under the temperature value letter;

The temperature threshold is a maximum temperature value of the heat dissipation area under normal working conditions.

Optionally, the adjusting and controlling the rotation speed of the sub-fan according to the rotation control information includes:

Transmitting the rotation control information to a control panel of the sub-fan; such that a control panel of the sub-fan controls the rotation speed of the sub-fan according to the rotation control information.

On the other hand, an embodiment of the present invention further provides a device fan speed control device, including:

An information collecting module, configured to acquire temperature information of each heat dissipation area in the device;

a calculation module, configured to calculate rotation control information of each sub-fan under the acquired temperature information according to a position correspondence relationship between the heat dissipation area and the sub-fan;

The control module is configured to adjust the rotational speed of the sub-fan according to the rotation control information.

Optionally, the device fan speed control device further includes: a positioning module and a first setting module;

The positioning module is configured to acquire, respectively, location information of each of the heat dissipation regions and each of the sub fans that dissipate heat to the heat dissipation regions;

The first setting module is configured to: establish, according to the obtained location information of the heat dissipation area and position information of the sub-fan, a position correspondence relationship between each of the heat dissipation areas and a sub-fan that dissipates heat from the heat dissipation area.

Optionally, one or more temperature detecting units are respectively disposed corresponding to each of the heat dissipation regions, and the information collection module is configured to:

The heat dissipation area of the sub-fan is determined according to the location correspondence relationship, and the temperature detection unit included in the heat dissipation area where the sub-fan is located is obtained, and the temperature value detected by the temperature detection unit is obtained.

Optionally, the information collection module is further configured to:

Acquiring the position information of the temperature detecting unit, and determining a correspondence between the position information of the temperature detecting unit and the position information of the sub-fan according to the sub-fan corresponding to the temperature detected by the temperature detecting unit in the heat-dissipating area;

The calculation module is set to:

Calculating, according to the determined correspondence between the location information of the file detecting unit and the position information of the sub-fan, and the temperature value detected by the temperature detecting unit, the sub-fan is at the temperature value Turn the control information.

Optionally, the calculating unit is configured to be

And comparing the obtained temperature value included in the temperature information of the heat dissipation area with a preset temperature threshold; when the temperature value is greater than a preset temperature threshold, calculating rotation control information of the sub fan at the temperature value ;

The temperature threshold is a maximum temperature value of the heat dissipation region under normal operating conditions.

Optionally, the control module is configured to: send the rotation control information to a control panel of the sub-fan; so that a control panel of the sub-fan controls the rotation speed of the sub-fan according to the rotation control information. .

The embodiment of the invention further provides a device fan speed control system, comprising: the device fan speed control device as described above; the device fan speed control device: obtaining temperature information of each heat dissipation area; and calculating the child fan according to the temperature information The rotation control information under the acquired temperature information; the rotation speed of the sub-fan is adjusted according to the rotation control information.

Compared with the related art, the technical solution provided by the embodiment of the present invention includes: calculating the rotation control information of the sub-fan under the temperature information according to the temperature information of the heat dissipation area in the device, according to the position correspondence relationship between the heat dissipation area and the sub-fan, Adjusting and controlling the rotation speed of the sub-fan according to the rotation control information; in the embodiment of the invention, the temperature information of the heat dissipation area is obtained according to the corresponding relationship between the heat dissipation area and the sub-fan, and the corresponding relationship with the sub-fan is determined according to the temperature information. The speed of the sub-fans can be adjusted directly and in a targeted manner according to the actual situation, thereby achieving independent control adjustment of each sub-fan in the device. In the embodiment of the present invention, the control of the speed of the sub-fan is controlled according to the actual situation of the device to control the size of the noise generated by each sub-fan, thereby achieving reasonable control of the device noise and reducing the power consumption of the device fan. Reduce the waste of resources.

Other aspects will be apparent upon reading and understanding the drawings and detailed description.

BRIEF abstract

1 is a structural diagram of a PTN device in the related art;

2 is a frame diagram of a device fan speed regulation processing in the related art;

3 is a flowchart of a method for adjusting a fan speed of a device according to Embodiment 1 of the present invention;

4 is a structural block diagram of an apparatus for adjusting a fan speed of a device according to Embodiment 2 of the present invention;

5 is another structural block diagram of a device fan speed regulating device according to Embodiment 3 of the present invention;

FIG. 6 is a structural block diagram of a device according to Embodiment 3 of the present invention.

Detailed

Embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.

Embodiment 1:

Please refer to FIG. 3. FIG. 3 is a flowchart of a method for multi-fan speed regulation according to an embodiment of the present invention, including:

Step (S) 301: acquiring temperature information of each heat dissipation area in the device;

In an optional embodiment, one or more temperature detecting units are disposed corresponding to each of the heat dissipating regions, and obtaining temperature information of each of the heat dissipating regions includes:

The temperature detecting unit of the corresponding heat dissipation area is inquired according to the position information of the sub-fan; the temperature value of the heat dissipation area is acquired by the temperature detecting unit as the temperature information.

Optionally, the temperature detecting unit can be disposed on each chip of each board in the heat dissipation area, and the temperature information on the chip is obtained by the temperature detecting unit, where the temperature information acquired includes: the current temperature value of the heat dissipation area and the heat dissipation. The location information of the area may include the temperature of the chip in the heat dissipation area and the position information of the temperature detecting unit disposed on the chip.

In an optional embodiment, obtaining temperature information of each heat dissipation area includes querying a temperature detection unit of the corresponding heat dissipation area according to position information of the sub-fan; and acquiring a temperature value of the heat dissipation area by the temperature detection unit. When the heat dissipation area includes one or more boards, the temperature information of the heat dissipation area can be obtained by obtaining the temperature values of all the boards in the heat dissipation area; and then the temperature values are obtained from the temperature values of all the obtained boards. The highest one is used as the acquired temperature information. Optionally, the temperature information includes the temperature value of each board and the position information of each board. The temperature detection unit set on the board can detect the acquisition in real time. The temperature detecting unit may be configured as a temperature sensor, and one or more temperature sensors may be disposed on each single board. After the device is powered on, the temperature value in the heat dissipation area is detected in real time through the set temperature sensor. While obtaining the temperature value of the heat dissipation area, the position information of the temperature sensor itself is obtained by the temperature sensor, and the position information of the heat dissipation area is obtained by the position information of the temperature sensor; optionally, the obtained heat dissipation area is also obtained. The position information of the sub-fan corresponding to the heat dissipation area is obtained. Optionally, in the embodiment, when acquiring the position information of each sub-fan, the positioning sensing unit may be disposed on each sub-fan. After obtaining the location information of the heat dissipation area, the position sensing unit is used to obtain the position information of the sub-fan corresponding to the heat dissipation area.

In an optional embodiment of the present invention, when the single board is composed of one or more chips, a temperature detecting unit may be disposed on each chip, and the temperature detecting unit is configured to detect the temperature value of the chip on the single board. Optionally, the temperature detecting unit may include a temperature sensor, and the temperature value of each chip is obtained by the temperature sensor, and then one of the temperature values of all the chips is selected as the temperature information of the obtained heat dissipation area.

In an optional embodiment of the present invention, while acquiring the temperature value on the temperature sensor on each chip, the position information of each temperature sensor is also acquired, according to the obtained position information of the temperature sensor and the position information of the sub-fan. The rotation control information of the sub-fan is calculated according to the correspondence relationship and the temperature value on the temperature sensor. Here, the correspondence between the position information of the temperature sensor and the position information of the sub-fan may be determined according to the position of the set temperature sensor and the position of the sub-fan when the temperature sensor is set. Optionally, when calculating the rotation control information, the temperature information may be obtained according to the maximum temperature value that each chip is subjected to, for example, the current temperature of the chip 1 is 40 degrees, the maximum withstand temperature is 50 degrees, and the current temperature of the chip 2 is 45 degrees. The maximum withstand temperature is 70 degrees. At this time, the corresponding sub-fan speed control should calculate the speed based on the temperature of the chip 1.

The rotation control information calculated by the embodiment of the present invention may be a rotation speed, a temperature, or the like. When the temperature is calculated, it may be adjusted according to a curve relationship between the rotation speed of the sub-fan and the temperature.

S302. Calculate rotation control information of each sub-fan under the acquired temperature information according to the positional relationship between the heat dissipation area and the sub-fan;

Optionally, calculating rotation control information of each sub-fan under the acquired temperature information includes:

Calculating rotation control information of the sub-fan under the temperature information according to the positional relationship between the heat dissipation area and the sub-fan, and the obtained temperature information; optionally, the rotation control information herein may include a rotation rate, a change rate of the rotation rate, and One of the speed control gears.

In this embodiment, the location information of the heat dissipation area and the location information of the sub-fan are obtained, and the corresponding relationship between the heat dissipation area and the sub-fan is established according to the obtained two pieces of position information.

Optionally, in this embodiment, the heat dissipation area includes a first positioning sensing unit, and the sub-fan includes a second positioning sensing unit, and when the corresponding relationship between the heat dissipation area and the sub-fan is established, the heat dissipation area and the sub-fan are separately obtained. Position information, specifically, detecting the position information of the heat dissipation area in real time through the first positioning sensing unit disposed on the heat dissipation area, and detecting the position information of the sub fan in real time through the second positioning sensing unit, and then passing the two positions Information establishes the correspondence between the two.

Optionally, in this embodiment, the heat dissipation area includes at least one single board, and the location information of the heat dissipation area may be the location information of the board in the heat dissipation area, and the corresponding relationship between the sub-fans is established by using the position information of the board;

Optionally, the board can also be configured by using at least one chip. When acquiring the location information of the heat dissipation area, the board can obtain the position information of each chip on the board, and establish the slave fan according to the position information of the chip. Correspondence.

In this embodiment, when calculating the rotation rate of the sub-fan under the current temperature information according to the obtained relationship between the temperature information and the sub-fan, the correspondence between the temperature value and the rate may be calculated; And querying, according to the obtained location information of the sub-fan, the corresponding relationship between the speed of the sub-fan and the temperature value; optionally, the corresponding relationship may be a curve relationship diagram; after obtaining the highest temperature value, Calculating the rotation control information of the sub-fan according to the corresponding relationship, and finally, obtaining a control strategy of the sub-fan rotation rate according to the calculated rotation control information; optionally, when the correspondence is a curve relationship diagram, the detection may be directly based on the detection The temperature value obtained is queried from the curve diagram to obtain the corresponding sub-fan rotation rate.

S303. Adjust and control the rotation speed of the sub-fan according to the rotation control information.

In this embodiment, optionally, when adjusting the rotation speed of the sub-fan, firstly calculating the rotation control information of the sub-fan, such as: the rotation speed control gear position; and then positioning the control panel of the corresponding sub-fan through the position information, The rotation speed of the sub-fan is adjusted by the control panel according to the speed control gear position.

The device fan speed adjustment method provided in this embodiment further includes: setting a temperature threshold, where the temperature threshold is a temperature value of the heat dissipation area under normal working conditions; it is understood that the temperature threshold may be It is the maximum temperature value of each board on the heat dissipation area, and compares the obtained maximum temperature value with the temperature threshold; and determines the rotation control information of each sub-fan at the temperature value according to the comparison result.

Optionally, in this embodiment, adjusting the rotation speed of the sub-fan according to the rotation control information includes: transmitting the rotation control information to the control panel of the sub-fan; and controlling the sub-fan according to the rotation control information to control the rotation speed of the sub-fan according to the rotation control information. .

The embodiment of the invention further provides a computer storage medium, wherein the computer storage medium stores computer executable instructions, and the computer executable instructions are used to execute the device fan speed adjustment method.

An embodiment of the present invention further provides an apparatus for implementing fault diagnosis, including: a memory and a processor; wherein

The processor is configured to execute program instructions in the memory;

Program instructions perform the following operations on the processor read:

Obtain temperature information of each heat dissipation area in the device;

Calculating rotation control information of each sub-fan under the acquired temperature information according to the positional relationship between the heat dissipation area and the sub-fan;

The rotation speed of the sub fan is adjusted according to the rotation control information.

Embodiment 2:

Please refer to FIG. 4. FIG. 4 is a structural block diagram of a device fan speed adjusting device according to an embodiment of the present invention.

The device fan speed adjusting device 1 provided by the embodiment includes: an information collecting module 11, a calculating module 12 and a control module 13;

The information collection module 11 is configured to: acquire temperature information of each heat dissipation area in the device;

The calculation module 12 is configured to: according to the temperature information acquired by the information collection module 11, the position of the heat dissipation area and the position of the sub-fan, and calculate the rotation control information of each sub-fan under the acquired temperature information;

The control module 13 is configured to: adjust and control the rotation speed of the sub-fan according to the rotation control information calculated by the calculation module 12;

Optionally, in this embodiment, the device fan speed adjusting device 1 further includes a positioning module 14 and a first setting module 15;

The positioning module 14 is configured to: respectively acquire position information of each of the heat dissipation areas and each of the sub-fans that dissipate heat from the heat dissipation area; that is, obtain position information of the heat dissipation area on the device and position information of the sub-fans; respectively, on the heat dissipation area and the sub-fans A positioning module is provided, and optionally, one or more heat dissipation areas are disposed on each device in the embodiment. Optionally, the device provided in this embodiment is provided for more convenient location information of each heat dissipation area. The fan speed adjusting device 1 respectively sets the positioning module 14 for each heat dissipating area, and obtains the position information of all the heat dissipating areas in the device by acquiring the position information of the corresponding heat dissipating area detected by the positioning module 14 on each heat dissipating area; similarly, The device fan speed adjusting device 1 also sets a positioning module 14 for each sub-fan in the device, and obtains the position information detected by the positioning module 14 on each sub-fan to obtain the position information of all the sub-fans in the device;

The first setting module 15 is configured to establish a positional correspondence between each heat dissipation area on the device and a sub-fan that dissipates heat from the heat dissipation area according to the position information of the heat dissipation area acquired by the positioning module 14 and the position information of the sub-fan.

Optionally, the device fan speed adjusting device 1 provided by the embodiment of the present invention further includes a first positioning sensing unit and a second positioning sensing unit, wherein the first positioning sensing unit is disposed in a heat dissipation area of the device, and the second The positioning sensing unit is disposed on the sub-fan of the device, and the positioning module 14 detects the position information of the heat dissipation area by using the first positioning sensing unit disposed in the heat dissipation area, and detects the acquisition of the sub-fan by the second positioning sensing unit. location information.

Optionally, in this embodiment, the positioning module 14 is further configured as a first positioning sensing unit and a second positioning sensing unit, and then the positioning module 14 is respectively disposed on the heat dissipation area and the sub-fan, such that the positioning module 14 The location information can be obtained directly from the heat dissipation area and the sub-fan, and the problem that the information acquisition error occurs when the positioning module 14 indirectly acquires the position information through some sensors, and the precise positioning of the positioning module 14 is realized.

The device provided in this embodiment further includes a temperature detecting unit disposed on the heat dissipating area, and the information collecting module 11 is configured to determine a heat dissipating area where the sub fan is located according to the position correspondence relationship, and query the sub The temperature detecting unit included in the heat dissipating area of the fan obtains the temperature value detected by the temperature detecting unit, and includes: querying the temperature detecting unit of the corresponding heat dissipating area according to the position information of the sub fan acquired by the positioning module 14;

Optionally, the information collection module is further configured to:

Acquiring the position information of the temperature detecting unit, and determining a correspondence relationship between the position information of the temperature detecting unit and the position information of the sub-fan according to the sub-fan corresponding to the temperature detected by the temperature detecting unit in the heat-dissipating area;

The calculation module is set to:

And determining, according to the determined correspondence between the position information of the file detecting unit and the position information of the sub-fan, and the temperature value detected by the temperature detecting unit, the rotation control information of the sub-fan under the temperature value.

For each chip on each board, the temperature tolerance is different. Some chips can run at higher temperatures. Some chips will be damaged due to excessive temperature. Therefore, the sub-fans are based on temperature information. In the control, the chip with the lowest temperature tolerance can be used. In order to solve the above problem, the information collection sub-module 112 provided in this embodiment is further configured to acquire the location information of the temperature detection unit; the calculation module 12 is configured to: The position information of the obtained temperature sensor corresponds to the position information of the sub-fan, and the temperature value on the temperature detecting unit calculates the rotation control information of the sub-fan under the temperature value. The temperature of the chip is obtained by acquiring the position information of the temperature detecting unit, and the temperature bearing capability of the chip is determined, and it is determined according to the result of the determination whether the temperature of the chip has been calculated as a standard.

The computing module of the device fan speed adjusting device 1 provided in this embodiment is configured to:

And comparing the temperature value included in the obtained temperature information of the heat dissipation area with a preset temperature threshold; when the temperature value is greater than the preset temperature threshold, calculating rotation control information of the sub fan at the temperature value;

The temperature threshold is the maximum temperature value of the heat dissipation region under normal operating conditions.

The control module 13 is configured to transmit the rotation control information to the control panel of the sub-fan such that the control panel of the sub-fan controls the rotation speed of the sub-fan according to the rotation control information.

The fan of the device provided by the embodiment provides speed regulation and heat dissipation for the fan of the device. The individual control adjustment of each sub-fan in the device solves the problem that only the uniform speed adjustment can be performed in the prior art.

Embodiment 3:

In this embodiment, the device fan speed regulating device provided by the present invention is described in detail by taking a sensor as an example.

Please refer to FIG. 5. FIG. 5 is a structural block diagram of the device fan speed adjusting device 1 according to the embodiment.

The device fan speed adjusting device 1 provided in this embodiment includes an information collecting module 11, a calculating module 12 and a control module 13, wherein:

The information collection module 11 is configured to: acquire temperature information of a heat dissipation area in the device;

The calculating module 12 is configured to: according to the temperature information and the position correspondence relationship acquired by the information collecting module 11, calculate the rotation control information of each sub-fan under the acquired temperature information, where the position correspondence relationship is a correspondence relationship between the heat dissipation area and the sub-fan;

The control module 13 is configured to adjust and control the rotation speed of the sub-fan according to the rotation control information calculated by the calculation module 12.

Optionally, in this embodiment, the information collection module 11 is configured as a temperature sensor 51 existing in the related art, and the temperature sensors are respectively disposed in each heat dissipation area of the device, and the control module 14 is configured as a controller of the device. After obtaining the temperature information of the heat dissipation area, the rotation control information of the sub-fan is calculated according to the temperature information, and the rotation control information herein may include one of a rotation rate, a change amount of the rotation rate, and a rotation speed control position.

As shown in FIG. 6, the structural block diagram of the device provided in this embodiment includes at least one slot. In this embodiment, the device is configured with 14 slots, which are slot 611, slot 612, and slot. 613, slot 614, slot 615, slot 616, slot 617, slot 618, slot 619, slot 620, slot 621, slot 622, slot 623, slot 624, the heat dissipation area includes at least A slot is provided with a single board in each slot, and the board is composed of at least one chip. The device provided in this embodiment is provided with 10 sub-fans, and the sub-fan is disposed in the fan slot 60. And corresponding to at least one slot, a sub-fan can dissipate heat from at least one slot.

In this embodiment, the temperature information of the heat dissipation area can be obtained by using a temperature sensor disposed in the slot to obtain the temperature information of each slot. Optionally, the core of each slot board can be obtained. The piece of information, and then obtains the highest temperature value from the temperature information of all the chips as the temperature information of the slot is output to the calculation module 12, and the calculation module 12 calculates the sub-fan according to the highest temperature value sent by the received temperature sensor. Turn the control information.

In this embodiment, a positioning module 14 may be disposed on each of the sub-fans. Optionally, the positioning module 14 may be configured by a positioning sensor 53 disposed on the sub-fan of the device through the positioning. The sensor directly acquires the position information of the sub-fan. In addition, the positioning sensor 52 is disposed in each slot of the heat dissipation area, and acquires the position information of the heat dissipation area by acquiring the position information of the slot.

In this embodiment, the control panel 54 is further disposed for each sub-fan, and the control panel 54 can be directly disposed on the sub-fan to facilitate accurate control of the sub-fan, or can be disposed on the control module 13, and the control module 13 The rotation speed control strategy unit 55 includes, after the calculation module calculates the rotation control information, the rotation control strategy unit 55 specifies a corresponding control strategy according to the rotation control information, and the control module 13 controls the rotation speed of the sub-fan according to the control strategy.

The speed control process of the device fan speed regulating device 1 provided by this embodiment includes:

The temperature value detected by the temperature sensor 51 of the board in each slot on the device is acquired, and transmitted to the calculation module 12, and the position information of the temperature sensor 51 is also acquired by the positioning sensor 52 on the temperature sensor 51, and sent. To the calculation module 12, the calculation module 12 calculates the rotation control information of the sub-fan according to the temperature value and the position information, and sends the rotation control information to the rotation speed control strategy unit 55. The rotation speed control strategy unit 55 also acquires the position information of the sub-fan, and the rotation speed control strategy unit 55 The rotation speed of the corresponding sub-fan is controlled according to the rotation control information and the position information of the sub-fan.

In addition, the present invention further provides an apparatus fan speed control system, the system comprising: at least one device fan speed control device provided by the above embodiment, obtaining temperature information of a heat dissipation area by using a device fan speed control device, and calculating according to temperature information The rotation control information of the sub-fan under the current temperature information adjusts and controls the rotation speed of the sub-fan according to the rotation control information.

In summary, the fan speed control method and device of the device provided by the present invention control the speed of the fan of the device in real time, and the fan of the device is separately controlled. The fan is separately used according to the actual heat dissipation of the heat of the device. Control, through the control of the fan speed to achieve the opposite The noise is controlled, and the speed of the sub-fan is controlled according to the actual situation of the device to control the size of the noise generated by each sub-fan, thereby achieving reasonable control of the device noise and reducing the fan of the device. Power consumption.

One of ordinary skill in the art will appreciate that all or a portion of the above steps may be performed by a program to instruct related hardware, such as a processor, which may be stored in a computer readable storage medium, such as a read only memory, disk or optical disk. Wait. Alternatively, all or part of the steps of the above embodiments may also be implemented using one or more integrated circuits. Correspondingly, each module/unit in the foregoing embodiment may be implemented in the form of hardware, for example, by implementing an integrated circuit to implement its corresponding function, or may be implemented in the form of a software function module, for example, being executed by a processor and stored in a memory. Programs/instructions to implement their respective functions. The invention is not limited to any specific form of combination of hardware and software.

The embodiments disclosed in the present application are as described above, but the descriptions are only for the purpose of understanding the present application, and are not intended to limit the present application, such as the specific implementation method in the embodiments of the present invention. Any modifications and changes in the form and details of the embodiments may be made by those skilled in the art without departing from the spirit and scope of the disclosure. The scope defined by the appended claims shall prevail.

Industrial applicability

The above technical solution realizes controlling the rotation speed of the sub-fan according to the temperature information of each heat dissipation area of the device; reducing the noise generated by the sub-fan and the power consumption of the device fan.

Claims

A device fan speed adjustment method includes:

Obtaining temperature information of each heat dissipation area in the device;

Calculating rotation control information of each of the sub-fans under the acquired temperature information according to a positional relationship between the heat dissipation area and the sub-fan;

Adjusting the rotational speed of the sub-fan according to the rotation control information.
The device fan speed adjustment method according to claim 1, wherein the device fan speed adjustment method further comprises:

Obtaining, respectively, location information of each of the heat dissipation regions and position information of each sub-fan that dissipates the heat dissipation region;

And establishing, according to the obtained location information of the heat dissipation area and the position information of the sub-fan, the position correspondence relationship between each of the heat dissipation areas and the sub-fan that dissipates heat from the heat dissipation area.
The device fan speed control method according to claim 2, wherein each of the heat dissipation regions includes a corresponding one or more temperature detecting units, and the obtaining temperature information of each heat dissipation region includes:

Determining a heat dissipation area of the sub-fan according to the position correspondence relationship, querying a temperature detecting unit included in the heat dissipation area of the sub-fan, and acquiring a temperature value detected by the temperature detecting unit.
The device fan speed adjustment method according to claim 3, wherein the obtaining temperature information of each heat dissipation area further comprises: acquiring position information of the temperature detection unit, and corresponding to the temperature detected by the temperature detection unit in the heat dissipation area a sub-fan, determining a correspondence between position information of the temperature detecting unit and position information of the sub-fan;

The calculating, by the temperature detecting unit, the rotation control information of each of the sub-fans under the acquired temperature information, according to the determined relationship between the position information of the determined temperature detecting unit and the position information of the sub-fan The temperature value calculates rotational control information of the sub-fan at the temperature value.
The device fan speed control method according to any one of claims 1 to 4, wherein the calculating the rotation control information of each of the sub-fans under the acquired temperature information comprises:

Comparing the obtained temperature value included in the temperature information of the heat dissipation area with a preset temperature threshold;

When the temperature value is greater than a temperature threshold, calculating a rotation control signal of the sub-fan at the temperature value;

The temperature threshold is a maximum temperature value of the heat dissipation area under normal working conditions.
The device fan speed adjustment method according to any one of claims 1 to 4, wherein the adjusting control of the rotation speed of the sub-fan according to the rotation control information comprises:

Transmitting the rotation control information to a control panel of the sub-fan; such that a control panel of the sub-fan controls the rotation speed of the sub-fan according to the rotation control information.
A device fan speed control device includes:

An information collecting module, configured to acquire temperature information of each heat dissipation area in the device;

a calculation module, configured to calculate rotation control information of each sub-fan under the acquired temperature information according to a position correspondence relationship between the heat dissipation area and the sub-fan;

The control module is configured to adjust the rotational speed of the sub-fan according to the rotation control information.
The device fan speed regulating device according to claim 7, further comprising: a positioning module and a first setting module;

The positioning module is configured to acquire, respectively, location information of each of the heat dissipation regions and each of the sub fans that dissipate heat to the heat dissipation regions;

The first setting module is configured to: establish, according to the obtained location information of the heat dissipation area and position information of the sub-fan, a position correspondence relationship between each of the heat dissipation areas and a sub-fan that dissipates heat from the heat dissipation area.
The device fan speed regulating device according to claim 8, wherein one or more temperature detecting units are respectively disposed corresponding to each of the heat dissipating regions, and the information collecting module is configured to:

The heat dissipation area of the sub-fan is determined according to the location correspondence relationship, and the temperature detection unit included in the heat dissipation area where the sub-fan is located is obtained, and the temperature value detected by the temperature detection unit is obtained.
The device fan speed regulating device according to claim 9, wherein the information collecting mode The block is also set to:

Acquiring the position information of the temperature detecting unit, and determining the correspondence between the position information of the temperature detecting unit and the position information of the sub-fan according to the sub-fan corresponding to the temperature detected by the temperature detecting unit in the heat-dissipating area

The calculation module is set to:

And determining, according to the determined correspondence between the position information of the file detecting unit and the position information of the sub-fan, and the temperature value detected by the temperature detecting unit, the rotation control information of the sub-fan under the temperature value.
The device fan speed regulating device according to any one of claims 7 to 10, wherein the calculating unit is set to;

And comparing the obtained temperature value included in the temperature information of the heat dissipation area with a preset temperature threshold; when the temperature value is greater than a preset temperature threshold, calculating rotation control information of the sub fan at the temperature value ;

The temperature threshold is a maximum temperature value of the heat dissipation region under normal operating conditions.
The device fan speed adjusting device according to any one of claims 7 to 10, wherein

The control module is configured to: send the rotation control information to a control panel of the sub-fan; so that a control panel of the sub-fan controls the rotation speed of the sub-fan according to the rotation control information.
An apparatus fan speed control system comprising the device fan speed control device according to any one of claims 7 to 12, wherein the device fan speed control device is:

Obtaining temperature information of each heat dissipation area; calculating rotation control information of the sub-fan under the acquired temperature information according to the temperature information; and adjusting a rotation speed of the sub-fan according to the rotation control information.