CN2849963Y

CN2849963Y - Semiconductor cooling radiator

Info

Publication number: CN2849963Y
Application number: CN 200520134146
Authority: CN
Inventors: 张雷兵
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-12-01
Filing date: 2005-12-01
Publication date: 2006-12-20
Anticipated expiration: 2015-12-01

Abstract

The utility model relates to a semiconductor refrigeration heat radiation device which comprises a radiator, a heat radiation fan arranged at the upper part of the radiator, a semiconductor refrigerator arranged at the bottom of the radiator, a coldness transferring block which contacts the semiconductor refrigerator, and a temperature controller, wherein the temperature controller is provided with a control output interface electrically connected with the heat radiation fan. A temperature sensor contacts the coldness transferring block. Coldness which is quickly produced by the semiconductor refrigerator and heat which is produced when an integrated circuit chip works are mutually neutralized, which is good for the stable operation of the integrated circuit chip. The temperature controller can control the working conditions of the heat radiation fan, which can effectively reduce the noise of the heat radiation device.

Description

The conductor refrigeration heat abstractor

Technical field

The utility model relates to the heat abstractor that a kind of heat dissipation of integrated circuit chip is used.

Background technology

In the prior art, the heat abstractor that is used for heat dissipation of integrated circuit chip mainly contains following several:

1, Natural Heat Convection: directly sticking radiator on integrated circuit (IC) chip, because it does not have fan, just lean on the Natural Heat Convection of wind, so the heat dissipation capacity of this radiator is very limited, use the caloric value of figure of video card of this heat dissipating method too little, generally only about 3-8 watt;

2, air blast cooling heat radiation: form by some aluminums or copper radiator and fan, radiator and number of fans are decided according to the caloric value needs of integrated circuit (IC) chip and the outward appearance demand of product, and the fan number increases, to a certain degree can play the effect that air quantity increases, radiating efficiency improves, but the noise that thereupon brings is increasing;

3, the combination of heat pipe and air blast cooling device: heat is exported to rapidly on the radiator on the back side or next door with heat pipe, by fan radiator is carried out the air blast cooling heat radiation again, heat is loose in air.And work for a long time as fruit chip, the temperature at heat pipe two ends can move closer to because of the rapid heat transfer of heat pipe, causes the thermal conductivity variation of heat pipe, and the radiating effect of entire heat dissipation device is variation also; Secondly, if since when making and installing many-sided factor make do not have good bond between heat pipe and the radiator, promptly can cause certain thermal resistance, the effect of heat pipe is just poorer like this; In addition, heat pipe must take bigger space, and cost of manufacture is also relatively more expensive.

Along with high-speed development of science and technology, computer operation speed is more and more faster, and the running frequency of the chip of central processing unit and video card is more and more higher, and corresponding caloric value is also increasing, more than several heat abstractors all can't satisfy the heat radiation requirement of chip.

Summary of the invention

The utility model purpose provides a kind of conductor refrigeration heat abstractor, and it still can make heat dissipation of integrated circuit chip rapidly when chip works long hours, and can reduce noise.

For achieving the above object, the technical solution adopted in the utility model is: a kind of conductor refrigeration heat abstractor, comprise radiator, be arranged at the radiator fan of described radiator top, it also comprises the semiconductor cooler of the bottom that is arranged at described radiator, with the contacted cold transfer block of described semiconductor cooler, temperature controller, the temperature sensor that is electrically connected with described temperature controller, has the control output interface on the described temperature controller, described control output interface and radiator fan are electrically connected, and described temperature sensor contacts with cold transfer block.

The outside of described cold transfer block is with heat insulation lasso.

Described control output interface also is electrically connected with semiconductor cooler.

Described temperature sensor inserts the inside of cold transfer block.

Because the technique scheme utilization, the utility model compared with prior art has following advantage: the heat that produces when cold that semiconductor cooler produces fast and chip operation neutralizes mutually, helps chip stable operation; Temperature controller can be controlled the working condition of semiconductor cooler, if temperature is lower than set point, semiconductor cooler quits work, when temperature is higher than set point, semiconductor cooler is started working, and makes temperature stabilization in set point, has both reduced the temperature of central processing unit, can avoid condensed water to produce again, make central processing unit move safely; Temperature controller can also be controlled the working condition of radiator fan, and when temperature was lower than set point, radiator fan quit work, and when temperature was higher than set point, radiator fan was started working, and can effectively lower the noise of this heat abstractor, to safeguard quiet operational environment.

Description of drawings

Accompanying drawing 1 is a three-dimensional exploded view of the present utility model;

Accompanying drawing 2 is the three-dimensional exploded view of temperature controller;

Accompanying drawing 3 is a three-dimensional assembly diagram of the present utility model;

Wherein: 1, radiator fan; 2, radiator; 3, semiconductor cooler; 4, temperature sensor; 5, temperature controller; 6, electric power connection line; 8, cold transfer block; 9, heat insulation lasso; 10, housing; 11, power supply access interface; 12, control output interface; 13, control switch; 14, control chip.

Embodiment

Referring to accompanying drawing 1, accompanying drawing 3, a kind of conductor refrigeration heat abstractor, comprise radiator 2, be arranged at the radiator fan 1 of described radiator 2 tops, it also comprises the semiconductor cooler 3 of the bottom that is arranged at described radiator 2, with described semiconductor cooler 3 contacted cold transfer blocks 8, temperature controller 5, the temperature sensor 4 that is electrically connected with described temperature controller 5, has control output interface 12 on the described temperature controller 5, described control output interface 12 is electrically connected with radiator fan 1, described temperature sensor 4 contacts with cold transfer block 8, in the embodiment that the utility model adopts usually, the inside that described temperature sensor 4 inserts cold transfer block 8.Be with heat insulation lasso 9 around the described cold transfer block 8, heat insulation lasso 9 be enclosed within cold transfer block 8 around, the invalid loss of cold of the cold transfer block 8 that can prevent.

The utility model uses on the graphic process unit of computer video card usually, can certainly use on other heating electronic building brick.Semiconductor cooler 3 is by the electric current of correct direction, and a surface temperature of the contact radiator 2 of semiconductor cooler 3 raises and forms the hot junction, and its another side temperature can descend and then form cold junction, and the cold junction of semiconductor cooler 3 is attached on the cold transfer block 8.

Shown in accompanying drawing 2, temperature controller 5 comprises housing 10, is arranged at power supply access interface 11, control output interface 12, control switch 13, control chip 14 in the housing 10, power supply access interface 11 is connected with electric power connection line 6,12 of control output interfaces and radiator fan 1.Temperature sensor 4 is surveyed the temperature at cold transfer block 8 centers, cold transfer block 8 adopts aluminum to make usually, its conductive coefficient is better, make the temperature at video card graphic chips place approach the temperature of cold transfer block 8 centers, control chip 14 is with detected data and set point contrast, when detecting temperature is lower than design temperature, control switch 13 is in open-circuit condition, the output of control output interface 12 no currents, semiconductor cooler 3 is not worked with radiator fan 1, does not produce power and noise this moment; Along with video card graphic chips deal with data, power increases, caloric value increases, raise with the temperature of the contacted cold transfer block of video card graphic chips 8 centers, semiconductor cooler 3 work, make the cold junction of semiconductor cooler 3 produce cold, cold transfer block 8 is accepted cold and cold is passed to the video card graphic chips, the heat that produces with graphic chips neutralizes mutually, reduce temperature, simultaneous temperature transducer 4 is given control chip 14 with feedback information, when detecting temperature is higher than design temperature, control chip 14 starts control switch 13, make radiator fan 1 work, the heat that the hot junction produces of semiconductor cooler 3 work is by the heat conduction of radiator 2, and the heat that semiconductor cooler 3 is produced is transmitted to the surface of radiator 2, and the generation forced draft can be taken the heat on the surface of radiator in the air to and go during again by radiator fan 1 work.

Claims

1, a kind of conductor refrigeration heat abstractor, comprise radiator (2), be arranged at the radiator fan (1) of described radiator (2) top, it is characterized in that: it also comprises the semiconductor cooler (3) of the bottom that is arranged at described radiator (2), with the contacted cold transfer block of described semiconductor cooler (3) (8), temperature controller (5), the temperature sensor (4) that is electrically connected with described temperature controller (5), has control output interface (12) on the described temperature controller (5), described control output interface (12) is electrically connected with radiator fan (1), and described temperature sensor (4) contacts with cold transfer block (8).

2, conductor refrigeration heat abstractor according to claim 1 is characterized in that: the outside of described cold transfer block (8) is with heat insulation lasso (9).

3, conductor refrigeration heat abstractor according to claim 1 is characterized in that: described control output interface (12) also is electrically connected with semiconductor cooler (3).

4, conductor refrigeration heat abstractor according to claim 1 is characterized in that: described temperature sensor (4) inserts the inside of cold transfer block (8).