CN216596147U

CN216596147U - Computer chip heat dissipation mechanism

Info

Publication number: CN216596147U
Application number: CN202121645207.6U
Authority: CN
Inventors: 孟庆鑫
Original assignee: Beijing Tianzuo Shuncheng Technology Development Co ltd
Current assignee: Beijing Tianzuo Shuncheng Technology Development Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2022-05-24
Anticipated expiration: 2031-07-20

Abstract

The utility model discloses a computer chip heat dissipation mechanism, belonging to the technical field of computers, comprising a computer shell, wherein a water circulation refrigeration mechanism, an exhaust refrigeration mechanism and a water cooling liquid changing structure are arranged in the computer shell, and the water circulation refrigeration mechanism comprises: the water-cooling liquid holds chamber, water-cooling tube, refrigeration chamber, fin, chip, motor, gear pump, drainage gear, and the inside fixed mounting of computer housing has the chip, and the inside cavity of computer housing is provided with the water-cooling liquid and holds the chamber, and the water-cooling liquid holds the chamber and is connected with refrigeration chamber and gear pump through the water-cooling tube. According to the utility model, after the chip is heated, heat can be absorbed by water cooling liquid in the water cooling tube, the water cooling liquid containing cavity is circulated to the refrigerating cavity by the water cooling tube through the gear pump, and the radiating fins in the refrigerating cavity can refrigerate the water cooling liquid with increased temperature.

Description

Computer chip heat dissipation mechanism

Technical Field

The utility model belongs to the technical field of computers, and particularly relates to a computer chip heat dissipation mechanism.

Background

Chips are a general term for semiconductor device products, mainly including semiconductor devices, and also including miniaturization methods such as passive components, and are often manufactured on the surface of a semiconductor wafer, and the chips are prone to generate heat during operation to affect the use of a computer.

The heat dissipation structure for the CPU chip has the advantages that a water cooling pipeline is added at the upper end of the CPU chip, cold water is circulated through a circulating pump, and cold air is quickly discharged to the CPU chip through a fan at the upper end of the water cooling pipeline, so that the CPU chip can dissipate heat quickly, and the heat dissipation structure is simple in integral structure and convenient to disassemble; wherein, the deficiency points are as follows:

the device can not refrigerate the internal cold water, the refrigerating effect can be obviously reduced after the device is used for a period of time, the internal cold water is not easy to replace, the water quality is easy to mildew, and the structure of the device is insufficient to save energy, and the heat emission is too much.

SUMMERY OF THE UTILITY MODEL

The utility model aims to: in order to solve the above problems, a heat dissipation mechanism for a computer chip is provided.

The technical scheme adopted by the utility model is as follows: a computer chip heat dissipation mechanism comprises a computer shell, wherein a water circulation refrigeration mechanism, an exhaust refrigeration mechanism and a water-cooling liquid exchange structure are arranged inside the computer shell.

Wherein, water circulating refrigeration mechanism includes: water-cooling liquid holds chamber, water-cooling tube, refrigeration chamber, fin, CPU cold head, fan, motor, gear pump, drainage gear, the inside fixed mounting of computer shell has the CPU cold head, the inside cavity of computer shell is provided with the water-cooling liquid and holds the chamber, water-cooling liquid holds the chamber and is connected with refrigeration chamber and gear pump through the water-cooling tube, and the water-cooling tube top is "S" type and spirals on the CPU cold head, refrigeration chamber one side fixed mounting has the fin, the outside fixed mounting that is close to fin one side of computer shell has the fan, the top fixed mounting of the inside gear pump of computer shell has the motor, and motor output shaft passes the gear pump and extends to the gear pump outside, the motor is connected with drainage gear through output shaft middle part, and drainage gear sets up inside the gear pump.

Wherein, exhaust refrigeration mechanism includes: the computer cooling system comprises an exhaust fan and air inlet fan blades, wherein the exhaust fan is fixedly mounted on two sides of a CPU cold head on the top of a computer shell, and the air inlet fan blades are connected to the top of a motor through an output shaft.

Wherein, trade water-cooling liquid structure includes: the computer shell comprises a pouring valve and a liquid inlet pipe, wherein the pouring valve is fixedly installed at the bottom of a water-cooling liquid containing cavity on one side of the computer shell, the liquid inlet pipe is fixedly installed at the top of the water-cooling liquid containing cavity, and the liquid inlet pipe extends to the outside of the computer shell.

In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that:

1. according to the utility model, after the chip is heated, heat can be absorbed by water cooling liquid in the water cooling tube, the water cooling liquid containing cavity is circulated to the refrigerating cavity by the water cooling tube through the gear pump, and the radiating fins in the refrigerating cavity can refrigerate the water cooling liquid with increased temperature.

2. According to the utility model, when the water cooling liquid needs to be replaced, the water cooling liquid is poured through the liquid inlet pipe, the leakage-proof ball moves backwards when meeting external pressure and enters the water cooling liquid containing cavity, the leakage-proof ball is pressed to block the liquid inlet pipe when the pressure exists in the water cooling liquid containing cavity, and the pouring valve can conveniently pour out the water cooling liquid needing to be replaced.

3. According to the utility model, the motor is connected with the air inlet fan blades through the top of the output shaft, the motor not only provides power for the gear pump, but also provides power for the air inlet fan blades, so that the power consumption is reduced, the energy is saved, the heat emission is reduced, and the exhaust fan can effectively exhaust the internal hot air.

Drawings

FIG. 1 is a schematic diagram of the front structure of the present invention;

FIG. 2 is a schematic top view of a gear pump according to the present invention;

FIG. 3 is a schematic diagram of a three-dimensional structure of a motor and a drain gear in the present invention.

The labels in the figure are: 1. a computer housing; 2. a water-cooling liquid holding chamber; 201. a dump valve; 3. a liquid inlet pipe; 4. a water-cooled tube; 5. a refrigeration cavity; 501. a heat sink; 502. a fan; 6. cooling the CPU; 7. an exhaust fan; 8. a motor; 801. a gear pump; 802. an air intake fan blade; 803. a water discharge gear.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the utility model:

referring to fig. 1-3, a computer chip heat dissipation mechanism includes a computer housing 1, and a water circulation refrigeration mechanism, an exhaust refrigeration mechanism and a water-cooling liquid exchange structure are disposed inside the computer housing 1.

In this embodiment, the water circulation refrigeration mechanism includes: the water cooling liquid storage cavity 2, the water cooling pipe 4, the refrigeration cavity 5, the radiating fin 501, the fan 502, the CPU cold head 6, the motor 8, the gear pump 801 and the drainage gear 803;

the CPU cold head 6 is installed in the laminating of the CPU one side in the computer shell 1, the inside cavity of the computer shell 1 is provided with a water-cooling liquid containing cavity 2, the water-cooling liquid containing cavity 2 is connected with a refrigerating cavity 5 and a gear pump 801 through a water-cooling pipe 4, the top of the water-cooling pipe 4 is coiled on the CPU cold head 6 in an S shape, a radiating fin 501 is fixedly installed on one side of the refrigerating cavity 5, a fan 502 is fixedly installed on one side, close to the radiating fin 501, of the outside of the computer shell 1, heat can be absorbed by the water-cooling liquid in the water-cooling pipe 4 after the CPU cold head 6 generates heat, the water-cooling liquid containing cavity 2 is circulated to the refrigerating cavity 5 through the gear pump 801, the radiating fin 501 in the refrigerating cavity 5 can absorb the temperature of the water-cooling liquid to the outside, the heat is discharged by the fan 502, and the water-cooling liquid is used for refrigerating.

In this embodiment, the motor 8 is fixedly mounted above the gear pump 801 inside the computer housing 1, the output shaft of the motor 8 passes through the gear pump 801 and extends to the outside of the gear pump 801, the middle of the motor 8 is connected with the drainage gear 803 through the output shaft, the drainage gear 803 is arranged inside the gear pump 801, and the starting motor 8 drives the drainage gear 803 to rotate through the output shaft, so as to provide kinetic energy for the gear pump 801, thereby circulating the water-cooling liquid.

In this embodiment, the exhaust refrigeration mechanism includes: exhaust fan 7, intake fan 802;

the both sides of computer housing 1 top CPU cold head 6 all fixed mounting have exhaust fan 7, and motor 8 is connected with air inlet fan blade 802 through the top of output shaft, and motor 8 both provides power for gear pump 801, also provides power for air inlet fan blade 802, has reduced electric power and has used, reduces the heat emission when more energy-conserving, and exhaust fan 7 can be with the effectual discharge of inside steam.

In this embodiment, trade water-cooling liquid structure includes: a dump valve 201, a liquid inlet pipe 3;

the bottom fixed mounting that computer shell 1 one side water-cooling liquid held chamber 2 has a valve 201 that pours, and the top fixed mounting that the water-cooling liquid held chamber 2 has feed liquor pipe 3, and feed liquor pipe 3 extends to computer shell 1 outside, opens the valve when the water-cooling liquid needs to be changed and pours the water-cooling liquid into through feed liquor pipe 3, and the valve 201 that pours can be convenient pours the water-cooling liquid that needs to be changed.

In this embodiment, the exhaust fan 7 and the motor 8 are both electrically connected to an external power source.

The working principle is as follows: firstly, water cooling liquid is poured into the water cooling liquid through the liquid inlet pipe 3, then the starting motor 8 drives the drainage gear 803 to rotate through the output shaft, kinetic energy is provided for the gear pump 801, thereby circulating the water cooling liquid, absorbing the heat of the CPU cold head 6 after heating by the water cooling liquid in the water cooling tube 4, the water cooling liquid containing cavity 2 is circulated to the refrigerating cavity 5 by the water cooling pipe 4 through the gear pump 801, the temperature of the water cooling liquid is absorbed to the outside by the radiating fins 501 in the refrigerating cavity 5, the heat is discharged by the fan 502, and the water cooling liquid is used for refrigerating, meanwhile, the motor 8 not only provides power for the gear pump 801, but also provides power for the air inlet fan blades 802 to suck in outside air, so that the use of electric power is reduced, more energy is saved, heat emission is reduced, and the inside steam can be effectively discharged by the exhaust fan 7, and the water cooling liquid to be replaced can be conveniently poured out by the pouring valve 201 when the water cooling liquid needs to be replaced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A computer chip heat dissipation mechanism, includes computer shell (1), its characterized in that: a water circulation refrigeration mechanism, an exhaust refrigeration mechanism and a water-cooling liquid exchange structure are arranged in the computer shell (1);

the water circulation refrigeration mechanism comprises: the water cooling system comprises a water cooling liquid containing cavity (2), a water cooling pipe (4), a refrigerating cavity (5), a radiating fin (501), a fan (502), a CPU cold head (6), a motor (8), a gear pump (801) and a drainage gear (803);

a CPU cold head (6) is mounted on one side of a CPU in the computer shell (1) in a fitting manner, a water cooling liquid containing cavity (2) is arranged in the computer shell (1) in a hollow manner, the water cooling liquid containing cavity (2) is connected with a refrigerating cavity (5) and a gear pump (801) through a water cooling pipe (4), the top of the water cooling pipe (4) is S-shaped and is spirally wound on the CPU cold head (6), a radiating fin (501) is fixedly mounted on one side of the refrigerating cavity (5), and a fan (502) is fixedly mounted on one side, close to the radiating fin (501), of the outer portion of the computer shell (1);

the computer shell (1) is characterized in that a motor (8) is fixedly mounted above the gear pump (801), an output shaft of the motor (8) penetrates through the gear pump (801) to extend to the outer side of the gear pump (801), the middle of the motor (8) is connected with a drainage gear (803) through the output shaft, and the drainage gear (803) is arranged inside the gear pump (801).

2. The computer chip heat dissipation mechanism of claim 1, wherein: the exhaust refrigeration mechanism includes: an exhaust fan (7) and an air inlet fan blade (802);

the computer is characterized in that exhaust fans (7) are fixedly mounted on two sides of a CPU cold head (6) on the top of the computer shell (1), and the motor (8) is connected with air inlet fan blades (802) through the top of an output shaft.

3. The computer chip heat dissipation mechanism of claim 1, wherein: trade water-cooling liquid structure includes: a dump valve (201) and a liquid inlet pipe (3);

computer shell (1) one side water-cooling liquid holds bottom fixed mounting in chamber (2) and has a valve of dumping (201), the top fixed mounting that the water-cooling liquid held chamber (2) has feed liquor pipe (3), and feed liquor pipe (3) extend to computer shell (1) outside.