CN206058098U - A kind of heat radiator of computer CPU - Google Patents
A kind of heat radiator of computer CPU Download PDFInfo
- Publication number
- CN206058098U CN206058098U CN201620789197.6U CN201620789197U CN206058098U CN 206058098 U CN206058098 U CN 206058098U CN 201620789197 U CN201620789197 U CN 201620789197U CN 206058098 U CN206058098 U CN 206058098U
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- CN
- China
- Prior art keywords
- housing
- storage tank
- heat
- heat conduction
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This utility model belongs to field of computer technology, and in particular to a kind of heat radiator of computer CPU.The heat radiator of computer CPU, including housing, heat conduction briquetting, radiating tube, storage tank and radiator fan, the housing bottom is provided with heat conduction briquetting, housing is provided with storage tank, radiating tube is wound with the heat conduction briquetting, radiating tube two ends connect to form loop with storage tank, radiating tube is provided with water pump with the outlet of storage tank connectivity part, in the housing, correspondence heat conduction briquetting is provided with radiator fan, and housing is symmetrically arranged on two with multiple diversion fans.Its advantage is：Simple structure, it is easy to assembly, strengthen the radiating effect of radiator fan.
Description
Technical field
This utility model belongs to field of computer technology, and in particular to a kind of heat radiator of computer CPU.
Background technology
In the product design field of computer, the radiating of system decides the design success or failure of whole product.In mainboard, central authorities
In all components and parts such as processor (Central Processing Unit, abbreviation CPU), internal memory, hard disk, the power consumption of CPU is most
Greatly, caloric value is maximum, and maximum wattage, reaches as many as 130W, if radiating treatment is bad, just cannot play CPU most at present
Big performance.Existing cpu heat is the CPU radiatings for extruding the different profiles of composition using multiple metal monoliths by external force mostly
Device fin, is radiated by radiator fins, during CPU heat dissipation designs, will obtain preferable heat dispersion, often
The following two kinds method can be used comprehensive：One is the size for increasing radiator helping radiate；Two is to install high-power, high-revolving
Fan, carrys out additional cooler and is radiated.But problem present in said method is：The volume of radiator is larger, cost
It is higher, it is big using noise during fan cooling, and also fan belongs to easily worn part, brings certain wind to the stability of whole system
Danger.
Utility model content
This utility model is in order to make up the defect of prior art, there is provided a kind of simple structure, the calculating of good heat dissipation effect
Machine CPU heat abstractors.
This utility model is achieved by the following technical solution：
A kind of heat radiator of computer CPU, including housing, heat conduction briquetting, radiating tube, storage tank and radiator fan, it is described
Housing bottom is provided with heat conduction briquetting, and housing is provided with storage tank, is wound with radiating tube on the heat conduction briquetting, radiating tube two ends with
Storage tank connects to form loop, and radiating tube is provided with water pump with the outlet of storage tank connectivity part, correspondence heat conduction pressure in the housing
Block is provided with radiator fan, and housing is symmetrically arranged on two with multiple diversion fans, and radiator fan, diversion fan and water pump are respectively by leading
Line is connected with power supply.
Further, the housing is symmetrically arranged on two with fastening bolt positioned at heat conduction briquetting, and housing is carried out by fastening bolt
Assembling.
Further, liquid level sensor is provided with the storage tank, storage tank is provided with filling opening.
Further, the radiating tube is heat dissipation copper pipe.
Further, on the heat conduction briquetting that the radiating tube is wound into screw thread shape.
The beneficial effects of the utility model are：A kind of heat radiator of computer CPU simple structure of this utility model, assembling side
Just, being assembled by fastening bolt, making heat conduction briquetting thermal contact conductance be carried out with CPU, the coolant in storage tank is by radiating
Pipe flow moves and absorbs the heat on heat conduction briquetting, and the heat on radiating tube and heat conduction briquetting is shed by radiator fan, diversion fan
Air circulation in aggravation housing, strengthens the radiating effect of radiator fan.
Description of the drawings
Below in conjunction with the accompanying drawings this utility model is further described.
Accompanying drawing 1 is structural representation of the present utility model.
In figure, 1 housing, 2 heat conduction briquettings, 3 radiating tubes, 4 storage tanks, 5 water pumps, 6 radiator fans, 7 fastening bolts, 8 liquid feedings
Mouthful, 9 diversion fans, 10 liquid level sensors, 11 wires.
Specific embodiment
Accompanying drawing 1 is a kind of specific embodiment of the present utility model.A kind of heat radiator of computer CPU of the utility model, bag
Housing 1, heat conduction briquetting 2, radiating tube 3, storage tank 4 and radiator fan 6 are included, 1 bottom of the housing is provided with heat conduction briquetting 2, housing 1
Storage tank 4 is provided with, radiating tube 3 on the heat conduction briquetting 2, is wound with, 3 two ends of radiating tube connects to form loop with storage tank 4,
Radiating tube 3 is provided with water pump 5 with the outlet of 4 connectivity part of storage tank, and in the housing 1, correspondence heat conduction briquetting 2 is provided with radiator fan
6, housing 1 is symmetrically arranged on two with multiple diversion fans 9, and radiator fan 6, diversion fan 9 and water pump 5 are respectively by wire 11 and electricity
Source connects.
Further, the housing 1 is symmetrically arranged on two with fastening bolt 7 positioned at heat conduction briquetting 2, and housing 1 passes through fastening bolt 7
Assembled.
Further, liquid level sensor 10 is provided with the storage tank 4, storage tank 4 is provided with filling opening 8.
Further, the radiating tube 3 is heat dissipation copper pipe.
Further, on the heat conduction briquetting 2 of 3 one-tenth screw thread shape windings of the radiating tube.
This utility model is not limited to above-mentioned embodiment, and anyone should learn what is made under enlightenment of the present utility model
There is same or like technical scheme with this utility model, each fall within protection domain of the present utility model.
Technology that this utility model is not described in detail, shape, construction part are known technology.
Claims (5)
1. a kind of heat radiator of computer CPU, including housing, heat conduction briquetting, radiating tube, storage tank and radiator fan, its feature
Be that the housing bottom is provided with heat conduction briquetting, housing is provided with storage tank, radiating tube is wound with the heat conduction briquetting, dissipate
Heat pipe two ends connect to form loop with storage tank, and radiating tube is provided with water pump with the outlet of storage tank connectivity part, in the housing
Correspondence heat conduction briquetting is provided with radiator fan, and housing is symmetrically arranged on two with multiple diversion fans, radiator fan, diversion fan and water pump
Connected with power supply by wire respectively.
2. a kind of heat radiator of computer CPU according to claim 1, is characterized in that：The housing is located at heat conduction briquetting
Fastening bolt is symmetrically arranged on two with, housing is assembled by fastening bolt.
3. a kind of heat radiator of computer CPU according to claim 1, is characterized in that：Liquid level is provided with the storage tank
Sensor, storage tank are provided with filling opening.
4. a kind of heat radiator of computer CPU according to claim 1, is characterized in that：The radiating tube is heat dissipation copper pipe.
5. a kind of heat radiator of computer CPU according to claim 1, is characterized in that：The radiating tube is twined into screw thread shape
Around heat conduction briquetting on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620789197.6U CN206058098U (en) | 2016-07-26 | 2016-07-26 | A kind of heat radiator of computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620789197.6U CN206058098U (en) | 2016-07-26 | 2016-07-26 | A kind of heat radiator of computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206058098U true CN206058098U (en) | 2017-03-29 |
Family
ID=58376742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620789197.6U Expired - Fee Related CN206058098U (en) | 2016-07-26 | 2016-07-26 | A kind of heat radiator of computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206058098U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
-
2016
- 2016-07-26 CN CN201620789197.6U patent/CN206058098U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170329 Termination date: 20170726 |