CN214957804U - Water-cooling temperature control system - Google Patents
Water-cooling temperature control system Download PDFInfo
- Publication number
- CN214957804U CN214957804U CN202121331562.6U CN202121331562U CN214957804U CN 214957804 U CN214957804 U CN 214957804U CN 202121331562 U CN202121331562 U CN 202121331562U CN 214957804 U CN214957804 U CN 214957804U
- Authority
- CN
- China
- Prior art keywords
- water
- cooling
- temperature control
- cooled
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a water-cooling temperature control system, which comprises a water tank, a water pump, a water-cooling temperature control module and a cooled object which are connected into a loop through a circulating pipeline, wherein the circulating pipelines at the front end and the rear end of the cooled object are respectively connected with a front temperature sensor and a rear temperature sensor; the water-cooling temperature control module comprises a TEC module, the hot end of the TEC module is fixedly attached to the radiator, the cold end of the TEC module is fixedly attached to the heat-conducting water-cooling plate, and a cooling water channel is arranged in the heat-conducting water-cooling plate. The volume of the water-cooling temperature control module of the utility model can be reduced to 0.1m3Within 1m of the traditional method3The size of the product is reduced by more than one tenth, so that the whole system is more portable and flexible to be applied to various fieldsA synthetic environment; the utility model discloses a TEC and thermistor's real-time feedback and accuse temperature, rated power consumption can be controlled within 50W, great reduction the loss of power consumption, the cost is reduced.
Description
Technical Field
The utility model relates to a cooling device, in particular to water-cooling temperature control system.
Background
When active, semiconductor pump modules generate a large amount of heat. The existing water-cooling temperature control system mostly adopts a water-cooling machine to control the temperature of a water channel, has larger size and is not compact, and the volume is basically 1m3And the system is difficult to be integrated into a product with a narrow internal space, and has high cost and large power consumption.
It is therefore desirable to design a new cooling system to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a water-cooling temperature control system has solved the water-cooling temperature control system size that has currently been used for semiconductor pumping module great, and is not compact, is difficult to integrate to go in the middle of the narrow and small product of inner space, and is with high costs moreover, defect that the consumption is big.
The technical scheme of the utility model is realized like this:
a water-cooling temperature control system comprises a water tank, a water pump, a water-cooling temperature control module and a cooled object which are sequentially connected into a loop through a circulating pipeline, wherein the circulating pipelines at the front end and the rear end of the cooled object are respectively connected with a front temperature sensor and a rear temperature sensor; the water-cooling temperature control module comprises a TEC module, a hot end of the TEC module is fixedly attached to the radiator, a cold end of the TEC module is fixedly attached to the heat-conducting water-cooling plate, a cooling water channel is arranged in the heat-conducting water-cooling plate, a water inlet end and a water outlet end of the cooling water channel are respectively connected with the circulating pipeline, and the water-cooling temperature control module further comprises a temperature sensor for detecting the internal temperature of the cooling water channel or the temperature of the heat-conducting water-cooling plate.
Further, a heat radiation fan is arranged on the periphery of the heat radiator.
Furthermore, the radiator is a fin-inserted radiator, and the radiator is made of aluminum or copper.
Further, the heat conduction type water-cooling plate is an aluminum plate or a copper plate.
Furthermore, the cooling water channel is arranged in the heat-conducting water-cooling plate in a back-and-forth bending mode, and the water inlet end and the water outlet end of the cooling water channel are respectively arranged on two opposite sides of the heat-conducting water-cooling plate.
Furthermore, a cooling pipe is arranged in the cooled object or wound on the surface of the cooled object, and the inlet end and the outlet end of the cooling pipe are respectively connected with the circulating pipeline.
Further, the temperature sensor, the front temperature sensor and the rear temperature sensor are all thermistors.
Further, the object to be cooled is a semiconductor-side pump module.
The utility model has the advantages that:
1. the volume of a water cooling machine of the existing water cooling temperature control system is basically 1m3Left and right, the utility model discloses a water-cooling temperature control module volume can reduce to 0.1m3Within, the volume is reduced by more than one tenth, thereby reducing the volume of the product and leading the whole system to be more portable and flexibly applied to various occasions and environments.
2. The rated consumption of standard temperature of current water-cooling temperature control system all is more than 1kW, the utility model discloses a TEC and thermistor's real-time feedback and accuse temperature, rated consumption can be controlled within 50W, great reduction the loss of power consumption, the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a connection block diagram of the present invention;
FIG. 2 is a schematic view of the structure of the middle water-cooling temperature control module of the present invention;
fig. 3 is a schematic view of a sectional structure of the middle heat-conducting water-cooling plate of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a water-cooling temperature control system comprises a water tank 1, a water pump 2, a water-cooling temperature control module 3 and an object to be cooled 4 which are sequentially connected into a loop through a circulating pipeline 5, wherein the circulating pipelines at the front end and the rear end of the object to be cooled 4 are respectively connected with a front temperature sensor 51 and a rear temperature sensor 52; the water-cooling temperature control module 3 comprises a TEC module 31, the hot end of the TEC module 31 is fixedly attached to the radiator 32, the cold end of the TEC module 31 is fixedly attached to the heat-conducting water-cooling plate 33, a cooling water channel 331 is arranged in the heat-conducting water-cooling plate 33, the water inlet end and the water outlet end of the cooling water channel 331 are respectively connected with the circulating pipeline 5, and the water-cooling temperature control module further comprises a temperature sensor 34 for detecting the internal temperature of the cooling water channel or the temperature of the heat-conducting water-cooling plate.
If the heat quantity of the object 4 to be cooled is high, in order to ensure the heat dissipation effect, a heat dissipation fan 35 is arranged on the periphery of the heat sink 32, and the heat dissipation is carried out by matching with the heat sink 32; the heat radiation fan 35 may not be used if the heat quantity of the object 4 to be cooled is not so high.
The radiator 32 is a fin-inserted radiator, the radiator 32 is made of aluminum or copper, and the aluminum plate and the copper plate have good heat-conducting performance.
The heat-conducting water-cooling plate 33 is an aluminum plate or a copper plate, and the aluminum plate and the copper plate have good heat-conducting properties.
The cooling water channel 331 is disposed in the heat-conducting water-cooling plate 33 in a back-and-forth bending manner, and a water inlet end and a water outlet end of the cooling water channel 331 are disposed on two opposite sides of the heat-conducting water-cooling plate 33, respectively. The back and forth bending may arrange the cooling water passage 331 as long as possible in a unit area, improving heat exchange performance. When the cooling water channel 331 is processed, a horizontal transverse hole and a horizontal longitudinal hole may be formed on the heat-conducting water-cooling plate 33, and then the plug 36 is inserted into the punched hole, so that the cooling water channel 331 forms a water flow channel which is bent back and forth, and the sealing property is ensured.
Wherein, the inside of the object 4 to be cooled is provided with a cooling pipe or the surface of the object is wound with a cooling pipe, and the inlet end and the outlet end of the cooling pipe are respectively connected with the circulating pipeline 5.
The temperature sensor 34, the front temperature sensor 51 and the rear temperature sensor 52 are all thermistors.
As a further example, the object 4 to be cooled is a semiconductor-side pump module.
This embodiment during operation, the water of depositing in the water tank 1 sends into water-cooling temperature control module 3 through water pump 2, water flows the back from cooling water course 331, the heat of aquatic passes through heat conduction type water-cooling board 33 and transmits the cold junction for TEC module 1, when electric current passes through TEC module 1, the cold junction endotherm of TEC module 1, and pass the heat of cold junction absorption for the hot junction, release heat through the hot junction, the heat that the hot junction emitted dispels the heat through radiator 2 again, the water that is refrigerated is through by refrigerated object 4, cool off refrigerated object 4, get into water tank 1 at last, get into next circulation.
Wherein, water tank 1 is used for depositing the water, and water pump 2 plays the power effect, and water pump 2 promotes water and loops through water tank 1, water pump 2, water-cooling temperature control module 3 and by the cooling object 4 along circulating line 5 and carry out the circulation flow, and water tank 1, water pump 2 cooperate water-cooling temperature control module 3 to reach the effect of replacing current water cooling plant.
The volume of a water cooling machine of the existing water cooling temperature control system is basically 1m3Left and right, the utility model discloses a 3 volumes of water-cooling temperature control module can reduce to 0.1m3Within, the volume is reduced by more than one tenth, thereby reducing the volume of the product and leading the whole system to be more portable and flexibly applied to various occasions and environments.
The rated consumption of standard temperature of current water-cooling temperature control system all is more than 1kW, the utility model discloses a TEC and thermistor's real-time feedback and accuse temperature, rated consumption can be controlled within 50W, great reduction the loss of power consumption, the cost is reduced.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a water-cooling temperature control system which characterized in that:
the water cooling temperature control device comprises a water tank, a water pump, a water cooling temperature control module and an object to be cooled which are sequentially connected into a loop through a circulating pipeline, wherein the circulating pipelines at the front end and the rear end of the object to be cooled are respectively connected with a front temperature sensor and a rear temperature sensor;
the water-cooling temperature control module comprises a TEC module, a hot end of the TEC module is fixedly attached to the radiator, a cold end of the TEC module is fixedly attached to the heat-conducting water-cooling plate, a cooling water channel is arranged in the heat-conducting water-cooling plate, a water inlet end and a water outlet end of the cooling water channel are respectively connected with the circulating pipeline, and the water-cooling temperature control module further comprises a temperature sensor for detecting the internal temperature of the cooling water channel or the temperature of the heat-conducting water-cooling plate.
2. The water-cooled temperature control system of claim 1, wherein: and the periphery of the radiator is provided with a radiating fan.
3. The water-cooled temperature control system of claim 1, wherein: the radiator is an inserting piece type radiator, and the radiator is made of aluminum or copper.
4. The water-cooled temperature control system of claim 1, wherein: the heat-conducting water-cooling plate is an aluminum plate or a copper plate.
5. The water-cooled temperature control system of claim 1, wherein: the cooling water channel is arranged in the heat-conducting water-cooling plate in a back-and-forth bending mode, and the water inlet end and the water outlet end of the cooling water channel are respectively arranged on two opposite sides of the heat-conducting water-cooling plate.
6. The water-cooled temperature control system of claim 1, wherein: the inside of the cooled object is provided with a cooling pipe or the surface of the cooled object is wound with a cooling pipe, and the inlet end and the outlet end of the cooling pipe are respectively connected with the circulating pipeline.
7. The water-cooled temperature control system of claim 1, wherein: the temperature sensor, the front temperature sensor and the rear temperature sensor are all thermistors.
8. The water-cooled temperature control system of claim 1, wherein: the object to be cooled is a semiconductor-side pump module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121331562.6U CN214957804U (en) | 2021-06-16 | 2021-06-16 | Water-cooling temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121331562.6U CN214957804U (en) | 2021-06-16 | 2021-06-16 | Water-cooling temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214957804U true CN214957804U (en) | 2021-11-30 |
Family
ID=79051323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121331562.6U Active CN214957804U (en) | 2021-06-16 | 2021-06-16 | Water-cooling temperature control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214957804U (en) |
-
2021
- 2021-06-16 CN CN202121331562.6U patent/CN214957804U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102055043A (en) | Battery and battery module | |
| CN214957804U (en) | Water-cooling temperature control system | |
| CN205491614U (en) | Integral type cooling device | |
| CN206895114U (en) | A kind of positioning radiator of communication apparatus | |
| CN114531825B (en) | Power auxiliary heat dissipation design method, server power supply and data center | |
| CN204131372U (en) | A kind of mine-used frequency-converter cooling device | |
| CN205665634U (en) | Liquid cooling's rack -mounted server | |
| CN213184963U (en) | High-power semiconductor laser | |
| CN215011244U (en) | Liquid cooling heat dissipation and waste heat recovery heating equipment and liquid cooling heating rack | |
| CN210463394U (en) | Novel semiconductor water-cooling air conditioner | |
| CN112123723A (en) | Cooling system of injection mold | |
| CN220083755U (en) | Spiral condenser | |
| CN213213274U (en) | Heat radiator for single-phase asynchronous motor | |
| CN220556290U (en) | Cooling water heat energy recycling device | |
| CN210569344U (en) | Industrial semiconductor water cooling equipment | |
| CN210070701U (en) | Multimode protection type variable frequency radiator | |
| CN217210477U (en) | Coal industry cooling device | |
| CN210537207U (en) | Radiator, air conditioner frequency converter with radiator and electronic equipment | |
| CN220798901U (en) | DC/DC power supply heat abstractor | |
| CN219693410U (en) | Heating device | |
| CN213916185U (en) | Prevent overheated formula cutter welding machine | |
| CN220791650U (en) | Hydraulic power station | |
| CN217252660U (en) | Up-drawing continuous casting impregnated copper rod leading-in device capable of rapidly dissipating heat | |
| CN208752565U (en) | A kind of heat radiator of computer CPU | |
| CN220240041U (en) | Pouring cooling device for valve casting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |