CN210569344U

CN210569344U - Industrial semiconductor water cooling equipment

Info

Publication number: CN210569344U
Application number: CN201921036608.4U
Authority: CN
Inventors: 汪湖川
Original assignee: Suzhou Gefan Hardware Plastic Industry Co Ltd
Current assignee: Suzhou Gefan Hardware Plastic Industry Co Ltd
Priority date: 2019-07-04
Filing date: 2019-07-04
Publication date: 2020-05-19
Anticipated expiration: 2029-07-04

Abstract

The utility model discloses an industrial semiconductor water cooling equipment, the power distribution box comprises a box body, be equipped with circulating water equipment and electrical control unit in the box, circulating water equipment and electrical control unit all with box fixed connection, circulating water equipment includes coolant tank and the circulating water pump who sets up in the coolant tank, circulating water pump's delivery port fixedly connected with inlet tube, the outer fixed surface of box upside is connected with radiating unit, the last cold water outlet pipe that is connected with of radiating unit, the inside fixedly connected with of box goes out the water interface board, the cold water outlet pipe communicates with going out the water interface board, it installs a plurality of connectors on the interface board to go out the water, the connector stretches out the box, fixedly connected with water backward flow interface board in the box, water; the heat dissipation unit comprises an N-type semiconductor and a P-type semiconductor which are jointly clamped and connected with a conducting strip. Which can cool the equipment and reduce the noise generation at the same time.

Description

Industrial semiconductor water cooling equipment

Technical Field

The utility model relates to a cooling arrangement, concretely relates to industry semiconductor water cooling plant.

Background

With the rapid development of the industry, various industrial devices are more and more precise and complex, the requirements of a large number of local devices on the temperature are more and more strict, and the application of local cooling and constant temperature control technologies is generated in order to solve the problem of local heat dissipation and cooling of the devices or the problem of keeping a certain temperature range constant. The equipment units with severe temperature requirements are generally refrigerated by using refrigeration equipment, and then the local parts of the equipment units are cooled by using cooled water, and the refrigeration equipment is water cooling equipment.

Traditional water cooling equipment is cooled down recirculated cooling water by compressor, makes the cooling water pass through the pipeline and reaches equipment needs cooling or need keep homothermal position by circulating water pump, takes away equipment local heat, then circulates through return flow return water tank.

The compressor type cold water equipment generates a large amount of heat when the compressor is used for refrigerating, so that a large fan is arranged at the top of the equipment, the heat of the compressor is conveniently dissipated, and the compressor is prevented from being broken down due to overhigh temperature. However, the large fan rotates at a high speed when dissipating heat of the compressor, and generates very large noise;

disclosure of Invention

In order to overcome the not enough among the prior art, the utility model provides an industry semiconductor water cooling plant, it can be when equipment cooling, and noise abatement produces.

In order to achieve the purpose, the utility model discloses an industrial semiconductor water cooling equipment, the power distribution box comprises a box body, be equipped with the division board in the box, the both sides of division board are equipped with circulating water equipment and electrical control unit respectively, circulating water equipment and electrical control unit all with box fixed connection, circulating water equipment includes cooling water tank and the circulating water pump that sets up in the cooling water tank, circulating water pump's delivery port fixedly connected with inlet tube, the outer surface fixedly connected with radiating unit of box upside, electrical control unit is connected with radiating unit electricity, the inlet tube is connected with radiating unit, the last cold water outlet pipe that is connected with radiating unit, the inside fixedly connected with of box goes out the water interface board, the cold water outlet pipe communicates with going out the water interface board, it installs a plurality of connectors on the play water interface board, the connector stretches out the box, the fixedly connected with; the heat dissipation unit comprises an N-type semiconductor and a P-type semiconductor which are jointly clamped and connected with a conducting strip.

Furthermore, the electric control unit comprises a PLC controller and a power supply, wherein the anode of the power supply is electrically connected with the N-type semiconductor, and the cathode of the power supply is electrically connected with the P-type semiconductor.

Furthermore, a temperature controller is fixedly connected to the box body and electrically connected with the electric control unit.

Furthermore, a water adding and discharging pipe is fixedly connected to the cooling water tank, and a valve is connected to the water adding and discharging pipe.

Further, the cooling water tank is connected with a water tank liquid level device.

Furthermore, the upper end of the heat dissipation unit is fixedly connected with a plurality of heat dissipation fins.

Has the advantages that: the heat dissipation unit is arranged, the N-type semiconductor and the P-type semiconductor in the heat dissipation unit absorb heat after the electric control unit is electrified, the temperature of cooling water in the cooling water tank is taken away, and a compressor and a fan are not used, so that noise is reduced.

Drawings

The invention will be further described and illustrated with reference to the accompanying drawings.

FIG. 1 is a schematic structural view of the whole of the present embodiment;

FIG. 2 is a schematic structural view of the back of the present embodiment;

fig. 3 is an exploded view of the present embodiment.

Reference numerals: 1. a box body; 2. a separator plate; 3. a water circulating apparatus; 4. an electrical control unit; 5. a water inlet pipe; 6. a heat dissipation unit; 7. a cold water outlet pipe; 8. a water outlet interface plate; 9. a connector; 10. a water return interface plate; 11. a temperature controller; 12. adding a drainage pipe; 13. a valve; 14. a tank level gauge; 15. and a heat sink.

Detailed Description

The technical solution of the present invention will be more clearly and completely explained by the description of the preferred embodiments of the present invention with reference to the accompanying drawings.

Example (b): the industrial semiconductor water cooling equipment comprises a box body 1, wherein a position in the middle of the inside of the box body 1 is fixedly connected with a partition plate 2, and the partition plate 2 divides the box body 1 into two mutually-closed parts.

Fixedly connected with circulating water equipment 3 in the left side box 1 of division board 2, circulating water equipment 3 includes a cooling water tank of fixed connection in box 1, embeds a circulating pump in the cooling water tank, and the circulating pump is used for taking the water in the cooling water tank out of cooling water tank. An outlet of the circulating pump is connected with a water inlet pipe 5, the top end of the outer side of the box body 1 is fixedly connected with a heat dissipation unit 6, the water inlet pipe 5 is communicated with the interior of the heat dissipation unit 6, the heat dissipation unit 6 is communicated with a cold water outlet pipe 7, the cold water outlet pipe 7 is connected with a water outlet interface board 8, and the water outlet interface board 8 is fixedly connected to the left side of the partition board 2 of the box body 1. Eight connectors 9 are arranged on the water outlet interface board 8, the connectors 9 extend out of the box body 1, each connector 9 is provided with an independent control valve to control the opening and closing of the connector 9, a water backflow interface board 10 is fixedly connected in the box body 1 to collect water flowing from the connectors 9 to equipment, and the water backflow interface board 10 is communicated with the cooling water tank.

The principle of the water cooling equipment for cooling other equipment is as follows: the circulating pump pumps water into the heat dissipation unit 6 from the cooling water tank, the heat dissipation unit 6 cools the cooling water, the cooled cooling water is sent into the water outlet interface board 8 through the cold water outlet pipe 7, the connectors 9 in the water outlet interface board 8 perform multi-path management on the cooling water, the cooling water is sent to a plurality of other devices for multi-path cooling, the cooling water cooled by the other devices absorbs the temperature of the other devices, and the cooling water is heated and then flows into the cooling water tank through the water backflow interface board 10 again to form circulation.

The heat dissipation unit 6 is mainly cooled by semiconductors, and the heat dissipation unit 6 comprises an N-type semiconductor and a P-type semiconductor, and an electric conduction sheet is clamped and connected between the N-type semiconductor and the P-type semiconductor. The N-type semiconductor is a silicon semiconductor doped with phosphorus and arsenic, the P-type semiconductor is a silicon semiconductor doped with boron and gallium, and the conducting strip is a copper material. When a current flows from the N-type semiconductor to the P-type semiconductor, one of the two ends of the N-type semiconductor or the P-type semiconductor radiates heat, and the other end of the N-type semiconductor or the P-type semiconductor absorbs heat. The heat absorbing end of the N-type semiconductor or the P-type semiconductor faces downward, and the cooling water pumped out from the cooling water tank by the circulating pump is in contact with the heat absorbing end of the N-type semiconductor or the P-type semiconductor, so that the heat in the cooling water can be absorbed.

Be equipped with electrical control unit 4 on the right side of division board 2, electrical control unit 4 is connected with heat dissipation unit 6 electricity, and electrical control unit 4 includes PLC controller and power, and the positive pole of power is connected with N type semiconductor electricity, and the negative pole and the P type semiconductor electricity of power are connected, and electrical control unit 4 supplies power for heat dissipation unit 6, and wherein the PLC controller can adopt the PLC controller of model FX 3U-16.

The upper end of the heat dissipation unit 6 is a heat-releasing end, a heat dissipation fin 15 is fixedly arranged at the upper end of the heat dissipation unit 6, the heat dissipation fin 15 is made of copper, air heated by the heat dissipation unit 6 is in contact with the heat dissipation fin 15, and heat is dissipated out of the heat dissipation unit 6 in time by virtue of the heat conduction capability of the copper heat dissipation fin 15.

The cooling water tank is fixedly connected with a water adding and discharging pipe 12, the water adding and discharging pipe 12 can be used for adding cooling water into the cooling water tank and discharging the cooling water in the cooling water tank out of the cooling water tank, the water adding and discharging pipe 12 extends out of the tank body 1, and the water adding and discharging pipe 12 is connected with a valve 13 to control the opening and closing of the water adding and discharging pipe 12. In addition, a tank level gauge 14 is fixedly connected to the cooling water tank, the tank level gauge 14 extends into the cooling water tank to detect and display the cooling water capacity in the cooling water tank, and the type of the tank level gauge 14 can adopt a YWZ-80T level gauge.

Still temperature controller 11 of fixedly connected with in box 1, temperature controller 11 is connected with 4 electricity of electrical control unit, temperature controller 11 is arranged in detecting the temperature in box 1, and pass through the wire with temperature signal and give the PLC controller, judge the height of the temperature value of temperature controller 11 transmission through the PLC controller, if the temperature value is greater than behind the temperature that the PLC controller set for, then the PLC controller reminds the user to close water cooling equipment and overhauls water cooling equipment through the alarm of electricity connection, wherein temperature controller 11 can adopt the temperature controller 11 that the model is WSJ-300.

The above detailed description merely describes the preferred embodiments of the present invention and does not limit the scope of the present invention. Without departing from the design concept and spirit scope of the present invention, the ordinary skilled in the art should belong to the protection scope of the present invention according to the present invention provides the text description and drawings to the various modifications, replacements and improvements made by the technical solution of the present invention. The scope of protection of the present invention is determined by the claims.

Claims

1. The industrial semiconductor water cooling equipment comprises a box body (1) and is characterized in that a partition plate (2) is arranged in the box body (1), circulating water equipment (3) and an electrical control unit (4) are respectively arranged on two sides of the partition plate (2), the circulating water equipment (3) and the electrical control unit (4) are both fixedly connected with the box body (1), the circulating water equipment (3) comprises a cooling water tank and a circulating water pump arranged in the cooling water tank, a water outlet of the circulating water pump is fixedly connected with a water inlet pipe (5), a heat dissipation unit (6) is fixedly connected with the outer surface of the upper side of the box body (1), the electrical control unit (4) is electrically connected with the heat dissipation unit (6), the water inlet pipe (5) is connected with the heat dissipation unit (6), a cold water outlet pipe (7) is connected onto the heat dissipation unit (6), a water outlet interface board (8) is fixedly connected with the inside of, the cold water outlet pipe (7) is communicated with a water outlet interface board (8), a plurality of connectors (9) are mounted on the water outlet interface board (8), the connectors (9) extend out of the box body (1), a water backflow interface board (10) is fixedly connected in the box body (1), and the water backflow interface board (10) is communicated with the cooling water tank;

the heat dissipation unit (6) comprises an N-type semiconductor and a P-type semiconductor which are jointly clamped and connected with a conducting strip.

2. The industrial semiconductor water cooling plant according to claim 1, wherein the electrical control unit (4) comprises a PLC controller and a power supply, the positive pole of the power supply is electrically connected with the N-type semiconductor and the negative pole of the power supply is electrically connected with the P-type semiconductor.

3. The industrial semiconductor water cooling equipment as claimed in claim 1, wherein a temperature controller (11) is fixedly connected to the box body (1), and the temperature controller (11) is electrically connected with the electric control unit (4).

4. The industrial semiconductor water cooling equipment according to claim 1, wherein a water adding and discharging pipe (12) is fixedly connected to the cooling water tank, and a valve (13) is connected to the water adding and discharging pipe (12).

5. The industrial semiconductor water cooling plant according to claim 1, characterized in that a tank level gauge (14) is connected to the cooling water tank.

6. The industrial semiconductor water cooling equipment as claimed in claim 1, wherein a plurality of cooling fins (15) are fixedly connected to the upper end of the heat radiating unit (6).