CN222263456U - A water cooling device for server cabinet - Google Patents
A water cooling device for server cabinet Download PDFInfo
- Publication number
- CN222263456U CN222263456U CN202420786256.9U CN202420786256U CN222263456U CN 222263456 U CN222263456 U CN 222263456U CN 202420786256 U CN202420786256 U CN 202420786256U CN 222263456 U CN222263456 U CN 222263456U
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- China
- Prior art keywords
- heat dissipation
- fixedly connected
- heat
- water
- cooling
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000001816 cooling Methods 0.000 title claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims abstract description 112
- 239000004519 grease Substances 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000005086 pumping Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000498 cooling water Substances 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 9
- 238000007664 blowing Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003020 moisturizing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本实用新型涉及服务器机柜散热技术领域，具体为一种服务器机柜水冷散热装置，包括底板，所述底板的顶部固定连接有散热主壳体，所述散热主壳体的内部设置有混动降温组件，所述混动降温组件包括散热箱，所述散热箱固定连接在散热主壳体的内部，所述散热箱的内部固定连接有潜水循环泵。该服务器机柜水冷散热装置，通过安装混动降温组件，便于使得该水冷散热结构利用向下输出输水的潜水泵打乱水流的轨迹，使得冷却水能够充分的与被冷却降温的导热铜板接触，从而更加高效的对导热硅脂降温，使导热硅脂另一端的服务器机柜完成高效的降温，可使得降温水的温度低于室外温度，在室外温度较高时散热效果更好，大大提高散热装置在使用时的实用性。
The utility model relates to the technical field of heat dissipation of server cabinets, specifically a water-cooled heat dissipation device for a server cabinet, comprising a bottom plate, a heat dissipation main shell fixedly connected to the top of the bottom plate, a hybrid cooling component arranged inside the heat dissipation main shell, the hybrid cooling component comprising a heat dissipation box, the heat dissipation box fixedly connected to the inside of the heat dissipation main shell, and a submersible circulation pump fixedly connected inside the heat dissipation box. The water-cooled heat dissipation device for a server cabinet, by installing a hybrid cooling component, facilitates the water-cooling heat dissipation structure to disrupt the trajectory of the water flow by using a submersible pump that outputs water downward, so that the cooling water can fully contact the heat-conducting copper plate to be cooled, thereby cooling the thermal grease more efficiently, so that the server cabinet at the other end of the thermal grease can complete efficient cooling, and the temperature of the cooling water can be lower than the outdoor temperature, and the heat dissipation effect is better when the outdoor temperature is high, greatly improving the practicality of the heat dissipation device when in use.
Description
Technical Field
The utility model relates to the technical field of server cabinet heat dissipation, in particular to a water-cooling heat dissipation device of a server cabinet.
Background
The server is generally the core of IT industry operation, the operation and the closure of the server, the rapid temperature rise, if exceeding the safe operation temperature, may cause system breakdown or service life damage, and proper cooling system is of great importance.
The water-cooling radiator in the prior art generally adopts a mode of blowing by matching the heat conduction of the copper radiating fins with the blowing of the radiating fan to radiate heat, but the maximum cooling degree of radiating water in the mode is not lower than the outdoor normal temperature, if the outdoor normal temperature is higher, the radiating effect of the water-cooling radiator can be greatly influenced.
Disclosure of utility model
The utility model aims to provide a water cooling device for a server cabinet, which is used for solving the problem that the water cooling radiator provided in the background art is poor in heat dissipation effect. In order to achieve the purpose, the water cooling device of the server cabinet comprises a bottom plate, the top of the bottom plate is fixedly connected with a heat dissipation main shell, a mixed cooling component is arranged in the heat dissipation main shell and comprises a heat dissipation box, the heat dissipation box is fixedly connected in the heat dissipation main shell, a submersible circulating pump is fixedly connected in the heat dissipation box, a water suction pipe is fixedly connected to the water inlet end of the front side of the submersible circulating pump, a water outlet pipe is fixedly connected to the water outlet end of the back side of the submersible circulating pump, the water outlet end of the water outlet pipe is positioned in the heat dissipation box, a heat dissipation circulating pipe is fixedly connected to the top of the heat dissipation box, a heat conduction copper plate is fixedly connected to the middle part of the heat dissipation box, a semiconductor refrigerating sheet is fixedly connected to the front side of the semiconductor refrigerating sheet, and the back side of the semiconductor refrigerating sheet is provided with a component on the right side of the heat dissipation box, so that the submersible pump water cooling structure can utilize the track of submersible pump water flow downwards, the water can be fully cooled with the water suction pipe, the water can be cooled down, the heat conduction effect can be improved when the heat dissipation device is used for cooling the silicon, and the heat dissipation device is more effectively cooled outdoors, and the heat dissipation effect can be improved, and the heat dissipation effect can be achieved when the heat is higher, and the heat dissipation effect is better is cooled down, and the heat is cooled down is more outdoor when the heat is used.
Further preferably, the water storage component comprises a movable door, the movable door swing joint is in the front of heat dissipation main casing, one side fixedly connected with storage water tank of the inside far away discrete hot box of heat dissipation main casing, the top fixedly connected with moisturizing pipe of storage water tank, the top swing joint of moisturizing pipe has the closing cap, the water inlet end on drinking-water pipe right side extends to the inside of storage water tank to the right, the left side of storage water tank is provided with heat dissipation component, can make water-cooling heat abstractor can the circulation heat dissipation.
Further preferably, the heat radiation component comprises a heat radiation frame, heat radiation frame fixed connection is in the front of heat radiation box, the semiconductor refrigeration piece is located the inside of heat radiation frame, the front fixedly connected with copper guidance heat fin of semiconductor refrigeration piece, the positive one side that is close to the heat radiation box of heat radiation main casing is provided with the air inlet window, the right side of heat radiation frame is provided with the air guide window, the left side fixed intercommunication of heat radiation frame has the exhaust hose, the left side fixedly connected with radiator fan of air guide window, the top of radiator fan is provided with control assembly, is convenient for dispel the heat of semiconductor refrigeration piece, makes it can sustainable use.
Further preferably, the control assembly comprises heat-conducting silicone grease, the heat-conducting silicone grease is fixedly connected to the back surface of the heat-radiating main shell, and the front surface of the heat-conducting silicone grease extends forwards to be fixedly communicated with the heat-radiating circulating pipe, so that heat of the server cabinet is conveniently conducted.
Further preferably, the front surface of the heat conduction silicone grease is fixedly connected with a temperature sensor, the right side of the heat dissipation main shell is fixedly connected with a controller, and the practicability of the heat dissipation device in use is improved.
Further preferably, the temperature sensor is electrically connected with the controller, and the controller is electrically connected with the submersible circulating pump, the semiconductor refrigerating sheet and the heat dissipation fan, so that the submersible circulating pump is more convenient and practical in use.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, the mixed cooling component is arranged, so that the water cooling structure is convenient to disturb the track of water flow by utilizing the submerged pump for downwards outputting water, and the cooling water can fully contact with the cooled heat conduction copper plate, so that the heat conduction silicone grease is cooled more efficiently, the server cabinet at the other end of the heat conduction silicone grease is cooled efficiently, the temperature of the cooled water is lower than the outdoor temperature, the heat dissipation effect is better when the outdoor temperature is higher, and the practicability of the heat dissipation device is greatly improved when the heat dissipation device is used.
According to the utility model, the semiconductor refrigerating sheet is arranged, so that the cold end of the semiconductor refrigerating sheet is convenient to refrigerate the heat-conducting copper plate, heat-radiating cooling water can uniformly exchange heat with the cooled heat-conducting copper plate, and the copper-guiding heat fins at the other end can continuously cool the heat-conducting copper plate, so that the efficiency of the heat-radiating device in use is improved.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic diagram of a front cross-sectional structure of the present utility model;
FIG. 3 is a schematic side sectional view of the present utility model;
FIG. 4 is a schematic view of the structure of FIG. 2A according to the present utility model;
fig. 5 is a schematic diagram of the structure of fig. 3B according to the present utility model.
The heat-dissipating device comprises a base plate, a heat-dissipating main shell, a water storage component, a mixed cooling component, a heat-dissipating component, a control component, a movable door, a water storage tank, a water supplementing pipe, a sealing cover, a heat-dissipating box, a water submersible circulating pump, a water pumping pipe, a water outlet pipe, a heat-dissipating circulating pipe, a heat-conducting copper plate, a semiconductor refrigerating sheet, a heat-dissipating frame, a heat-dissipating plate, a copper heat-conducting fin, a heat-dissipating window, a heat-dissipating inlet window, a heat-dissipating hose, a heat-dissipating fan, a heat-conducting silicone grease, a heat-dissipating sensor, a heat-conducting sensor and a controller.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a worker of ordinary skill in the art without creative efforts, are within the protection scope of the present utility model based on the embodiments of the present utility model.
Referring to fig. 1-5, the utility model provides a technical scheme that a water cooling device of a server cabinet comprises a bottom plate 1, wherein a heat dissipation main shell 2 is fixedly connected to the top of the bottom plate 1, a mixed cooling component 4 is arranged in the heat dissipation main shell 2, the mixed cooling component 4 comprises a heat dissipation box 401, the heat dissipation box 401 is fixedly connected to the inside of the heat dissipation main shell 2, a submersible circulating pump 402 is fixedly connected to the inside of the heat dissipation box 401, a water pumping pipe 403 is fixedly connected to the water inlet end of the front side of the submersible circulating pump 402, a water outlet pipe 404 is fixedly connected to the water outlet end of the back side of the submersible circulating pump 402, the water outlet end of the water outlet pipe 404 is positioned in the inside of the heat dissipation box 401, a heat dissipation circulating pipe 405 is fixedly connected to the top of the heat dissipation box 401, a heat conducting copper plate 406 is fixedly connected to the middle part of the heat dissipation box 401, a semiconductor refrigerating sheet 407 is fixedly connected to the front side of the heat conducting copper plate 406, the back side of the semiconductor refrigerating sheet 407 extends backwards to the front side of the heat conducting copper plate 406, and a water storage component 3 is arranged on the right side of the heat dissipation box 401.
In this embodiment, as shown in fig. 1 and 2, the water storage component 3 includes a movable door 301, the movable door 301 is movably connected to the front surface of the heat dissipation main housing 2, one side of the heat dissipation main housing 2 far away from the heat dissipation box 401 is fixedly connected with a water storage tank 302, the top of the water storage tank 302 is fixedly connected with a water supplementing pipe 303, the top of the water supplementing pipe 303 is movably connected with a sealing cover 304, the water inlet end on the right side of the water pumping pipe 403 extends to the inside of the water storage tank 302 rightward, the left side of the water storage tank 302 is provided with a heat dissipation component 5, the heat dissipation component 5 includes a heat dissipation frame 501, the heat dissipation frame 501 is fixedly connected to the front surface of the heat dissipation box 401, the semiconductor cooling fin 407 is located in the inside of the heat dissipation frame 501, the front surface of the semiconductor cooling fin 407 is fixedly connected with a copper heat conduction fin 502, one side of the front surface of the heat dissipation main housing 2 close to the heat dissipation box 401 is provided with an air inlet window 503, the right side of the heat dissipation frame 501 is provided with a air guide window 504, the left side of the heat dissipation frame 501 is fixedly connected with an air exhaust hose 505, the left side of the air guide window 504 is fixedly connected with a fan 506, the upper side of the fan 506 is provided with a control component 6, when in use 601, the silicone grease is located far away from the heat dissipation main housing 2, and then contacts one end of the heat dissipation main housing 2 with the heat dissipation main housing 2, and then contacts with the heat dissipation main housing 2, as shown in the heat dissipation device
In this embodiment, as shown in fig. 2 and 3, the control component 6 includes a heat-conducting silicone grease 601, the heat-conducting silicone grease 601 is fixedly connected to the back surface of the heat-dissipating main housing 2, the front surface of the heat-conducting silicone grease 601 extends forward and is fixedly connected with the heat-dissipating circulation tube 405, the front surface of the heat-conducting silicone grease 601 is fixedly connected with a temperature sensor 602, the right side of the heat-dissipating main housing 2 is fixedly connected with a controller 603, the temperature sensor 602 is electrically connected with the controller 603, the controller 603 is electrically connected with the submersible circulation pump 402, the semiconductor cooling fin 407 and the heat-dissipating fan 506, when the heat of the server cabinet is higher, the heat source transfers the heat to the heat-dissipating circulation tube 405 through the heat-conducting silicone grease 601, meanwhile, the temperature sensor 602 detects that the temperature of the heat-conducting silicone grease 601 is higher than a set threshold, the temperature sensor 602 sends a signal to the controller 603, the controller 603 controls the starting of the submersible circulation pump 402, the semiconductor cooling fin 407 and the heat-dissipating fan 506, the submerged circulation pump 402 pumps water in the water storage tank 302 into the heat dissipation box 401 through the water pumping pipe 403, along with the continuous rising of the water level and water pressure in the heat dissipation box 401, the water is enabled to be in contact with the heat conduction copper plate 406 continuously, the continuously rising water level is enabled to be in circulation contact with the heat conduction silicone grease 601 through the heat dissipation circulation pipe 405 and takes away heat of the heat conduction silicone grease 601 to be conveyed into the water storage tank 302 again, the cold end of the semiconductor refrigerating sheet 407 continuously outputs cooling to the heat conduction copper plate 406, the heat conduction copper plate 406 exchanges heat with cooling water, cooling and heat dissipation of cooling are completed, negative pressure is generated inside the heat dissipation frame 501 through the heat dissipation fan 506 blowing air to the left side, under the action of the negative pressure, external air enters the air guide window 504 inside the heat dissipation main shell 2 through the air inlet window 503, the air is in contact with the copper heat guide fins 502, and the heat is discharged to the outside through the air exhaust hose 505.
The water-cooling heat dissipation device for the server cabinet has the advantages that when the water-cooling heat dissipation device is used, the working process is as follows:
As shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, when in use, one end of the heat conduction silicone grease 601 far away from the heat dissipation main shell 2 is contacted with a heat source of the server cabinet, then the heat dissipation main shell 2 is positioned, when the heat of the server cabinet is higher, the heat source transmits the heat to the heat dissipation circulating pipe 405 through the heat conduction silicone grease 601, meanwhile, the temperature sensor 602 detects that the temperature of the heat conduction silicone grease 601 is higher than a set threshold value, the temperature sensor 602 sends a signal to the controller 603, the controller 603 controls to start the submersible circulating pump 402, the semiconductor cooling fin 407 and the heat dissipation fan 506, the submersible circulating pump 402 pumps water in the water storage tank 302 into the heat dissipation box 401 through the water pumping pipe 403, as the water level and the water pressure in the heat dissipation box 401 continuously rise, the water continuously contacts with the heat conduction copper plate 406, the continuously rising water level is in contact with the heat conduction silicone grease 601 through the heat dissipation circulating pipe 405, and the heat of the heat conduction silicone grease 601 is re-transported into the water storage tank 302, the continuous output of the semiconductor cooling fin 407 cools the 406, the heat conduction copper plate 406 is cooled, the heat is cooled down, the heat of the heat conduction box 406 is cooled down, the heat is completely exchanged with the heat conduction water is cooled down, the heat is cooled down, and the heat is completely cooled down to the air is blown down to the outside through the heat conduction box 502, and the negative pressure air is cooled down by the heat conduction copper plate 502, and the heat is cooled down by the heat conduction air is cooled down by the heat conduction fan heat pipe 502, and the air is cooled down by the heat conduction air and cooled down.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420786256.9U CN222263456U (en) | 2024-04-16 | 2024-04-16 | A water cooling device for server cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420786256.9U CN222263456U (en) | 2024-04-16 | 2024-04-16 | A water cooling device for server cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222263456U true CN222263456U (en) | 2024-12-27 |
Family
ID=93998555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420786256.9U Active CN222263456U (en) | 2024-04-16 | 2024-04-16 | A water cooling device for server cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222263456U (en) |
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2024
- 2024-04-16 CN CN202420786256.9U patent/CN222263456U/en active Active
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| GR01 | Patent grant |