CN207733930U - A kind of semiconductor air-conditioning bed with pressing fin slices radiator - Google Patents
A kind of semiconductor air-conditioning bed with pressing fin slices radiator Download PDFInfo
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- CN207733930U CN207733930U CN201720469093.1U CN201720469093U CN207733930U CN 207733930 U CN207733930 U CN 207733930U CN 201720469093 U CN201720469093 U CN 201720469093U CN 207733930 U CN207733930 U CN 207733930U
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Abstract
A kind of semiconductor air-conditioning bed with pressing fin slices radiator, it includes mainly bed, TEC semiconductor refrigeratings component and its control circuit.TEC semiconductor refrigerating components are mounted on bed board, it includes mainly 12706 semiconductor chilling plates of TEC1, cool accumulating block, aluminium absorber plate, pressing aluminium (or copper) fin slices radiator, super-silent miniature turbine fan (12VDC, 1000rpm) and two temperature controllers of two pieces of concatenations.Semiconductor air-conditioning bed with pressing fin slices radiator is using the configuration of 12VDC safe voltages, Double temperature Controller and the triple anti-supercooling design protections of aluminium absorber plate and prevents the moisture condensation design of aluminium absorber plate; Double temperature Controller design can effectively prevent air conditioning bed to be subcooled, high safety.Semiconductor air-conditioning bed technical solution manufacturing cost with pressing fin slices radiator is low, and operation energy consumption is low (only 36W or so), 10 hours power consumption≤0.5KWh, is a kind of integrated innovation technical solution using mature technology.
Description
Technical field
The Refrigeration ＆ Air-Conditioning technical field of patent category In Engineering Thermal Physics of the present invention.
Technical background
Room air conditioner is mostly constant speed air-conditioning or convertible frequency air-conditioner, 10m at present2Room mostly uses 1 air-conditioning, not because of Energy Efficiency Ratio
Together, input power is between 700W~1000W.The thermal capacity such as building, furniture are big, and metabolism is slow when night people sleep,
Heat dissipation capacity is low, only 92W or so (27 DEG C of temperature), low load with strong power, and energy-saving potential is huge.
Summer major part nighttime temperature is not much different for 24 DEG C~26 DEG C at 27 DEG C~32 DEG C, with comfort air conditioning temperature.Room
Air conditioner is mostly small without fresh air or fresh air volume, and disengaging air-conditioned room thermal shock is big, and air conditioner disease incidence is high.Therefore, using complete
Fresh air (windowing) room partial air conditioning, is a kind of energy-saving technical scheme with strong points.
Find that current room partial air conditioning (all-fresh air) is mostly air conditioning mosquito net, air-conditioning bed mattress or semiconductor by patent retrieval
Air conditioner, these technical solutions are relative complex, and cost is higher, and commercialization difficulty is big.Direct-cooled semiconductor air-conditioning bed (the patent No.
201620536922.9) complicated, there is also temperature for assembly type semiconductor air-conditioning bed (patent No. ZL 201210256082.7)
Refrigerating efficiency low disadvantage when higher.
Invention content
The present invention is big for current room air conditioner energy consumption, and heat gain from occupant's low contradiction when nighttime sleep, proposes one
This with strong points, healthy, energy saving, mute technical solution of semiconductor air-conditioning bed of the kind with pressing fin slices radiator, it is utilized
Semiconductor refrigerating (thermoelectric cooling) technology, creates a kind of all-fresh air room partial air conditioning, is that one kind making full use of existing maturation
The integrated innovation technical solution of technology.Semiconductor air-conditioning bed with pressing fin slices radiator, it includes mainly bed, TEC semiconductors
Cooling assembly and its control circuit.TEC semiconductor refrigerating components are mounted on bed board, it includes mainly the TEC1- of 2 pieces of concatenations
12706 semiconductor chilling plates, cool accumulating block, aluminium absorber plate, pressing fin slices radiator, super-silent miniature turbine fan (12VDC,
1000rpm) and two temperature controllers.Night summer, semiconductor chilling plate make the heat absorption plate temperature of the aluminium on bed under bamboo mat reduce
To 26 DEG C~28 DEG C, the hot-spot of human body and bed is eliminated, human body mean skin temperature is reduced, makes one to feel comfortable.
Pressing fin slices radiator and low noise design
Assembly type semiconductor air-conditioning bed (patent No. ZL 201210256082.7) is using air and (array) the parallel wing that cracks
Piece aluminum profile heat radiator heat transfer free convection, although natural convection air heat transfer effect can be strengthened by L-type heat bridge, in gas
Refrigerating efficiency is not high when temperature is higher.
Therefore, add super-silent miniature turbine fan (12VDC, 1000rpm) is air-cooled (to force using pressing aluminium fin sheet heat radiator
Heat loss through convection) scheme can effectively improve semiconductor refrigerating efficiency.Super-silent miniature turbine fan (7) is fixed on pressing aluminium fin
Radiator (6) is intermediate.Pressing aluminium fin sheet heat radiator (6) is that numerous aluminium or copper fin stack up using pressure fixing process, will
One of lateral pressurization simultaneously polishes, and is contacted with the hot junction of TEC semiconductor chilling plates, another side is extended as cooling fin
Fin.
Miniature turbine fan working voltage is reduced by divider resistance (60 Europe or so), makes super-silent mini-fan
(12VDC, 2W or so) motor speed has 2500rpm to be reduced to 1000rpm, with effective control noise to 10 decibels or so.
A kind of semiconductor air-conditioning bed with pressing fin slices radiator, including bamboo mat, aluminium absorber plate, bed board, TEC on bed board
Semiconductor refrigerating component and its control circuit, TEC semiconductor refrigerating components include the TEC1-12706 semiconductor systems of two pieces of concatenations
Cold, cool accumulating block, aluminium absorber plate, pressing aluminium fin sheet heat radiator and super-silent miniature turbine fan；With pressing fin slices radiator
One of feature of semiconductor air-conditioning bed is that aluminium absorber plate and TEC semiconductor refrigerating components are directly installed on bed board both sides up and down；
Opening square hole on bed board, cool accumulating block are installed in bed board square hole, and TEC semiconductor chilling plates are installed below cool accumulating block, under cool accumulating block
Side connects TEC semiconductor chilling plate cold ends, and TEC semiconductor chilling plate hot-side heat dissipations are added super-silent using pressing aluminium fin sheet heat radiator
Miniature turbine fan forced convection heat sink conception, super-silent miniature turbine fan are fixed among pressing aluminium fin sheet heat radiator, pressure
Gu aluminium fin sheet heat radiator is that numerous aluminium or copper fin stack up, by one of lateral pressurization and polish, and partly with TEC
Conductor cooling piece hot junction contacts, and another side extends the fin as cooling fin；The lower all round closure of bed, air is by head of a bed bottom
The trepanning in portion enters, and hot-air is flowed out from the trepanning on the bed board of tailstock.
Triple anti-supercooling safe designs
" summer sits up stone, and the autumn sits up plate." once human body loses thermal balance, it is easy for leading to hypothermia, life is caused to endanger
The disease seed of trouble is buried in danger.Therefore, anti-supercooling protection is most important.
Maximum cooling capacity limits anti-supercooling design
The present invention has done abundant research to human thermal comfort, and it is 13.8W to calculate the refrigerating capacity needed when sleep quality, is examined
Consider the heat exchange of the thermal capacity and aluminium absorber plate and air of bamboo mat, the overall refrigerating effect of TEC1-12706 semiconductor chilling plates is
14.4W~21.6W is suitable.
The anti-supercooling protection of Double temperature Controller
Using Double temperature Controller scheme, effectively reduce temperature controller because contact adhesion and caused by aluminium absorber plate
The probability of supercooling.Assuming that the probability of the relay contact adhesion of single temperature controller is one thousandth, then Double temperature Controller side
The probability of the relay contact adhesion of case is hundred a ten thousandths.
Data shows that human skin mean temperature is 33.5 DEG C, and the surface temperature of human body clothing and skin is 30 DEG C, is considered
To the thermal resistance of bamboo mat, it is suitable that aluminium absorber plate set temperature, which is 26 DEG C~28 DEG C,.
The anti-supercooling protection of self limiting
According to the performance chart of TEC1-12706 semiconductor chilling plates, the heat transfer temperature difference ↑ at hot and cold both ends or ↓ → refrigeration
Measure ↓ or ↑.
When thermistor temperature sensor is bad or electronic temperature controller breaks down, aluminium absorb heat plate temperature it is too low → heat transfer
The temperature difference ↑ → refrigerating capacity ↓ → aluminium heat absorption plate temperature ↑, when monolithic heat transfer temperature difference is 67K, refrigerating capacity → 0.
On the other hand, when refrigerating capacity ↑ → TEC hot-side temperatures ↑ → heat transfer temperature difference ↑ → refrigerating capacity ↓
Therefore, this programme has the anti-supercooling defencive function of self limiting.
The hot junctions TEC overheating protection
Due to using the equidirectional superposition series connection of two pieces of TEC1-12706 semiconductor chilling plates, TEC1-12706 semiconductor refrigeratings
The cold and hot both ends maximal heat transfer temperature difference of piece is 67 DEG C × 2=134 DEG C, and the heat transfer temperature difference at hot and cold both ends ↑ → refrigerating capacity ↓, therefore
It is necessary to control the heat transfer temperature difference at the cold and hot both ends of TEC1-12706 semiconductor chilling plates.On the other hand, TEC semiconductor chilling plates heat
It holds temperature excessively high, easily damages TEC semiconductor chilling plates.For this purpose, this programme, which uses, is tightly attached to TEC1-12706 semiconductor refrigeratings
The bimetal strip thermostat (normally closed, 55 DEG C power-off) in piece hot junction realizes the hot junctions TEC overheating protection.
Advantageous effect
Room air conditioner is mostly constant speed air-conditioning or convertible frequency air-conditioner, 10m at present2Room mostly uses 1 air-conditioning, not because of Energy Efficiency Ratio
Together, input power is between 700W~1000W.Semiconductor air-conditioning bed with pressing fin slices radiator uses 12VDC safe voltages
Configuration, Double temperature Controller and the triple anti-supercooling design protections of aluminium absorber plate prevent the moisture condensation design of aluminium absorber plate, two temperature control
Device design can effectively prevent air conditioning bed to be subcooled, high safety.Pressing fin slices radiator adds super-silent miniature turbine fan
(12VDC, 1000rpm) air-cooled scheme can effectively improve semiconductor refrigerating efficiency, and effectively control noise is to 10 decibels or so.
The cost of material is low for semiconductor air-conditioning bed technical solution with pressing fin slices radiator, and operation energy consumption is low (only 36W or so), 10 hours
Power consumption≤0.5KWh is a kind of mute, healthy, energy saving, comfortable all-fresh air room air conditioner technical solution, a kind of using ripe
The integrated innovation technical solution of technology.
Description of the drawings
Fig. 1 is TEC semiconductor chilling plate main circuit diagrams；
Fig. 2 is TEC semiconductor refrigerating component assembling figures；
Fig. 3 is the A direction views of Fig. 2.
Wherein, 100- D.C. regulated power supplies, 200- main switches, 300- bimetallic temperature controllers, 400-TEC1-
12706 semiconductor chilling plates, the first electronic temperature controllers of 500-, the second electronic temperature controllers of 600-, 700- are super-silent
Miniature turbine fan electromotor, 800- divider resistances, 1- bamboo mats, 2- aluminium absorber plates, 3- bed boards, 4- cool accumulating blocks, 5- copper coins,
6-pressing aluminium fin sheet heat radiators, the super-silent miniature turbine fans of 7-, the thermistor temp of the first electronic temperature controllers of 8-
Sensor, the thermistor temperature sensor of the second electronic temperature controllers of 9-, 10-TEC fix box, and 11 and 12- is heat-insulated
Damping heat-preservation cotton plate.
Specific implementation mode
Improve heat transfer measure
Effectively to reduce thermal contact resistance, when installing TEC cooling pieces, cool accumulating block, aluminium absorber plate and pressing fin slices radiator,
All there are the places of thermal contact resistance, it is necessary to heat-conducting silicone grease is cleaned out and coat, to improve heat transfer.
100- D.C. regulated power supplies be 12VDC, 3.2A,
300- bimetallic temperature controllers are normally closed, 55 DEG C of power-off,
400-TEC1-12706 semiconductor chilling plates are 2 series connection,
The first electronic temperature controllers of 500- and the second electronic temperature controllers of 600- are 26 DEG C~28 DEG C,
The super-silent miniature turbine fan electromotors of 700- are 12VDC, 1000rpm or so.
800- divider resistances are 60 Europe or so.
It accesses after the series connection of 400 equidirectional superposition of two panels TEC1-12706 semiconductor chilling plates and is supplied by 12VDC regulated power supplies 100
In the main circuit of electricity.Two concatenated electronic temperature controllers include the first electronic temperature controller (500), the second electron temperature
Controller (600), set temperature are 26 DEG C~28 DEG C.The thermistor temperature sensor 8 of first electronic temperature controller,
The thermistor temperature sensor 9 of two electronic temperature controllers is mounted in the box of TEC semiconductor refrigerating components, and is close to cold-storage
Copper billet 4, to detect and control aluminium absorber plate 2 by the first electronic temperature controller 500, the second electronic temperature controller 600
Temperature；Divider resistance 800 makes its rotating speed be reduced to 1000rpm by 2500rpm for reducing super-silent mini-fan electric moter voltage
Left and right, to reduce noise.Bimetallic temperature controller 300 is close to the installation of TEC semiconductor chilling plates hot junction, when pressing fin dissipates
Hot device overheat when temperature >=55 DEG C, cuts off main circuit, to prevent TEC semiconductor chilling plates hot junction overheats and burns out TEC semiconductor systems
Cold.
1- bamboo mat thickness is δ=2mm,
2- aluminium absorber plates, size be 500 × 1000mm, δ=1mm,
3- bed board thickness is δ=8mm,
4- cold-storage block sizes are 40 × 40 × 30mm,
5- copper plate thickness is δ=1mm,
The heat dissipation area of 6- pressing aluminium fin sheet heat radiators is more than 15 × 104mm2,
The super-silent miniature turbine fans of 7- be 12VDC, 1000rpm or so,
11 and 12- heat-insulating and shock-absorbing heat-preservation cotton plates, compressed thickness are δ=2mm,
Equidirectional superposition installation TEC is fixed in box 10 after the concatenation of two panels TEC1-12706 semiconductor chilling plates 400, in bed
The square hole of 60 × 80mm is opened on plate 3, cool accumulating block 4 is put into square hole, then installs aluminium absorber plate 2, and aluminium absorber plate 2 is solid by screw
It is scheduled on bed board 3.Two aperture φ 4 × 2 are opened in 10 bottom the same side of TEC fixed bins, as TEC1-12706 semiconductor chilling plates
400 wiring hole.Bimetal strip thermostat 300 is close to TEC semiconductor chilling plates hot junction, i.e. copper coin 5 is installed, when pressing fin dissipates
The hot junctions hot device TEC overheat, and when temperature >=55 DEG C, cut off main circuit, to prevent TEC semiconductor chilling plates hot junction overheats and burns out TEC
Semiconductor chilling plate.
The assembling of TEC semiconductor refrigerating components
Attached drawing 1 and Figure of description 2 carry out the installation of TEC semiconductor refrigerating components to specifications.
(1) square hole of 60 × 80mm is opened at tailstock about 700mm in the center line of bed.
(2) attached drawing 2 to specifications, pressing fin slices radiator 6 and copper coin 5 are fixed on by clip and stove bolt respectively
On TEC boxes 10, and it is encased inside thermal insulation cotton plate 11 between TEC boxes 10 and copper coin 5, then bimetallic temperature is controlled
Device 300 is close to the installation of copper coin 5.
(3) attached drawing 2 to specifications, it is respectively two-sided to apply after two panels TEC1-12706 semiconductor chilling plates 400 are concatenated
Upper heat-conducting silicone grease, equidirectional superposition installation TEC are fixed in box 10, and having for TEC semiconductor chilling plates literal is close to cool accumulating block 4
(cold end), TEC semiconductor chilling plates connect copper coin 5 without literal (hot junction).
(4) attached drawing 2 to specifications, coat heat-conducting silicone grease by 4 upper and lower surface of copper cool accumulating block, are put into square hole, according still further to
Figure of description 2 installs aluminium absorber plate 2, and thermal insulation cotton plate 12 is encased inside between TEC boxes 10 and aluminium absorber plate 2, and aluminium is inhaled
Hot plate is screwed on bed board.It must assure that aluminium absorber plate 2 and copper cool accumulating block 4, cool accumulating block 4 and TEC semiconductor chilling plates
The good contact of 400 cold ends (TEC semiconductor chilling plates have literal).
(5) box surrounding is fixed to TEC with 704 silica gel and is sealed processing, it is moisture-proof damp proof, to improve service life.
The installation of semiconductor air-conditioning bed with pressing fin
(1) TEC semiconductor refrigerating components are installed to institute's evolution hole site on bed.
(2) if all round closure under bed, stomata should be driven into head of a bed bottom and bed board tail portion and venthole (φ 30 × 5) is each
5.
The connection of TEC semiconductor chilling plate main circuits
Attached drawing 1 connects TEC semiconductor chilling plate main circuits to specifications.
(1) after concatenating two panels TEC1-12706 semiconductor chilling plates 400, attached drawing 1 accesses main circuit to specifications.Note
Meaning red line connects anode, and black line connects cathode.
(2) by the first electronic temperature controller 500, the second electronic temperature controller 600, the access of attached drawing 1 is led to specifications
In circuit, the thermistor temperature sensor 8 of the first electronic temperature controller 500, the second electronic temperature controller 600 temperature-sensitive
Attached drawing 2 is fixed in TEC boxes 10 resistance temperature sensor 9 to specifications, and is close to cold-storage copper billet 4.
(3) by divider resistance 800, miniature turbine fan electromotor 700 and bimetal strip thermostat 300 attached drawing to specifications
In 1 access main circuit.
(4) control Figure of description 1 checks whether each TEC cooling assemblies connect correctly.
(5) it is powered and examines refrigeration effect and radiator heat-dissipation effect.
Claims (2)
1. a kind of semiconductor air-conditioning bed with pressing fin slices radiator, including bamboo mat (1), aluminium absorber plate (2), bed board on bed board
(3), TEC semiconductor refrigeratings component and its control circuit, characterized in that TEC semiconductor refrigerating components include two pieces of concatenations
TEC1-12706 semiconductor chilling plates (400), cool accumulating block (4), aluminium absorber plate (2), pressing aluminium fin sheet heat radiator (6) and super-silent
Miniature turbine fan (7)；One of the feature of semiconductor air-conditioning bed with pressing fin slices radiator is aluminium absorber plate (2) and TEC
Semiconductor refrigerating component is directly installed on bed board (3) both sides up and down；Opening square hole on bed board (3), cool accumulating block (4) are installed on bed board
(3) in square hole, TEC semiconductor chilling plates (400) are installed below cool accumulating block (4), and TEC semiconductor systems are connect below cool accumulating block (4)
Cold (400) cold end, TEC semiconductor chilling plates (400) hot-side heat dissipation are added super-silent miniature using pressing aluminium fin sheet heat radiator (6)
Turbofan (7) forced convertion heat sink conception, super-silent miniature turbine fan (7) are fixed in pressing aluminium fin sheet heat radiator (6)
Between, pressing aluminium fin sheet heat radiator (6) is that numerous aluminium or copper fin stack up, and by one of lateral pressurization and is polished,
And contacted with TEC semiconductor chilling plates (400) hot junction, another side extends the fin as cooling fin；The lower surrounding envelope of bed
It closes, air is entered by the trepanning of head of a bed bottom, and hot-air is flowed out from the trepanning on the bed board of tailstock.
2. the semiconductor air-conditioning bed according to claim 1 with pressing fin slices radiator, characterized in that two concatenated electricity
Sub- temperature controller includes the first electronic temperature controller (500), the second electronic temperature controller (600), the first electron temperature
The thermistor temperature sensor (8) of controller (500), the thermistor temp sensing of the second electronic temperature controller (600)
Device (9) is mounted in the fixation box (10) of TEC semiconductor chilling plates (400), and is close at left and right sides of cool accumulating block (4), to
It detects and aluminium absorber plate (2) temperature is controlled by the first electronic temperature controller (500), the second electronic temperature controller (600)
And its supercooling can be effectively prevent, the first electronic temperature controller (500), the second electronic temperature controller (600) setting value
It is identical；It is snugly fitted on TEC semiconductor chilling plates (400) hot junction using bimetallic temperature controller (300), to prevent
TEC semiconductor chilling plates (400) hot junction overheats.
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| CN201720469093.1U CN207733930U (en) | 2017-05-02 | 2017-05-02 | A kind of semiconductor air-conditioning bed with pressing fin slices radiator |
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| CN201720469093.1U CN207733930U (en) | 2017-05-02 | 2017-05-02 | A kind of semiconductor air-conditioning bed with pressing fin slices radiator |
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| CN207733930U true CN207733930U (en) | 2018-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111887659A (en) * | 2020-07-16 | 2020-11-06 | 晋会斌 | Air-conditioning bed |
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2017
- 2017-05-02 CN CN201720469093.1U patent/CN207733930U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111887659A (en) * | 2020-07-16 | 2020-11-06 | 晋会斌 | Air-conditioning bed |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181106 Address after: 525000 139 Guandu two road, Maoming, Guangdong Patentee after: Guangdong University of Petrochemical Technology Address before: 525000 Department of active teaching and research, College of mechanical and electrical engineering, Guangdong Petrochemical College, Maoming, Guangdong Patentee before: Shen Ronghua |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180817 Termination date: 20190502 |
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| CF01 | Termination of patent right due to non-payment of annual fee |