CN220417719U - Heat radiation cover - Google Patents
Heat radiation cover Download PDFInfo
- Publication number
- CN220417719U CN220417719U CN202322038492.0U CN202322038492U CN220417719U CN 220417719 U CN220417719 U CN 220417719U CN 202322038492 U CN202322038492 U CN 202322038492U CN 220417719 U CN220417719 U CN 220417719U
- Authority
- CN
- China
- Prior art keywords
- cover body
- cover
- semiconductor
- cold air
- cold wind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title description 2
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 238000009423 ventilation Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims abstract 4
- 235000013305 food Nutrition 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a heat dissipation cover, includes the cover body, locates the semiconductor cold wind ware in cover body upper portion, the cover body provides the installation cavity for semiconductor cold wind ware, the installation cavity is equipped with the bottom ventilation hole, with the help of the ventilation hole makes the cold wind that conductor cold wind ware produced enter into the cover body and make the temperature in the cover body space drop. The semiconductor refrigeration air is utilized to enable foods in the cover body to keep a low-temperature circulating air environment, so that the freshness of the foods is kept, the structure is simple, the use is convenient, the manufacturing and using costs are low, the energy is saved, the environment is protected, and the like; therefore, it has excellent performance in technical, practical and economical aspects.
Description
Technical Field
The utility model relates to a heat dissipation cover.
Background
According to market investigation and patent retrieval, the existing food (meal) is generally put into a refrigerator to be frozen for fresh-keeping after being not completely eaten, but more old people are relatively exclusive to using the refrigerator, and in hot summer, the temperature is higher, so that the deterioration of the food is easy to cause, and food safety accidents are caused; for this purpose, we have developed a heat sink.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a heat dissipation cover, which comprises a cover body and a semiconductor air cooler arranged at the upper part of the cover body, wherein the cover body provides a mounting cavity for the semiconductor air cooler, the mounting cavity is provided with a bottom ventilation hole, and cold air generated by the semiconductor air cooler enters the cover body by means of the ventilation hole so as to reduce the temperature of the space in the cover body.
In one or more embodiments of the present utility model, a cover is disposed on the mounting cavity, a heat dissipation hole is disposed on the cover, and the semiconductor cooler includes a semiconductor cooling plate and a fan.
In one or more embodiments of the utility model, the mounting cavity is provided with elongated holes by means of which the air flow is circulated.
In one or more embodiments of the utility model, the bottom of the cover is provided with a skirt by means of which the cover and the platform are sealed.
Compared with the background technology, the utility model has the following effects: by adopting the technical scheme, the semiconductor is utilized to make cold air so as to keep the food in the cover body in a low-temperature circulating air environment, so that the freshness of the food is kept, and the food has the advantages of simple structure, convenient use, low manufacturing and using cost, energy conservation, environmental protection and the like; therefore, it has excellent performance in technical, practical and economical aspects.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating cover according to an embodiment of the present utility model;
FIG. 2 is a schematic view showing an expanded structure of a heat dissipating cover according to an embodiment of the present utility model;
those skilled in the art will recognize, from the shape, construction and understanding of the arrangements shown in the drawings, the various components of the drawings are not necessarily to scale and the dimensions of the various components and elements of the drawings may be exaggerated or reduced to more clearly illustrate the embodiments of the present utility model described herein.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout.
The orientations shown in the drawings are not to be construed as limiting the specific scope of the utility model, and merely as a reference to the preferred embodiments, variations in the positions or numbers of product components shown in the drawings or structural simplifications may be made.
The terms "connected" and "connected" as used in the specification and illustrated in the drawings refer to the components as being "connected" to each other, and are understood to mean fixedly connected or detachably connected or integrally connected; the connection can be direct connection or connection through an intermediate medium, and a person skilled in the art can understand the connection relation according to specific situations to obtain a screw connection or riveting or welding or clamping or embedding and other modes to replace the modes in different embodiments in a proper mode.
Terms of orientation such as up, down, left, right, top, bottom, and the like, as well as orientations shown in the drawings, may be used for direct contact or contact by additional features between the components; such as directly above and obliquely above, or it merely represents above the other; other orientations may be understood by analogy. The technical scheme and the beneficial effects of the utility model are more clear and definite by further describing the specific embodiments of the utility model with reference to the drawings in the specification.
The specific embodiments will be described below with reference to the illustrations of fig. 1-2, however, it will be readily appreciated by those skilled in the art that the detailed description given herein with respect to these illustrations is for illustrative purposes only and should not be construed as limiting, and that the present embodiment provides a heat dissipation cover comprising a cover 1, a semiconductor cooler 2 disposed at an upper portion of the cover 1, the cover 1 providing a mounting cavity 11 for the semiconductor cooler 2, the mounting cavity 11 being provided with a bottom vent hole 12, by means of which vent hole 12 the cool air generated by the semiconductor cooler 2 enters the cover 1 to lower the temperature of the space within the cover.
The mounting cavity 11 is provided with a cover body 3, the cover body 3 is provided with a heat dissipation hole 31, and the semiconductor cooler 2 comprises a semiconductor refrigerating sheet 21 and a fan 22. The mounting chamber 11 is provided with elongated holes 13, by means of which elongated holes 13 the air flow is circulated.
The bottom of the cover body 1 is provided with a skirt 4, which can be made of silica gel strips, can also be folded at the lower part of the cover body, and the like, and can form a seal with the cover body and the platform by means of the skirt 4.
In view of the foregoing, and in combination with the accompanying drawings, the following principles are provided:
when the semiconductor cold air device works, the semiconductor cold air device 2 is electrified to generate cold air, and the cold air is conveyed in the cold air lower cover body 1 to form cold air flow to circulate in the cover body; the semiconductor is utilized to make cold air so as to keep the food in the cover body in a low-temperature circulating air environment, so that the freshness of the food is kept, the structure is simple, the use is convenient, the manufacturing and using cost is low, the energy is saved, the environment is protected, and the like; therefore, it has excellent performance in technical, practical and economical aspects.
For purposes of explanation, the foregoing descriptions use specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the embodiments. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described above, but that modifications and substitutions using techniques known in the art on the basis of the present utility model fall within the scope of the present utility model, which is defined by the claims.
Claims (4)
1. A heat dissipation cover, characterized in that: the semiconductor cold air device comprises a cover body and a semiconductor cold air device arranged on the upper portion of the cover body, wherein the cover body provides an installation cavity for the semiconductor cold air device, the installation cavity is provided with a bottom ventilation hole, and cold air generated by the semiconductor cold air device enters the cover body through the ventilation hole to reduce the temperature of the space in the cover body.
2. The heat sink cover according to claim 1, wherein: the mounting cavity is provided with a cover body, the cover body is provided with a heat dissipation hole, and the semiconductor cooler comprises a semiconductor refrigerating sheet and a fan.
3. The heat sink cover according to claim 2, wherein: the mounting chamber is provided with elongated holes by means of which the air flow is circulated.
4. A heat sink cap according to claim 3, wherein: the bottom of the cover body is provided with a skirt edge, and the cover body and the platform form a seal by means of the skirt edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322038492.0U CN220417719U (en) | 2023-07-31 | 2023-07-31 | Heat radiation cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322038492.0U CN220417719U (en) | 2023-07-31 | 2023-07-31 | Heat radiation cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220417719U true CN220417719U (en) | 2024-01-30 |
Family
ID=89657876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322038492.0U Active CN220417719U (en) | 2023-07-31 | 2023-07-31 | Heat radiation cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220417719U (en) |
-
2023
- 2023-07-31 CN CN202322038492.0U patent/CN220417719U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |