CN207353421U - A kind of cooling device - Google Patents

Abstract

A kind of cooling device is disclosed, including：Semiconductor chilling plate, including chill surface and heating face, are connected with conducting wire；Radiator, contacts with the heating face of semiconductor chilling plate；Thermal insulation layer, positioned at the periphery of semiconductor chilling plate, including wire guide, wherein, conducting wire passes through the wire guide so that conducting wire is at least partially disposed at outside thermal insulation layer, the distribution corresponding with the edge of thermal insulation board of the conducting wire outside thermal insulation layer.The both ends of conducting wire are pierced by the thermal insulation board by wire guide respectively, are connected with power supply.Semiconductor chilling plate is multiple, array distribution, and is serially connected by conducting wire.Diffusion sheet is further included, it is plate-like, on the chill surface of semiconductor chilling plate so that thermal insulation layer is between diffusion sheet and radiator.Conducting wire through thermal insulation layer can be located at outside thermal insulation layer, can strengthen the degree of heat radiation of conducting wire, make the reliability of cooling device strengthen, extend its service life so that it with highly reliable, technique is simple, it is easy for installation the characteristics of.

Description

a cooling device

technical field

The utility model relates to the field of water cooling systems, in particular to a cooling device.

Background technique

Energy shortage and environmental pollution are two major challenges facing the development of the world's automobile industry today. The development of electric vehicles has become one of the main directions for the development of the automobile industry in recent years. A certain foundation has been laid, pure electric vehicles have been widely favored by all walks of life, and the development of electric vehicles is largely restricted by the maturity of the three major technologies of battery cell technology, battery management system, and motor drive control system. As a key component of electric vehicles, power batteries have a major impact on the power, economy and safety of the vehicle. The safety performance of the battery system is particularly important, and the thermal management system of the power battery is responsible for monitoring and adjusting the temperature of the battery cells to improve safety performance and service life. A water cooling system is often used to dissipate heat from the power battery.

The electric vehicle power battery adopts the compressor type water-cooling cooling method of the prior art. The cooling system is generally composed of a condenser, a compressor, an expansion valve, a cooling plate, an electric water pump, a water tank and other components. There are many components involved, and the related cooling components occupy a lot of space. The volume is large, the weight of the corresponding components affects the cruising range of the vehicle, and the manufacturing process is complicated, the protection treatment requirements are strict, the risk of failure is high, and the cost is high.

Utility model content

The technical problem solved by the utility model is to provide a cooling device, the wires passing through the heat insulation layer can be located outside the heat insulation layer, and correspond to the edge of the heat insulation layer, and on the premise of simple and convenient manufacturing process, the insulation of the wires can be enhanced. The degree of heat dissipation enhances the reliability of the cooling device, thereby prolonging its service life.

According to a cooling device provided by the utility model, it is characterized in that it includes: a semiconductor refrigeration sheet, including a cooling surface and a heating surface, connected to a wire; a radiator, in contact with the heating surface of the semiconductor refrigeration sheet; heat insulation Layer, located on the periphery of the semiconductor refrigeration sheet, including a wire hole, wherein the wire passes through the wire hole, so that the wire is at least partially located outside the heat insulation layer, and all the wires located outside the heat insulation layer The wires are distributed correspondingly to the edge of the heat shield.

Preferably, both ends of the wire pass through the wire hole and pass through the heat insulation board respectively, and are connected to a power supply.

Preferably, there are a plurality of semiconductor cooling chips distributed in arrays and connected in series through the wires.

Preferably, a diffusion sheet is also included, which is plate-shaped and located on the cooling surface of the semiconductor cooling sheet, so that the heat insulation layer is located between the diffusion sheet and the heat sink.

Preferably, the diffuser and the heat sink respectively include a first installation hole and a second installation hole corresponding to each other, and the heat insulation layer includes a through hole corresponding to the first installation hole and the second installation hole. The hole, the diffuser, the heat insulation layer and the radiator are connected by rivets or bolts.

Preferably, the diffuser and the radiator are respectively made of aluminum alloy, wherein the diffuser is extruded from aluminum alloy.

Preferably, the cooling surface and the heating surface of the semiconductor cooling chip are respectively coated with thermal conductive silicone grease.

Preferably, the heat insulation layer is made of microporous calcium silicate board.

Preferably, it further includes: a water tank, and the diffusion sheet is attached to the outside of the water tank.

Preferably, the heat sink further includes a plurality of heat dissipation fins.

According to the cooling device of the present invention, the cooling is performed by the semiconductor cooling sheet, and the passing wire of the semiconductor cooling sheet is connected to the low-voltage DC power supply, so that the semiconductor includes a cooling surface and a heating surface. The wires connected with the semiconductor refrigerating sheet pass through the wire holes of the heat insulation layer located around the semiconductor refrigerating sheet, so that most of the wires are located outside the heat insulation layer, and the distribution of the wires corresponds to the edge of the heat insulation layer. It can avoid the influence of the heat insulation layer on the heat dissipation of the current-carrying wires, so that the current-carrying wires can dissipate heat normally. On the premise of simple manufacturing process and convenient installation, the heat dissipation degree of the wire can be enhanced, the reliability of the cooling device can be enhanced, and the service life of the cooling device can be extended.

At the same time, the diffuser on the cooling surface of the semi-conductor cooling sheet is in the shape of a sheet, which is attached to the cooling surface and the outside of the water tank respectively. The diffuser is made of aluminum alloy and is extruded. Not only the structure is simple, the installation is convenient, but also the cooling area of the cooling device can be increased, the cooling speed of the liquid in the water tank can be accelerated, thereby improving the working efficiency.

In addition, the semiconductor refrigeration sheet of the utility model is connected with a low-voltage DC power supply, which not only improves the safety factor of the refrigeration device, but also makes the control circuit simple, thereby reducing the production cost.

In a word, the cooling device of the utility model has a simple structure, less components involved, and light weight, so that the manufacturing process is simple and the manufacturing cost is low. Simultaneously, the cooling device of the utility model has no compressor, no freon, has the advantages of no noise, no vibration, no leakage, environmental protection and safety.

Description of drawings

Through the following description of the embodiments of the present invention with reference to the accompanying drawings, the above and other objects, features and advantages of the present invention will be more clear.

Fig. 1 and Fig. 2 show the perspective view and the exploded view of the perspective view of the water cooling system of the embodiment of the present invention respectively;

Fig. 3 shows the perspective view of the semiconductor refrigeration sheet and the heat insulation layer of the cooling device of the embodiment of the utility model

Fig. 4 shows the perspective view of the semiconductor refrigeration chip of the cooling device of the embodiment of the utility model;

Fig. 5 shows the perspective view of the heat insulation layer of the cooling device of the embodiment of the utility model;

Fig. 6 shows the perspective view of the diffuser of the cooling device of the embodiment of the utility model;

Fig. 7 shows a perspective view of the radiator of the cooling device according to the embodiment of the present invention.

Detailed ways

The utility model will be described in more detail below with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown in the drawings.

In the following, many specific details of the present invention are described, such as the structure, material, size, process and technology of components, so as to understand the present invention more clearly. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.

It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the part is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

Fig. 1 shows a perspective view of the water cooling system of the embodiment of the utility model. The water cooling system of the present invention includes a cooling device 100 and a water tank 900 . The cooling device 100 can be located outside the water tank 900 , wherein it can be placed on the bottom or side of the water tank 900 , and attached to the outside of the water tank 900 or the water pipe. The cooling device 100 and the water tank 900 may be detachably fixed, such as bolted or other suitable fixed connections. The water tank 900 of the water cooling system may also be a water pipe, or other suitable water containers. The above-mentioned water cooling system can be the cooling system of the power battery of the electric vehicle, which is located at the ventilation position of the lower part of the chassis of the electric vehicle, so as to facilitate heat dissipation.

Fig. 2 shows an exploded perspective view of the water cooling system of the embodiment of the present invention. The cooling device 100 of the present invention includes a semiconductor cooling chip 110 , a heat sink 120 , a heat insulating layer 130 , a diffusion sheet 150 and a wire 140 . The semiconductor cooling chip 110 includes a cooling surface and a heating surface, and the cooling surface can realize the cooling function of the semiconductor cooling chip 110 . The diffusion sheet 150 is located on the cooling surface of the peltier refrigerating sheet 110 , and is attached to the cooling surface to expand the cooling area of the device. The radiator 120 is located on the heating surface of the peltier refrigerating sheet 110 and can realize the heat dissipation function. The heat insulation layer 130 is located around the peltier 110 and between the diffuser 150 and the radiator 120 for separating the diffuser 150 from the radiator 120 to avoid heat conduction between the diffuser 150 and the radiator 120 . At the same time, the diffusing sheet 150 is attached to the semiconductor cooling sheet 110 and the outside of the water tank 900 respectively, which can increase the cooling area, thereby rapidly cooling the liquid in the water tank 900, which can not only improve the protection performance, but also improve the cooling efficiency.

Fig. 3 shows the perspective view of the semiconductor refrigeration sheet and the heat insulation layer of the cooling device of the embodiment of the utility model, and Fig. 4 and Fig. 5 respectively show the perspective views of the semiconductor refrigeration sheet and the insulation layer of the cooling device of the embodiment of the utility model. The semiconductor refrigeration sheet 110 of the present invention may be multiple, and distributed in an array, connected in series through wires 140, the two ends of the wires 140 are connected to a power supply, and the power supply may be a low-voltage direct current power supply. A plurality of semiconductor cooling chips 110 connected in series to form a cooling surface and a heating surface, not only makes the control circuit simple, but also has a high safety factor in the cooling process, and can reduce the manufacturing cost of the cooling system. The cooling surface and the heating surface of the semiconductor cooling plate 110 are uniformly attached with heat-conducting silica gel. The heat-conducting silica gel has a high heat rate, which can accelerate the temperature diffusion of the cooling surface or the heating surface, thereby improving the cooling effect of the refrigeration device.

The heat insulation layer 130 includes wire holes 131 and through holes 132 . Wherein, wire hole 131 is corresponding to the position that wire 140 is connected with semiconductor refrigeration sheet 110, and the wire 140 that is connected with semiconductor refrigeration sheet 110 can pass wire hole 131, and is placed outside heat insulating layer 130, can make wire 140 except Close to the part connected to the peltier refrigerating sheet 110 , most of the remaining wires 140 are outside the heat insulating layer 130 . Meanwhile, the wires 140 located outside the heat insulation layer 130 correspond to the edge of the heat insulation layer 130 . In this way, the influence of the heat insulation layer 130 on the heat dissipation of the conducting wire 140 can be avoided, so that the conducting wire 140 can dissipate heat normally. On the premise of simple manufacturing process and convenient installation, the heat dissipation degree of the wire 140 can be enhanced, so that the reliability of the cooling device can be enhanced, thereby prolonging its service life. At the same time, the thickness of the thermal insulation layer 130 is equal to or smaller than that of the semiconductor cooling sheet 110 , so that the cooling surface and the heating surface are attached to the diffusion sheet 150 and the radiator 120 respectively. In addition, the thermal insulation layer 130 can be made of 132 microporous calcium silicate board, or other suitable materials. In a word, the heat insulation layer 130 can effectively isolate the temperature conduction between the diffuser 150 and the radiator 120 under the premise of ensuring that the peltier refrigerating sheet 110 is normally energized and dissipated normally, thereby ensuring the effectiveness of the cooling device.

Fig. 6 shows a perspective view of the diffuser of the cooling device according to the embodiment of the present invention. The diffusion sheet 150 includes a first installation hole 151 corresponding to the through hole 132 on the heat insulation layer 130 . The diffuser 150 is extruded from aluminum alloy and is in the shape of a plate. The surface is treated with sandblasting and hard anodic oxidation, which can make the heat dissipation efficiency high and the anti-corrosion ability strong. At the same time, the diffuser 150 is attached to the cooling surface and the outside of the water tank 900 respectively, which not only has a simple structure and is easy to install, but also can increase the cooling area of the cold device and accelerate the cooling speed of the liquid in the water tank 900, thereby improving work efficiency.

Fig. 7 shows a perspective view of the radiator of the cooling device according to the embodiment of the present invention. The heat sink 120 includes a second mounting hole 121 and a plurality of heat dissipation fins 122 . Wherein, one side of the radiator 120 is attached to the heating surface, and a plurality of cooling fins 122 are located on the other side, which not only can increase the heat conduction area, but also makes the radiator 120 The heat dissipation rate increases. The second installation hole 121 corresponds to the first installation hole 151 located in the diffusion sheet 150, and the diffusion sheet 150, the heat insulation layer 130 and the radiator 120 can be fixed to each other through the first installation hole 151, the second installation hole 121 and the through hole 132. Connection, the fixed connection can be connected by rivets, bolts, or other suitable connections. The heat sink 120 can be made of high thermal conductivity material, such as aluminum alloy material, or other suitable materials.

At the same time, the size of the diffusion sheet 150, the heat insulation layer 130 and the radiator 120 can correspond to each other; the shape of the diffusion sheet 150, the insulation layer 130 and the radiator 120 can correspond to the shape of the outer wall of the water tank 900 or the outer wall of the water pipe, such as a diffusion sheet 150 and the bonding surface of the heat sink 120 may be rectangular, or other suitable shapes. The cooling device 100 of the present utility model is insulated from the battery system and the whole vehicle, so as to ensure no leakage risk during operation and improve the safety factor of the water cooling system and the electric vehicle.

The cooling device 100 of the present utility model has a simple structure, less components involved, and light weight, so that the manufacturing process is simple and the manufacturing cost is low. Simultaneously, the cooling device 100 of the utility model has no compressor, no freon, has the advantages of no noise, no vibration, no leakage, environmental protection and safety.

It should be noted that in this article, relational terms such as first and second etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

Embodiments according to the present invention are as described above, and these embodiments do not exhaustively describe all details, nor limit the utility model to only the specific embodiments described. Obviously many modifications and variations are possible in light of the above description. This description selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that those skilled in the art can make good use of the utility model and the modification and use on the basis of the utility model . The invention is to be limited only by the claims and their full scope and equivalents.

Claims (10)

1. A kind of 1. cooling device, it is characterised in that including：

   Semiconductor chilling plate, including chill surface and heating face, are connected with conducting wire；

   Radiator, contacts with the heating face of the semiconductor chilling plate；

   Thermal insulation layer, positioned at the periphery of the semiconductor chilling plate, including wire guide,

   Wherein, the conducting wire passes through the wire guide so that the conducting wire is at least partially disposed at outside the thermal insulation layer, positioned at institute State the conducting wire distribution corresponding with the edge of the thermal insulation board outside thermal insulation layer.
2. 2. cooling device according to claim 1, it is characterised in that the both ends of the conducting wire pass through the wire guide respectively The thermal insulation board is pierced by, is connected with power supply.
3. 3. cooling device according to claim 1, it is characterised in that the semiconductor chilling plate is multiple, array distribution, And it is serially connected by the conducting wire.
4. 4. cooling device according to claim 1, it is characterised in that diffusion sheet is further included, it is plate-like, partly led positioned at described On the chill surface of body cooling piece so that the thermal insulation layer is between the diffusion sheet and the radiator.
5. 5. cooling device according to claim 4, it is characterised in that the diffusion sheet and the radiator include respectively The first mounting hole and the second mounting hole corresponded, the thermal insulation layer include and first mounting hole and second peace The corresponding through hole in hole is filled, the diffusion sheet, the thermal insulation layer and the radiator by rivet interlacement or are bolted.
6. 6. cooling device according to claim 4, it is characterised in that the diffusion sheet and the radiator are respectively adopted Aluminum alloy materials are made, wherein the diffusion sheet is aluminium alloy extruded shaping.
7. 7. cooling device according to claim 1, it is characterised in that the chill surface of the semiconductor chilling plate and Heat-conducting silicone grease is smeared respectively on the heating face.
8. 8. cooling device according to claim 1, it is characterised in that the thermal insulation layer is made of calcium silicate board with microporous.
9. 9. cooling device according to claim 4, it is characterised in that the cooling device is used in water-cooling system, described Water-cooling system includes water tank, and the diffusion sheet on the outside of the water tank with fitting.
10. 10. cooling device according to claim 1, it is characterised in that the radiator further includes multiple radiating fins.