CN102858141B - Dispersive heat radiation type thermostat for field instruments - Google Patents
Dispersive heat radiation type thermostat for field instruments Download PDFInfo
- Publication number
- CN102858141B CN102858141B CN201210335800.XA CN201210335800A CN102858141B CN 102858141 B CN102858141 B CN 102858141B CN 201210335800 A CN201210335800 A CN 201210335800A CN 102858141 B CN102858141 B CN 102858141B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat radiation
- subspace
- chilling plate
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a dispersive heat radiation type thermostat for field instruments. A heat radiation passage is externally disposed on the top of the box body, a plurality of parallel heat radiation fins are arranged in the heat radiation passage, a fan is arranged at one end of the heat radiation passage, space on the top in the box body is divided into a plurality of subspace heat radiation boxes, the bottom of each subspace heat radiation box is a shared double-rail support structure, the lower portions of the heat radiation fins are nested on the top wall in the box body and are semiconductor cooling fins arranged in the subspace heat radiation boxes, cooling guide fins are arranged on the lower portions of the semiconductor cooling fins, heat surfaces of the semiconductor cooling fins are connected with the heat radiation fins, and the cold surfaces of the semiconductor cooling fins are connected with the cooling guide fins. The semiconductor cooling fins and the cooling guide fins are arranged in each subspace heat radiation box. Temperature detection and control modules arranged below the cooling guide fins and electronic instruments to be radiated are arranged in the subspace heat radiation boxes, and the temperature detection and control modules are connected with the semiconductor cooling fins via a power source driving module. The dispersive heat radiation type thermostat is capable of effectively isolating heat and cold transfer, and realizes heat radiation of the electronic instruments working in the outdoor environment.
Description
Technical field
The present invention relates to a kind of instrument Thermotank device, particularly work in the instrument Thermotank device of wild environment, being used for realizing the heat radiation to working in electronic instrument under open-air atmosphere, reducing the device fault that high temperature causes.
Background technology
The normal work of hot environment to electronic instrument has a significant impact, particularly be placed in the electronic instrument in field, under hot summer daylight, in addition the heating of instrument itself, the temperature that operational environment reaches quite high can be made, have a strong impact on the normal work of electronic instrument, cause electronic instrument fault, even can produce certain potential safety hazard in some occasion.
For this situation, people adopt instrument incubator, under making the electronic instrument be placed in incubator be operated in a more suitable temperature environment.The part but traditional incubator comes with some shortcomings: with regard to refrigeration modes, conventional vacuum case adopts external hanging type compressor air-conditioning refrigeration, and compressor air-conditioning volume is large, and can not be placed in incubator, do not have special safeguard measure easily stolen, meanwhile, involving great expense of air-conditioning; In refrigeration radiating method, conventional vacuum case adopts integral type refrigeration radiating, and to the unified refrigeration radiating that has living space of whole casing, without specific aim, radiating efficiency is low, and power consumption is large; In the configuration aspects of incubator, conventional vacuum case take inner space as integral type, and not by spatial mode blocking, can not solve modularization internal thermal equilibrium problem, energy waste is larger.
Summary of the invention
The object of the invention is the deficiency of the instrument incubator for existing field condition, propose the field apparatus insulating box of the distributing heat radiation that a kind of volume is little, power consumption is little, refrigeration radiating efficiency is high.
The technical solution used in the present invention is: comprise casing, casing is equipped with heat dissipation channel outside top, multiple fin is side by side provided with in heat dissipation channel, one end of heat dissipation channel is provided with fan, headroom in casing is divided to be separated with multiple subspaces heat dissipation tank, it is shared Double-rail support structure bottom every sub spaces heat dissipation tank, fin bottom is inlaid on the roof in casing and is arranged in the semiconductor chilling plate of subspace heat dissipation tank, semiconductor chilling plate bottom is cool guide sheet, the hot side of semiconductor chilling plate is connected with fin, huyashi-chuuka (cold chinese-style noodles) is connected with cool guide sheet, semiconductor chilling plate and cool guide sheet is all had in every sub spaces heat dissipation tank, and in every sub spaces heat dissipation tank, all have the electronic instrument being positioned at temperature detection below cool guide sheet and control module and need dispelling the heat, temperature detection and control module connect semiconductor chilling plate by electric power driving module.
Beneficial effect of the present invention is as follows:
1, the present invention is directed to the Instrument Design of field condition, refrigeration radiating mode adopts semiconductor refrigerating technology to casing refrigeration radiating, but not compressor air-conditioning refrigeration, fail safe is high, greatly reduces power consumption, installs and also facilitates.
2, the present invention is directed to semiconductor chilling plate can only have refrigeration feature to small volume space, instrument container larger for volume is partitioned into as required the subspace heat dissipation tank of respective numbers, the only refrigeration radiating of antithetical phrase space heat elimination packing list, meets the condition of work of semiconductor chilling plate.
3, the present invention puts into subspace heat dissipation tank there being the electronic device of strict demand to operating ambient temperature, and as CPU etc., it is outside that other are then placed on subspace heat dissipation tank to the electronic device that operating ambient temperature does not require.This mode by subspace heat dissipation tank, internal and external environment being completely cut off also separate refrigeration, is improve refrigerating efficiency, saves the energy and regulating time.
The fin of the semiconductor chilling plate 4, in the present invention discharges side by side, all in the heat dissipation channel of insulating box outside, and heat dissipation channel axially arrangement is pressed in fin fin direction, only need a fan just can form air circulation in heat dissipation channel, realize gelled heat radiation, and do not need each fin to add radiator fan.The existence of heat dissipation channel, both ensure that the circulation of air, served again the protection to fin, avoided the exposed damage of fin.
5, the present invention adds one layer of heat preservation thermal insulation layer at subspace heat dissipation tank inwall, and this insulation layer material adopts compressed sponge.Can effectively isolate cold and hot transmission, make refrigeration in the heat dissipation tank of subspace better.
6, the heat dissipation tank top, subspace in the present invention is all connected with casing with dorsal surface, saves material.The right edge of positive side is connected with right flank by hinge, and positive side is can switching door structure, facilitates the taking and placing of electronic instrument, does not need dismounting.Bottom has Double-rail support to support subspace heat dissipation tank, strengthens structural stability.
The cool guide sheet of the semiconductor chilling plate refrigerating system 7, in the present invention is at the top of subspace heat dissipation tank, and the cold air of cool guide sheet periphery declines, and hot-air rises, and this just defines cross-ventilation automatically, and does not need to add fan belt moving air flow again.
Accompanying drawing explanation
Fig. 1 is overall structure profile of the present invention;
Fig. 2 is the stereochemical structure enlarged drawing of Fig. 1 sub-spaces heat dissipation tank 6 internal structure and associated member thereof;
Fig. 3 is the mounting structure enlarged drawing of fin 3 of the present invention, semiconductor chilling plate 4, cool guide sheet 5 and heat insulating mattress 16, electric wire 17;
Fig. 4 is the internal structure enlarged drawing of heat dissipation channel 2 in Fig. 1;
In figure: 1. casing; 2. heat dissipation channel; 3. fin; 4. semiconductor chilling plate; 5. cool guide sheet; 6. subspace heat dissipation tank; 7. fan; 8. circuit breaker; 9. Double-rail support structure; 11. temperature detection and control module; 12. electronic devices; 13. hinges; 14. sponges; 15. handles; 16. heat insulating mattresss; 17. electric wires.
Embodiment
The field apparatus insulating box of distributing heat radiation of the present invention is the insulating box for the design of field condition apparatus, insulating box improves on the basis of original instrument container, change semiconductor chilling plate refrigeration into, by stages independently dispels the heat, replacement traditional compressor air-conditioning heat dissipation.
See Fig. 1-4, the present invention includes casing 1 and the external heat dissipation channel 2 at casing 1 top, in heat dissipation channel 2, have multiple fin 3 located side by side, at heat dissipation channel 2 one end provided with fan 7, drive airflow radiating.Headroom in casing 1 is divided to be separated with multiple subspaces heat dissipation tank 6, is shared Double-rail support structure 9 bottom every sub spaces heat dissipation tank 6.Fin 3 is below semiconductor chilling plate 4, the tank wall that semiconductor chilling plate 4 is inlaid in the top layer in casing 1 is positioned at subspace heat dissipation tank 6, is with heat insulating mattress 16 and protects, prevent semiconductor chilling plate 4 from being compressed outside semiconductor chilling plate 4.Cool guide sheet 5 is below semiconductor chilling plate 4, and cool guide sheet 5 periphery is the cabinet space of subspace heat dissipation tank 6.Every sub spaces heat dissipation tank 6 is independently opened up, a public casing between they are adjacent, and subspace heat dissipation tank 6 is wide equal with height, and length sets according to internal electronic device 12 volume.Subspace heat dissipation tank 6 top is all connected with casing 1 with the back side, and bottom is supported by Double-rail support structure 9.All install a semiconductor chilling plate 4 and one and half cool guide sheets 5 in every sub spaces heat dissipation tank 6, the electronic instrument 12 being positioned at temperature detection below cool guide sheet 5 and control module 11 and needing heat radiation is also equipped with in every sub spaces heat dissipation tank 6 inside.Part beyond subspace heat dissipation tank 6 is non-brake method heat-dissipating space, and non-brake method heat-dissipating space volume is large, is used for settling circuit breaker 8 grade not need the electronic device of low-temperature working environment.
Different from the instrument insulating box that traditional air conditioner is freezed, insulating box of the present invention adopts the casing 1 internal refrigeration storage heat radiation of semiconductor chilling plate 4 pairs of insulating boxs.Semiconductor chilling plate 4 volume is little, mechanical moving component, install very convenient.After semiconductor chilling plate 4 powers on, semiconductor chilling plate 4 hot side can release heat, and huyashi-chuuka (cold chinese-style noodles) then absorbs heat, utilizes huyashi-chuuka (cold chinese-style noodles) can reach the effect of refrigeration radiating.But semiconductor chilling plate 4 can only dispel the heat to the space refrigeration of small volume, the excessive refrigeration of volume is very not obvious.And the volume of the casing 1 of field instrumentation case very large (being generally 400-600L), have little effect with semiconductor chilling plate 4, if with multiple semiconductor chilling plate, cost can corresponding rising.In order to solve the problem, piecemeal is carried out in bulky casing 1 inside by the present invention, as required casing 1 inside division is gone out the subspace heat dissipation tank 6 of respective numbers, installs semiconductor chilling plate 4 in every sub spaces heat radiation box 6.Isolate internal and external environment by subspace heat dissipation tank 6, dispel the heat to subspace heat dissipation tank 6 separate refrigeration by semiconductor chilling plate 4.The model of semiconductor chilling plate 4 is selected, decide according to the cold gross power of product that can meet temperature difference requirement, it must ensure that the summation of the refrigeratory capacity when working temperature is greater than the gross power of target heat load in the heat dissipation tank of subspace, otherwise cannot reach requirement.Namely the maximum refrigeratory capacity of semiconductor chilling plate 4 is
cmax, the thermal power of each electronic instrument 12 of subspace heat dissipation tank 6
pi, only satisfies condition
time, refrigeration requirement could be met, reach modularization internal thermal equilibrium.Subspace heat dissipation tank 6 volume sets according to electronic device 12 size put into wherein.The selection of semiconductor chilling plate 4 model, can be decide according to the cold gross power of product that meet temperature difference requirement, it must ensure that the summation of the refrigeratory capacity when working temperature is greater than the gross power of target electronic device 12 heat load in subspace heat dissipation tank 6.Need the part of thermal component electronic device 12 small volume, be placed in the little subspace heat dissipation tank 6 of volume, semiconductor chilling plate 4 selects model TEC1-12708.And needing the part that thermal component 12 volume is larger, corresponding subspace heat dissipation tank 6 volume is large, and semiconductor chilling plate 4 is selected and produced cold power relatively large TES1-12712.Semiconductor chilling plate 4 is placed in the top tank wall of casing 1, is with heat insulating mattress 16 outward and fixes and protection, prevent semiconductor chilling plate 4 to be extruded.Without the need to thermal component, as circuit breaker 8 and circuit lines, these do not need the device of low-temperature working environment to be then placed on outside subspace heat dissipation tank 6.The general layout of this local refrigeration radiating, had both met the cryogenic conditions of semiconductor chilling plate 4, additionally reduced refrigeration radiating space, only to the space refrigeration heat radiation needing refrigeration, substantially increased refrigerating efficiency.
See Fig. 2, the top of subspace heat dissipation tank 6 is all connected with casing 1 with the back side, saves top and backing material.The right edge in front is connected with right flank by hinge 13, and front is provided with handle 15, and front is equivalent to the door of subspace heat dissipation tank 6, controls front folding by handle 15, and door facilitates the taking and placing of electronic instrument 12.Supported by Double-rail support structure 9 bottom subspace heat dissipation tank 6.Have one deck compressed sponge 14 at the inwall of subspace heat dissipation tank 6, it is heat insulation layer, can cold and hot transmission that effectively separaant space heat elimination case 6 is inside and outside.Are cool guide sheets 5 at the top of subspace heat dissipation tank 6, dispelled the heat by the inner conduction cooling of cool guide sheet 5 antithetical phrase space heat elimination case 6, need work electronic instrument 12 to be at low ambient temperatures placed in subspace heat dissipation tank 6.
See Fig. 3,4, semiconductor chilling plate 4 connects electric wire 17, and the hot side of semiconductor chilling plate 4 is connected with fin 3, and huyashi-chuuka (cold chinese-style noodles) is connected with cool guide sheet 5, and centre is pasted by heat-conducting silicone grease, is screwed in together between fin 3 and cool guide sheet 5.After powering to semiconductor chilling plate 4 by electric wire 17, the hot side of semiconductor chilling plate 4 can generate heat, and huyashi-chuuka (cold chinese-style noodles) can absorb heat.Semiconductor chilling plate 4 is embedded in the top layer tank wall of the casing 1 of insulating box, and periphery is fixed by heat insulating mattress 16 and protected, and prevent the extruding of semiconductor chilling plate 4 from causing damage, and heat insulating mattress 16 can effectively isolate cold and hot transmission, makes refrigeration better.Hot side good heat radiating must be given when semiconductor chilling plate 4 works, semiconductor chilling plate 4 is being easy to without working under radiating condition damage, fin 3 is connected with the hot side of semiconductor chilling plate 4, fin 3 is arranged in the heat dissipation channel 2 outside insulating box 1 top side by side, the arrangement of passage axial direction pressed by the fin of fin 3, ensures air-flow conducting.At the head of heat dissipation channel 2, radiator fan 7 is housed, is driven the radiating airflow of in heat dissipation channel 2 by fan 7, fin 3 is dispelled the heat.Cool guide sheet 5 is connected with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 4, is arranged on the top in subspace heat dissipation tank 6.Due to density reasons, the cold air of cool guide sheet 5 periphery sinks, and the Base Heat air in subspace heat dissipation tank 6 rises, and automatically defining cross-ventilation, driving air to flow without the need to adding fan 7.The configuration achieves outside concentrating to dispel the heat, the inner high efficiency instrument insulating box freezed respectively.
The present invention can realize the control to temperature, is realized by temperature detection and control module 11.Temperature detection and control module 11 have all been installed in every sub spaces heat dissipation tank 6, temperature detection and control module 11 connect semiconductor chilling plate 4 by electric power driving module, the temperature inside the box of Real-Time Monitoring corresponding subspace heat dissipation tank 6, when the temperature of the temperature of subspace heat dissipation tank 6 higher than setting being detected, such as 25 degree time, temperature detection and control module 11 control corresponding electric power driving module and work to semiconductor chilling plate 4, antithetical phrase space heat elimination case 6 refrigeration radiating; When temperature detection and control module 11 monitor space temperature lower than setting temperature time, such as 25 degree time, temperature detection and control module 11 control corresponding semiconductor chilling plate 4 and quit work.So, make to keep in subspace heat dissipation tank 6 space temperature that stable always.By antithetical phrase space heat elimination case 6 temperature detection respectively, refrigeration radiating reaches heat balance respectively, and this method is efficient, energy-conservation.
To sum up; the present invention can not deviate from the multi-form enforcement of essential characteristic of the present invention; the present embodiment combines semiconductor refrigerating technology, automation detection and control technology, for field environmental protection system for field device provides constant temperature to protect, and has the feature of energy-conservation, safety, environmental protection.Improve the refrigeration radiating mode of insulating box, have great application prospect.The present invention is not only confined to the insulating box for wild environment, can be applied to instrument insulating box under multiple environment as required.
Claims (1)
1. the field apparatus insulating box of a distributing heat radiation, comprise casing (1), heat dissipation channel (2) is equipped with outside casing (1) top, multiple fin (3) is side by side provided with in heat dissipation channel (2), one end of heat dissipation channel (2) is provided with fan (7), headroom in casing (1) is divided to be separated with multiple subspaces heat dissipation tank (6), every sub spaces heat dissipation tank (6) bottom is shared Double-rail support structure (9), fin (3) bottom is inlaid on the roof in casing (1) and is arranged in the semiconductor chilling plate (4) of subspace heat dissipation tank (6), semiconductor chilling plate (4) bottom is cool guide sheet (5), the hot side of semiconductor chilling plate (4) is connected with fin (3), huyashi-chuuka (cold chinese-style noodles) is connected with cool guide sheet (5), semiconductor chilling plate (4) and cool guide sheet (5) is all had in every sub spaces heat dissipation tank (6), and in every sub spaces heat dissipation tank (6), all have the temperature detection and control module (11) that are positioned at cool guide sheet (5) below and the electronic instrument (12) that need dispel the heat, temperature detection and control module (11) connect semiconductor chilling plate (4) by electric power driving module, it is characterized in that:
The top of subspace heat dissipation tank (6) is all connected with casing (1) with the back side, the right edge in front is connected by hinge (13) and right flank, and front is provided with handle (15);
When temperature detection and control module (11) detect that temperature in subspace heat dissipation tank (6) is higher than design temperature, temperature detection and control module (11) control corresponding semiconductor chilling plate (4) work, antithetical phrase space heat elimination case (6) refrigeration radiating; When temperature detection and control module (11) detect that temperature in subspace heat dissipation tank (6) is lower than design temperature, temperature detection and control module (11) control corresponding semiconductor chilling plate (4) and quit work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210335800.XA CN102858141B (en) | 2012-09-12 | 2012-09-12 | Dispersive heat radiation type thermostat for field instruments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210335800.XA CN102858141B (en) | 2012-09-12 | 2012-09-12 | Dispersive heat radiation type thermostat for field instruments |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102858141A CN102858141A (en) | 2013-01-02 |
| CN102858141B true CN102858141B (en) | 2015-03-04 |
Family
ID=47404209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210335800.XA Expired - Fee Related CN102858141B (en) | 2012-09-12 | 2012-09-12 | Dispersive heat radiation type thermostat for field instruments |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102858141B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353564B (en) * | 2013-07-08 | 2015-07-15 | 工业和信息化部电子第五研究所 | Intermittent life testing device |
| CN104174448B (en) * | 2014-08-18 | 2016-01-20 | 合肥工业大学 | Natural convection high-accuracy and constant incubator |
| CN105208820A (en) * | 2015-10-20 | 2015-12-30 | 南京中网卫星通信股份有限公司 | Water-proof and dust-proof communication box |
| CN106524568A (en) * | 2017-01-04 | 2017-03-22 | 江苏特力威信息系统有限公司 | Forced refrigeration equipment box |
| CN107248364A (en) * | 2017-08-03 | 2017-10-13 | 火星人视野（北京）教育科技有限公司 | A kind of hot refrigerator of teaching and preparation method thereof |
| CN107943145A (en) * | 2017-12-21 | 2018-04-20 | 大连中工策控科技有限公司 | A kind of easy to remove and heat dissipation industrial personal computer |
| CN108645072A (en) * | 2018-05-30 | 2018-10-12 | 无锡艾迪尔家居有限公司 | A kind of semiconductor refrigeration radiating device |
| CN109163199A (en) * | 2018-07-27 | 2019-01-08 | 合肥金新允电子技术有限公司 | A kind of wall-mounted installation structure of touch panels of household |
| CN110581452B (en) * | 2019-09-10 | 2021-07-02 | 滁州康贝伟业电气设备有限公司 | Ventilation filter screen assembly for electric power cabinet |
| CN111520957A (en) * | 2020-04-27 | 2020-08-11 | 苏州昱竣新材料有限公司 | High-efficient container formula freezer |
| CN115986909B (en) * | 2023-01-11 | 2023-10-20 | 南京致丰能源设备有限公司 | Constant-temperature box-type uninterrupted power supply |
| CN117347541B (en) * | 2023-12-04 | 2024-04-12 | 湖南凯莱谱生物科技有限公司 | Gas chromatograph containing cold and hot temperature field generating device, detection method and application |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409374A (en) * | 2008-11-19 | 2009-04-15 | 南京科迅科技有限公司 | Constant temperature cabinet for accumulator and temperature-controlling method thereof |
| CN102320420A (en) * | 2011-05-27 | 2012-01-18 | 公安部第一研究所 | Incubator based on semiconductor refrigeration |
-
2012
- 2012-09-12 CN CN201210335800.XA patent/CN102858141B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409374A (en) * | 2008-11-19 | 2009-04-15 | 南京科迅科技有限公司 | Constant temperature cabinet for accumulator and temperature-controlling method thereof |
| CN102320420A (en) * | 2011-05-27 | 2012-01-18 | 公安部第一研究所 | Incubator based on semiconductor refrigeration |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102858141A (en) | 2013-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102858141B (en) | Dispersive heat radiation type thermostat for field instruments | |
| CN107219906B (en) | Semiconductor cold storage type radiator device and method | |
| CN102412515B (en) | Automatic cooling outdoor cabinet | |
| CN203759637U (en) | Computer hard disk drive semiconductor cooling heating device | |
| CN110912009A (en) | Electric control cabinet capable of keeping constant temperature | |
| CN2791583Y (en) | Plate-type heat exchanger | |
| CN201181135Y (en) | Semiconductor refrigerator and use thereof | |
| CN104679175A (en) | Dustproof radiating machine case | |
| CN206728481U (en) | A kind of housings close formula charging pile | |
| CN202257426U (en) | Semi-conductor refrigeration notebook computer radiator | |
| CN204285927U (en) | A kind of field refrigerator | |
| CN218006860U (en) | Liquid cooling equipment, integrated cabinet and container | |
| CN202474599U (en) | Automatic cooling outdoor intelligent distribution box | |
| CN202333510U (en) | Automatic cooling outdoor cabinet | |
| CN216752636U (en) | High-efficient radiating server rack | |
| CN113038804B (en) | Fresh air cooling and heat exchanging system based on semiconductor refrigerating sheet | |
| CN202231602U (en) | Frequency converter box | |
| CN202536401U (en) | Camera bag with intelligent cold-heat control | |
| JPWO2019150560A1 (en) | Power converter | |
| CN204513842U (en) | Conductor refrigeration system | |
| CN206531339U (en) | A kind of refrigerator | |
| CN204013071U (en) | A kind of cooling system of totally-enclosed machine | |
| KR200493401Y1 (en) | Battery cooling system | |
| CN106723773A (en) | A kind of parasols based on semiconductor chilling plate | |
| CN219291474U (en) | Low-temperature operation experiment table |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20150912 |
|
| EXPY | Termination of patent right or utility model |