CN219291474U

CN219291474U - Low-temperature operation experiment table

Info

Publication number: CN219291474U
Application number: CN202222959289.2U
Authority: CN
Inventors: 吴鹏
Original assignee: North China University of Science and Technology
Current assignee: North China University of Science and Technology
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-07-04
Anticipated expiration: 2032-11-08

Abstract

The utility model relates to the field of experimental equipment facilities, in particular to a low-temperature operation experiment table. The semiconductor refrigerating device comprises a table top, wherein the table top is a heat conducting table top, a semiconductor refrigerating sheet is arranged below the table top, the refrigerating surface of the semiconductor refrigerating sheet is fixedly connected with the heat conducting table top, a radiating sheet is arranged below the semiconductor refrigerating sheet, and the radiating sheet is arranged in a packaging box with an opening at the top; the front and the back of the packaging box are provided with heat dissipation windows, and the bottom is provided with an air inlet; the heat conduction table top is fixed at the top of the packaging box; the positive electrode and the negative electrode of the semiconductor refrigerating sheet are respectively connected with the positive electrode and the negative electrode of the low-voltage direct current power supply correspondingly. The utility model utilizes the semiconductor refrigerating sheet and the radiating sheet to form a simple cooling system, is matched with the packaging box and the low-voltage direct current power supply to form a low-temperature operation platform in an open environment, can provide a long-time low-temperature operation environment for a user, and is easy to keep the clean and tidy experiment table top.

Description

Low-temperature operation experiment table

Technical Field

The utility model relates to the field of experimental equipment facilities, in particular to a low-temperature operation experiment table.

Background

In the experimental operations of subjects such as cell biology, cell morphology and genetics, and in the detection of genetic diseases in departments related to medical institutions, it is often necessary to operate the experimental materials or the experimental vessels in an environment below room temperature (usually-10 ℃).

At present, when the operation is required in a low-temperature environment, a common laboratory operation method is to put experimental materials (laboratory vessels) on a frozen ice box for operation. However, the ice box is rapidly warmed up at room temperature, and is difficult to keep a long-time low temperature; in summer with high air humidity, condensed water can be generated to pollute the experiment table, and if the experiment table is polluted by self-made ice boxes, ice water splashes outside due to melting of ice in the boxes. Currently, in the prior art, a low-temperature test environment is realized by utilizing liquid nitrogen, for example, a national utility model patent with a patent number of CN209311077U is named as a low-temperature test stand, and the technology adopts liquid nitrogen for cooling.

Therefore, research on a low-temperature operation platform without a freezing ice box and in an open environment is a problem to be solved urgently.

Disclosure of Invention

The utility model aims at solving a plurality of problems of the low-temperature operation environment realized by the ice box in the prior art, thereby developing a low-temperature operation experiment table.

The technical scheme adopted for realizing the purpose is as follows: the low-temperature operation experiment table comprises a table top, wherein the table top is a heat conduction table top, a semiconductor refrigerating sheet is arranged below the table top, the refrigerating surface of the semiconductor refrigerating sheet is fixedly connected with the heat conduction table top, a radiating sheet is arranged below the semiconductor refrigerating sheet, and the radiating sheet is arranged in a packaging box with an opening at the top; the front and the back of the packaging box are provided with heat dissipation windows, and the bottom is provided with an air inlet; the heat conduction table top is fixed at the top of the packaging box; the positive electrode and the negative electrode of the semiconductor refrigerating sheet are respectively connected with the positive electrode and the negative electrode of the low-voltage direct current power supply correspondingly.

Compared with the prior art, the utility model utilizes the semiconductor refrigerating sheet and the radiating sheet to form a simple cooling system, and is matched with the packaging box and the low-voltage direct-current power supply to form a low-temperature operation platform in an open environment; the utility model has simple structure, low cost, easy maintenance, good cooling effect and convenient experiment operation, can provide a long-time low-temperature operation environment for a user, and is easy to keep the experiment table surface clean and tidy.

The utility model adopts the following preferable scheme:

the heat conduction table top is made of aluminum alloy or copper alloy.

A cooling fan is arranged in the packaging box; the cooling fans are divided into cooling fans which are arranged at the bottoms of the cooling fins and used for introducing cold air into the cooling fins, and cooling fans which are arranged at the front or rear inner cooling windows of the packaging box and used for discharging hot air in the packaging box; the positive and negative poles of the cooling fan are respectively connected with the positive and negative poles of the cooling fin.

And heat conduction silicone grease is respectively coated between the heat conduction table surface and the semiconductor refrigerating sheet and between the semiconductor refrigerating sheet and the radiating sheet.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a top view of the enclosure of an embodiment of the present utility model;

FIG. 3 is a perspective view of an enclosure in an embodiment of the utility model;

in the figure: a table top 1; a semiconductor refrigerating sheet 2; a heat sink 3; the packaging box 4, the heat dissipation window 4-1 and the air inlet 4-2; and a heat radiation fan 5.

Detailed Description

The utility model will now be described in detail with reference to the accompanying drawings and examples:

the low-temperature operation experiment table provided by the embodiment mainly comprises a table top 1, a semiconductor refrigerating sheet 2, a radiating fin 3, a low-voltage direct current power supply and the like.

The table top 1 is a heat conducting table top, in this embodiment, the heat conducting table top 1 is made of copper alloy, and in addition, aluminum alloy and other metal alloys with good heat conducting performance can be used for manufacturing the heat conducting table top. The embodiment adopts a 12vDC power adapter to provide the required low-voltage power supply for the embodiment; in the implementation, a voltage reducing device (such as a direct current switch power supply LED transformer) can be arranged in the packaging box, and an alternating current power supply can be connected to the outside.

As shown in fig. 2, in the present embodiment, a semiconductor cooling plate 2 is disposed below the table top 1, the semiconductor cooling plate 2 is divided into a cooling surface and a heat dissipating surface, the cooling surface of the semiconductor cooling plate 2 is fixedly connected to the table top 1, the number of the semiconductor cooling plates 2 is related to the area of the table top 1 and the size of the semiconductor cooling plate 2, and two semiconductor cooling plates 2 are used in the present embodiment. The semiconductor refrigerating plate 2 is provided with the fin 3 below, and the fin 3 is laminated with the cooling surface of semiconductor refrigerating plate 2, adopts screw fixed connection between fin 3 and the mesa 1.

In the embodiment, the heat conducting silica gel is coated between the semiconductor refrigerating sheet 2 and the table board 1, and between the semiconductor refrigerating sheet 2 and the radiating fin 3, namely, the heat transfer effect is ensured by filling the heat exchanging surface with the heat conducting silica gel.

As shown in fig. 2 and 3, the top of the package 4 is open. As shown in fig. 1, the heat conducting table top 1 is fixed and covers the top opening of the packaging box 4, and in this embodiment, the heat conducting table top 1 and the packaging box 4 are fixedly connected by using screws, and any means capable of fixing the heat conducting table top 1 and the packaging box 4, such as bonding, clamping, riveting, and the like, may be adopted in the implementation. The heat sink 3 and the semiconductor cooling fin 2 are housed inside the package case 4.

As shown in fig. 2 and 3, in order to improve the refrigerating effect of the present embodiment, heat dissipation windows 4-1 are respectively provided at the front and rear sides of the package box 4, and an air inlet 4-2 is provided at the bottom side. In this embodiment, the height of the heat sink 3 is consistent with the lower edge of the heat dissipation window 4-1 in front of or behind the package box 4, and the size specifications of the heat dissipation windows in front of and behind are uniform in this embodiment, and the length of the heat sink 3 is consistent with the heat dissipation window 4-1.

Meanwhile, in the embodiment, four cooling fans 5 are further arranged in the packaging box 4, wherein two cooling fans 5 are arranged at the bottom of the cooling fin 3 and used for introducing external air with lower temperature into the packaging box 4 and entering into gaps of the cooling fin 3 to take away heat of the cooling fin 3; the other two heat dissipation fans 5 are used to exhaust the air (hot air) of higher temperature in the package case 4. By adding four cooling fans 5, the air circulation inside the packaging box 4 is improved, and compared with the natural ventilation, the integrated forced circulation is formed, so that the semiconductor refrigerating sheet 2 works more smoothly, and the refrigerating effect of the embodiment is improved.

In order to meet the installation requirements of the exhaust cooling fan 5, the radiator width is narrower than the width of the packaging box 4 by one or two thicknesses of the cooling fan 5. The positive electrode and the negative electrode of the semiconductor refrigeration piece 2 are respectively connected with the positive electrode and the negative electrode of the low-voltage direct current power supply correspondingly.

Working principle: after the power is on, the semiconductor refrigerating sheet 2 starts to work, as the refrigerating surface is connected with the heat conducting table top 1 through the heat conducting silicone grease, the temperature of the heat conducting table top 1 is reduced, the heat radiating surface of the semiconductor refrigerating sheet 2 is connected with the heat radiating sheet 3 through the heat conducting silicone grease, the heat is conducted onto the heat radiating sheet 3, the cooling air is led (pumped) into the box through the air inlet 4-2 from the outside of the packaging box 4 by the cooling fan 5 connected onto the heat radiating sheet 3 and blown into the heat radiating sheet 3, the heat on the heat radiating sheet 3 is taken away, the air absorbing the heat in the heat radiating sheet 3 is pumped out of the box by the cooling fan 5 for exhausting air on the packaging box 4, and the air enables the semiconductor refrigerating sheet 2 to work smoothly through a complete circulation.

The application method of the embodiment comprises the following steps: after the power is turned on, the heat conduction table top 1 is rapidly cooled and kept at a lower temperature, and the temperature depends on the specification of the semiconductor refrigerating sheet 2; when the embodiment is operated, the air in the packaging box is discharged by the rear 2 cooling fans, and the external cold air enters the packaging box from the bottom and the front.

The foregoing references to front, rear, bottom, and the like are merely for the purpose of the drawing and are not to be construed as limiting the structure or characteristics. In practice, the operator should stand opposite the direction of exhaust of the heat dissipation window 4-1. In the present embodiment, as shown in fig. 1, the heat radiation fan is installed at the front, and the hot air is discharged from the front, so that it is preferable that the operator stands at the rear when using the device.

Claims

1. The utility model provides a low temperature operation laboratory bench, includes mesa, its characterized in that: the table top is a heat conduction table top, a semiconductor refrigerating sheet is arranged below the table top, the refrigerating surface of the semiconductor refrigerating sheet is fixedly connected with the heat conduction table top, a radiating sheet is arranged below the semiconductor refrigerating sheet, and the radiating sheet is arranged in a packaging box with an opening at the top; the front and the back of the packaging box are provided with heat dissipation windows, and the bottom is provided with an air inlet; the heat conduction table top is fixed at the top of the packaging box; the positive electrode and the negative electrode of the semiconductor refrigerating sheet are respectively connected with the positive electrode and the negative electrode of the low-voltage direct current power supply correspondingly.

2. The cryogenically operated laboratory bench of claim 1 wherein: the heat conduction table top is made of aluminum alloy or copper alloy.

3. The cryogenically operated laboratory bench of claim 1 wherein: a cooling fan is arranged in the packaging box; the cooling fans are divided into cooling fans which are arranged at the bottoms of the cooling fins and used for introducing cold air into the cooling fins, and cooling fans which are arranged at the front or rear inner cooling windows of the packaging box and used for discharging hot air in the packaging box; the positive and negative poles of the cooling fan are respectively connected with the positive and negative poles of the cooling fin.

4. The cryogenically operated laboratory bench of claim 1 wherein: and heat conduction silicone grease is respectively coated between the heat conduction table surface and the semiconductor refrigerating sheet and between the semiconductor refrigerating sheet and the radiating sheet.