CN219291474U - Low-temperature operation experiment table - Google Patents

Abstract

The utility model relates to the field of experimental equipment and facilities, in particular to a low-temperature operation experimental platform. It includes a table top, the table top is a heat conduction table top, a semiconductor cooling chip is arranged under the table top, the cooling surface of the semiconductor cooling chip is fixedly connected with the heat conducting table top, a heat sink is arranged under the semiconductor cooling chip, and the heat sink is installed in a packaging box with an opening at the top; There are heat dissipation windows on the front and back of the packaging box, and air inlets on the bottom surface; the heat conduction table is fixed on the top of the packaging box; the positive and negative poles of the semiconductor refrigeration sheet are respectively connected to the positive and negative poles of the low-voltage DC power supply. The utility model uses a semiconductor refrigeration sheet and a heat sink to form a simple cooling system, and is equipped with a packaging box and a low-voltage DC power supply to form a low-temperature operating platform in an open environment, which can provide users with a long-term low-temperature operating environment and is easy to maintain The laboratory table is clean and tidy.

Description

Low temperature operation test bench

technical field

The utility model relates to the field of experimental equipment and facilities, in particular to a low-temperature operation experimental platform.

Background technique

In the experimental operations of cell biology, cell morphology, genetics and other disciplines, as well as in the detection of genetic diseases in related departments of medical institutions, it is often necessary to store experimental materials or experimental vessels in a room below room temperature (usually ~ 10 degrees Celsius). environment to operate.

At present, when low-temperature environment operation is required, the common operation method in the laboratory is to place the experimental material (experimental vessel) on a frozen ice box for operation. However, the ice box heats up rapidly at room temperature, and it is difficult to maintain a low temperature for a long time; and in summer when the air humidity is high, condensed water will be generated to pollute the experimental table. If it is a self-made ice box, it will also be caused by the melting of ice Cause ice water to splash and pollute the experimental table. At present, in the prior art, there are still methods that use liquid nitrogen to realize the low-temperature test environment. For example, the national utility model patent with the patent number CN209311077U, the patent name is low-temperature test bench, and this technology uses liquid nitrogen for cooling. Certain limitations.

Therefore, it is an urgent problem to study a low-temperature operating platform that does not need to rely on a freezing ice box and can provide an open environment.

Utility model content

This utility aims to solve many problems of the existing low-temperature operating environment by means of ice boxes, and therefore develops a low-temperature operating test bench.

The technical solution adopted in order to achieve the above purpose is: a low-temperature operation test bench, including a table top, the table is a heat conduction table top, a semiconductor refrigeration sheet is arranged under the table top, the cooling surface of the semiconductor refrigeration sheet is fixedly connected with the heat conduction table top, and the bottom of the semiconductor refrigeration sheet is arranged. There is a heat sink, and the heat sink is installed in a package box with an open top; there are heat dissipation windows on the front and back of the package box, and an air inlet on the bottom surface; the heat conduction table is fixed on the top of the package box; the positive and negative poles of the semiconductor refrigeration sheet are respectively connected Positive and negative connections for low voltage DC power supply.

Compared with the prior art, the utility model utilizes semiconductor cooling fins and heat sinks to form a simple cooling system, together with packaging boxes and low-voltage DC power supplies, to form a low-temperature operating platform in an open environment; the utility model has simple structure and low cost , Easy maintenance, good cooling effect, convenient for experimental operation, can provide users with a long-term low-temperature operating environment, and easy to keep the experimental table clean and tidy.

The utility model adopts following preferred scheme:

The heat conduction table is made of aluminum alloy or copper alloy.

A heat dissipation fan is arranged inside the packaging box; the cooling fan is divided into a cooling fan arranged at the bottom of the heat sink for introducing cold air into the heat sink, and a heat dissipation fan arranged at the front or rear inner heat dissipation window of the packaging box for dissipating the cooling air in the packaging box. A heat dissipation fan for discharging hot air; the positive and negative poles of the heat dissipation fan are respectively connected to the positive and negative poles of the heat sink.

Between the heat conduction table and the semiconductor cooling sheet, and between the semiconductor cooling sheet and the heat sink, thermal conductive silicone grease is coated respectively.

Description of drawings

Fig. 1 is the structural representation of the utility model embodiment;

Fig. 2 is a top view of the packaging box in the embodiment of the utility model;

Fig. 3 is a perspective view of the packaging box in the embodiment of the present invention;

In the figure: table top 1; semiconductor refrigeration sheet 2; heat sink 3; package box 4, heat dissipation window 4-1, air inlet 4-2; heat dissipation fan 5.

Detailed ways

The utility model will be described in detail below in conjunction with accompanying drawing and embodiment:

The low-temperature operation experiment platform provided in this embodiment mainly includes a table top 1, a semiconductor cooling chip 2, a heat sink 3, a low-voltage DC power supply, and the like.

The mesa 1 is a heat-conducting mesa. In this embodiment, a copper alloy is used to make the heat-conducting mesa 1. In addition, aluminum alloys and other metal alloys with good thermal conductivity can be used to make the heat-conducting mesa. This embodiment uses a 12vDC power adapter to provide the required low-voltage power supply for this embodiment; in specific implementation, a step-down device (such as a DC switching power supply LED transformer) can also be installed in the packaging box, and an external AC power supply can be connected.

As shown in Figure 2, in this embodiment, a semiconductor refrigeration chip 2 is arranged below the table top 1, and the semiconductor refrigeration sheet 2 is divided into a cooling surface and a heat dissipation surface, and the cooling surface of the semiconductor refrigeration sheet 2 is fixedly connected with the table top 1, and the semiconductor refrigeration sheet The number of 2 is related to the area of the table top 1 and the size of the semiconductor cooling chip 2, and two semiconductor cooling chips 2 are used in this embodiment. A cooling fin 3 is arranged below the semiconductor cooling chip 2, and the cooling fin 3 is attached to the heat dissipation surface of the semiconductor cooling chip 2, and the cooling fin 3 and the table top 1 are fixedly connected by screws.

When implementing this embodiment, the semiconductor cooling chip 2 and the table top 1, and between the semiconductor cooling chip 2 and the cooling fin 3 are respectively coated with thermally conductive silica gel, that is, the heat transfer effect is ensured by filling the heat transfer surface with thermally conductive silicone grease.

As shown in Figures 2 and 3, the top of the packaging box 4 is open. As shown in Figure 1, the heat conduction table 1 is fixed and covered at the top opening of the packaging box 4. In this embodiment, the heat conduction table 1 and the packaging box 4 are fixedly connected by screws. During specific implementation, any heat conduction table can be used. 1 means of fixing with the packaging box 4, such as bonding, clamping, riveting and so on. The heat sink 3 and the semiconductor cooling chip 2 are packed inside the packaging box 4 .

As shown in Figures 2 and 3, in order to improve the cooling effect of this embodiment, heat dissipation windows 4-1 are respectively provided on the front and rear of the packaging box 4, and an air inlet 4-2 is provided on the bottom surface. In this embodiment, the height of the heat sink 3 is consistent with the lower edge of the heat dissipation window 4-1 at the front or rear of the packaging box 4. 1 consistent.

Simultaneously, the present embodiment is also provided with four cooling fans 5 in the packaging box 4, wherein two cooling fans 5 are installed on the bottom of the heat sink 3, and are used to introduce the external lower temperature air into the packaging box 4, and enter the The slits of the heat sink 3 take away the heat of the heat sink 3; the other two heat dissipation fans 5 are used to discharge the air (hot air) with a higher temperature in the packaging box 4 out of the box. By adding four heat dissipation fans 5, the air circulation inside the packaging box 4 is improved, and a complete forced circulation is formed to make the semiconductor cooling chip 2 work more smoothly than relying on natural ventilation, and the cooling effect of this embodiment is improved.

In order to meet the installation requirements of the cooling fan 5 for air exhaust, the width of the radiator is narrower than the width of the packaging box 4 by one or two thicknesses of the cooling fan 5 . The positive pole and the negative pole of the semiconductor refrigeration chip 2 are respectively connected to the positive pole and the negative pole of the low-voltage DC power supply.

Working principle: After the power is turned on, the semiconductor cooling sheet 2 starts to work. Since the cooling surface and the heat conduction table 1 are connected by heat-conducting silicone grease, the temperature of the heat-conducting table 1 decreases, and the heat dissipation surface of the semiconductor refrigeration sheet 2 and the heat sink 3 are connected by heat-conducting silicone grease. Guided to the heat sink 3, the heat dissipation fan 5 connected to the heat sink 3 guides (pumps) the cold air from the outside of the packaging box 4 through the air inlet 4-2 into the box, and blows into the heat sink 3 to take away the heat sink 3, and the cooling fan 5 used for air exhaust on the packaging box 4 draws the air that has absorbed the heat inside the heat sink 3 to the outside of the box, and the air makes the semiconductor cooling chip 2 work smoothly through a complete cycle.

The usage method of this embodiment: after the power is turned on, the heat-conducting table 1 will cool down rapidly and be kept at a lower temperature, which depends on the specifications of the semiconductor refrigeration sheet 2; The 2 cooling fans are exhausted, and the external cold air enters the packaging box from the bottom and the front.

The above-mentioned directional language such as front, back, and bottom is only for the perspective of the drawings, and should not be interpreted as a limiting language of structure or features. In actual use, the operator should stand opposite to the exhaust direction of the cooling window 4-1. As shown in Figure 1, in this embodiment, the cooling fan is installed in the front, and the hot air is exhausted from the front, therefore, it is advisable for the operator to stand behind when using it.

Claims (4)

1. The utility model provides a low temperature operation laboratory bench, includes mesa, its characterized in that: the table top is a heat conduction table top, a semiconductor refrigerating sheet is arranged below the table top, the refrigerating surface of the semiconductor refrigerating sheet is fixedly connected with the heat conduction table top, a radiating sheet is arranged below the semiconductor refrigerating sheet, and the radiating sheet is arranged in a packaging box with an opening at the top; the front and the back of the packaging box are provided with heat dissipation windows, and the bottom is provided with an air inlet; the heat conduction table top is fixed at the top of the packaging box; the positive electrode and the negative electrode of the semiconductor refrigerating sheet are respectively connected with the positive electrode and the negative electrode of the low-voltage direct current power supply correspondingly.

2. The cryogenically operated laboratory bench of claim 1 wherein: the heat conduction table top is made of aluminum alloy or copper alloy.

3. The cryogenically operated laboratory bench of claim 1 wherein: a cooling fan is arranged in the packaging box; the cooling fans are divided into cooling fans which are arranged at the bottoms of the cooling fins and used for introducing cold air into the cooling fins, and cooling fans which are arranged at the front or rear inner cooling windows of the packaging box and used for discharging hot air in the packaging box; the positive and negative poles of the cooling fan are respectively connected with the positive and negative poles of the cooling fin.

4. The cryogenically operated laboratory bench of claim 1 wherein: and heat conduction silicone grease is respectively coated between the heat conduction table surface and the semiconductor refrigerating sheet and between the semiconductor refrigerating sheet and the radiating sheet.

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