CN206225839U - A kind of low-tension distribution box heat abstractor - Google Patents

Abstract

The utility model discloses a cooling device for a low-voltage distribution box, which comprises a device casing, a fan, a semiconductor heat exchange plate and a temperature sensor. A drive motor is arranged on the device casing, and a fan is connected under the drive motor. The motor is covered with a ventilation cover, and semiconductor heat exchange plates are installed side by side in the housing of the device. The semiconductor heat exchange plates are connected to the circuit distribution board at the top by wires. There are copper pipes inside the semiconductor heat exchange plates, and the copper tubes The pipe string is between the semiconductor heat exchange plates. The utility model sets the device shell, fan, semiconductor heat exchange plate and temperature sensor, so that the fan can more effectively cooperate with the cooling function of the semiconductor refrigeration sheet, and jointly dissipate heat from the distribution box, and the energy The utilization rate is high, and the cooling plate can individually cool some original equipment that is easy to heat up quickly according to the needs of the power distribution device, reducing the power consumption of the single-use fan for cooling the overall distribution box.

Description

A cooling device for a low-voltage distribution box

technical field

The utility model relates to the technical field of heat dissipation for a distribution box, in particular to a heat dissipation device for a low-voltage distribution box.

Background technique

Power distribution box is assembled in closed or semiclosed metal safe by electrical wiring requirement by switchgear, measuring instrument, protective device and auxiliary equipment or on screen width, forms low-voltage power distribution equipment, when energized for a long time or the load is too high, the distribution box is assembled in the closed or semiclosed metal safe or on the screen width. , it will inevitably generate heat. If the temperature is not lowered in time, the continuous rise of the temperature will burn out the circuit equipment, and even cause a fire. Most of the cooling devices used in the market at this stage use cooling fans to dissipate the overall heat dissipation of the distribution box. The single-use cooling fan not only has a low energy utilization rate and consumes electricity, but also cannot dissipate heat in a targeted manner to the heat-sensitive electrical equipment in the distribution box, and more improvements are needed. To sum up, so I designed a low-voltage distribution box cooling device.

Utility model content

The purpose of this utility model is to provide a low-voltage power distribution box cooling device. By setting the device shell, fan, semiconductor heat exchange plate and temperature sensor, the fan can more effectively cooperate with the cooling function of the semiconductor refrigeration sheet, and jointly carry out the cooling of the power distribution box. Heat dissipation, high energy utilization rate, the heat dissipation plate can individually cool some original equipment that is easy to heat up according to the needs of the power distribution device, so as to solve the problems raised in the above-mentioned background technology.

In order to achieve the above object, the utility model provides the following technical solutions: a low-voltage power distribution box cooling device, including a device shell, a fan, a semiconductor heat exchange plate and a temperature sensor, the drive motor is arranged on the device shell, and the drive motor A fan is connected to the bottom, the drive motor is covered with a ventilation cover, and semiconductor heat exchange plates are installed side by side in the housing of the device. There are copper pipes inside, and the copper pipes are connected between the semiconductor heat exchange plates. One end of the copper pipe is connected to the air inlet, and the other end of the copper pipe is connected to the air pump. The other end of the air pump is connected through a three-joint connecting pipe. To the working cooling plate, a temperature sensor is set on the working cooling plate, a controller is set on one side of the device shell, semiconductor cooling sheets are symmetrically arranged at both ends of the copper tube in the middle of the semiconductor heat exchange plate, and the semiconductor cooling plate The outside of the sheet is covered with an aluminum plate.

Preferably, countersunk screw holes are provided at both ends of the housing of the device.

Preferably, each branch of the three-joint connecting pipe is provided with a switch.

Preferably, the semiconductor cooling chip is adhered to the inner wall of the aluminum plate through thermal conductive silicone grease, and a heat sink is provided on the outer side of the aluminum plate.

Compared with the prior art, the beneficial effect of the utility model is: the utility model sets the device shell, the fan, the semiconductor heat exchange plate and the temperature sensor, so that the fan can more effectively cooperate with the cooling function of the semiconductor refrigeration sheet, and combine the power distribution The heat dissipation of the box is high, and the energy utilization rate is high. The cooling plate can individually cool some original equipment that is easy to heat up quickly according to the needs of the power distribution device, and reduce the power consumption of the single-use fan for cooling the overall distribution box.

Description of drawings

Fig. 1 is the main structural representation of the utility model;

Fig. 2 is a structural schematic diagram of the semiconductor heat exchange plate of the present invention.

In the figure: 1. Device shell, 2. Drive motor, 3. Fan, 4. Ventilation cover, 5. Semiconductor heat exchange plate, 6. Circuit distribution board, 7. Copper tube, 8. Air inlet, 9. Air pump, 10. Three-joint connecting pipe, 11. Working cooling plate, 12. Temperature sensor, 13. Controller, 14. Semiconductor refrigeration sheet, 15. Aluminum plate, 16. Countersunk screw holes, 17. Heat sink.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figure 1-2, the utility model provides a technical solution: a low-voltage power distribution box cooling device, including a device shell 1, a fan 3, a semiconductor heat exchange plate 5 and a temperature sensor 12, the device shell 1 is set There is a drive motor 2, and countersunk screw holes 16 are arranged at both ends of the device shell 1, which is convenient for installing the device on the side wall of the distribution box. The drive motor 2 is connected with a fan 3, and the drive motor 2 is covered with Ventilation cover 4, semiconductor heat exchange plates 5 are installed side by side in the device shell 1, and the semiconductor heat exchange plates 5 are connected to the circuit distribution plate 6 at the top by wires, and copper pipes are connected inside the semiconductor heat exchange plates 5 7, and the copper pipe 7 is connected between the semiconductor heat exchange plates 5, the air inlet 8 is connected to one end of the copper pipe 7, the air pump 9 is connected to the other end of the copper pipe 7, and the other end of the air pump 9 is connected to the pipe through three joints 10 is connected to the working cooling plate 11, and each sub-pipe on the three-joint connecting pipe 10 is provided with a switch, which is convenient for on-site installation and control according to the actual situation of the distribution box. The working cooling plate 11 is provided with A temperature sensor 12, a controller 13 is arranged on one side of the device shell 1, and a semiconductor cooling sheet 14 is symmetrically arranged at both ends of the copper tube 7 in the middle of the semiconductor heat exchange plate 5, and the outer side of the semiconductor cooling sheet 14 is covered with an aluminum plate 15 , the semiconductor refrigerating sheet 14 is stuck on the inner wall of the aluminum plate 15 through heat-conducting silicone grease, and the outer side of the aluminum plate 15 is provided with a heat sink 17, and the heat-conducting silicon grease can transfer heat well, and the aluminum plate 15 provided with the heat sink 17 is placed on the fan. It can quickly dissipate heat under the action.

The working principle of the utility model is to turn on the power supply, install the cooling device on the outer wall of the distribution box, and place the working cooling plate 11 on the side of the components that are easy to be damaged by temperature rise. When the temperature measured by the temperature sensor 12 reaches the warning temperature, Start the driving motor 2, drive the fan 3 to rotate, and constantly draw air. At this time, the air pump 9 operates to suck the air into the copper tube 7 from the air inlet 8. The heat in the copper pipe 7 is absorbed and transferred to the side of the aluminum plate 15, and the fan 7 continuously draws air to cool down the heat sink 17, so that the heat in the copper pipe 7 is transferred to the air, and the cooled air passes through the copper pipe 7. It enters the working cooling plate 11 through the three-joint connecting pipe 10, and blows to the original equipment in the distribution box, so that the temperature in the area of the working cooling plate 11 drops, so that a series of heat dissipation tasks can be completed.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (4)

1. A cooling device for a low-voltage distribution box, including a device housing (1), a fan (3), a semiconductor heat exchange plate (5) and a temperature sensor (12), characterized in that: the device housing (1) is set There is a drive motor (2), a fan (3) is connected under the drive motor (2), the drive motor (2) is covered with a ventilation cover (4), and semiconductor heat sinks are installed side by side in the device shell (1). The exchange plate (5), the semiconductor heat exchange plate (5) is connected to the circuit distribution plate (6) at the top by wires, the semiconductor heat exchange plate (5) has a copper pipe (7) inside, and the copper pipe (7) Connected in series between semiconductor heat exchange plates (5), one end of the copper tube (7) is connected to an air inlet (8), and the other end of the copper tube (7) is connected to an air pump (9), the The other end of the air pump (9) is connected to the working cooling plate (11) through a three-joint connecting pipe (10). The working cooling plate (11) is provided with a temperature sensor (12), and one side of the device housing (1) is provided There is a controller (13), and the two ends of the copper tube (7) in the middle of the semiconductor heat exchange plate (5) are symmetrically provided with a semiconductor cooling plate (14), and the outer side of the semiconductor cooling plate (14) is covered with an aluminum plate (15) . 2. A low-voltage distribution box cooling device according to claim 1, characterized in that: countersunk screw holes (16) are provided at both ends of the device casing (1). 3. A low-voltage distribution box cooling device according to claim 1, characterized in that: each branch of the three-joint connecting pipe (10) is provided with a switch. 4. A low-voltage power distribution box cooling device according to claim 1, characterized in that: the semiconductor cooling chip (14) is glued to the inner wall of the aluminum plate (15) through heat-conducting silicone grease, and the outer side of the aluminum plate (15) is Radiating fins (17) are provided.