High in clouds control box-type substation based on environment on-line monitoring
Technical Field
The invention relates to the technical field of electrical equipment, in particular to a cloud control box-type substation based on environment online monitoring.
Background
The box-type substation is also called a pre-installed substation or a pre-installed substation. The high-voltage switch equipment, the distribution transformer and the low-voltage distribution device are factory prefabricated indoor and outdoor compact distribution equipment which are integrated according to a certain wiring scheme, namely, the functions of transformer voltage reduction, low-voltage distribution and the like are organically combined together and are arranged in a steel structure box which is damp-proof, rust-proof, dust-proof, rat-proof, fireproof, anti-theft, heat-insulating, totally-closed and movable. The box-type transformer substation is suitable for mines, factory enterprises, oil-gas fields and wind power stations, replaces the original civil power distribution room and power distribution station, and becomes a novel complete set of power transformation and distribution device.
The cloud control box-type substation collects environmental information such as temperature, humidity, noise, gas PH value and the like detected by an environmental monitoring module in the original box-type substation through the intelligent control box, and transmits data to cloud equipment. The intelligent control box has the temperature requirement suitable for working. However, in actual operation, the temperature in the cloud box transformer substation may increase due to the operation of various devices or the influence of the external environment. Correspondingly, the temperature of the intelligent control box in the cloud box transformer substation also rises, so that the intelligent control box is influenced to transmit data to the cloud equipment, and the accuracy of cloud monitoring is reduced. The existing intelligent control box has poor heat dissipation effect and can not reduce the temperature of the existing intelligent control box to enable the existing intelligent control box to reach a good working state.
Therefore, how to provide a novel heat dissipation device, carry out the thermal treatment to intelligent control case, reduce the temperature of its box, make it can be accurately to high in the clouds transmission data, improve the accuracy of high in the clouds control, the technical problem that technical staff in this field had a urgent need to solve.
Disclosure of Invention
Therefore, the invention provides a cloud control box-type substation based on environment online monitoring, and aims to solve the problem that in the prior art, the accuracy of data transmission from an intelligent control box to a cloud device is reduced due to the fact that the temperature of the intelligent control box is increased when the cloud box-type substation works.
In order to achieve the above purpose, the invention provides the following technical scheme:
a cloud control box-type substation based on environment online monitoring mainly comprises a cloud box-type substation body and cloud equipment, the cloud box transformer substation is internally provided with a high-pressure chamber, a low-pressure chamber, a transformer chamber, an environment detection module and an intelligent control box, the high-voltage chamber, the low-voltage chamber, the transformer chamber and the environment detection module are respectively in wireless connection with the intelligent control box, the intelligent control box is wirelessly connected with the cloud end equipment, and also comprises a first radiating fin, a radiating area and a driving radiating device, the outer side wall of the intelligent control box is vertically provided with a first radiating fin, the outer side wall of the intelligent control box is provided with a driving radiating device in a sliding way, the driving heat dissipation device covers the first heat dissipation fins, the intelligent control box is divided into an upper control box body, a middle control box body and a lower control box body, and the outer side walls of the upper control box body, the middle control box body and the lower control box body are all provided with heat dissipation areas.
Further, the driving heat dissipation device comprises a semiconductor refrigeration piece, a polished rod, a lead screw, a motor structure, a bearing structure, a sleeve structure and a nut structure, wherein the semiconductor refrigeration piece is arranged between the polished rod and the lead screw, the semiconductor refrigeration piece is close to one side of the box body and is a cold end, the side of the semiconductor refrigeration piece, which is far away from the box body, is a hot end, the cold end of the semiconductor refrigeration piece is vertically provided with a second heat dissipation fin, the upper ends of the polished rod and the lead screw are provided with the motor structure, the lower ends of the polished rod and the lead screw are provided with the bearing structure, the motor structure and the bearing structure are respectively arranged on the outer side walls of the upper control box body and the lower control box body in a sliding manner, a long-strip key is vertically arranged on the polished rod, the sleeve structure is sleeved outside the polished rod, the sleeve structure is clamped on the polished rod, the nut structure is connected outside the lead screw, and one end of the semiconductor refrigeration piece is hinged with the sleeve structure, the other end of the semiconductor refrigeration piece is hinged with the nut structure.
Furthermore, the driving heat dissipation device further comprises a rotating disc, the rotating disc is rotatably connected to the outer side wall of the upper control box body, the rotating disc is arranged between the polished rod and the motor structure at the upper end of the lead screw, the upper end of the rotating disc is connected with the motor structure at the upper end of the polished rod through a rigid rope, and the lower end of the rotating disc is connected with the motor structure at the upper end of the lead screw through a rigid rope.
Further, the driving heat dissipation device at least comprises an initial state, and when the initial state is achieved, the motor structure at the upper end of the screw rod drives the screw rod to rotate, the screw rod rotates to drive the nut structure to move up and down, the nut structure moves up and down to drive the semiconductor refrigeration piece to move up and down, and the second heat dissipation fins at the cold ends of the semiconductor refrigeration pieces are inserted into the first heat dissipation fins in a sliding mode.
Further, be equipped with many square louvres in the heat dissipation region, inside floating fan that is equipped with of upper portion control box, middle part control box and lower part control box, the medial surface in heat dissipation region is pressed close to floating fan.
Further, drive heat abstractor still includes user state, and when user state, motor structure on the polished rod drives the polished rod rotates, the polished rod rotates and drives the sleeve pipe structure rotates, simultaneously, rolling disc forward motion, polished rod and lead screw are in slide and inwards gather together on the intelligent control case lateral wall, make semiconductor refrigeration piece moves to the box around the pin joint at its both ends, second radiating fin on the semiconductor refrigeration piece plug into in the square radiating hole, and support on floating fan.
Furthermore, the semiconductor refrigeration piece is split type semiconductor refrigeration piece, and the polylith is connected through the connecting rod between the semiconductor refrigeration piece, the both ends of connecting rod are equipped with the spring respectively in the cover, just the spring supports respectively the both ends of semiconductor refrigeration piece, the hot junction dustcoat of semiconductor refrigeration piece is equipped with the drum, hang in the drum and weather the fan.
Furthermore, the semiconductor refrigeration piece at least comprises a first state, and when the semiconductor refrigeration piece is in the first state, the springs respectively and inwards extrude two ends of the semiconductor refrigeration piece, so that the semiconductor refrigeration pieces are tightly attached.
Further, the semiconductor refrigeration piece still includes the second state, and when the second state, the rolling disc reverse motion, polished rod and lead screw are in slide and outside keeping away from on the intelligent control case lateral wall, both ends the semiconductor refrigeration piece is also outside keeping away from, the spring is extruded, and the polylith produces the gap between the semiconductor refrigeration piece.
Furthermore, an upper groove is formed in the upper end of the outer side wall of the upper control box body, a lower groove is formed in the lower end of the outer side wall of the lower control box body, the motor structure comprises a motor and a motor base, the upper ends of the polished rod and the lead screw are in transmission connection with the motor, the motor is arranged on the motor base, the motor base is arranged in the upper groove in a sliding mode, the bearing structure comprises a bearing and a bearing seat, the lower ends of the polished rod and the lead screw are connected with the bearing in a rotating mode, the bearing is arranged on the bearing seat, the bearing seat is arranged in the lower groove in a sliding mode, and the rotating disc is connected in the upper groove in a rotating mode.
The invention has the following advantages:
according to the intelligent control cabinet, the first radiating fins are arranged on the outer side wall of the intelligent control cabinet, and heat of the intelligent control cabinet is radiated through the first radiating fins, so that the temperature in the intelligent control cabinet is reduced; the intelligent control box is further divided into an upper control box body, a middle control box body and a lower control box body, heat dissipation areas are arranged on the outer side walls of the upper control box body, the middle control box body and the lower control box body, and heat of the intelligent control box is dissipated through the heat dissipation areas, so that the temperature in the intelligent control box is reduced; this application still utilizes drive heat abstractor, and drive heat abstractor can further dispel the heat on the first radiating fin on the one hand, and on the other hand is according to the temperature of different boxes, and control drive heat abstractor moves, and it is regional to peg graft the heat dissipation on the box lateral wall that needs the cooling with drive heat abstractor, further reduces the temperature in the box to pertinence ground reduces the temperature of intelligent control case, improves the thermal diffusivity of intelligent control case.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a schematic structural diagram of an intelligent control box and a driving heat sink;
FIG. 2 is a schematic structural diagram of a driving heat dissipation device;
FIG. 3 is a cross-sectional view of the intelligent control box;
FIG. 4 is a cross-sectional view of the driven heat sink in use;
FIG. 5 is an initial state diagram of the semiconductor chilling plate;
FIG. 6 is a diagram showing the usage state of the semiconductor refrigerating sheet;
FIG. 7 is a first state diagram of the semiconductor chilling plate;
FIG. 8 is a second state diagram of the semiconductor chilling plate;
FIG. 9 is a cross-sectional view of the semiconductor chilling plate, the drum and the blow-dry fan;
FIG. 10 is a front view of a cloud box transformer;
in the figure:
1, an intelligent control box; 101 an upper control box body; 102 middle control box body; 103 lower control box; 2 first heat dissipation fins; 3 a heat dissipation area; 4 driving the heat dissipation device; 401 semiconductor chilling plates; 402 a polish rod; 403 screw mandrel; 404 a motor structure; 4041 an electric motor; 4042 motor base; 405 a bearing structure; 4051 bearing; 4052 bearing seat; 406 a sleeve structure; 407 a nut structure; 408 a rotating disk; 5 second heat dissipation fins; 6 long-bar bonds; 7 a rigid cord; 8, square heat dissipation holes; 9 a floating fan; 10 connecting rods; 11 a spring; 12, a cylinder; 13 blowing the fan dry; 14, arranging a groove; 15 grooves are formed.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the related technical problem existing in the prior art, the embodiment of the application provides a cloud control box-type substation based on environment on-line monitoring, aims at solving the problems of poor heat dissipation performance and the like of the existing intelligent control box, and achieves the effect of improving the accuracy of data transmission from the intelligent control box to the cloud equipment. As shown in fig. 1 to 10, the cloud box substation specifically includes a cloud box body and a cloud device. Be equipped with high-voltage chamber, low-voltage chamber, transformer room, environment detection module and intelligent control case 1 in the cloud case becomes the box, high-voltage chamber, low-voltage chamber, transformer room, environment detection module respectively with intelligent control case 1 wireless connection, intelligent control case 1 and high in the clouds equipment wireless connection. Environmental information such as temperature, humidity, noise, gaseous pH value that intelligent control case 1 becomes interior environmental monitoring module through collecting the unit case to transmit data to high in the clouds equipment, make the staff can real time monitoring cloud case become the internal environment in, thereby generate the data report, the behavior of each part in the control cloud case becomes.
In actual work, the temperature in the cloud box transformer substation can be increased due to the work of various devices or the influence of the external environment. Correspondingly, the temperature of the intelligent control box 1 in the cloud box transformer substation also rises, so that the intelligent control box 1 is influenced to transmit data to the cloud equipment, and the accuracy of cloud monitoring is reduced. In order to improve the accuracy of cloud monitoring, the heat dissipation of the intelligent control box 1 needs to be enhanced.
The vertical first radiating fin 2 that is equipped with on the lateral wall of intelligent control case 1 distributes out the heat of intelligent control case 1 through first radiating fin 2 to reduce the temperature in the intelligent control case 1. The intelligent control box 1 is divided into an upper control box body 101, a middle control box body 102 and a lower control box body 103, and the outer side walls of the upper control box body 101, the middle control box body 102 and the lower control box body 103 are all provided with a heat dissipation area 3. The heat of the intelligent control box 1 is radiated through the heat radiation area 3, so that the temperature in the intelligent control box 1 is reduced. The outer side wall of the intelligent control box 1 is provided with a driving heat dissipation device 4 in a sliding mode, and the driving heat dissipation device 4 covers the first heat dissipation fins 2. On the one hand, the heat on the first radiating fins 2 can be further dissipated by the driving radiating device 4, on the other hand, the driving radiating device 4 is controlled to move according to the temperatures of different boxes, the driving radiating device 4 is inserted into a radiating area 3 on the outer side wall of the box body needing cooling, the temperature in the box body is further reduced, and therefore the temperature of the intelligent control box 1 is pertinently reduced, and the heat dissipation performance of the intelligent control box 1 is improved.
The upper end of the outer side wall of the upper control box 101 is provided with an upper groove 14, and the lower end of the outer side wall of the lower control box 103 is provided with a lower groove 15. The driving heat sink 4 includes a semiconductor cooling plate 401, a light rod 402, a lead screw 403, a motor structure 404, a bearing structure 405, a sleeve structure 406, and a nut structure 407. The upper ends of the polish rod 402 and the lead screw 403 are provided with motor structures 404, and the motor structures 404 are slidably arranged in the upper groove 14. The lower ends of the polish rod 402 and the lead screw 403 are provided with bearing structures 405, and the bearing structures 405 are slidably arranged in the lower grooves 15. The sleeve structure 406 is sleeved outside the polish rod 402, and the screw 403 is externally screwed with a nut structure 407. A semiconductor refrigerating sheet 401 is arranged between the polish rod 402 and the screw rod 403, one end of the semiconductor refrigerating sheet 401 is hinged with the sleeve structure 406, and the other end of the semiconductor refrigerating sheet 401 is hinged with the nut structure 407. Semiconductor refrigeration piece 401 is pressed close to the box one side and is the cold junction, and semiconductor refrigeration piece 401 keeps away from the box one side and is the hot junction. And a second radiating fin 5 is vertically arranged at the cold end of the semiconductor chilling plate 401.
When the heat dissipation device 4 is driven to be in an initial state, the motor structure 404 at the upper end of the screw rod 403 drives the screw rod 403 to rotate, the screw rod 403 rotates to drive the nut structure 407 to move up and down, the nut structure 407 moves up and down to drive the semiconductor refrigeration piece 401 to move up and down, and the second heat dissipation fin 5 at the cold end of the semiconductor refrigeration piece 401 is inserted into the first heat dissipation fin 2 in a sliding manner. Second radiating fin 5 on the semiconductor refrigeration piece 401 and the 2 grafting contacts of first radiating fin on the intelligent control case 1 to transmit the cold junction of semiconductor refrigeration piece 401 through second radiating fin 5 with the heat on the first radiating fin 2, the heat is absorbed to the cold junction of semiconductor refrigeration piece 401, distributes away from the hot junction of semiconductor refrigeration piece 401, further improves the thermal diffusivity of intelligent control case 1.
The motor structure 404 includes a motor 4041 and a motor base 4042, the upper ends of the polish rod 402 and the lead screw 403 are connected with the motor 4041 in a transmission manner, and the rotation of the motor 4041 can drive the lead screw 403 and the polish rod 402 to rotate. The motor 4041 is arranged on the motor base 4042, the motor base 4042 is arranged in the upper groove 14 in a sliding manner, and the motor base 4042 slides in the upper groove 14, so that the screw rod 403 and the polish rod 402 are driven to move in the upper groove 14; the bearing structure 405 includes a bearing 4051 and a bearing seat 4052, the lower ends of the polish rod 402 and the lead screw 403 are rotatably connected with the bearing 4051, the bearing 4051 is disposed on the bearing seat 4052, and the bearing seat 4052 is slidably disposed in the lower groove 15. When the upper ends of the screw 403 and the polish rod 402 rotate or move, the bearings 4051 and the bearing seats 4052 at the lower ends thereof cooperate with the movement of the screw 403 and the polish rod 402, so that the whole screw 403 and the polish rod 402 move.
The strip key 6 is vertically arranged on the polish rod 402, the sleeve structure 406 is sleeved outside the polish rod 402, and the sleeve structure 406 is clamped on the polish rod 402, so that the sleeve structure 406 cannot freely rotate on the polish rod 402 and can only rotate along with the rotation of the polish rod 402, and the angle of the sleeve structure 406 changes. The screw 403 is externally screwed with a nut structure 407, and the nut structure 407 moves up and down when the screw 403 rotates by applying the working principle of the screw 403.
The driving heat dissipation device 4 further comprises a rotating disc 408, the rotating disc 408 is rotatably connected in the upper groove 14 on the outer side wall of the upper control box 101, the rotating disc 408 is arranged between the polish rod 402 and the motor structure 404 at the upper end of the lead screw 403, the upper end of the rotating disc 408 is connected with the motor structure 404 at the upper end of the polish rod 402 through a rigid rope 7, and the lower end of the rotating disc 408 is connected with the motor structure 404 at the upper end of the lead screw 403 through a rigid rope 7. The rotating disc 408 moves forward, and the motor structure 404 at the upper ends of the polish rod 402 and the lead screw 403 is pulled to slide in the upper groove 14 and gather inwards, so that the polish rod 402 and the lead screw 403 are close to each other; the rotating disc 408 moves in the opposite direction, pulling the motor structure 404 on the upper end of the polish rod 402 and the lead screw 403 to slide in the upper groove 14 and move away inwards, so that the polish rod 402 and the lead screw 403 move away from each other.
A plurality of square heat dissipation holes 8 are formed in the heat dissipation area 3, floating type fans 9 are arranged inside the upper control box body 101, the middle control box body 102 and the lower control box body 103, and the floating type fans 9 are close to the inner side face of the heat dissipation area 3. When the air-cooling type air-conditioning box works normally, heat is dissipated through the floating type fans 9 in the box bodies, and the hot air in the box bodies and the outside air form circulation. Because the internal structures of the upper control box, the middle control box 102 and the lower control box 103 are different, the temperatures defined by the internal structures for normal operation are different. The intelligent control box 1 is also in wireless connection with an external controller, the external controller can detect the real-time temperature of the upper control box 101, the middle control box 102 or the lower control box 103, and the controller controls the rotation of the motor 4041 and the rotating disc 408. When the temperature in a certain box body exceeds the limited temperature, the controller controls and drives the heat dissipation device 4 to start the use state.
When the heat dissipation device 4 is driven to be in a use state, firstly, the motor 4041 drives the screw 403 to rotate, so that the nut structure 407 drives the semiconductor chilling plate 401 to move upwards or downwards to the outside of the box body needing further heat dissipation, and the semiconductor chilling plate 401 is located in the heat dissipation area 3. Then motor 4041 on the polished rod 402 drives polished rod 402 forward rotation, polished rod 402 forward rotation drives sleeve structure 406 and rotates certain angle to the box in, simultaneously, carousel 408 forward motion for polished rod 402 and lead screw 403 slide in last recess 14 and gather together each other, and make semiconductor refrigeration piece 401 move to the box around the pin joint at its both ends, thereby peg graft into square louvre 8 with second radiating fin 5 on the semiconductor refrigeration piece 401 in, and support on floating fan 9.
When the second radiating fins 5 on the conductor refrigerating sheet are inserted into the square radiating holes 8, hot air in the box body needing further heat radiation can not be radiated from the square radiating holes 8. And the second radiating fin 5 on the conductor refrigeration sheet is propped against the floating fan 9, so that the floating fan 9 directly blows the second radiating fin 5. The hot air in the box body contacts the cold end of the conductor refrigerating sheet through the floating fan 9, so that cold air is generated, the hot air in the box body is generated into the cold air, and the temperature in the box body is reduced.
When the temperature in the box body is reduced to an appropriate temperature, the controller controls the motor 4041 on the polish rod 402 to drive the polish rod 402 to rotate reversely, the polish rod 402 rotates reversely to drive the sleeve structure 406 to rotate outwards at a certain angle, meanwhile, the rotating disc 408 moves reversely, so that the polish rod 402 and the lead screw 403 slide in the upper groove 14 and are away from each other, the semiconductor refrigeration piece 401 moves outwards from the box body around the hinged point at the two ends of the semiconductor refrigeration piece 401, and the semiconductor refrigeration piece 401 is taken out from the square heat dissipation hole 8.
The controller continuously receives the temperatures in different boxes, and continuously controls the driving heat dissipation device 4 to cool the next box, so that the driving heat dissipation device 4 is opened again to be in a use state, and the next cycle is repeatedly executed, thereby pertinently performing heat dissipation treatment on different boxes and improving the heat dissipation performance of the intelligent control box 1.
When the second heat radiating fins 5 at the cold end of the semiconductor refrigerating sheet 401 refrigerate the hot air in the box body, water condensation beads are easily generated, and the water condensation beads influence the refrigerating effect of the semiconductor refrigerating sheet 401. In order to blow dry the hydrogel beads on the second heat dissipation fins 5, the semiconductor chilling plates 401 are divided into three semiconductor chilling plates 401, which are divided into two split semiconductor chilling plates 401. Three semiconductor chilling plates 401 are connected through a connecting rod 10, two ends of the connecting rod 10 are respectively sleeved with springs 11, and the springs 11 respectively abut against two ends of the semiconductor chilling plates 401. The hot end outer cover of the semiconductor refrigeration sheet 401 is provided with a cylinder 12, and a blow-drying fan 13 is hung in the cylinder 12.
When the semiconductor refrigeration piece 401 is in the first state, the springs 11 respectively press the two ends of the semiconductor refrigeration piece 401 inwards, so that the plurality of semiconductor refrigeration pieces 401 are tightly attached together to form a whole. And the whole semiconductor refrigerating sheet 401 is utilized to carry out heat dissipation treatment on different boxes.
After the semiconductor chilling plate 401 is finished, the water condensation beads on the semiconductor chilling plate need to be dried. Semiconductor refrigeration piece 401 is in the second state, and when the second state, and rolling disc 408 reverse motion, polished rod 402 and lead screw 403 slide and outwards keep away from on intelligent control case 1 lateral wall, and the semiconductor refrigeration piece 401 at both ends is also outwards kept away from, and spring 11 is extrudeed. The semiconductor chilling plates 401 at the two ends are separated from the semiconductor chilling plates 401 in the middle, so that gaps are formed among the semiconductor chilling plates 401, and the second radiating fins 5 with water condensation beads are exposed. And starting a blow-drying fan 13 outside the hot end of the semiconductor refrigeration sheet 401 to blow-dry the hydrogel beads.
The application process of the embodiment of the invention is as follows:
the external controller detects the temperature of the upper control box 101, the middle control box 102 or the lower control box 103 in real time. When the temperature in a certain box exceeds the limited temperature, the controller controls the motor 4041 to drive the screw 403 to rotate, so that the nut structure 407 drives the semiconductor refrigeration piece 401 to move upwards or downwards to the outside of the box body which needs further heat dissipation, and the semiconductor refrigeration piece 401 is located in the heat dissipation area 3. Then motor 4041 on the polished rod 402 drives polished rod 402 forward rotation, polished rod 402 forward rotation drives sleeve structure 406 and rotates certain angle in to the box, and simultaneously, carousel 408 forward motion for polished rod 402 and lead screw 403 slide in last recess 14 and gather together each other, and make semiconductor refrigeration piece 401 move to the box around the pin joint at its both ends, thereby peg graft into square louvre 8 with second radiating fin 5 on the semiconductor refrigeration piece 401 in, and support on floating fan 9, thereby pertinence carries out the heat radiation processing to intelligent control case 1.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.