CN207719773U - A kind of intelligent heat dissipation bus duct - Google Patents

A kind of intelligent heat dissipation bus duct Download PDF

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Publication number
CN207719773U
CN207719773U CN201721811799.8U CN201721811799U CN207719773U CN 207719773 U CN207719773 U CN 207719773U CN 201721811799 U CN201721811799 U CN 201721811799U CN 207719773 U CN207719773 U CN 207719773U
Authority
CN
China
Prior art keywords
busbar
heat dissipation
intelligent heat
temperature
epipleural
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721811799.8U
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Chinese (zh)
Inventor
于晓岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongzhou Electric Co Ltd
Original Assignee
Zhongzhou Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongzhou Electric Co Ltd filed Critical Zhongzhou Electric Co Ltd
Priority to CN201721811799.8U priority Critical patent/CN207719773U/en
Application granted granted Critical
Publication of CN207719773U publication Critical patent/CN207719773U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of intelligent heat dissipation bus duct, including busbar protecting crust, the more busbars being arranged in parallel in busbar protecting crust and the Intelligent heat dissipation device being arranged in busbar protecting crust;The Intelligent heat dissipation device includes power supply, radiating block, radiator fan, semiconductor chilling plate and open type temperature switch; the bottom plate of the radiating block is fixed on epipleural upper surface; the semiconductor chilling plate is fixed on epipleural lower surface, and the open type temperature switch is contacted with the insulating protective layer of busbar conductor;The utility model reaches when redirecting temperature of temperature switch in insulating protective layer temperature; Intelligent heat dissipation device can be started automatically; when being powered using semiconductor chilling plate underlaying surface temperature quickly reduce, the quick raised characteristic of upper surface temperature; logical heat transfer; the temperature of the insulating protective layer of bus-bars conductor is quickly reduced; the insulation melting layer on bus bar is prevented, the service life of bus duct is effectively extended.

Description

A kind of intelligent heat dissipation bus duct
Technical field
The utility model is related to bus duct field more particularly to a kind of intelligent heat dissipation bus ducts.
Background technology
Modern high-rise building and large-scale workshop need huge electric energy, and face thousands of hundreds of amperes needed for this huge load Powerful electric current will to select safe and reliable transmission equipment, bus-bar system be to select well.
Traditional bus duct carries out busbar conductor using in busbar conductor outer cladding mylar or cold and hot Heat-Shrinkable Tubings Insulation, this insulation mode can lead to insulating layer fever aging or breakdown because of overcurrent or overvoltage.In addition, bus duct radiates Ability is poor or because external factor causes temperature in bus duct excessively high, can also make this insulation melting layer, shorten making for bus duct With service life, or even generation fire.
Utility model content
The purpose of this utility model is to provide a kind of intelligent heat dissipation bus duct, the environment temperature in busbar can be monitored in real time Degree, the excessively high automatic cooling of temperature prevent the insulation melting layer on bus bar, effectively extend the service life of bus duct.
To achieve the goals above, the utility model uses following technical scheme:
A kind of intelligent heat dissipation bus duct, including busbar protecting crust and Duo Gen are arranged in parallel in the busbar in busbar protecting crust, The busbar includes busbar conductor and coats the insulating protective layer of the busbar conductor, further includes the intelligence being arranged in busbar protecting crust It can radiator;
The busbar protecting crust is enclosed by epipleural, lower side panel, left plate and right plate;
The Intelligent heat dissipation device includes that power supply, radiating block, radiator fan, semiconductor chilling plate and open type temperature are opened It closes, radiating block is made of bottom plate and the cooling fin being arranged on bottom plate, power supply, radiator fan, semiconductor chilling plate and open type Temperature switch is connected;
The bottom plate of the radiating block is fixed on epipleural upper surface, and radiator fan is fixed on a heat sink, and described partly leads Body cooling piece is fixed on epipleural lower surface, and the open type temperature switch is contacted with the insulating protective layer of busbar conductor.
The epipleural upper surface and epipleural lower surface offer mounting groove, and thermally conductive sheet is equipped in mounting groove.
The beneficial effects of the utility model:
A kind of intelligent heat dissipation bus duct described in the utility model reaches temperature in the insulating protective layer temperature of bus-bars conductor When redirecting temperature of switch, can start Intelligent heat dissipation device, underlaying surface temperature is fast when being powered using semiconductor chilling plate automatically Speed reduces, the quick raised characteristic of upper surface temperature, leads to heat transfer, by the fast prompt drop of the temperature of the insulating protective layer of bus-bars conductor It is low, at the same time it can also which the heat of semiconductor chilling plate upper surface is quickly spilt by thermally conductive sheet, radiating block and radiator fan Outside bus duct, the insulation melting layer on bus bar is prevented, the service life of bus duct is effectively extended.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally The every other embodiment that field those of ordinary skill is obtained without making creative work, belongs to this practicality Novel protected range.
As shown in Figure 1:A kind of intelligent heat dissipation bus duct described in the utility model, including busbar protecting crust 1 and Duo Gen are put down Row is set to the busbar in busbar protecting crust 1, and the busbar includes busbar conductor 2 and coats the insulation protection of the busbar conductor 2 Layer 3, further includes the Intelligent heat dissipation device being arranged in busbar protecting crust 1;
The busbar protecting crust 1 is enclosed by epipleural 4, lower side panel, left plate and right plate.
The Intelligent heat dissipation device includes power supply, radiating block 6, radiator fan 7, semiconductor chilling plate 5 and open type temperature Switch 9 is spent, radiating block 6 is made of bottom plate and the cooling fin being arranged on bottom plate, power supply, radiator fan 7, semiconductor chilling plate 5 It connects with open type temperature switch 9;
The bottom plate of the radiating block 6 is fixed on 4 upper surface of epipleural, and radiator fan 7 is fixed on a heat sink, and described half Conductor cooling piece 5 is fixed on 4 lower surface of epipleural, and the open type temperature switch 9 and the insulating protective layer 3 of busbar conductor 2 connect It touches;Preferred embodiment is:4 upper surface of the epipleural and 4 lower surface of epipleural offer mounting groove, are equipped in mounting groove Thermally conductive sheet 8;Thermally conductive sheet 8 has the advantages that heat transference efficiency is high, can ensure that the heat of 5 upper surface of semiconductor chilling plate can be fast Speed passes to cooling fin by thermally conductive sheet 8;The temperature that redirects of open type temperature switch 9 can be according to the industry requirement temperature of bus duct Degree selection.
When using a kind of intelligent heat dissipation bus duct described in the utility model, when the busbar temperature in bus duct is increased to often When the threshold value of open form temperature switch 9, open type temperature switch 9 is closed, and semiconductor chilling plate 5 and radiator fan 7 are powered on;Half The temperature of the lower surface of conductor cooling piece 5 quickly reduces, and logical heat transfer reduces the insulation protection for quickly reducing busbar conductor 2 The temperature of layer 3;Meanwhile the temperature of the upper surface of semiconductor chilling plate 5 quickly increases, due to semiconductor chilling plate 5 and epipleural 4 Between be provided with thermally conductive sheet 8, therefore, the heat of 5 upper surface of semiconductor chilling plate can be transmitted to heat dissipation quickly through thermally conductive sheet 8 Piece, and by 7 rapid cooling of radiator fan, ensure 5 efficiency operation of semiconductor chilling plate, it can also while saving electric quantity of power supply It is reached for the purpose of 3 fast cooling of insulating protective layer of busbar conductor 2.
A kind of intelligent heat dissipation bus duct described in the utility model reaches temperature in 3 temperature of insulating protective layer of bus-bars conductor When redirecting temperature of degree switch, can start Intelligent heat dissipation device, underlaying surface temperature when being powered using semiconductor chilling plate 5 automatically It quickly reduces, quickly raised characteristic, logical heat transfer are fast by the temperature of the insulating protective layer 3 of bus-bars conductor for upper surface temperature Speed reduces, at the same time it can also by thermally conductive sheet 8, radiating block 6 and radiator fan 7 that the heat of 5 upper surface of semiconductor chilling plate is fast Speed is spilt into outside bus duct, is prevented the insulation melting layer on bus bar, is effectively extended the service life of bus duct.
Finally it should be noted that:The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it System;Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should Understand:It still can be with technical scheme described in the above embodiments is modified, either to which part or whole Technical characteristic carries out equivalent replacement;And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution are new The range of each embodiment technical solution of type.

Claims (2)

1. a kind of intelligent heat dissipation bus duct, including busbar protecting crust and Duo Gen are arranged in parallel in the busbar in busbar protecting crust, institute Busbar is stated to include busbar conductor and coat the insulating protective layer of the busbar conductor, it is characterised in that:Further include that setting is anti-in busbar Intelligent heat dissipation device in protective case;
The busbar protecting crust is enclosed by epipleural, lower side panel, left plate and right plate;
The Intelligent heat dissipation device includes power supply, radiating block, radiator fan, semiconductor chilling plate and open type temperature switch, Radiating block is made of bottom plate and the cooling fin being arranged on bottom plate, power supply, radiator fan, semiconductor chilling plate and open type temperature Switch series connection;
The bottom plate of the radiating block is fixed on epipleural upper surface, and radiator fan is fixed on a heat sink, the semiconductor system Cold is fixed on epipleural lower surface, and the open type temperature switch is contacted with the insulating protective layer of busbar conductor.
2. a kind of intelligent heat dissipation bus duct according to claim 1, it is characterised in that:The epipleural upper surface and upside Plate lower surface offers mounting groove, and thermally conductive sheet is equipped in mounting groove.
CN201721811799.8U 2017-12-22 2017-12-22 A kind of intelligent heat dissipation bus duct Expired - Fee Related CN207719773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721811799.8U CN207719773U (en) 2017-12-22 2017-12-22 A kind of intelligent heat dissipation bus duct

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721811799.8U CN207719773U (en) 2017-12-22 2017-12-22 A kind of intelligent heat dissipation bus duct

Publications (1)

Publication Number Publication Date
CN207719773U true CN207719773U (en) 2018-08-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721811799.8U Expired - Fee Related CN207719773U (en) 2017-12-22 2017-12-22 A kind of intelligent heat dissipation bus duct

Country Status (1)

Country Link
CN (1) CN207719773U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864675A (en) * 2020-07-08 2020-10-30 江苏海纬集团有限公司 Intelligent bus duct that can monitor
CN112054458A (en) * 2020-10-12 2020-12-08 江苏君子母线有限公司 Special heat dissipation type bus duct of high-voltage bus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864675A (en) * 2020-07-08 2020-10-30 江苏海纬集团有限公司 Intelligent bus duct that can monitor
CN112054458A (en) * 2020-10-12 2020-12-08 江苏君子母线有限公司 Special heat dissipation type bus duct of high-voltage bus

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180810

CF01 Termination of patent right due to non-payment of annual fee