CN203279343U - Electric apparatus with heat dissipation function - Google Patents
Electric apparatus with heat dissipation function Download PDFInfo
- Publication number
- CN203279343U CN203279343U CN 201320328269 CN201320328269U CN203279343U CN 203279343 U CN203279343 U CN 203279343U CN 201320328269 CN201320328269 CN 201320328269 CN 201320328269 U CN201320328269 U CN 201320328269U CN 203279343 U CN203279343 U CN 203279343U
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- substrate
- sinking function
- heat sinking
- copper foil
- electric device
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Abstract
The utility model relates to an electric apparatus with a heat dissipation function, comprising a direct current brushless motor, a controller and a switch unit, wherein the switch unit is arranged in the direct current brushless motor; the controller comprises an MCU; the switch unit is in connection with the MCU through cables; the switch unit comprises a substrate possessing a heat dissipation function and a power device arranged on the substrate. The electric apparatus with a heat dissipation function possesses the beneficial effects of easy installation and small size and can raise efficiency.
Description
Technical field
The utility model relates to Motor Control Field, more particularly, relates to a kind of electric device with heat sinking function.
Background technology
Dc brushless motor has that efficient is high, specific volume power density is high, easy to control, without advantages such as rapid wear devices, be applied to gradually in recent years in electric tool, replace original brush motor, series excited machine etc.
The several functions such as the electric tool complete machine will be realized turning porthole, plank, screws, impact endurance test shock, stall, its electric current, power are all larger.Battery-powered electric tool particularly, its supply power voltage is low, reach high-power, and the electric current that needs is all very large.
Electric tool is because of the demand of use, and electric current is all between several amperes to hundreds of amperes.Large electric current will cause the power device caloric value large, and temperature sharply raises, and high temperature will have a strong impact on the performance of power device, even directly damage power device.Circuit Copper Foil between power device also because not dispelling the heat well, the phenomenons such as Copper Foil fuses, burns may occur.Therefore, the heat dissipation problem of power device and circuit Copper Foil becomes dc brushless motor and is applied to problem needing to overcome in electric tool.
In existing electric tool, mainly adopt glass mat as the carrying of electronic circuit, electronic device.But glass mat heat conduction, heat dispersion are very poor, can not be power device heat conduction, heat radiation.
Present method is, the electrical property pin of power device is welded on glass mat, increases in addition aluminum (or other materials) fin and is pressed on the thermal conductive surface of power device.If each power device independently uses a fin, it is installed trouble, lowers efficiency, and space structure requires increase, the volume of increase product.If a plurality of power devices share a fin, also there is the Insulation Problems between power device, needing to increase in addition is the material that heat conduction is insulated again again, for a plurality of power devices insulate, can reduce power device to the heat conduction of fin although insulating material has the heat conduction function.Fig. 1 is the schematic diagram before glass fibre PCB and the assembling of plug-in unit power device, and Fig. 2 is the schematic diagram after glass fibre PCB and the assembling of plug-in unit power device, and in Fig. 1 and Fig. 2,01 is the heat radiation aluminium, and 02 is insulating material, and 03 is the plug-in unit power device, and 04 is pcb board; Fig. 3 is the schematic diagram before glass fibre PCB and the assembling of paster power device, and Fig. 4 is the schematic diagram after glass fibre PCB and the assembling of paster power device, and in Fig. 3 and Fig. 4,11 are the heat radiation aluminium, and 12 is insulating cement, and 13 is the paster power device, and 14 is pcb board.Prior art is just dispelled the heat for power device, and the circuit Copper Foil on glass mat between each power device is still not heat radiation also, and Copper Foil fusing, the risk of burning still exist.
The utility model content
The technical problems to be solved in the utility model is, for the defective that the above-mentioned installation of prior art bothers, lowers efficiency, volume is larger, provide a kind of install simple, raise the efficiency, the electric device with heat sinking function of small volume.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of electric device with heat sinking function, comprise dc brushless motor, controller and switch element; It is inner that described switch element is arranged on described dc brushless motor, and described controller comprises MCU, and described switch element is connected by cable with described MCU; Described switch element comprises the substrate with heat sinking function and is arranged on power device on described substrate.
In the electric device with heat sinking function described in the utility model, described substrate is metal substrate or metal-cored PCB.
In the electric device with heat sinking function described in the utility model, described metal substrate is copper base or aluminium base or iron substrate, and described metal-cored PCB is copper core PCB or aluminium core PCB or iron core PCB.
In the electric device with heat sinking function described in the utility model, described substrate comprises first substrate and the second substrate that is connected with described first substrate, and described first substrate is circular, and described second substrate is rectangle.
In the electric device with heat sinking function described in the utility model, described substrate is quadrangle or hexagon or polygon, and described quadrangle or hexagon or polygonal center are provided with through hole.
In the electric device with heat sinking function described in the utility model, described dc brushless motor inside is provided with Hall element or hall device, and described switch element and described Hall element or hall device are arranged on the same circuit board.
In the electric device with heat sinking function described in the utility model, described substrate is any one in single sided board, double sided board and multi-layer sheet.
In the electric device with heat sinking function described in the utility model, described power device be MOSFET or/and IGBT or/and triode or/and controllable silicon.
In the electric device with heat sinking function described in the utility model, described double sided board is formed by aluminium lamination, the first insulating barrier, the first copper foil layer, the second insulating barrier and the compacting of the second copper foil layer, described the first insulating barrier and the first copper foil layer are successively set on the one side of described aluminium lamination, and described the second insulating barrier and the second copper foil layer are successively set on the another side of described aluminium lamination.
In the electric device with heat sinking function described in the utility model, insulate by insulating material between described power device and described the first copper foil layer or the second copper foil layer.
In the electric device with heat sinking function described in the utility model, described power device is provided with radiating surface, and described radiating surface is welded on described substrate.
Implement the electric device with heat sinking function of the present utility model, has following beneficial effect: be arranged on due to power device on the substrate with heat sinking function, can be with its heating conduction to this substrate, do not need extra radiating element, Gu has saved the operation of assembling, fixed heat sink part, so it is installed simply, has improved efficient, simultaneously owing to not needing extra radiating element, so it has reduced volume.
Description of drawings
Fig. 1 is glass fibre PCB and the front schematic diagram of plug-in unit power device assembling in prior art;
Fig. 2 is the schematic diagram after the assembling of glass fibre PCB and plug-in unit power device in prior art;
Fig. 3 is glass fibre PCB and the front schematic diagram of paster power device assembling in prior art;
Fig. 4 is the schematic diagram after the assembling of glass fibre PCB and paster power device in prior art;
Fig. 5 is the structural representation that the utlity model has switch element in embodiment of electric device of heat sinking function;
Fig. 6 is the position view of each layer of substrate in described embodiment.
Embodiment
Can understand and implement the utility model for the ease of those of ordinary skill in the art, below in conjunction with accompanying drawing, the utility model embodiment is described further.
In the electric device embodiment of the utility model heat sinking function, this electric device comprises dc brushless motor, controller and switch element; Wherein, switch element is arranged on dc brushless motor inside, and controller comprises MCU, and switch element is connected by cable with MCU; Controller is as driving, the rotation control section of dc brushless motor, and MCU is any one in 8,16 or 32, it is worth mentioning that, MCU can be also DSP or CPU or MPU, mainly does the controls such as logical algorithm calculating, protection, speed governing.In the present embodiment, the structural representation of switch element as shown in Figure 5, in Fig. 5, switch element comprises the substrate 32 with heat sinking function and is arranged on power device 31 on this substrate 32.Substrate 32 is metal substrate or metal-cored PCB, and metal substrate is copper base or aluminium base or iron substrate, and metal-cored PCB is copper core PCB or aluminium core PCB or iron core PCB, power device 31 be MOSFET or/and IGBT or/and triode or/and controllable silicon.Substrate 32 can be any one in single sided board, double sided board and multi-layer sheet.
In Fig. 5, substrate 32 comprises first substrate and the second substrate that is connected with first substrate, first substrate is circular, second substrate is that the two ends of the circular diameter parallel with one side rectangle of rectangle are respectively arranged with groove 33, two angles of rectangle are provided with chamfering, certainly, under the certain situation of the present embodiment, rectangle also can not arrange chamfering.Certainly, under the certain situation of the present embodiment, substrate 32 also can be other shapes, and for example: substrate is quadrangle or hexagon or polygon, and above-mentioned quadrangle or hexagon or polygonal center are provided with through hole.It is worth mentioning that, in the present embodiment, dc brushless motor inside is provided with Hall element or hall device, and switch element and Hall element or hall device are arranged on the same circuit board.
In the present embodiment, substrate 3 is double sided board, and substrate 3 uses two-sided aluminium base, and certainly, in the other situation of the present embodiment, substrate 3 also can use other substrates, for example aluminium core PCB, copper base, copper core PCB, iron substrate or iron core PCB.Fig. 6 is the position view of each layer of substrate in the present embodiment, in Fig. 6, be double sided board in substrate 32(the present embodiment) formed by aluminium lamination 321, the first insulating barrier 322, the first copper foil layer 323, the second insulating barrier 324 and the second copper foil layer 325 compactings, the first insulating barrier 322 and the first copper foil layer 323 are successively set on the one side of aluminium lamination 321, and the second insulating barrier 324 and the second copper foil layer 325 are successively set on the another side of aluminium lamination 321.Wherein the first copper foil layer 323 and the second copper foil layer 325 are all circuit layers, and its area and layout are all relevant with concrete circuit.Under the certain situation of the present embodiment, substrate 32 can be also single sided board or multi-layer sheet.
In a word, in the present embodiment, aluminium base is applied in the electric device with heat sinking function, as the carrier of high power device and electronic circuit.High power device directly is welded on certain thickness aluminum base PCB plate; and the applying as much as possible of the radiating surface of power device is welded on the aluminum base PCB plate; to greatest extent, the heating with power device of prestissimo is conducted to aluminium base; utilize good heat conductive, the heat dispersion of aluminium material; the heating of power device is conducted, reach the purpose of protecting power device, the stability of machine product being provided.Because power device 31 directly is welded on aluminium base, no matter be the pin with electrical property, or the thermal conductive surface of power device 31 (radiating surface), all directly welding is fitted in above aluminium base, utilized to greatest extent heat conducting area, its heat conduction, radiating effect are obvious.
Traditional mode need to increase screw or screens, and power device and fin are pressed together, and exists each position extruding force inhomogeneous, inhomogeneous, the inconsistent problem of heat conduction.The heat conducting path of the utility model be by power device 31 directly to aluminium base, without any intermediate link, and power device 31 is welded on above aluminium base, solid and reliable, heat conduction uniformity.
The traditional glass fiber board will be assembled, the fixed heat sink part, and radiating element is fixed by screw or screens usually, in the process of holding screw nail, because the dynamics that each position screw clamps is inconsistent, cause each power device inconsistent to the heat conduction of fin, affect stability, the consistency of product.More likely in the process that screw clamps, overexertion directly damages electronic device.In the present embodiment, adopt automation equipment or other modes that power device 31 is mounted on aluminium base, by the hot environment of automatic equipment or other modes, scolding tin is melted, then after low temperature solidifies, just complete the processing of PCB.Owing to not needing fin, its processing mode is simple, saves cost of labor; There is no artificial intervention, improved homogeneity of product and stability.Reduce simultaneously volume, facilitated overall design.
For power apparatus, the circuit Copper Foil between power device is also wanted bearing great current (several amperes to hundreds of amperes).At present under industrial condition, on all kinds of PCB plates (comprising glass mat, aluminium base, all kinds of metal substrate), the restriction of thickness is arranged as the Copper Foil of connecting electronic circuit, the resistance (several milliohms are to several ohm) of any is also arranged, in the situation that the large electric current of flowing through also all will generate heat.Under present industrial condition, copper thickness can not strengthen arbitrarily, and its resistance can not reduce, and heat radiation is exactly reliable in order to guarantee product safety.
Traditional approach, for line insulation, electric leakage requirement, Copper Foil is upper and lower the insulating oil enamelled coating, and it can't dispel the heat.Because the existence of insulating oil enamelled coating, the mode that also can't increase fin as power device is the Copper Foil heat radiation.Do not consider in a conventional manner the heat dissipation problem of Copper Foil at all.
In the present embodiment, also be covered with the Copper Foil of connection of electronic devices circuit on aluminium base, comprise the Copper Foil of 31 of power devices.The very large electric current (several amperes to hundreds of amperes) that the Copper Foil that power device is 31 wants 31 of load power devices to flow through, it also has very large heating, Copper Foil itself is exactly to be attached to above aluminium base, the heat that Copper Foil can be produced like this conducts fast to the aluminium in aluminium base, with this part heat, to greatest extent, the conducting of prestissimo.Guarantee the safe and reliable of circuit, product.So it has good heat conduction, radiating effect to the electronic circuit Copper Foil.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. the electric device with heat sinking function, is characterized in that, comprises dc brushless motor, controller and switch element; It is inner that described switch element is arranged on described dc brushless motor, and described controller comprises MCU, and described switch element is connected by cable with described MCU; Described switch element comprises the substrate with heat sinking function and is arranged on power device on described substrate.
2. the electric device with heat sinking function according to claim 1, is characterized in that, described substrate is metal substrate or metal-cored PCB.
3. the electric device with heat sinking function according to claim 2, is characterized in that, described metal substrate is copper base or aluminium base or iron substrate, and described metal-cored PCB is copper core PCB or aluminium core PCB or iron core PCB.
4. have according to claim 3 the electric device of heat sinking function, it is characterized in that, described substrate comprises first substrate and the second substrate that is connected with described first substrate, and described first substrate is circular, and described second substrate is rectangle.
5. have according to claim 3 the electric device of heat sinking function, it is characterized in that, described substrate is quadrangle or hexagon or polygon, and described quadrangle or hexagon or polygonal center are provided with through hole.
6. according to claim 4 or 5 described electric devices with heat sinking function, is characterized in that, described dc brushless motor inside is provided with Hall element or hall device, and described switch element and described Hall element or hall device are arranged on the same circuit board.
7. the electric device with heat sinking function according to claim 6, is characterized in that, described substrate is any one in single sided board, double sided board and multi-layer sheet.
8. the electric device with heat sinking function according to claim 7, is characterized in that, described power device be MOSFET or/and IGBT or/and triode or/and controllable silicon.
9. the electric device with heat sinking function according to claim 8, it is characterized in that, described double sided board is formed by aluminium lamination, the first insulating barrier, the first copper foil layer, the second insulating barrier and the compacting of the second copper foil layer, described the first insulating barrier and the first copper foil layer are successively set on the one side of described aluminium lamination, and described the second insulating barrier and the second copper foil layer are successively set on the another side of described aluminium lamination.
10. the electric device with heat sinking function according to claim 9, it is characterized in that, insulate by insulating material between described power device and described the first copper foil layer or the second copper foil layer, described power device is provided with radiating surface, and described radiating surface is welded on described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320328269 CN203279343U (en) | 2013-06-07 | 2013-06-07 | Electric apparatus with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320328269 CN203279343U (en) | 2013-06-07 | 2013-06-07 | Electric apparatus with heat dissipation function |
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| Publication Number | Publication Date |
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| CN203279343U true CN203279343U (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320328269 Expired - Lifetime CN203279343U (en) | 2013-06-07 | 2013-06-07 | Electric apparatus with heat dissipation function |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985704A (en) * | 2014-05-29 | 2014-08-13 | 浙江大学 | Power electronic module in symmetric parallel connection |
| WO2015124036A1 (en) * | 2014-02-19 | 2015-08-27 | 刘晓霖 | Switching circuit structure based on printed circuit board |
| CN108429437A (en) * | 2018-03-21 | 2018-08-21 | 西安交通大学 | A kind of micro- sense type IGBT series and parallel structures |
| CN111228107A (en) * | 2020-01-14 | 2020-06-05 | 深圳市恒瑞灵机电有限公司 | Control method and device of massage gun and readable storage medium |
| CN112925288A (en) * | 2021-01-20 | 2021-06-08 | 金华职业技术学院 | Integrated electric control device of electric automobile |
| CN114698241A (en) * | 2022-03-16 | 2022-07-01 | 广东汇芯半导体有限公司 | Semiconductor integrated circuit and manufacturing method thereof |
-
2013
- 2013-06-07 CN CN 201320328269 patent/CN203279343U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015124036A1 (en) * | 2014-02-19 | 2015-08-27 | 刘晓霖 | Switching circuit structure based on printed circuit board |
| CN103985704A (en) * | 2014-05-29 | 2014-08-13 | 浙江大学 | Power electronic module in symmetric parallel connection |
| CN108429437A (en) * | 2018-03-21 | 2018-08-21 | 西安交通大学 | A kind of micro- sense type IGBT series and parallel structures |
| CN108429437B (en) * | 2018-03-21 | 2019-12-24 | 西安交通大学 | Micro-inductive IGBT series-parallel structure |
| CN111228107A (en) * | 2020-01-14 | 2020-06-05 | 深圳市恒瑞灵机电有限公司 | Control method and device of massage gun and readable storage medium |
| CN112925288A (en) * | 2021-01-20 | 2021-06-08 | 金华职业技术学院 | Integrated electric control device of electric automobile |
| CN112925288B (en) * | 2021-01-20 | 2021-11-02 | 金华职业技术学院 | Integrated electric control device of electric automobile |
| CN114698241A (en) * | 2022-03-16 | 2022-07-01 | 广东汇芯半导体有限公司 | Semiconductor integrated circuit and manufacturing method thereof |
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| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131106 |
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| CX01 | Expiry of patent term |