CN102837099A - Assembly device for welding circuit board and heat sinking base plate and welding method thereof - Google Patents
Assembly device for welding circuit board and heat sinking base plate and welding method thereof Download PDFInfo
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- CN102837099A CN102837099A CN2011101668863A CN201110166886A CN102837099A CN 102837099 A CN102837099 A CN 102837099A CN 2011101668863 A CN2011101668863 A CN 2011101668863A CN 201110166886 A CN201110166886 A CN 201110166886A CN 102837099 A CN102837099 A CN 102837099A
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- circuit board
- power amplifier
- amplifier module
- welding
- module circuit
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Abstract
The invention discloses an assembly device for welding a circuit board and a heat sinking base plate and a welding method of the assembly device, relating to the emitting and manufacturing technical field of a radio and a television. The assembly device comprises clamping board layers consisting of a bottom board, a middle board and a top board which are horizontally arranged in sequence, and a clamping rod which is arranged on the centers of the clamping plate layers and penetrates through the three layers of the clamping plates, wherein a clamp handle capable of clamping or loosening the three layers of the clamping plates is arranged on the top end of the clamping rod; and bolts for fixing the three layers of the clamping plates are respectively arranged on four corners of the clamping plate layers. A welding piece consisting of a power amplifier module circuit board and the heat sinking base plate can be arranged on the bottom board; a plurality of pressing columns with pressure spring devices are fixedly connected below the middle board vertically; and a position of each pressing column is in one-to-one correspondence with the power amplifier module circuit board and a pressing hole on the heat sinking base plate respectively. Compared with the prior art, the assembly device can effectively ensure the power amplifier module circuit board to reliably connect with the heat sinking base plate for a long time, so as to achieve good electrical conductivity and thermal conductivity, and improve working stability and reliability of an amplifier.
Description
Technical field
Type of the present invention relates to radio and television emission manufacturing technology field, especially for the fitting device and the welding method thereof of power amplifier module circuit board and heat sink substrate solidified welding.
Background technology
In TV and radio emission machine, power amplifier is a core component, is used for the amplification of signal.Its stability, reliability directly influence performance, signal transmission and the signal cover of emitter.
In the prior art, what extensively adopt being connected of amplifier module circuit board and heat sink substrate is that screw is fastening.There are many shortcomings in this mode: the fastening initial stage of screw; Can guarantee that circuit board contacts with the good of heat sink substrate; But after emitter work a period of time,, thereby make its contact-making surface produce the gap because the variation of circuit board and heat sink substrate temperature causes the surface both distortion.Emitter is in long-term work; Be deposited on the directly conduction and the heat conduction of the heat sink substrate of influence of impurity such as dust, dirt of gap location; Cause the amplifier stability variation, also can make amplifier produce concussion when serious, cause the damage of amplifier core device-power tube.
Summary of the invention
In order to overcome the deficiency that above-mentioned prior art exists, the purpose of this invention is to provide a kind of fitting device and welding method thereof that is used for circuit board and the welding of heat sink substrate.It can guarantee that the power amplifier module circuit board is connected with heat sink substrate reliably and with long-term, and makes it have favorable conductive, thermal conductivity, improves amplifier job stability, reliability.
In order to reach the foregoing invention purpose, technical scheme of the present invention realizes as follows:
A kind of fitting device that is used for circuit board and the welding of heat sink substrate; Its design feature is; It comprises the splinting layer of being made up of base plate, middle plate and top board horizontal positioned successively and is positioned at the splinting layer center and runs through the clamping bar of triple laminate; The clamp handle of the top of clamping bar for making triple laminate clamp or unclamp, four jiaos of splinting layer are respectively equipped with the fixedly screw of triple laminate.Can place the weldment of forming by power amplifier module circuit board and heat sink substrate on the base plate; In the below of plate be fixedly connected a plurality of crimping posts that have compression-spring device vertically downward, the position of each crimping post respectively with power amplifier module circuit board and heat sink substrate on the crimping hole corresponding one by one.
In above-mentioned fitting device, said baseboard material adopts resistant to elevated temperatures phenolic resins plate.
A kind of welding method that is used for circuit board and the welding of heat sink substrate, it uses the fitting device that comprises that triple laminate, clamping bar, clamp handle and crimping post are formed, and the steps include:
The position that
goes up the crimping hole according to the size of power amplifier module circuit board and its processes the steel mesh of a bottom tin cream;
places on the heat sink substrate steel mesh and the location, with scraper plate tin cream wipeed off;
Lift the clamp handle on
, the screw of outwarding winding, taking off the assembly of accomplishing after the welding becomes power amplifier module.
In above-mentioned welding method, said welding stage preheat temperature is 215 ℃, and power amplifier module circuit board surface temperature preset value is 200 ℃.
The present invention is owing to adopted said structure and method; Utilize a kind of elasticity scalable, dismountable fitting device that the power amplifier module circuit board is placed on the welding stage with the reliable crimping of heat sink substrate that applies tin cream and heat, realize that the welding of power amplifier module circuit board and heat sink substrate is solidified.The present invention can make power amplifier module circuit board and heat sink substrate have stable, reliable electrical equipment to be connected, and good thermal diffusivity is arranged, thereby make whole power amplifier module that stable electric property arranged.The characteristics of fitting device are: can guarantee even when welding, the reliable crimping of power amplifier module circuit board and heat sink substrate, easy accessibility is saved installation work-hour.
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is described further.
Description of drawings
Fig. 1 is a fitting device structural representation of the present invention;
Fig. 2 is a steel mesh sketch map in the embodiment of the invention;
Fig. 3 is the heat sink substrate sketch map that applies tin cream in the embodiment of the invention;
Fig. 4 is placed on the sketch map on the heat sink substrate for power amplifier module circuit board in the embodiment of the invention;
Fig. 5 is the sketch map of welding stage in the embodiment of the invention.
The specific embodiment
Referring to Fig. 1; Fitting device of the present invention comprises the splinting layer of being made up of the base plate 1, middle plate 2 and the top board 3 that adopt resistant to elevated temperatures phenolic resins sheet material material horizontal positioned successively and is positioned at the splinting layer center and runs through the clamping bar 4 of triple laminate; The clamp handle 5 that the top of clamping bar 4 clamps or unclamps for making triple laminate, four jiaos of splinting layer are respectively equipped with the screw 7 that a pine that is used for fixing triple laminate does not take off.Can place the weldment of forming by power amplifier module circuit board 11 and heat sink substrate 12 on the base plate 1; In the below of plate 2 be fixedly connected a plurality of crimping posts 6 that have compression-spring device vertically downward, the position of each crimping post 6 respectively with power amplifier module circuit board 11 and heat sink substrate 12 on crimping hole 13 corresponding one by one.
Welding method step of the present invention is:
The position that
goes up crimping hole 13 according to the size of power amplifier module circuit board 11 and its processes the steel mesh 16 of a bottom tin cream, and is as shown in Figure 2;
is placed on power amplifier module circuit board 11 on the heat sink substrate 12 that applies tin cream and forms assembly, and be as shown in Figure 4;
is referring to Fig. 5; Welding stage 14 is preheating to 215 ℃; Assembly is put into heating on the thermal treatment zone 15 of welding stage 14; When treating that power amplifier module circuit board 11 surface temperatures reach 200 ℃ of preset values, assembly is put into heat radiation cooling on the radiator platform, scolding tin solidifies;
Lift clamp handle 5 on
, the screw 7 of outwarding winding, taking off the assembly of accomplishing after the welding becomes power amplifier module.
Claims (4)
1. fitting device that is used for the welding of circuit board and heat sink substrate; It is characterized in that; It comprises the splinting layer of being made up of base plate (1), middle plate (2) and top board (3) horizontal positioned successively and is positioned at the splinting layer center and runs through the clamping bar (4) of triple laminate; The clamp handle (5) of the top of clamping bar (4) for making triple laminate clamp or unclamp; Four jiaos of splinting layer are respectively equipped with the fixedly screw of triple laminate (7); Can place the weldment of being made up of power amplifier module circuit board (11) and heat sink substrate (12) on the base plate (1), the below of middle plate (2) is fixedly connected a plurality of crimping posts (6) that have compression-spring device vertically downward, the position of each crimping post (6) respectively with power amplifier module circuit board (11) and heat sink substrate (12) on crimping hole (13) corresponding one by one.
2. fitting device according to claim 1 is characterized in that, said base plate (1) material adopts resistant to elevated temperatures phenolic resins plate.
3. welding method that is used for the welding of circuit board and heat sink substrate, its uses the fitting device that comprises triple laminate, clamping bar (4), clamp handle (5) and crimping post (6) composition, the steps include:
The position that
goes up crimping hole (13) according to the size of power amplifier module circuit board (11) and its processes the steel mesh (16) of a bottom tin cream;
is with welding stage (14) preheating; Assembly is put into the thermal treatment zone (15) of welding stage (14) and goes up heating; Treat that power amplifier module circuit board (11) is when surface temperature reaches preset value; Assembly is put into heat radiation cooling on the radiator platform, and scolding tin solidifies;
Lift clamp handle (5), the screw of outwarding winding (7) on
, taking off the assembly of accomplishing after welding becomes power amplifier module.
4. welding method according to claim 3 is characterized in that, said welding stage (14) preheat temperature is 215 ℃, and power amplifier module circuit board (11) surface temperature preset value is 200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101668863A CN102837099A (en) | 2011-06-21 | 2011-06-21 | Assembly device for welding circuit board and heat sinking base plate and welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101668863A CN102837099A (en) | 2011-06-21 | 2011-06-21 | Assembly device for welding circuit board and heat sinking base plate and welding method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102837099A true CN102837099A (en) | 2012-12-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101668863A Pending CN102837099A (en) | 2011-06-21 | 2011-06-21 | Assembly device for welding circuit board and heat sinking base plate and welding method thereof |
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| CN (1) | CN102837099A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252100A (en) * | 2015-11-10 | 2016-01-20 | 苏州新一磁业有限公司 | Welding method of ultrathin metal parts |
| CN107257015A (en) * | 2013-08-09 | 2017-10-17 | 胜美达集团株式会社 | The manufacture method of aerial coil part |
| CN110756940A (en) * | 2019-10-29 | 2020-02-07 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN111250813A (en) * | 2020-02-19 | 2020-06-09 | 华芯威半导体科技(北京)有限责任公司 | Welding tool and method for internal electrode of power semiconductor module |
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| CN1436033A (en) * | 2002-01-26 | 2003-08-13 | 华为技术有限公司 | Interlayer connecting method and apparatus |
| CN201493581U (en) * | 2009-05-15 | 2010-06-02 | 上海闻泰电子科技有限公司 | Special clamp for circuit board passing through reflow solder furnace |
| CN201657519U (en) * | 2010-01-09 | 2010-11-24 | 博威科技(深圳)有限公司 | PCB braze welding clamp |
| CN202137491U (en) * | 2011-06-21 | 2012-02-08 | 北京同方吉兆科技有限公司 | A tooling device used for welding a circuit board and a heat sink substrate |
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2011
- 2011-06-21 CN CN2011101668863A patent/CN102837099A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1436033A (en) * | 2002-01-26 | 2003-08-13 | 华为技术有限公司 | Interlayer connecting method and apparatus |
| CN201493581U (en) * | 2009-05-15 | 2010-06-02 | 上海闻泰电子科技有限公司 | Special clamp for circuit board passing through reflow solder furnace |
| CN201657519U (en) * | 2010-01-09 | 2010-11-24 | 博威科技(深圳)有限公司 | PCB braze welding clamp |
| CN202137491U (en) * | 2011-06-21 | 2012-02-08 | 北京同方吉兆科技有限公司 | A tooling device used for welding a circuit board and a heat sink substrate |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107257015A (en) * | 2013-08-09 | 2017-10-17 | 胜美达集团株式会社 | The manufacture method of aerial coil part |
| CN107257025A (en) * | 2013-08-09 | 2017-10-17 | 胜美达集团株式会社 | The manufacture method of aerial coil part |
| CN107257010A (en) * | 2013-08-09 | 2017-10-17 | 胜美达集团株式会社 | The manufacture method of aerial coil part |
| CN107257025B (en) * | 2013-08-09 | 2020-06-26 | 胜美达集团株式会社 | Method for manufacturing antenna coil component |
| CN107257015B (en) * | 2013-08-09 | 2020-12-01 | 胜美达集团株式会社 | Method for manufacturing antenna coil component |
| CN107257010B (en) * | 2013-08-09 | 2020-12-11 | 胜美达集团株式会社 | Method for manufacturing antenna coil component |
| CN105252100A (en) * | 2015-11-10 | 2016-01-20 | 苏州新一磁业有限公司 | Welding method of ultrathin metal parts |
| CN110756940A (en) * | 2019-10-29 | 2020-02-07 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN110756940B (en) * | 2019-10-29 | 2022-01-18 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN111250813A (en) * | 2020-02-19 | 2020-06-09 | 华芯威半导体科技(北京)有限责任公司 | Welding tool and method for internal electrode of power semiconductor module |
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Application publication date: 20121226 |