CN203353020U - Heat radiation structure for inverter power supply circuit module - Google Patents
Heat radiation structure for inverter power supply circuit module Download PDFInfo
- Publication number
- CN203353020U CN203353020U CN 201320298441 CN201320298441U CN203353020U CN 203353020 U CN203353020 U CN 203353020U CN 201320298441 CN201320298441 CN 201320298441 CN 201320298441 U CN201320298441 U CN 201320298441U CN 203353020 U CN203353020 U CN 203353020U
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- Prior art keywords
- radiator
- inverter power
- layer
- heat radiation
- utility
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a heat radiation structure for an inverter power supply circuit module, and the structure comprises an aluminium substrate and a radiator. The aluminium substrate comprises a welding layer, an insulating layer, and an aluminium plate, wherein the welding layer, the insulating layer and the aluminium plate are stacked layer by layer. The welding layer is welded with an electronic element in a circuit module in a manner of surface contact. The aluminium plate is connected with the radiator in the manner of surface contact. The heat radiation structure provided by the utility model reduces manual operation when ensuring the heat radiation of the electronic element, reduces a fraction defective caused by a human act in a machining process, and is low in production cost.
Description
Technical field
The utility model relates to the board production manufacture field, relates in particular to a kind of radiator structure for the inverter power circuit assembly.
Background technology
In prior art, the electronic component heating is the key factor of restriction circuit performance.The generator inverter, also be inverter, is the important component part of generator.The alternating current that its effect is exactly that generator windings is produced is converted to stable civil power (220V/50Hz) output, normal for various electrical equipment.Inverter mainly is comprised of rectification and inversion two large divisions, wherein rectifying part adopts all-wave switching regulator rectification principle more, and main applying electronic element is diode, thyristor (SCR), cutoff thyristor (GTO) and power field effect pipe (MOSFET) etc.; And Converting Unit adopts inverter bridge to realize more, main electronic component is that insulated gate bipolar transistor (IGBT) and MOS control thyristor (MCT) etc.Above-mentioned electronic component is the basic device of inverter, can pass through larger electric current during work, so fever phenomenon is serious, so use high-power encapsulating electronic components, its efficiently radiates heat also just becomes a large emphasis of inverter structural design more.
For the heat radiation of high-power encapsulating electronic components, be generally on the basis of the fin of electronic component own in the past, then appended the radiator that more volume is installed, and adopted securing member (screw/nut) to connect between the two.Between the fin of electronic component own and securing member, and the radiator that appends between all need to carry out insulation processing, adopt insulating particle and insulation spacer to be isolated more.Operating process needs manual carrying out, and complex process, radiating effect is poor and reliability is low, often can cause the damage of insulating particle or insulation spacer in operating process, and then causes defective insulation.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of radiator structure for the inverter power circuit assembly, when guaranteeing electronic element radiating, reduces manual operations, and reducing people in the course of processing is the fraction defective caused, low production cost.
In order to solve the problems of the technologies described above, the utility model provides a kind of radiator structure for the inverter power circuit assembly, comprise aluminium base and radiator, described aluminium base comprises successively stacked weld layer, insulating barrier and aluminium sheet, electronic component in described weld layer and circuit unit is with the welding of face contact form, and described aluminium sheet is connected with the face contact form with described radiator.
As preferably, described weld layer comprises with described insulating barrier is close to and covers the copper layer, and the described copper layer outer surface that cover is coated with for the solder(ing) paste layer with described welding electronic elements.
As preferably, the outer surface of described aluminium sheet is coated with heat conductive silica gel, and described aluminium sheet is connected with described radiator by described heat conductive silica gel.
Compared with prior art, the beneficial effect of the radiator structure for the inverter power circuit assembly of the present utility model is:
1, changed the structure that in the prior art, electronic component adopts securing member to be connected with radiator, more without in installation process, connector being carried out to insulation processing, the whole technological process of the utility model can adopt automatic equipment, universal fixture to be processed, easy and simple to handle and homogeneity of product is secure;
2, reduce manual operations, can reduce people in the course of processing is the fraction defective caused;
3, electronic component is connected with radiator by heat conductive silica gel by aluminium base, and the heat produced in work is dispersed with short, the fastest approach, has improved radiating efficiency, has reduced the temperature rise of electronic component, has improved product reliability;
4, guarantee the abundant heat radiation of electronic component, thereby widened the type selecting scope of electronic component in practical engineering application, guaranteed the electric property that finished product is good;
5, the reliability of electronic component improves, and makes the electric reliability of finished product at utmost be guaranteed.
The accompanying drawing explanation
The overall structure schematic diagram of the radiator structure for the inverter power circuit assembly that Fig. 1 is embodiment of the present utility model;
The structural representation of the aluminium base of the radiator structure for the inverter power circuit assembly that Fig. 2 is embodiment of the present utility model.
Main description of reference numerals
Embodiment
The radiator structure for the inverter power circuit assembly below in conjunction with the drawings and specific embodiments to embodiment of the present utility model is described in further detail, but not as to restriction of the present utility model.
The overall structure schematic diagram of the radiator structure for the inverter power circuit assembly that Fig. 1 is embodiment of the present utility model; The structural representation of the aluminium base of the radiator structure for the inverter power circuit assembly that Fig. 2 is embodiment of the present utility model.As depicted in figs. 1 and 2, the radiator structure for the inverter power circuit assembly of embodiment of the present utility model, comprise aluminium base 1 and radiator 2, aluminium base 1 comprises successively stacked weld layer, insulating barrier 12 and aluminium sheet 13, electronic component 200 in weld layer and circuit unit 100 is with the welding of face contact form, and aluminium sheet 13 is connected with the face contact form with radiator 2.The insulating barrier 12 of the present embodiment should adopt structure and the material that thermal conductivity is good.By above structure setting, make the radiator structure for the inverter power circuit assembly of embodiment of the present utility model change the structure that the prior art electronic component adopts securing member to be connected with radiator, more without in installation process, securing member being carried out to insulation processing, reduce manual operations, can reduce people in the course of processing is the fraction defective caused simultaneously.
As a kind of improvement, the weld layer of the radiator structure for the inverter power circuit assembly of embodiment of the present utility model comprises with insulating barrier 12 is close to and covers copper layer 11, covers copper layer 11 outer surface and is coated with for the solder(ing) paste layer 3 with electronic component 200 welding.The technological process of production of take describes as example: can obtain by any prior art means the aluminium base (such as aluminium base being covered to process for copper etc.) of the present embodiment, the aluminium base surface cover copper layer 11 by between insulating barrier 12 and aluminium sheet 13 more than dielectric voltage withstand 3000V; By the outer surface printed solder paste layer 3 that covers copper layer 11 of aluminium base 1, use Special positioning tool by such as aforesaid controllable silicon, IGBT etc. of electronic component 200() be placed in solder(ing) paste layer 3 place; Adopt surface/veneer welding manner (SMT), for example adopt reflow machine, the copper layer 11 that covers of electronic component 200 and aluminium base 1 is welded with formation face and contacts, at utmost play the effect of heat conduction and heat radiation.
As further improving, the outer surface of the aluminium sheet 13 of the radiator structure for the inverter power circuit assembly of embodiment of the present utility model is coated with heat conductive silica gel 4, and aluminium sheet 13 is connected with radiator 2 by heat conductive silica gel 4.Heat conductive silica gel has superpower heat conductivility and high adhesiveness energy, and there are good insulation property, be suitable for the requirement of the radiator structure for the inverter power circuit assembly of embodiment of the present utility model to electric property, mechanical structure performance and physical thermal conductive performance.This structure makes electronic component 200 pass through heat conductive silica gel 4 to radiator 2 heat conduction and heat radiation, the heat produced in work is dispersed with short, the fastest approach, improved radiating efficiency, reduced the temperature rise of electronic component 200, improved product reliability, and guaranteed the abundant heat radiation of electronic component 200, made the type selecting scope of electronic component 200 more extensive.
Above embodiment is only exemplary embodiment of the present utility model, is not used in restriction the utility model, and protection range of the present utility model is defined by the claims.Those skilled in the art can make various modifications or be equal to replacement the utility model in essence of the present utility model and protection range, this modification or be equal to replacement and also should be considered as dropping in protection range of the present utility model.
Claims (3)
1. the radiator structure for the inverter power circuit assembly, it is characterized in that, comprise aluminium base and radiator, described aluminium base comprises successively stacked weld layer, insulating barrier and aluminium sheet, electronic component in described weld layer and circuit unit is with the welding of face contact form, and described aluminium sheet is connected with the face contact form with described radiator.
2. the radiator structure for the inverter power circuit assembly according to claim 1, is characterized in that, described weld layer comprises with described insulating barrier is close to and cover the copper layer, and the described copper layer outer surface that cover is coated with for the solder(ing) paste layer with described welding electronic elements.
3. the radiator structure for the inverter power circuit assembly according to claim 2, is characterized in that, the outer surface of described aluminium sheet is coated with heat conductive silica gel, and described aluminium sheet is connected with described radiator by described heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320298441 CN203353020U (en) | 2013-05-28 | 2013-05-28 | Heat radiation structure for inverter power supply circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320298441 CN203353020U (en) | 2013-05-28 | 2013-05-28 | Heat radiation structure for inverter power supply circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203353020U true CN203353020U (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320298441 Expired - Lifetime CN203353020U (en) | 2013-05-28 | 2013-05-28 | Heat radiation structure for inverter power supply circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203353020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360703A (en) * | 2017-08-30 | 2017-11-17 | 无锡隆盛科技股份有限公司 | A kind of radiator structure of pcb board |
-
2013
- 2013-05-28 CN CN 201320298441 patent/CN203353020U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360703A (en) * | 2017-08-30 | 2017-11-17 | 无锡隆盛科技股份有限公司 | A kind of radiator structure of pcb board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180105 Address after: 065000 Hebei city of Langfang Province on the north side of Yaohua Road Economic and Technological Development Zone, hi tech Industrial Co., Ltd. the new Austrian Patentee after: Langfang Jinrun Zhitong Technology Co.,Ltd. Address before: 065600 banyan Boulevard, Yongqing Industrial Park, Langfang, Hebei Patentee before: Langfang Jinrun Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131218 |
|
| CX01 | Expiry of patent term |