CN205648317U - Circuit board heat dissipation structure for switch - Google Patents
Circuit board heat dissipation structure for switch Download PDFInfo
- Publication number
- CN205648317U CN205648317U CN201620438356.8U CN201620438356U CN205648317U CN 205648317 U CN205648317 U CN 205648317U CN 201620438356 U CN201620438356 U CN 201620438356U CN 205648317 U CN205648317 U CN 205648317U
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- CN
- China
- Prior art keywords
- heat
- fin
- circuit board
- switch
- cooling mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a circuit board heat dissipation structure for switch to solve the low technical problem of current switch heat dispersion, including the circuit board body, still including set up in heat dissipation mechanism on the circuit board body, the series thermal silica board that heat dissipation mechanism includes the heat -conducting plate, makes by series thermal silica, the series thermal silica board is hugged closely the back of circuit board body sets up, just the heat conduction plate voltage is in on the series thermal silica board, still set up including perpendicular a plurality of fin on the heat -conducting plate, each fin is the S -shaped structure, the circuit board body still be provided with two at least fans with one side, still include controller, at least one temperature sensor, temperature sensor hugs closely the heat -conducting plate sets up, just temperature sensor with the controller is connected, the fan respectively through relay with the controller is connected.
Description
Technical field
This utility model relates to a kind of switch, particularly relates to the circuit board radiating structure of a kind of switch.
Background technology
Switch, as relay station important in LAN, provides reliable maincenter hinge for LAN, and exchanges at it
In the use for a long time of machine, the wiring board in switch in use himself can produce substantial amounts of heat, and these are hot
Amount needs eliminate timely, and if this heat can not be discharged timely, the most then will be inverted the switch speed of service
Slow down and affect the stability of switch, heavy then wiring board will be caused to burn out and likely bring the phenomenons such as spontaneous combustion, make
Become rupturing of whole LAN, and prior art uses an exhaust fan is set in a switch, and at switch
Afterbody corresponding exhaust outlet be set solve the problems referred to above；And existing mainframe box is usually placed on inside bin, this kind
Phenomenon is not smooth by the heat radiation being inverted hot blast, is unfavorable for the heat radiation of switch, and this kind of phenomenon is more serious,
Therefore, necessary the problems referred to above are solved.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, adapts to reality need, it is provided that a kind of switch
Circuit board radiating structure, the technical problem low to solve current SWITCH heat dispersion.
In order to realize the purpose of this utility model, the technical scheme that this utility model is used is:
Design the circuit board radiating structure of a kind of switch, including wiring board body；It is characterized in that: also include arranging
Cooling mechanism on described wiring board body, described cooling mechanism includes heat-conducting plate, the thermal conductive silicon being made up of heat conductive silica gel
Offset plate；Described thermal conductive silicon offset plate is close to the back of described wiring board body and is arranged, and described heat-conducting plate is pressed in described thermal conductive silicon
On offset plate；Also include several fin being vertically set on described heat-conducting plate, the S-shaped structure of each fin；
Preferably, the same side at described wiring board body is additionally provided with at least two fan；Also include controller, at least
One temperature sensor, described temperature sensor is close to described heat-conducting plate and is arranged, and described temperature sensor and described control
Device connects, and described fan is connected with described controller by a relay respectively.
Preferably, each fin is additionally provided with the through hole of these fin both sides through.
Preferably, described heat-conducting plate, fin are made by heat-conducting plastic plate, and the integration of described heat-conducting plate, fin
Constitute.
Preferably, described heat-conducting plate, fin are made by aluminium sheet, and described heat-conducting plate, fin integration composition.
Preferably, the thickness of described thermal conductive silicon offset plate is 2.0mm～3.0mm.
Preferably, described fin setting arranged in arrays.
Preferably, described cooling mechanism is two, the respectively first cooling mechanism, the second cooling mechanism, and described first dissipates
Heat engine structure is arranged on the wiring board body being provided with forceful electric power circuit pack, described second cooling mechanism be arranged on be provided with weak
On the wiring board body of electric line part, and described first cooling mechanism, the second cooling mechanism interval setting.
The beneficial effects of the utility model are:
Its novel structure of the design, rationally, be easily achieved, meanwhile, wiring board in use can be produced by the design
Heat effectively discharge, provide for wiring board and ensure reliably, be simultaneously based on the switch of the design in use
Existing switch steam can be solved and discharge the most smooth problem, be greatly improved stability and the safety of switch.
Accompanying drawing explanation
Fig. 1 is cross section of the present utility model state primary structure schematic diagram；
Fig. 2 is flat state primary structure schematic diagram of the present utility model；
Fig. 3 is the fin primary structure schematic diagram in this utility model；
In figure: 1. wiring board body；2. thermal conductive silicon offset plate；3,3-1,3-2. heat-conducting plate；4, bolt is 5. fixed；6. heat radiation
Sheet；7. through hole；8. fan.
Detailed description of the invention
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings:
Embodiment 1: the circuit board radiating structure of a kind of switch, sees Fig. 1, Fig. 2；It includes wiring board body 1；
Also including the cooling mechanism being arranged on described wiring board body 1, in the design, described cooling mechanism includes heat-conducting plate
3, the thermal conductive silicon offset plate 2 being made up of heat conductive silica gel；Described thermal conductive silicon offset plate 2 is close to the back of described wiring board body 1 and is set
Put, and described heat-conducting plate 3 is pressed on described thermal conductive silicon offset plate 2；Also include being vertically set on described heat-conducting plate is some
Individual fin 6, each S-shaped structure of fin 6；In order to improve the performance of heat radiation in the design, the design is in each heat radiation
The through hole 7 of these fin both sides through it is additionally provided with on sheet 6.In the design, the thickness of described thermal conductive silicon offset plate is
2.0mm～3.0mm, the setting arranged in arrays of described fin；Meanwhile, described heat-conducting plate, fin integration are constituted,
And described heat-conducting plate, fin made by heat-conducting plastic plate or made by aluminium sheet.
Further, the design is also additionally provided with two fans 8 in the same side of described wiring board body 1；Also include control
Device processed, temperature sensor, described temperature sensor is close to described heat-conducting plate 3 and arranges, and described temperature sensor and institute
Stating controller to connect, described fan 8 is connected with described controller by a relay respectively.
The design in use, in its normal condition, can open a fan and carry out conventional heat radiation, and once circuit
The temperature of plate body is too high, and reaches the temperature set by temperature sensor and controller, and it is complete that its controller will control fan
The unlatching in portion, to improve the heat dispersion of hot blast.
Embodiment 2, part same as in Example 1 repeats no more, and difference is: the heat radiation machine described in the design
Structure is two, the respectively first cooling mechanism, the second cooling mechanism, and described first cooling mechanism is arranged on and is provided with forceful electric power
On the wiring board body of circuit pack, described second cooling mechanism is arranged on the wiring board body being provided with light current circuit pack
On, and described first cooling mechanism, the second cooling mechanism interval setting；It is possible to prevent forceful electric power line part by above-mentioned design
Point and light current circuit pack because of impacts such as electric arcs produced by the cooling mechanism of the design, provide for wiring board and protect reliably
Barrier.
What embodiment of the present utility model was announced is preferred embodiment, but is not limited thereto, the ordinary skill of this area
Personnel, easily according to above-described embodiment, understand spirit of the present utility model, and make different amplifications and change, but only
Will be without departing from spirit of the present utility model, all in protection domain of the present utility model.
Claims (7)
1. a circuit board radiating structure for switch, including wiring board body；It is characterized in that: also include being arranged at described
Cooling mechanism on wiring board body, the thermal conductive silicon offset plate that described cooling mechanism includes heat-conducting plate, is made up of heat conductive silica gel；
Described thermal conductive silicon offset plate is close to the back of described wiring board body and is arranged, and described heat-conducting plate is pressed in described thermal conductive silicon offset plate
On；Also include several fin being vertically set on described heat-conducting plate, the S-shaped structure of each fin；
It is additionally provided with at least two fan in the same side of described wiring board body；Also include controller, at least one temperature
Degree sensor, described temperature sensor is close to described heat-conducting plate and is arranged, and described temperature sensor is with described controller even
Connecing, described fan is connected with described controller by a relay respectively.
2. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: it is additionally provided with on each fin
The through hole of these fin both sides through.
3. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: described heat-conducting plate, fin
Made by heat-conducting plastic plate, and described heat-conducting plate, fin integration composition.
4. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: described heat-conducting plate, fin
Made by aluminium sheet, and described heat-conducting plate, fin integration composition.
5. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: the thickness of described thermal conductive silicon offset plate
Degree is 2.0mm～3.0mm.
6. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: described fin is matrix row
Row are arranged.
7. the circuit board radiating structure of switch as claimed in claim 1, it is characterised in that: described cooling mechanism is two,
Being respectively the first cooling mechanism, the second cooling mechanism, described first cooling mechanism is arranged on and is provided with forceful electric power circuit pack
Wiring board body on, described second cooling mechanism is arranged on the wiring board body being provided with light current circuit pack, and
Described first cooling mechanism, the second cooling mechanism interval are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620438356.8U CN205648317U (en) | 2016-05-10 | 2016-05-10 | Circuit board heat dissipation structure for switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620438356.8U CN205648317U (en) | 2016-05-10 | 2016-05-10 | Circuit board heat dissipation structure for switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648317U true CN205648317U (en) | 2016-10-12 |
Family
ID=57060492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620438356.8U Expired - Fee Related CN205648317U (en) | 2016-05-10 | 2016-05-10 | Circuit board heat dissipation structure for switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205648317U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108712825A (en) * | 2018-08-01 | 2018-10-26 | 四川海英电子科技有限公司 | A kind of production method of heat-conduction circuit board |
| CN110677738A (en) * | 2019-09-18 | 2020-01-10 | 四川豪威尔信息科技有限公司 | Anti-interference indoor 5G network communication device |
| CN112702661A (en) * | 2020-10-10 | 2021-04-23 | 陈钢 | High-efficient radiating switch |
| CN113395822A (en) * | 2021-06-16 | 2021-09-14 | 世强先进(深圳)科技股份有限公司 | Heat-dissipation and pressure-resistant PCB (printed circuit board) and electronic equipment |
-
2016
- 2016-05-10 CN CN201620438356.8U patent/CN205648317U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108712825A (en) * | 2018-08-01 | 2018-10-26 | 四川海英电子科技有限公司 | A kind of production method of heat-conduction circuit board |
| CN108712825B (en) * | 2018-08-01 | 2019-12-10 | 四川海英电子科技有限公司 | Manufacturing method of heat conduction circuit board |
| CN110677738A (en) * | 2019-09-18 | 2020-01-10 | 四川豪威尔信息科技有限公司 | Anti-interference indoor 5G network communication device |
| CN112702661A (en) * | 2020-10-10 | 2021-04-23 | 陈钢 | High-efficient radiating switch |
| CN113395822A (en) * | 2021-06-16 | 2021-09-14 | 世强先进(深圳)科技股份有限公司 | Heat-dissipation and pressure-resistant PCB (printed circuit board) and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20170510 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |