CN108712825A - A kind of production method of heat-conduction circuit board - Google Patents
A kind of production method of heat-conduction circuit board Download PDFInfo
- Publication number
- CN108712825A CN108712825A CN201810863558.0A CN201810863558A CN108712825A CN 108712825 A CN108712825 A CN 108712825A CN 201810863558 A CN201810863558 A CN 201810863558A CN 108712825 A CN108712825 A CN 108712825A
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- China
- Prior art keywords
- heat
- welded
- etching
- copper
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of production methods of heat-conduction circuit board, it includes the following steps：S1, etching step, specifically include following steps：S2, in substrate（2）Bottom surface on bond heat-conducting glue layer（1）, in heat-conducting glue layer（1）Bottom adhesive copper coin（4）；S3, in the copper coin of step S2（4）Bottom surface on and be welded with multiple main radiating copper sheets along its length（5）, and each main radiating copper sheet（5）Side on and along its short transverse be welded with multiple secondary radiating copper sheets（6）.The beneficial effects of the invention are as follows：Manufacturing cost is low, produces, and product radiating efficiency is high, produces product good heat dissipation effect, the long product lifecycle produced.
Description
Technical field
The present invention relates to a kind of production methods of heat-conduction circuit board.
Background technology
Heat-conduction circuit board is the supporting body of electronic device, is essential portion in an electronic product or electrical equipment
Point.With the development of electronics, electrical technology, requirement of the people to heat-conduction circuit board is also higher and higher, makees especially with LED
It is also higher and higher to the heat dissipation performance requirement of heat-conduction circuit board after entering into people's lives for illuminating device, currently, some are needed
It is all aluminum base circuit board to want the heat-conduction circuit board of high heat dispersion, i.e., one layer of heat-conducting glue, heat-conducting glue are equipped in the one side of aluminium sheet
On the one hand it can play the role of heat conduction, on the other hand also have and insulate, a sandwich circuit is provided on the another side of aluminium sheet
Layer, but the heat conductivility of heat-conducting glue is not fine, to which the heat conductivility of whole circuit board can be influenced.With the length of circuit board
Time service, heat bulk deposition eventually lead to line layer and burn on line layer, and seriously reduce circuit board uses the longevity
Life, the competitiveness in market are also gradually reduced.
Invention content
It is an object of the invention to overcome the prior art, the product that a kind of manufacturing cost is low, produces is provided and is dissipated
Thermal efficiency height, the product good heat dissipation effect produced, the long product lifecycle produced heat-conduction circuit board production method.
The purpose of the present invention is achieved through the following technical solutions：A kind of production method of heat-conduction circuit board, it include with
Lower step：
S1, etching step, specifically include following steps：
S11, copper coin is welded at the top of substrate, in the top adhesive adhesive tape of copper coin, it is ensured that the shape of adhesive tape and required line layer
Shape it is consistent；
S12, manufacture etching machine：In the both sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, in shaft
Plummer is welded, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, pressure is welded at the top of spring
Plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；It is finally installed on the side wall of etching groove free
Press, and it is connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S13, worker are lifted up two pressing plates, and then one end of substrate to be etched is placed therein below a pressing plate,
Its other end is positioned over below another pressing plate simultaneously, then unclamps two pressing plates, recovery masterpiece of the pressing plate in extension spring
With lower reset, substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S14, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the etching solution in groove body
In, etching solution is to being not covered with the copper, Cu corrosion of adhesive tape to obtain line layer；After etching a period of time, operation handwheel
Rotate backward 180 °, plummer resets, and opens air compressor machine at this time, and the high pressure gas of air compressor machine output is by the moisture on substrate surface
It blows down, blows down rear etching solution and come back in etching groove, to reuse etching solution, save production cost；
S15, it can be obtained line layer after tearing adhesive tape；
S2, heat-conducting glue layer is bonded on the bottom surface of substrate, in the bottom adhesive copper coin of heat-conducting glue layer；
S3, multiple main radiating copper sheets are welded on the bottom surface of the copper coin of step S2 and along its length, and each main are dissipated
It is welded with multiple secondary radiating copper sheets on the side of hot copper sheet and along its short transverse；
S4, copper pipe is run through into heat-conducting glue layer from left to right, the elongated end of copper pipe is folded upward in the outer of heat-conducting glue layer after running through
Portion, to finally produce heat-conduction circuit board.
The present invention has the following advantages：The production that manufacturing cost of the present invention is low, produces, and product radiating efficiency is high, produces
Product good heat dissipation effect, the long product lifecycle produced.
Description of the drawings：
Fig. 1 show the structural schematic diagram for the heat-conduction circuit board that this method is produced.
Specific implementation mode
The present invention will be further described below, and protection scope of the present invention is not limited to as described below：
A kind of production method of heat-conduction circuit board, it includes the following steps：
S1, etching step, specifically include following steps：
S11, copper coin is welded at the top of substrate, in the top adhesive adhesive tape of copper coin, it is ensured that the shape of adhesive tape and required line layer
Shape it is consistent；
S12, manufacture etching machine：In the both sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, in shaft
Plummer is welded, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, pressure is welded at the top of spring
Plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；It is finally installed on the side wall of etching groove free
Press, and it is connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S13, worker are lifted up two pressing plates, and then one end of substrate to be etched is placed therein below a pressing plate,
Its other end is positioned over below another pressing plate simultaneously, then unclamps two pressing plates, recovery masterpiece of the pressing plate in extension spring
With lower reset, substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S14, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the etching solution in groove body
In, etching solution is to being not covered with the copper, Cu corrosion of adhesive tape to obtain line layer；After etching a period of time, operation handwheel
Rotate backward 180 °, plummer resets, and opens air compressor machine at this time, and the high pressure gas of air compressor machine output is by the moisture on substrate surface
It blows down, blows down rear etching solution and come back in etching groove, to reuse etching solution, save production cost；
S15, it can be obtained line layer 3 after tearing adhesive tape；
S2, heat-conducting glue layer 1 is bonded on the bottom surface of substrate 2, in the bottom adhesive copper coin 4 of heat-conducting glue layer 1；
S3, multiple main radiating copper sheets 5 are welded on the bottom surface of the copper coin 4 of step S2 and along its length, and each led
It is welded with multiple secondary radiating copper sheets 6 on the side of radiating copper sheet 5 and along its short transverse；
S4, copper pipe 7 is run through into heat-conducting glue layer 1 from left to right, the elongated end of copper pipe 7 is folded upward in heat-conducting glue layer 1 after running through
Outside, to finally producing heat-conduction circuit board.
When the heat-conduction circuit board works long hours, a large amount of heat is generated on line layer 3, heat transfer is to heat-conducting glue
Layer 1, copper pipe 7 transfer heat to the external world, and main radiating copper sheet 5 and secondary radiating copper sheet 6 transfer heat to the external world, while heat-conducting glue
Layer 1 is also transferring heat to the external world, therefore will be transmitted to the heat transfer in heat-conducting glue layer 1 to extraneous by three kinds of modes,
Heat only is transmitted by heat-conducting glue layer compared to traditional, realizes and is completed in a short time heat dissipation, radiating efficiency higher, heat dissipation effect
More preferably, be not in pole the phenomenon that burning circuit connection to ensure that the heat-conduction circuit board is under normal temperature state always
The big service life for extending circuit board, the service life was up to 16 ~ 20 years.
Claims (1)
1. a kind of production method of heat-conduction circuit board, it is characterised in that：It includes the following steps：
S1, etching step, specifically include following steps：
S11, copper coin is welded at the top of substrate, in the top adhesive adhesive tape of copper coin, it is ensured that the shape of adhesive tape and required line layer
Shape it is consistent；
S12, manufacture etching machine：In the both sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, in shaft
Plummer is welded, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, pressure is welded at the top of spring
Plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；It is finally installed on the side wall of etching groove free
Press, and it is connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S13, worker are lifted up two pressing plates, and then one end of substrate to be etched is placed therein below a pressing plate,
Its other end is positioned over below another pressing plate simultaneously, then unclamps two pressing plates, recovery masterpiece of the pressing plate in extension spring
With lower reset, substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S14, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the etching solution in groove body
In, etching solution is to being not covered with the copper, Cu corrosion of adhesive tape to obtain line layer；After etching a period of time, operation handwheel
Rotate backward 180 °, plummer resets, and opens air compressor machine at this time, and the high pressure gas of air compressor machine output is by the moisture on substrate surface
It blows down, blows down rear etching solution and come back in etching groove, to reuse etching solution, save production cost；
S15, it can be obtained line layer after tearing adhesive tape（3）；
S2, in substrate（2）Bottom surface on bond heat-conducting glue layer（1）, in heat-conducting glue layer（1）Bottom adhesive copper coin（4）；
S3, in the copper coin of step S2（4）Bottom surface on and be welded with multiple main radiating copper sheets along its length（5）, and it is every
A main radiating copper sheet（5）Side on and along its short transverse be welded with multiple secondary radiating copper sheets（6）；
S4, by copper pipe（7）Run through heat-conducting glue layer from left to right（1）, by copper pipe after running through（7）Elongated end be folded upward in heat conduction
Glue-line（1）Outside, to finally producing heat-conduction circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810863558.0A CN108712825B (en) | 2018-08-01 | 2018-08-01 | Manufacturing method of heat conduction circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810863558.0A CN108712825B (en) | 2018-08-01 | 2018-08-01 | Manufacturing method of heat conduction circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108712825A true CN108712825A (en) | 2018-10-26 |
| CN108712825B CN108712825B (en) | 2019-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810863558.0A Active CN108712825B (en) | 2018-08-01 | 2018-08-01 | Manufacturing method of heat conduction circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108712825B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601467A (en) * | 2020-07-02 | 2020-08-28 | 遂宁市海翔电子科技有限公司 | Precise manufacturing method of high-heat-dissipation 5G circuit board |
| CN112087874A (en) * | 2020-08-24 | 2020-12-15 | 珠海杰赛科技有限公司 | Method for manufacturing blind slot plate |
Citations (5)
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|---|---|---|---|---|
| CN2514622Y (en) * | 2001-11-13 | 2002-10-02 | 扬博企业股份有限公司 | Etching machine for circuit board |
| CN2874982Y (en) * | 2005-12-20 | 2007-02-28 | 照敏企业股份有限公司 | Circuit board structure with radiation layer |
| JP2008016786A (en) * | 2006-07-04 | 2008-01-24 | Karentekku:Kk | Etching device for double-sided flexible printed circuit board |
| CN205648317U (en) * | 2016-05-10 | 2016-10-12 | 无锡商业职业技术学院 | Circuit board heat dissipation structure for switch |
| CN107105603A (en) * | 2017-05-16 | 2017-08-29 | 天津锐新昌轻合金股份有限公司 | A kind of processing method of the aluminium alloy heat radiator coordinated with heat pipe |
-
2018
- 2018-08-01 CN CN201810863558.0A patent/CN108712825B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2514622Y (en) * | 2001-11-13 | 2002-10-02 | 扬博企业股份有限公司 | Etching machine for circuit board |
| CN2874982Y (en) * | 2005-12-20 | 2007-02-28 | 照敏企业股份有限公司 | Circuit board structure with radiation layer |
| JP2008016786A (en) * | 2006-07-04 | 2008-01-24 | Karentekku:Kk | Etching device for double-sided flexible printed circuit board |
| CN205648317U (en) * | 2016-05-10 | 2016-10-12 | 无锡商业职业技术学院 | Circuit board heat dissipation structure for switch |
| CN107105603A (en) * | 2017-05-16 | 2017-08-29 | 天津锐新昌轻合金股份有限公司 | A kind of processing method of the aluminium alloy heat radiator coordinated with heat pipe |
Non-Patent Citations (1)
| Title |
|---|
| 段志伟等: "《电子线路CAD实训教程-Protel 99SE》", 30 June 2014 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601467A (en) * | 2020-07-02 | 2020-08-28 | 遂宁市海翔电子科技有限公司 | Precise manufacturing method of high-heat-dissipation 5G circuit board |
| CN112087874A (en) * | 2020-08-24 | 2020-12-15 | 珠海杰赛科技有限公司 | Method for manufacturing blind slot plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108712825B (en) | 2019-12-10 |
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