CN207869489U - A kind of high impedance multilayer circuit board - Google Patents
A kind of high impedance multilayer circuit board Download PDFInfo
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- CN207869489U CN207869489U CN201721859262.9U CN201721859262U CN207869489U CN 207869489 U CN207869489 U CN 207869489U CN 201721859262 U CN201721859262 U CN 201721859262U CN 207869489 U CN207869489 U CN 207869489U
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- shell
- substrate
- pillar
- circuit board
- high impedance
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Abstract
The utility model discloses a kind of high impedance multilayer circuit boards,Including shell,The lateral surface of the shell is equipped with fixed plate,The side of the fixed plate is equipped with fixing bolt,The fixed plate tiling is set on the shell,The shell is fixedly connected with the fixed plate by the fixing bolt,The side of the fixed plate is equipped with slot,The offside of the slot is equipped with shell door,The outer surface of the shell door is equipped with handle,The handle is bonded with the shell door,And it is welded with the shell door,The inside of the shell is equipped with pillar,The pillar insertion is set in the shell,And it is fixedly connected with the shell,The centre position of the pillar is equipped with baffle,This kind of high impedance multilayer circuit board,Equipped with layers of copper,So the wiring board is more convenient when in use,Layers of copper is not only sealed protection and also improves corrosion resistance to first substrate and second substrate and third substrate,Improve safety in utilization.
Description
Technical field
The utility model is related to wiring board technology field, specially a kind of high impedance multilayer circuit board.
Background technology
The title of wiring board circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, line
Road plate, pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing（Copper etches
Technology）Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, the batch production for permanent circuit and optimization electrical appliance cloth
Office plays an important role.Circuit board can be described as printed wiring board or printed circuit board, by processes such as pressings, by related process requirement
It combines, the wiring board with FPC characteristics and PCB characteristics of formation.
But existing wiring board mostly uses greatly traditional process and is fabricated for integration, being not easy to user and being detected,
The line impedance ability of poor reliability, wiring board is low, operation need professional equipment, operating difficulties is cumbersome, increase user when
Between and operating quantity, applicability is low, reduces working efficiency, and Personal Safety is low, and service life is shorter.
So how to design a kind of high impedance multilayer circuit board, becoming us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of high impedance multilayer circuit boards, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the utility model provides the following technical solutions：A kind of high impedance multilayer circuit board, including it is outer
The lateral surface of shell, the shell is equipped with fixed plate, and the side of the fixed plate is equipped with fixing bolt, the fixed plate tiling setting
In on the shell, the shell is fixedly connected with the fixed plate by the fixing bolt, and the side of the fixed plate is set
There are slot, the offside of the slot to be equipped with shell door, the outer surface of the shell door is equipped with handle, and the handle is pasted with the shell door
It closes, and is welded with the shell door, the inside of the shell is equipped with pillar, and the pillar insertion is set in the shell, and
It is fixedly connected with the shell, the centre position of the pillar is equipped with baffle, and the top of the baffle is equipped with asbestos board, the stone
The side of cotton plate is equipped with hot glue layer, and the hot glue layer tiling is set on the asbestos board, and passes through glue with the asbestos board
The bottom of bonding, the hot glue layer is equipped with first substrate, and the bottom of the first substrate is equipped with second substrate, the second substrate
Bottom end be equipped with third substrate, the centre position of the first substrate and the second substrate and the third substrate is equipped with resistance
Solder paste layer of ink, the solder mask layer nesting are set on the first substrate and the second substrate and the third substrate,
The first substrate is fixedly connected with the second substrate and the third substrate by the solder mask layer.
Further, the lateral surface of the shell is equipped with thermovent, and the thermovent tiling is set on the shell, and
It is fixedly connected with the shell.
Further, the end of the slot is equipped with buckle, and the buckle nesting is set on the slot, and with it is described
Slot is fixed by screws.
Further, the end of the shell door is equipped with hinge, and the hinge is bonded with the shell door, and is welded with the shell door
It connects.
Further, the adjacent side of the pillar is equipped with sliding shoe, and the sliding shoe tiling is set on the pillar, and with
The pillar flexible connection.
Further, the bottom of the third substrate is equipped with layers of copper, and the layers of copper nesting is set on the third substrate, and
It is fixed by screws with the third substrate.
Compared with prior art, the utility model has the beneficial effects that：This kind of high impedance multilayer circuit board is equipped with layers of copper,
So the wiring board is more convenient when in use, layers of copper is not only sealed guarantor to first substrate and second substrate and third substrate
Shield also improves corrosion resistance so that improves safety in utilization, the lateral surface of shell is equipped with thermovent, and thermovent can be improved outer
The heat sinking function of shell increases service life, and reliability is high, and safe operation is reliable, and applicability is high, easy to use and flexible, and
Resistance capabilities are high, are hardly damaged, and handling are convenient, and maintenance cost is small, have broad application prospects and practical advantages.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the shell partial structural diagram of the utility model；
Fig. 3 is the solder mask layer partial structural diagram of the utility model；
In figure：1- shells；2- thermovents；3- fixed plates；4- fixing bolts；5- slots；6- is buckled；7- shell doors；8- hinges；
9- handles；10- pillars；11- sliding shoes；12- baffles；13- asbestos boards；14- hot glue layers；15- first substrates；16- solder masks
Layer；17- second substrates；18- third substrates；19- layers of copper.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high impedance multilayer circuit board, including shell
1, the lateral surface of the shell 1 is equipped with fixed plate 3, and the side of the fixed plate 3 is equipped with fixing bolt 4, and the fixed plate 3 tiles
It is set on the shell 1, the shell 1 is fixedly connected with the fixed plate 3 by the fixing bolt 4, the fixed plate 3
Side be equipped with slot 5, the offside of the slot 5 is equipped with shell door 7, and the outer surface of the shell door 7 is equipped with handle 9, the handle 9
It is bonded with the shell door 7, and is welded with the shell door 7, the inside of the shell 1 is equipped with pillar 10, and the pillar 10 is embedded in
It is set in the shell 1, and is fixedly connected with the shell 1, the centre position of the pillar 10 is equipped with baffle 12, the gear
The top of plate 12 is equipped with asbestos board 13, and the side of the asbestos board 13 is equipped with hot glue layer 14, and the tiling of hot glue layer 14 is set to
On the asbestos board 13, and being bonded by glue with the asbestos board 13, the bottom of the hot glue layer 14 is equipped with first substrate 15,
The bottom of the first substrate 15 is equipped with second substrate 17, and the bottom end of the second substrate 17 is equipped with third substrate 18, and described the
The centre position of one substrate 15 and the second substrate 17 and the third substrate 18 is equipped with solder mask layer 16, the welding resistance
16 nesting of ink layer is set on the first substrate 15 and the second substrate 17 and the third substrate 18, first base
Plate 15 is fixedly connected with the second substrate 17 and the third substrate 18 by the solder mask layer 16.
Further, the lateral surface of the shell 1 is equipped with thermovent 2, and the tiling of the thermovent 2 is set to the shell 1
On, and be fixedly connected with the shell 1, the heat sinking function of the shell 1 can be improved in the thermovent 2, increases service life.
Further, the end of the slot 5 is equipped with buckle 6, and 6 nestings of the buckle are set on the slot 5, and with
The slot 5 is fixed by screws, and the buckle 6 prevents the first substrate 15 and the second substrate 17 and described the
The phenomenon that three substrates 18 are inserted into the slot 5 and have a rebound, increases reliability.
Further, the end of the shell door 7 is equipped with hinge 8, and the hinge 8 is bonded with the shell door 7, and with the shell
Door 7 welds, and the shell door 7 facilitates user to be detected repair to the shell 1, reduces maintenance cost.
Further, the adjacent side of the pillar 10 is equipped with sliding shoe 11, and the tiling of the sliding shoe 11 is set to the pillar
It on 10, and is flexibly connected with the pillar 10, the sliding shoe 11 reduces the first substrate 15 and the second substrate 17
Friction with the third substrate 18 when being inserted into the shell 1, improves applicability.
Further, the bottom of the third substrate 18 is equipped with layers of copper 19, and 19 nesting of the layers of copper is set to the third base
It on plate 18, and is fixed by screws with the third substrate 18, the layers of copper 19 is not only to the first substrate 15 and institute
It states second substrate 17 and the third substrate 18 is sealed protection and also improves corrosion resistance, improve safety in utilization.
Operation principle：First, shell 1 is positioned over fixing bolt 4 behind fixed position by fixed plate 3 and checks welding resistance
Whether ink layer 16 and layers of copper 19 are intact, and when in use, user leads to first substrate 15 and second substrate 17 and third substrate 18
It crosses after sliding shoe 11 is inserted into slot 5, then 6 fixed position of buckle on 1 side of rotary push shell, prevents first substrate 15 and the
Two substrates 17 and the rebound of third substrate 18 come out, because being equipped with hot glue layer 14, such words hot glue layer in the side of asbestos board 13
14 can increase the heat resistance of first substrate 15 and second substrate 17 and third substrate 18 so that improve work efficiency, welding resistance oil
The resistance capabilities of first substrate 15 and second substrate 17 and third substrate 18 can be improved in layer of ink 16, because at the bottom of third substrate 18
Portion is equipped with layers of copper 19, and such words layers of copper 19 is not only sealed guarantor to first substrate 15 and second substrate 17 and third substrate 18
Shield also improves corrosion resistance, improves safety in utilization, and asbestos board 13 can prevent user by opening 7 pairs of shells 1 of shell door
User is scalded when internal check, improves Personal Safety.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of high impedance multilayer circuit board, including shell（1）, it is characterised in that：The shell（1）Lateral surface be equipped with fix
Plate（3）, the fixed plate（3）Side be equipped with fixing bolt（4）, the fixed plate（3）Tiling is set to the shell（1）
On, the shell（1）With the fixed plate（3）Pass through the fixing bolt（4）It is fixedly connected, the fixed plate（3）Side
Equipped with slot（5）, the slot（5）Offside be equipped with shell door（7）, the shell door（7）Outer surface be equipped with handle（9）, described
Handle（9）With the shell door（7）Fitting, and with the shell door（7）Welding, the shell（1）Inside be equipped with pillar（10）,
The pillar（10）Insertion is set to the shell（1）It is interior, and with the shell（1）It is fixedly connected, the pillar（10）In
Meta position has installed baffle（12）, the baffle（12）Top be equipped with asbestos board（13）, the asbestos board（13）Side be equipped with
Hot glue layer（14）, the hot glue layer（14）Tiling is set to the asbestos board（13）On, and with the asbestos board（13）Pass through glue
Water bonds, the hot glue layer（14）Bottom be equipped with first substrate（15）, the first substrate（15）Bottom be equipped with the second base
Plate（17）, the second substrate（17）Bottom end be equipped with third substrate（18）, the first substrate（15）With the second substrate
（17）With the third substrate（18）Centre position be equipped with solder mask layer（16）, the solder mask layer（16）Nesting is set
It is placed in the first substrate（15）With the second substrate（17）With the third substrate（18）On, the first substrate（15）With
The second substrate（17）With the third substrate（18）Pass through the solder mask layer（16）It is fixedly connected.
2. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The shell（1）Lateral surface
Equipped with thermovent（2）, the thermovent（2）Tiling is set to the shell（1）On, and with the shell（1）It is fixedly connected.
3. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The slot（5）End set
There is buckle（6）, the buckle（6）Nesting is set to the slot（5）On, and with the slot（5）It is fixed by screws.
4. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The shell door（7）End set
There is hinge（8）, the hinge（8）With the shell door（7）Fitting, and with the shell door（7）Welding.
5. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The pillar（10）Adjacent side set
There is sliding shoe（11）, the sliding shoe（11）Tiling is set to the pillar（10）On, and with the pillar（10）Flexible connection.
6. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The third substrate（18）Bottom
Portion is equipped with layers of copper（19）, the layers of copper（19）Nesting is set to the third substrate（18）On, and with the third substrate（18）
It is fixed by screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859262.9U CN207869489U (en) | 2017-12-27 | 2017-12-27 | A kind of high impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859262.9U CN207869489U (en) | 2017-12-27 | 2017-12-27 | A kind of high impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869489U true CN207869489U (en) | 2018-09-14 |
Family
ID=63466894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721859262.9U Active CN207869489U (en) | 2017-12-27 | 2017-12-27 | A kind of high impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110974129A (en) * | 2019-12-23 | 2020-04-10 | 重庆金山医疗技术研究院有限公司 | Endoscope capsule lamp panel cover, endoscope capsule and assembling method |
-
2017
- 2017-12-27 CN CN201721859262.9U patent/CN207869489U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110974129A (en) * | 2019-12-23 | 2020-04-10 | 重庆金山医疗技术研究院有限公司 | Endoscope capsule lamp panel cover, endoscope capsule and assembling method |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
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| CP03 | Change of name, title or address |