CN207835918U - A kind of tear protected circuit plate - Google Patents
A kind of tear protected circuit plate Download PDFInfo
- Publication number
- CN207835918U CN207835918U CN201820194379.8U CN201820194379U CN207835918U CN 207835918 U CN207835918 U CN 207835918U CN 201820194379 U CN201820194379 U CN 201820194379U CN 207835918 U CN207835918 U CN 207835918U
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- CN
- China
- Prior art keywords
- temperature insulation
- insulation substrate
- reinforcing plates
- metal reinforcing
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of tear protected circuit plates, including high-temperature insulation substrate, the upper surface of the high-temperature insulation substrate is provided with insulating heat-conductive silica gel piece, the junction of the high-temperature insulation substrate and insulating heat-conductive silica gel piece is provided with heat-conducting glue, the insulating heat-conductive silica gel piece is bonded in the upper surface of high-temperature insulation substrate by heat-conducting glue, metal reinforcing plates are provided with above the high-temperature insulation substrate, the metal reinforcing plates are bolted to connection with high-temperature insulation substrate；It is provided with metal reinforcing plates on circuit boards, metal reinforcing plates can increase the structural strength of circuit board, circuit board is prevented to be torn since stress is excessive, it is provided with insulating heat-conductive silica gel piece on circuit boards, insulating heat-conductive silica gel piece can play cooling effect to the electronic component welded on high-temperature insulation substrate, prevent the heat that electronic component generates from constantly being accumulated on high-temperature insulation substrate, to prevent circuit board to be damaged since temperature is excessively high.
Description
Technical field
The utility model belongs to circuit board technology field, and in particular to a kind of tear protected circuit plate.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc., circuit board make circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for permanent circuit are laid out lifting
It acts on, circuit board can be described as printed wiring board or printed circuit board.
However traditional circuit board is caused to lack corresponding radiator structure on circuit board, is worked as electricity due to relatively simple for structure
At work, the part electronic component on circuit board will produce a large amount of heat to road plate, since the heat dissipation effect of circuit board is bad,
So that the heat that electronic component generates constantly accumulates on circuit boards, to the service life to the electronic component on circuit board
It has an impact, secondly, traditional circuit board causes the structural strength of circuit board general due to lacking corresponding reinforcement structure, when
When circuit board stress is excessive, circuit board is easily torn, to influence normal use of the user to circuit board.
Utility model content
The purpose of this utility model is to provide a kind of tear protected circuit plates, to solve biography mentioned above in the background art
The circuit board of system causes to lack corresponding radiator structure on circuit board due to relatively simple for structure, when circuit board at work, electricity
Part electronic component on the plate of road will produce a large amount of heat, since the heat dissipation effect of circuit board is bad so that electronic component produces
Raw heat constantly accumulates on circuit boards, to be had an impact to the service life of the electronic component on circuit board, secondly,
Traditional circuit board causes the structural strength of circuit board general, when circuit board stress is excessive due to lacking corresponding reinforcement structure
When, circuit board is easily torn, the problem of to influence normal use of the user to circuit board.
To achieve the above object, the utility model provides the following technical solutions：A kind of tear protected circuit plate, including high temperature resistant
Insulating substrate, the upper surface of the high-temperature insulation substrate are provided with insulating heat-conductive silica gel piece, the high-temperature insulation substrate with
The junction of insulating heat-conductive silica gel piece is provided with heat-conducting glue, and it is exhausted that the insulating heat-conductive silica gel piece by heat-conducting glue is bonded in high temperature resistant
The upper surface of edge substrate is provided with metal reinforcing plates, the metal reinforcing plates and resistance to height above the high-temperature insulation substrate
Warm insulating substrate is bolted to connection, and bolt mounting holes corresponding with bolt, institute are opened in the metal reinforcing plates
The limiting through hole that is provided at both ends with of metal reinforcing plates is stated, the lower surface of the metal reinforcing plates is provided with insulating polymer engineering plastic
Flitch, the insulating polymer engineering plastic flitch are bonded in the lower surface of metal reinforcing plates by high temperature resistant cement.
Preferably, the high-temperature insulation substrate is rectangular parallelepiped structure, is offered and bolt phase on high-temperature insulation substrate
Corresponding second bolt mounting holes, the both ends of high-temperature insulation substrate offer the second limit corresponding with limiting through hole and lead to
Hole, and the lower surface of high-temperature insulation substrate is provided with the copper coin of rectangular parallelepiped structure, high-temperature insulation substrate is logical with the copper coin
Cross the bonding connection of high-temperature insulation glue.
Preferably, the insulating heat-conductive silica gel piece is rectangular parallelepiped structure, and the thickness of insulating heat-conductive silica gel piece is 1mm.
Preferably, the metal reinforcing plates are hollow rectangular parallelepiped structure, and the thickness of metal reinforcing plates is 0.3mm, and golden
It is identical as the shape of insulating polymer engineering plastic flitch to belong to reinforcing plate.
Preferably, there are two the metal reinforcing plates are arranged in total, two metal reinforcing plates are bolted on resistance to height
The upper and lower surface of warm insulating substrate.
Preferably, the thickness of the high-temperature insulation substrate is 0.7mm.
Compared with prior art, the utility model has the beneficial effects that：
1. being provided with metal reinforcing plates on circuit boards, metal reinforcing plates can increase the structural strength of circuit board, prevent
Circuit board is torn since stress is excessive, secondly, insulating polymer engineering plastic flitch is provided in metal reinforcing plates, is insulated
Macromolecule engineering plastic plate can ensure the insulating properties between metal reinforcing plates and high-temperature insulation substrate, to make metal reinforce
The using effect of plate is more preferable.
2. being provided with insulating heat-conductive silica gel piece on circuit boards, insulating heat-conductive silica gel piece can be on high-temperature insulation substrate
The electronic component of welding plays cooling effect, prevents the heat that electronic component generates from constantly being accumulated on high-temperature insulation substrate
It is tired, to prevent circuit board to be damaged since temperature is excessively high.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the corresponding metal reinforcing plates vertical view of the utility model；
Fig. 3 is the corresponding metal reinforcing plates oblique view of the utility model；
Fig. 4 is the corresponding insulating heat-conductive silica gel piece sectional view of the utility model；
In figure：1- limiting through hole, 2- bolts, 3- metal reinforcing plates, 4- high-temperature insulations substrate, 5- insulating heat-conductive silica gel
Piece, 6- bolt mounting holes, 7- insulating polymer engineering plastics flitch, 8- heat-conducting glues.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- Fig. 4 is please referred to Fig.1, the utility model provides a kind of technical solution：A kind of tear protected circuit plate, including high temperature resistant
The upper surface of insulating substrate 4, high-temperature insulation substrate 4 is provided with insulating heat-conductive silica gel piece 5, high-temperature insulation substrate 4 and insulation
The junction of heat-conducting silica gel sheet 5 is provided with heat-conducting glue 8, and insulating heat-conductive silica gel piece 5 is bonded in high-temperature insulation base by heat-conducting glue 8
The top of the upper surface of plate 4, high-temperature insulation substrate 4 is provided with metal reinforcing plates 3, metal reinforcing plates 3 and high-temperature insulation base
Plate 4 is fixedly connected by bolt 2, and bolt mounting holes 6 corresponding with bolt 2, metal reinforcing plates are opened in metal reinforcing plates 3
3 are provided at both ends with limiting through hole 1, and the lower surface of metal reinforcing plates 3 is provided with insulating polymer engineering plastic flitch 7, insulation is high
Molecular engineering plastic plate 7 is bonded in the lower surface of metal reinforcing plates 3 by high temperature resistant cement.
In order to make the structural strength higher of high-temperature insulation substrate 4, in the present embodiment, it is preferred that high-temperature insulation substrate 4
For rectangular parallelepiped structure, second bolt mounting holes corresponding with bolt 2, high-temperature insulation are offered on high-temperature insulation substrate 4
The both ends of substrate 4 offer second limiting through hole corresponding with limiting through hole 1, and the lower surface of high-temperature insulation substrate 4 is set
It is equipped with the copper coin of rectangular parallelepiped structure, high-temperature insulation substrate 4 is bonded by high-temperature insulation glue with copper coin and connected.
In order to keep the heat dissipation effect of insulating heat-conductive silica gel piece 5 more preferable, in the present embodiment, it is preferred that insulating heat-conductive silica gel piece 5
For rectangular parallelepiped structure, and the thickness of insulating heat-conductive silica gel piece 5 is 1mm.
In order to make the structural strength higher of metal reinforcing plates 3, in the present embodiment, it is preferred that metal reinforcing plates 3 are hollow
Rectangular parallelepiped structure, the thickness of metal reinforcing plates 3 are 0.3mm, and the shape of metal reinforcing plates 3 and insulating polymer engineering plastic flitch 7
Shape is identical.
In order to keep the reinforcing effect of metal reinforcing plates 3 more preferable, in the present embodiment, it is preferred that metal reinforcing plates 3 are arranged in total
There are two, two metal reinforcing plates 3 are fixed on the upper and lower surface of high-temperature insulation substrate 4 by bolt 2.
In order to keep the weight of high-temperature insulation substrate 4 lighter, in the present embodiment, it is preferred that the thickness of high-temperature insulation substrate 4
Degree is 0.7mm.
The operation principle and process for using of the utility model：After the utility model installs, using bolt 2 by circuit board
It is fixed by limiting through hole 1, the insulating heat-conductive silica gel piece 5 on high-temperature insulation substrate 4 is due to good thermal conductivity
And insulating properties, therefore, insulating heat-conductive silica gel piece 5 can play heat dissipation to the electronic component welded on high-temperature insulation substrate 4
Effect, to which the heat for preventing electronic component from generating constantly accumulates on high-temperature insulation substrate 4, metal reinforcing plates 3 can be with
The structural strength for increasing circuit board, prevents circuit board to be torn since stress is excessive.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of tear protected circuit plate, including high-temperature insulation substrate (4), it is characterised in that：The high-temperature insulation substrate (4)
Upper surface be provided with insulating heat-conductive silica gel piece (5), the company of the high-temperature insulation substrate (4) and insulating heat-conductive silica gel piece (5)
The place of connecing is provided with heat-conducting glue (8), and the insulating heat-conductive silica gel piece (5) is bonded in high-temperature insulation substrate (4) by heat-conducting glue (8)
Upper surface, be provided with metal reinforcing plates (3) above the high-temperature insulation substrate (4), the metal reinforcing plates (3) with it is resistance to
High-temperature insulation substrate (4) is fixedly connected by bolt (2), is opened on the metal reinforcing plates (3) corresponding with bolt (2)
Bolt mounting holes (6), the metal reinforcing plates (3) are provided at both ends with limiting through hole (1), under the metal reinforcing plates (3)
Surface is provided with insulating polymer engineering plastic flitch (7), and the insulating polymer engineering plastic flitch (7) is viscous by high temperature resistant cement
It closes in the lower surface of metal reinforcing plates (3).
2. a kind of tear protected circuit plate according to claim 1, it is characterised in that：The high-temperature insulation substrate (4) is
Rectangular parallelepiped structure offers the second bolt mounting holes corresponding with bolt (2) on high-temperature insulation substrate (4), and high temperature resistant is exhausted
The both ends of edge substrate (4) offer the second limiting through hole corresponding with limiting through hole (1), and high-temperature insulation substrate (4)
Lower surface is provided with the copper coin of rectangular parallelepiped structure, and high-temperature insulation substrate (4) is viscous by high-temperature insulation glue with the copper coin
Close connection.
3. a kind of tear protected circuit plate according to claim 1, it is characterised in that：The insulating heat-conductive silica gel piece (5) is
Rectangular parallelepiped structure, and the thickness of insulating heat-conductive silica gel piece (5) is 1mm.
4. a kind of tear protected circuit plate according to claim 1, it is characterised in that：The metal reinforcing plates (3) are hollow
Rectangular parallelepiped structure, the thickness of metal reinforcing plates (3) is 0.3mm, and metal reinforcing plates (3) and insulating polymer engineering plastic flitch
(7) shape is identical.
5. a kind of tear protected circuit plate according to claim 1, it is characterised in that：The metal reinforcing plates (3) set in total
There are two setting, two metal reinforcing plates (3) are fixed on the upper and lower surface of high-temperature insulation substrate (4) by bolt (2).
6. a kind of tear protected circuit plate according to claim 1, it is characterised in that：The high-temperature insulation substrate (4)
Thickness is 0.7mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820194379.8U CN207835918U (en) | 2018-02-05 | 2018-02-05 | A kind of tear protected circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820194379.8U CN207835918U (en) | 2018-02-05 | 2018-02-05 | A kind of tear protected circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207835918U true CN207835918U (en) | 2018-09-07 |
Family
ID=63396954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820194379.8U Expired - Fee Related CN207835918U (en) | 2018-02-05 | 2018-02-05 | A kind of tear protected circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207835918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597087A (en) * | 2021-07-29 | 2021-11-02 | 昆山金鹏电子有限公司 | Compound high-accuracy PCB circuit board |
-
2018
- 2018-02-05 CN CN201820194379.8U patent/CN207835918U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597087A (en) * | 2021-07-29 | 2021-11-02 | 昆山金鹏电子有限公司 | Compound high-accuracy PCB circuit board |
| CN113597087B (en) * | 2021-07-29 | 2022-12-06 | 昆山金鹏电子有限公司 | Compound high-accuracy PCB circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 Termination date: 20220205 |