CN113597087A

CN113597087A - Compound high-accuracy PCB circuit board

Info

Publication number: CN113597087A
Application number: CN202110862236.6A
Authority: CN
Inventors: 程林海; 曹文英
Original assignee: Kunshan Jinpeng Electron Co ltd
Current assignee: Kunshan Jinpeng Electron Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2021-11-02
Anticipated expiration: 2041-07-29
Also published as: CN113597087B

Abstract

The invention relates to the technical field of PCB (printed circuit board) circuits, in particular to a composite high-precision PCB circuit board. It includes the printed board, and the printed board includes at least: the protective body comprises a welding top plate, the welding top plate is provided with a circuit bin, the welding top plate is provided with a first welding port, the circuit bin is connected with an insulating bottom plate, the insulating bottom plate comprises a bottom shell, and the bottom shell is provided with heat conducting plastic; the circuit board, circuit board include the circuit frame, are provided with the connector between two circuit frames, and the circuit frame is provided with circuit module, and circuit module includes the conduction body, and the conduction body is including switching on the piece, switches on the piece and has seted up No. two weld joints, switches on the piece and has seted up the conduction groove, and the conduction groove is provided with the metal block. The invention mainly provides a composite PCB with variable specifications.

Description

Compound high-accuracy PCB circuit board

Technical Field

The invention relates to the technical field of PCB (printed circuit board) circuits, in particular to a composite high-precision PCB circuit board.

Background

The PCB is a printed circuit board, also called a printed circuit board, is an important electronic component, is a support body of the electronic component, is a carrier for electrical interconnection of the electronic component, and consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding the electronic component, has double functions of a conducting circuit and the insulating bottom plate, can replace complex wiring, realizes electrical connection among components in a circuit, simplifies the assembly and welding work of electronic products, reduces the wiring workload in the traditional mode, and greatly lightens the labor intensity of workers; the size of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of electronic equipment are improved, however, the existing PCB circuit board has single specification, circuit boards with different specifications are required to be used according to different purposes, and the service efficiency of the circuit board is low, so that a composite circuit board with variable specification is required.

Disclosure of Invention

The present invention is directed to a composite high-precision PCB, which solves the above-mentioned problems of the prior art.

In order to achieve the above object, an object of the present invention is to provide a composite high-precision PCB, including a printed board, where the printed board at least includes:

the protective body comprises a welding top plate, the bottom of the welding top plate is provided with a circuit bin, the top of the welding top plate is provided with a plurality of first welding openings penetrating through the surface of the welding top plate, the first welding openings are communicated with the circuit bin, an insulating bottom plate is connected in the circuit bin and comprises a bottom shell positioned in the circuit bin, and heat conducting plastics are arranged at the bottom of the bottom shell;

the circuit board, the circuit board includes that two are located circuit frame in the circuit storehouse, circuit frame bottom with bottom casing top in close contact with, two be provided with the connector between the circuit frame, the circuit frame is "mouthful" style of calligraphy structure, be provided with circuit module in the circuit frame, circuit module is including being located the conduction in the circuit frame, the conduction includes a plurality of conduction pieces, No. two weldings that run through its surface are seted up to the conduction top, No. two weldings with a weld is linked together, the conduction groove has been seted up in the conduction piece, the conduction groove with No. two weldings are linked together, be provided with the metal block in the conduction groove.

As a further improvement of the technical scheme, the top surface of the welding top plate is coated with circuit board protective paint.

As a further improvement of the technical scheme, the inner surface of the circuit bin is provided with a positioning body, the bottom shell is correspondingly provided with a bottom positioning groove, the circuit frame is correspondingly provided with a middle positioning groove, the positioning body is in clamping fit with the bottom positioning groove, and the positioning body is in clamping fit with the middle positioning groove.

As a further improvement of the technical scheme, the metal block is provided with a connecting groove penetrating through the surface of the metal block, the metal block is of a cross-shaped structure, the middle of the metal block is provided with a layer, the tail end of the metal block is provided with a communicating body, and the metal block is connected with the adjacent metal block through the communicating body.

As a further improvement of the technical solution, the circuit module includes a blank block, and the blank block has a cubic structure.

As a further improvement of the technical scheme, a heat conduction groove is formed in the bottom of the heat conduction plastic, a heat radiator is connected in the heat conduction groove, the heat radiator is of a structure shaped like a Chinese character 'jing', a heat conduction strip is arranged at the top of the heat radiator, and the heat conduction strip is located in the heat conduction groove and connected with the heat conduction groove.

As a further improvement of the technical scheme, the bottom of the bottom shell is provided with an overhead foot, and a circulation port penetrating through the surface of the heat radiator is formed in the heat radiator.

As a further improvement of the technical solution, an auxiliary body is disposed on the surface of the top of the welding top plate, the auxiliary body includes an auxiliary frame connected to the welding top plate, a first sliding groove is formed in the top of the auxiliary frame, a first displacement body is connected in the first sliding groove, first sliding bodies are disposed at two ends of the bottom of the first displacement body, the first sliding body is slidably connected to the first sliding groove, a second sliding groove is formed in the first displacement body, a second displacement body is slidably connected to the second sliding groove, a sliding connection groove is formed in the second displacement body, a third sliding groove is formed in the second displacement body, and a placing frame is slidably connected to the third sliding groove.

As a further improvement of the technical scheme, a protrusion is arranged on the upper surface of one end of the placing frame, a threaded rod is connected to the inner portion of the protrusion of the placing frame in a rotating mode, a threaded groove is correspondingly formed in the surface of the second displacement body, and the threaded rod is located in the threaded groove and in threaded connection with the threaded groove.

As a further improvement of the technical scheme, the bottom of the auxiliary frame is provided with a plug pin, the top of the welding top plate is correspondingly provided with a combined groove, the combined groove is a cylindrical groove, and the plug pin is in plug fit with the combined groove.

Compared with the prior art, the invention has the beneficial effects that:

1. in this compound high accuracy PCB circuit board, can avoid because bottom casing, circuit frame take place for the removal of welding roof and lead to electronic component's stitch fracture through being provided with joint complex location body and bottom constant head tank and location body and middle constant head tank.

2. In this compound high accuracy PCB circuit board, thereby can reduce the temperature of circuit board with the heat derivation that the circuit board produced through being provided with the radiator, can accelerate the speed that the heat gived off to the air through being provided with overhead foot and circulation mouth.

3. In the composite high-precision PCB, the auxiliary body is arranged to fix the electronic element to be installed, so that the pins of the electronic element are prevented from being inclined or even broken during welding, and the welded top plate and the auxiliary body can be disassembled and installed through the combined groove and the pins which are matched in an inserting manner.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of a printed board structure according to the present invention;

FIG. 3 is a schematic view of the protective body of the present invention;

FIG. 4 is a schematic cross-sectional view of a welded roof panel of the present invention;

FIG. 5 is a schematic view of the structure of the insulating base plate according to the present invention;

FIG. 6 is a schematic cross-sectional view of the bottom housing of the present invention;

FIG. 7 is a cross-sectional view of a heat sink according to the present invention;

FIG. 8 is a schematic diagram of a circuit board structure according to the present invention;

FIG. 9 is a cross-sectional view of a conductive block according to the present invention;

fig. 10 is a schematic structural diagram of the auxiliary body of the present invention.

The various reference numbers in the figures mean:

100. printing a board;

110. a protective body;

111. welding a top plate; 112. a circuit bin; 113. a first weld crater; 114. a positioning body; 115. an insulating base plate; 116. a combination tank; 117. a bottom housing; 1171. a bottom positioning groove; 1172. a thermally conductive plastic; 1173. a heat conducting groove; 118. an overhead leg; 119. a heat sink; 1191. a heat conducting strip; 1192. a flow port;

120. a circuit board;

121. a circuit frame; 122. a linker; 123. a middle positioning groove; 124. a circuit module; 125. a conductive body; 1251. a conducting block; 1252. a second weld crater; 1253. a conduction groove; 1254. a metal block; 1255. connecting grooves; 1256. a communicating body; 1257. layering; 126. a blank block;

130. an auxiliary body;

131. an auxiliary frame; 1311. a pin; 132. a first sliding groove; 133. a first displacement body; 1331. a second sliding groove; 134. a first sliding body; 135. a second displacement body; 136. a sliding connecting groove; 137. a third sliding groove; 1371. a thread groove; 138. placing the frame; 139. a threaded rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Example 1

Referring to fig. 1 to 4 and fig. 8 to 9, an object of the present embodiment is to provide a composite high-precision PCB, including a printed board 100, where the printed board 100 at least includes:

the protective body 110 comprises a welding top plate 111, the bottom of the welding top plate 111 is provided with a circuit bin 112, the top of the welding top plate 111 is provided with a plurality of first welding openings 113 penetrating through the surface of the welding top plate, the first welding openings 113 are circular penetrating openings, the first welding openings 113 are communicated with the circuit bin 112, an insulating bottom plate 115 is connected in the circuit bin 112, the insulating bottom plate 115 comprises a bottom shell 117 located in the circuit bin 112, and the bottom of the bottom shell 117 is provided with heat conducting plastic 1172;

circuit board 120, circuit board 120 includes two circuit frames 121 that are located circuit bin 112, circuit frame 121 bottom and bottom casing 117 top in close contact with, be provided with connector 122 between two circuit frames 121, separate two circuit frames 121 through being provided with connector 122 and avoid the circuit interference, circuit frame 121 is "mouthful" style of calligraphy structure, be provided with circuit module 124 in the circuit frame 121, circuit module 124 is including being located the conducting body 125 of circuit frame 121, conducting body 125 includes a plurality of break-over blocks 1251, No. two weld joints 1252 that run through its surface are seted up to break-over block 1251 top, No. two weld joints 1252 are linked together with No. one weld joint 113, it has conducting groove 1253 to open in the break-over block 1251, conducting groove 1253 is linked together with No. two weld joints 1252, be provided with metal block 1254 in the conducting groove 1253.

In specific use, the embodiment selectively places different numbers of the conductive bodies 125 and the blank blocks 126 in the circuit frame 121, and places the conductive bodies 125 and the blank blocks 126 as required to realize the circuit connection, that is, places another conductive body 125 at the periphery of the conductive body 125 and makes the conductive body 1256 of the first conductive body 125 contact with the conductive body 1256 of the second conductive body 125 to realize the circuit connection, the blank blocks 126 are placed at the periphery of the conductive body 125 when the circuit is disconnected or no circuit exists at the circuit, and after the circuit specification is determined, the pins of the electronic component pass through the first welding openings 113 at the corresponding positions on the surface of the welding top plate 111 and are placed in the connecting grooves 1255 to be welded with the connecting grooves 1255, so that the connection with the circuit can be completed.

Further, in order to protect the circuit from damage, the top surface of the soldering top plate 111 is coated with a circuit board protective varnish, and the circuit can be protected from damage under the conditions such as chemical substances, vibration, moisture, salt spray, humidity and high temperature by being provided with the circuit board protective varnish.

Further in order to avoid the stitch fracture, the inner surface of the circuit bin 112 is provided with a positioning body 114, the positioning body 114 is a semi-cylinder-shaped protrusion, the bottom shell 117 is correspondingly provided with a bottom positioning groove 1171, the bottom positioning groove 1171 is a semi-cylinder-shaped groove, the circuit frame 121 is correspondingly provided with a middle positioning groove 123, the middle positioning groove 123 is a semi-cylinder-shaped groove, the positioning body 114 is in clamping fit with the bottom positioning groove 1171, the positioning body 114 is in clamping fit with the middle positioning groove 123, the bottom positioning groove 1171, the positioning body 114 and the middle positioning groove 123 which are provided with clamping fit can avoid the stitch fracture of the electronic element caused by the movement of the bottom shell 117 and the circuit frame 121 relative to the welding top plate 111.

In order to realize the circuit communication, the metal block 1254 is provided with a connecting groove 1255 penetrating through the surface of the metal block 1254, the connecting groove 1255 is a circular penetrating opening, the metal block 1254 is in a cross-shaped structure, a layer 1257 is arranged in the middle of the metal block 1254, a communicating body 1256 is arranged at the tail end of the metal block 1254, the metal block 1254 is connected with the adjacent metal block 1254 through the communicating body 1256, and the circuit communication can be realized through the arrangement of the metal block 1254.

Further, in order to form circuits with different specifications, the circuit module 124 includes a blank block 126, the blank block 126 is a cubic structure, and the circuits with different specifications can be formed by using different combinations of the conductive vias 125 and the blank block 126 in the circuit frame 121.

Example 2

As shown in fig. 5-7, since the circuit generates heat during power-on operation, in order to ensure normal use of the printed circuit board 100, the present embodiment is improved based on embodiment 1, wherein a heat conduction groove 1173 is formed at the bottom of the heat conduction plastic 1172, a heat sink 119 is connected in the heat conduction groove 1173, the heat sink 119 is in a "well" shape, a heat conduction strip 1191 is disposed at the top of the heat sink 119, the heat conduction strip 1191 is located in the heat conduction groove 1173 and connected to the heat conduction groove 1173, and the heat generated by the circuit board 120 can be conducted out by the heat sink 119, so as to reduce the temperature of the circuit board 120.

It is worth to be noted that the bottom of the bottom shell 117 is provided with the overhead leg 118, the heat dissipation body 119 is internally provided with the circulation port 1192 penetrating through the surface of the heat dissipation body, the circulation port 1192 is a circular through port, and the speed of heat dissipation into the air can be increased by the arrangement of the overhead leg 118 and the circulation port 1192.

Example 3

Referring to fig. 10, the specification of the circuit board can be changed while ensuring normal soldering of the electronic component, and the following improvements are made on the basis of embodiment 1:

wherein, the surface of the top of the welding top plate 111 is provided with an auxiliary body 130, the auxiliary body 130 comprises an auxiliary frame 131 connected with the welding top plate 111, the top of the auxiliary frame 131 is provided with a first sliding groove 132, the first sliding groove 132 is a concave groove structure, a first displacement body 133 is connected in the first sliding groove 132, two ends of the bottom of the first displacement body 133 are provided with a first sliding body 134, the first sliding body 134 is connected with the first sliding groove 132 in a sliding way, the first displacement body 133 is provided with a second sliding groove 1331, the second sliding groove 1331 is connected with a second displacement body 135 in a sliding way, the second displacement body 135 is provided with a sliding connecting groove 136, the second displacement body 135 is provided with a third sliding groove 137, and the third sliding groove 137 is connected with a placing frame 138 in a sliding way, the auxiliary body 130 can fix the electronic component to be mounted, and the pins of the electronic component are prevented from being skewed and even broken during welding.

In the embodiment, in specific use, the plug pins 1311 of the auxiliary frame 131 are aligned to the combination grooves 116 of the welding top plate 111, and after the fixed installation of the welding top plate 111 and the auxiliary body 130 is completed, the electronic component to be installed is placed in the placing frame 138, and then the threaded rod 139 is rotated, so that the threaded rod 139 drives the placing frame 138 to move in the third sliding groove 137 until the electronic component is fixed by the threaded rod 139, and then the pins of the electronic component can be welded, and after the electronic component is installed, the auxiliary body 130 is removed.

Further for better fixing, place frame 138 one end upper surface and be provided with the arch, place the protruding internal rotation of frame 138 and be connected with threaded rod 139, No. two displacement body 135's corresponding thread groove 1371 of having seted up in surface, threaded rod 139 is located thread groove 1371 and thread groove 1371 looks threaded connection, can be better fix electronic component through being provided with threaded connection area thread groove 1371, threaded rod 139.

Further, in order to realize the dismounting and mounting of the welding top plate 111 and the auxiliary body 130, the bottom of the auxiliary frame 131 is provided with a plug pin 1311, the plug pin 1311 is a cylinder, the top of the welding top plate 111 is correspondingly provided with a combination groove 116, the combination groove 116 is a groove with a cylindrical structure, the plug pin 1311 is in plug fit with the combination groove 116, and the dismounting and mounting of the welding top plate 111 and the auxiliary body 130 can be realized through the plug fit combination groove 116 and the plug pin 1311.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a compound high accuracy PCB circuit board which characterized in that: comprising a printed board (100), said printed board (100) comprising at least:

the protective device comprises a protective body (110), wherein the protective body (110) comprises a welding top plate (111), a circuit bin (112) is arranged at the bottom of the welding top plate (111), a plurality of first welding openings (113) penetrating through the surface of the welding top plate (111) are formed in the top of the welding top plate (111), the first welding openings (113) are communicated with the circuit bin (112), an insulating bottom plate (115) is connected in the circuit bin (112), the insulating bottom plate (115) comprises a bottom shell (117) located in the circuit bin (112), and heat conducting plastics (1172) are arranged at the bottom of the bottom shell (117);

the circuit board (120), the circuit board (120) includes two circuit frames (121) located in the circuit bin (112), the bottom of the circuit frame (121) is in close contact with the top of the bottom shell (117), a connecting body (122) is arranged between the two circuit frames (121), the circuit frame (121) is of a square structure, a circuit module (124) is arranged in the circuit frame (121), the circuit module (124) includes a conducting body (125) located in the circuit frame (121), the conducting body (125) includes a plurality of conducting blocks (1251), the top of each conducting block (1251) is provided with a second welding opening (1252) penetrating through the surface of the conducting block, the second welding opening (1252) is communicated with the first welding opening (113), a conducting groove (1253) is formed in each conducting block (1251), and the conducting groove (1253) is communicated with the second welding opening (1252), and a metal block (1254) is arranged in the conducting groove (1253).

2. A composite high-precision PCB board according to claim 1, wherein: and circuit board protective paint is coated on the top surface of the welding top plate (111).

3. A composite high-precision PCB board according to claim 1, wherein: the circuit bin (112) internal surface is provided with the location body (114), bottom casing (117) correspondingly is provided with bottom constant head tank (1171), constant head tank (123) in the middle of circuit frame (121) corresponding seted up, the location body (114) with bottom constant head tank (1171) joint cooperation, the location body (114) with middle constant head tank (123) joint cooperation.

4. A composite high-precision PCB board according to claim 1, wherein: the metal block (1254) is provided with a connecting groove (1255) penetrating through the surface of the metal block, the metal block (1254) is of a cross-shaped structure, the middle of the metal block (1254) is provided with a layering layer (1257), the tail end of the metal block (1254) is provided with a communicating body (1256), and the metal block (1254) is connected with the adjacent metal block (1254) through the communicating body (1256).

5. A composite high-precision PCB board according to claim 1, wherein: the circuit module (124) comprises a blank block (126), and the blank block (126) is of a cubic structure.

6. A composite high-precision PCB board according to claim 1, wherein: the bottom of the heat conducting plastic (1172) is provided with a heat conducting groove (1173), the heat radiator (119) is connected in the heat conducting groove (1173), the heat radiator (119) is of a structure shaped like a Chinese character 'jing', the top of the heat radiator (119) is provided with a heat conducting strip (1191), and the heat conducting strip (1191) is located in the heat conducting groove (1173) and connected with the heat conducting groove (1173).

7. A composite high-precision PCB circuit board according to claim 6, characterized in that: an overhead foot (118) is arranged at the bottom of the bottom shell (117), and a circulation port (1192) penetrating through the surface of the heat radiation body (119) is formed in the heat radiation body.

8. A composite high-precision PCB board according to claim 1, wherein: an auxiliary body (130) is arranged on the top surface of the welding top plate (111), the auxiliary body (130) comprises an auxiliary frame (131) connected with the welding top plate (111), the top of the auxiliary frame (131) is provided with a first sliding groove (132), a first displacement body (133) is connected in the first sliding groove (132), a first sliding body (134) is arranged at two ends of the bottom of the first displacement body (133), the first sliding body (134) is connected with the first sliding groove (132) in a sliding way, the first displacement body (133) is provided with a second sliding groove (1331), the second sliding groove (1331) is connected with a second displacement body (135) in a sliding way, sliding connection groove (136) have been seted up to No. two displacement body (135), No. three sliding tray (137) have been seted up to No. two displacement body (135), sliding connection has in No. three sliding tray (137) places frame (138).

9. A composite high-precision PCB board as in claim 8, wherein: it is provided with the arch to place frame (138) one end upper surface, the protruding internal rotation of placing frame (138) is connected with threaded rod (139), thread groove (1371) have been seted up correspondingly in the surface of No. two displacement body (135), threaded rod (139) are located in thread groove (1371) with thread groove (1371) looks threaded connection.

10. A composite high-precision PCB board as in claim 8, wherein: the bottom of the auxiliary frame (131) is provided with a plug pin (1311), the top of the welding top plate (111) is correspondingly provided with a combination groove (116), the combination groove (116) is a cylindrical groove, and the plug pin (1311) is in plug fit with the combination groove (116).