CN212783083U - High-voltage ceramic capacitor - Google Patents
High-voltage ceramic capacitor Download PDFInfo
- Publication number
- CN212783083U CN212783083U CN202021826586.4U CN202021826586U CN212783083U CN 212783083 U CN212783083 U CN 212783083U CN 202021826586 U CN202021826586 U CN 202021826586U CN 212783083 U CN212783083 U CN 212783083U
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- Prior art keywords
- insulating
- buckle
- dielectric chip
- ceramic
- ceramic capacitor
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 238000005253 cladding Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 8
- 230000007774 longterm Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a high-voltage ceramic capacitor, including two insulation buckle closure that the structure is the same, ceramic dielectric chip, soldering tin, first pin and second pin, be equipped with between two insulation buckle closures and hold the cavity, ceramic dielectric chip locates and holds in the cavity, is equipped with a plurality of louvres on the insulation buckle closure, and insulation buckle closure back bottom is equipped with the fixing base, is equipped with waist-shaped groove on the fixing base. The utility model discloses a locate ceramic dielectric chip in holding the cavity, and set up a plurality of louvres on insulating buckle closure respectively, in order to improve the radiating efficiency of ceramic dielectric chip, solved in the outer cladding resin insulation shell of ceramic dielectric chip and lead to the poor problem of thermal diffusivity; at the fixing base that insulating buckle closure back bottom set up, can convenience of customers pass through bolted connection's mode installation with ceramic capacitor and fix on the PCB board, effectively strengthen the utility model discloses a connection stability satisfies the user's needs and installs the demand that uses at the great complicated operating mode of vibration frequency with ceramic capacitor.
Description
Technical Field
The utility model relates to a ceramic capacitor field especially relates to a high-voltage ceramic capacitor.
Background
Ceramic capacitors, also known as ceramic capacitors or monolithic capacitors. As the name implies, a ceramic capacitor is a capacitor in which the dielectric material is ceramic. According to the difference of ceramic materials, the low frequency ceramic capacitor and the high frequency ceramic capacitor can be divided into two categories. The capacitor can be classified into a plurality of types such as a circular chip capacitor, a tubular capacitor, a rectangular capacitor, a chip capacitor, a feedthrough capacitor and the like according to the structural form.
In the prior art, the outer layer of a ceramic dielectric chip of a ceramic capacitor is generally coated with a resin insulating shell, a high-voltage ceramic capacitor can generate a large amount of heat in a long-time use state, and if the heat cannot be dissipated to the outside in time, the service life of the ceramic capacitor can be influenced; in addition, the ceramic capacitor is generally connected to the PCB by spot welding through the metal pins, and when the ceramic capacitor is installed in an environment with a high vibration frequency for use, the welding leg of the ceramic capacitor is easily loosened by vibration after a period of time, so that the failure rate of the device is increased.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the high-voltage ceramic capacitor is simple in structure, easy to dissipate heat, long in service life and stable to mount.
The technical scheme of the utility model as follows: a high-voltage ceramic capacitor comprises two insulating buckle covers with the same structure, a ceramic dielectric chip, soldering tin, a first lead pin and a second lead pin, wherein the two insulating buckle covers are connected through a buckle, a containing cavity is arranged between the two insulating buckle covers, the ceramic dielectric chip is arranged in the containing cavity, the first lead pin is connected with one end face of the ceramic dielectric chip, the second lead pin is connected with the other end face of the ceramic dielectric chip, the soldering tin is respectively arranged at the connection positions of the first lead pin and the second lead pin and the end face of the ceramic dielectric chip, and the ends of the first lead pin and the second lead pin, which are far away from the soldering tin, are respectively positioned outside the insulating buckle covers;
the ceramic dielectric chip fixing device comprises an insulating buckle cover, a fixing seat and a fixing base, wherein a plurality of heat dissipation holes are formed in the insulating buckle cover, a plurality of fixing columns used for clamping and fixing a ceramic dielectric chip are arranged in the middle of the insulating buckle cover, the bottom end of the back of the insulating buckle cover is provided with the fixing seat, and a waist-shaped groove is formed in the fixing seat.
By adopting the technical scheme, in the high-voltage ceramic capacitor, the upper right corner of the insulating buckle cover is provided with the first buckle, the upper left corner of the insulating buckle cover is provided with the first buckle groove, the lower left corner of the insulating buckle cover is provided with the second buckle, and the lower right corner of the insulating buckle cover is provided with the second buckle groove.
By adopting the technical scheme, in the high-voltage ceramic capacitor, the left side of the middle part of the insulating buckle cover is provided with the first positioning column, and the right side of the middle part of the insulating buckle cover is provided with the first positioning groove.
By adopting the technical scheme, in the high-voltage ceramic capacitor, the left side of the bottom of the insulating buckle cover is provided with the second positioning columns, and the right side of the bottom of the insulating buckle cover is provided with the second positioning grooves. .
By adopting the technical scheme, in the high-voltage ceramic capacitor, the first lead pin and the second lead pin are made of copper materials.
By adopting the technical scheme, in the high-voltage ceramic capacitor, the insulating buckle cover is made of epoxy resin.
By adopting the technical proposal, the utility model discloses a locate ceramic dielectric chip in the holding cavity that is formed by the mutual buckle connection of two insulation buckle closure, and set up a plurality of louvres on the insulation buckle closure respectively, in order to improve ceramic dielectric chip's radiating efficiency, prevent that high-pressure ceramic capacitor from arousing higher temperature rise in long-term use, thereby influence high-pressure ceramic capacitor's life, solved and wrapped the insulating shell of resin and leaded to the poor problem of thermal diffusivity in ceramic dielectric chip outer layer; the fixing seat arranged at the bottom end of the back of the insulating buckle cover can facilitate a user to install and fix the ceramic capacitor on the PCB board in a bolt connection mode, effectively enhance the connection stability of the utility model, and meet the requirement that the user needs to install the ceramic capacitor under a complex working condition with large vibration frequency for use; the whole structure is simple, the heat dissipation is easy, the service life is long, the installation is stable, and the device can be popularized and used.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of the structure of the present invention;
fig. 3 is a schematic view of the structure of the insulating cover of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 3, a high voltage ceramic capacitor includes two insulation caps 1 having the same structure, a ceramic dielectric chip 2, a solder 3, a first terminal pin 4, and a second terminal pin 5, the two insulation caps 1 are connected by a buckle, a containing cavity 10 is disposed between the two insulation caps 1, the ceramic dielectric chip 2 is disposed in the containing cavity 10, the first terminal pin 4 is connected to one end surface of the ceramic dielectric chip 2, the second terminal pin 5 is connected to the other end surface of the ceramic dielectric chip 2, the end surface joints of the first terminal pin 4, the second terminal pin 5, and the ceramic dielectric chip 2 are respectively provided with the solder 3, and the ends of the first terminal pin 4 and the second terminal pin 5, which are far away from the solder 3, are respectively located outside the insulation caps 1. In this embodiment, the first lead pin 4 and the second lead pin 5 can be mounted and connected to an external PCB by spot welding.
The ceramic dielectric chip fixing device is characterized in that a plurality of heat dissipation holes 11 are formed in the insulating buckle cover 1, a plurality of fixing columns 12 used for clamping and fixing the ceramic dielectric chip 2 are arranged in the middle of the insulating buckle cover 1, a fixing seat 13 is arranged at the bottom end of the back of the insulating buckle cover 1, and a waist-shaped groove 130 is formed in the fixing seat 13. In this embodiment, the arrangement of the fixing posts 12 can improve the clamping stability of the ceramic dielectric chip 2, and prevent the ceramic dielectric chip 2 from loosening in the accommodating cavity 10. A plurality of louvres 11 that set up on insulating buckle closure 1 can improve ceramic dielectric chip 2's radiating efficiency, prevent that high-voltage ceramic capacitor from arousing higher temperature rise in long term use to influence high-voltage ceramic capacitor's life, solved at ceramic capacitor outer cladding resin insulation cover and lead to the poor problem of thermal diffusivity. Be provided with fixing base 13 in 1 back bottom of insulating buckle closure, be equipped with waist type groove 130 at fixing base 13 simultaneously, but convenience of customers fixes ceramic capacitor on the PCB board through bolted connection's mode installation, effectively strengthens the utility model discloses a connection stability.
As shown in fig. 2 and fig. 3, further, a first buckle 101 is disposed at the upper right corner of the insulating buckle cover 1, a first buckle slot 102 is disposed at the upper left corner of the insulating buckle cover 1, a second buckle 103 is disposed at the lower left corner of the insulating buckle cover 1, and a second buckle slot 104 is disposed at the lower right corner of the insulating buckle cover 1. In this embodiment, the first buckle 101 of one insulation buckle cover 1 can be connected with the first buckle slot 102 of another insulation buckle cover 1 through a buckle, the second buckle 103 of one insulation buckle cover 1 can be connected with the second buckle slot 104 of another insulation buckle cover 1 through a buckle, the mode of connecting with a double buckle is adopted, and the assembly stability of the utility model can be improved.
As shown in fig. 3, further, a first positioning column 105 is arranged at the left side of the middle of the insulating cover 1, and a first positioning groove 106 is arranged at the right side of the middle of the insulating cover 1.
As shown in fig. 3, further, a plurality of second positioning pillars 107 are disposed on the left side of the bottom of the insulating cover 1, and a plurality of second positioning grooves 108 are disposed on the right side of the bottom of the insulating cover 1.
In this embodiment, the first positioning column 105 of one insulating cover 1 can be connected to the first positioning slot 106 of another insulating cover 1, and the second positioning column 107 of one insulating cover 1 can be connected to the second positioning slot 108 of another insulating cover 1, so that the two insulating covers 1 can be conveniently positioned and installed.
Further, the first terminal pin 4 and the second terminal pin 5 are made of copper material. In this embodiment, copper product electric conductive property is good, adopts first pin 4 and the second pin 5 that the copper product was made, can improve the utility model discloses and the electrically conductive effect between the PCB board.
Furthermore, the insulating buckle cover 1 is made of epoxy resin. In the embodiment, the epoxy resin not only has good electrical insulation, but also has good corrosion resistance and mechanical property, is easy to process by enterprises, and reduces the production cost.
By adopting the technical proposal, the utility model discloses a locate ceramic dielectric chip in the holding cavity that is formed by the mutual buckle connection of two insulation buckle closure, and set up a plurality of louvres on the insulation buckle closure respectively, in order to improve ceramic dielectric chip's radiating efficiency, prevent that high-pressure ceramic capacitor from arousing higher temperature rise in long-term use, thereby influence high-pressure ceramic capacitor's life, solved and wrapped the insulating shell of resin and leaded to the poor problem of thermal diffusivity in ceramic dielectric chip outer layer; the fixing seat arranged at the bottom end of the back of the insulating buckle cover can facilitate a user to install and fix the ceramic capacitor on the PCB board in a bolt connection mode, effectively enhance the connection stability of the utility model, and meet the requirement that the user needs to install the ceramic capacitor under a complex working condition with large vibration frequency for use; the whole structure is simple, the heat dissipation is easy, the service life is long, the installation is stable, and the device can be popularized and used.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A high voltage ceramic capacitor, characterized by: the ceramic-dielectric-ceramic-chip-embedded-type printed circuit board comprises two insulating buckle covers with the same structure, a ceramic dielectric chip, soldering tin, a first lead pin and a second lead pin, wherein the two insulating buckle covers are connected through a buckle, a containing cavity is arranged between the two insulating buckle covers, the ceramic dielectric chip is arranged in the containing cavity, the first lead pin is connected with one end face of the ceramic dielectric chip, the second lead pin is connected with the other end face of the ceramic dielectric chip, the soldering tin is respectively arranged at the connection positions of the first lead pin and the end face of the ceramic dielectric chip, and the ends, far away from the soldering tin, of the first lead pin and the second lead pin are respectively positioned outside the insulating buckle covers;
the ceramic dielectric chip fixing device comprises an insulating buckle cover, a fixing seat and a fixing base, wherein a plurality of heat dissipation holes are formed in the insulating buckle cover, a plurality of fixing columns used for clamping and fixing a ceramic dielectric chip are arranged in the middle of the insulating buckle cover, the bottom end of the back of the insulating buckle cover is provided with the fixing seat, and a waist-shaped groove is formed in the fixing seat.
2. The high voltage ceramic capacitor of claim 1, wherein: the insulating buckle cover is characterized in that a first buckle is arranged at the upper right corner of the insulating buckle cover, a first buckle groove is arranged at the upper left corner of the insulating buckle cover, a second buckle is arranged at the lower left corner of the insulating buckle cover, and a second buckle groove is arranged at the lower right corner of the insulating buckle cover.
3. The high voltage ceramic capacitor of claim 1, wherein: the middle part left side of insulating buckle closure is equipped with first reference column, the middle part right side of insulating buckle closure is equipped with first constant head tank.
4. The high voltage ceramic capacitor of claim 1, wherein: the bottom left side of insulating buckle closure is equipped with a plurality of second reference columns, the bottom right side of insulating buckle closure is equipped with a plurality of second constant head tanks.
5. The high-voltage ceramic capacitor as claimed in any one of claims 1 to 4, wherein: the first lead pin and the second lead pin are made of copper materials.
6. The high-voltage ceramic capacitor as claimed in any one of claims 1 to 4, wherein: the insulating buckle cover is made of epoxy resin materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021826586.4U CN212783083U (en) | 2020-08-27 | 2020-08-27 | High-voltage ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021826586.4U CN212783083U (en) | 2020-08-27 | 2020-08-27 | High-voltage ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212783083U true CN212783083U (en) | 2021-03-23 |
Family
ID=75055374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021826586.4U Active CN212783083U (en) | 2020-08-27 | 2020-08-27 | High-voltage ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212783083U (en) |
-
2020
- 2020-08-27 CN CN202021826586.4U patent/CN212783083U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high voltage ceramic capacitor Effective date of registration: 20211015 Granted publication date: 20210323 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: Guangdong Dafu Electronics Co.,Ltd. Registration number: Y2021980010802 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221213 Granted publication date: 20210323 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: Guangdong Dafu Electronics Co.,Ltd. Registration number: Y2021980010802 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-voltage ceramic capacitor Granted publication date: 20210323 Pledgee: Heyuan branch of China Guangfa Bank Co.,Ltd. Pledgor: Guangdong Dafu Electronics Co.,Ltd. Registration number: Y2024980015776 |