CN201039583Y

CN201039583Y - Multi-layer high heat conduction metal base plate and high heat conductive metal plate with this base plate

Info

Publication number: CN201039583Y
Application number: CNU2006201374525U
Authority: CN
Inventors: 陈介修
Original assignee: Leison Tech Co Ltd
Current assignee: Leison Tech Co Ltd
Priority date: 2006-10-17
Filing date: 2006-10-17
Publication date: 2008-03-19
Anticipated expiration: 2016-10-17

Abstract

The utility model provides a multi-layer high heat conducting metal base, and a high heat conducting metal plate which is provided with the multi-layer high heat conducting metal base; the utility model mainly utilizes a chemical milling type to lead the two surfaces of the metal base to be sunken, and the internal bottom surface presents a required first surface lead and a second surface lead or a power supply layer, then the utility model uses a high heat conducting insulating cement, a first conductor and a second conductor to fill in the sunken surfaces, so as to ensure the surface of the metal base to form a first conductor and a second conductor that are flat and exerted; the utility model can be used for assembling electronic building bricks, when carrying, the heat energy generated by the electronic building bricks can not be agglomerated on the surface of the metal base, but can be conducted to the first conductor and the second conductor because of the conduction action of the high heat conducting insulating glue, and then can be spread to the whole metal base, thereby enhancing the heat dissipation efficiency and protecting the electronic building brick; furthermore, the utility model can achieve proper insulating effect by the aid of the high heat conducting insulating glue, thereby avoiding a short circuit occurs on the conductors and the metal base.

Description

Multi-level high-thermal conductive metal base plate and high-thermal conductive metal plate with this substrate

Technical field

The utility model is about a kind of multi-level high-thermal conductive metal base plate and the high-thermal conductive metal plate with this substrate, refers to especially a kind ofly be used in surface electronic assembly assembling (encapsulation), and possesses the metal substrate that better radiating effect is arranged.

Background technology

Along with electronic product develops to light, thin, little, high density, multifunction, component on circuit board packaging density and integrated level are more and more higher, power consumption is increasing, thermal diffusivity to circuit board (PCB substrate) requires more and more urgent, if the thermal diffusivity of circuit board is bad or very poor, gently can cause on the printed circuit board components and parts overheated, heavy then make the reliability decrease of whole system or device.

Please join shown in Figure 1A, Figure 1B, Fig. 2 A, Fig. 2 B, be common at present on the radiating treatment practice of circuit board 1, mainly adopt the method that on a glass mat 10 1 surfaces, is combined with one or more metallic plate 11, and circuit, electronic building brick arranged be assemblied in glass mat 10 or metallic plate 11 surfaces; So when practice, can rely on large-area metallic plate to reach the acceleration radiating effect by the heat that electronic building brick produced.

Yet this kind strengthened the circuit board of thermolysis, though more early stage circuit board has preferable radiating effect, still careful its structure of close examination is implied with and does not improve part to the greatest extent:

1, described circuit board is when heat radiation, the good heat dissipation effect that the electronic building brick of direct contacting metal substrate is only arranged, metal substrate can't be permeated or conduct to part at glass mat then fully, cause being restricted on radiating effect and the efficient, when especially being used in the board structure of circuit of multiple field, this situation will be more obvious, and radiating effect can be poorer.

2, on the glass mat on the positive and negative two sides of described circuit board and the metal substrate the electronic building brick that is provided with respectively, because of wherein a side and electronic building brick near and conduct well, radiating effect is preferable naturally; Otherwise opposite side is because of can't effectively conducting, and its radiating effect is had a greatly reduced quality naturally.

3, therefore the circuit board of this kind kenel can't implement processing such as boring, plating for fear of because of the contact between conductor produces short circuit phenomenon, so the structure kenel of single sided board is only arranged at present.

Concluding above-mentioned disappearance can get, and in response to the fast development of electronic technology, the market demand of high-thermal conductive metal base plate is heated up, also more and more higher to its specification requirement simultaneously, and by above explanation as can be known, the existing practice obviously can't have been closed it and asked, and improved necessity in addition certainly will be arranged.In view of this utility model designer is the active research design, obtains an adequate solution scheme eventually, and the phase can provide industry extensively to use.

Summary of the invention

Therefore, main purpose of the present utility model is: a kind of multi-level high-thermal conductive metal base plate and the high-thermal conductive metal plate with this substrate are provided, be with two surfaces of metal substrate respectively in the chemical etching mode at interior different leads or the bus plane of being formed with, establish high heat conductive insulating glue and conductor filled again on its surface, make described metallic substrate surfaces concordant and expose required conductor, can obtain the essence effect of acceleration radiating efficiency with this structure utilization.

Another purpose of the present utility model is to provide a kind of multi-level high-thermal conductive metal base plate, and it can constitute multi-level kenel with described single metal substrate, with tool more polynary purposes and effect.

For achieving the above object, the technical solution adopted in the utility model is:

A kind of multi-level high-thermal conductive metal base plate, it is characterized in that: include a metal substrate, a surface is provided with the depression that accounts for its gross thickness 1/2 above degree of depth therein, and described depression inner bottom surface is provided with first lead or the bus plane of design, be filled with first conductor in the described depression, be provided with high heat conductive insulating glue between described first conductor and described first lead or the bus plane surface, and the outer surface of described first conductor is concordant with metal substrate; Another surface of metal substrate is provided with the another depression of not enough its gross thickness 1/2, and described another depression inner bottom surface is provided with second lead of design, be filled with second conductor in the described another depression, be provided with high heat conductive insulating glue between described second conductor and described second lead, and the outer surface of described second conductor is concordant with metal substrate.

Described first lead and second lead are bus plane.

For achieving the above object, the technical solution adopted in the utility model also comprises:

A kind of high-thermal conductive metal plate with multi-level high-thermal conductive metal base plate as claimed in claim 1, it is characterized in that: it is laminated with a plurality of described high-thermal conductive metal base plates and the surface is a metallic plate, and between per two adjacent metal substrates, be provided with high heat conductive insulating glue, also be provided with high heat conductive insulating glue between the metal substrate that described metallic plate is adjacent, described a plurality of metal substrate and metallic plate bind and are integral, described metal sheet surface is provided with the 3rd lead, and in described high-thermal conductive metal plate side or the front be provided with first, the 3rd conductor that second conductor connects.

Adopt the advantage that the utlity model has of technique scheme to be: to have more high cooling efficiency.

Description of drawings

Figure 1A, Figure 1B are respectively the outward appearance and the cutaway views of existing radiator structure;

Fig. 2 A, Fig. 2 B are respectively the outward appearance and the cutaway views of another existing radiator structure;

Fig. 3 is the outside drawing of the utility model one preferred embodiment;

Fig. 4 is the cutaway view of the utility model one preferred embodiment;

Fig. 5 is the outside drawing of another preferred embodiment of the utility model;

Fig. 6 is the cutaway view of another preferred embodiment of the utility model.

Description of reference numerals: 1-circuit board; 10-glass mat; 11 1 metallic plates; 2-metal substrate; 20-the first lead; 21-high heat conductive insulating glue; 22-the first conductor; 23-the second lead; 24-the second conductor; 25-metallic plate; 27-the three conductor.

Embodiment

Your juror can further more further understanding and understanding be arranged for ease of, to enumerate a preferred embodiment now and cooperate that graphic details are as follows structure of the present utility model, use and feature thereof:

At first, please cooperate and consult Fig. 3～shown in Figure 4, the utility model is design and a kind of multi-level high-thermal conductive metal base plate is provided, it is established has a metal substrate 2, and a surface utilizes the chemical agent etching to have to account for the depression of its gross thickness 1/2 above degree of depth therein, and inner bottom surface has first lead 20 or the bus plane of design, at described first lead 20 or bus plane surface coated high heat conductive insulating glue 21 is arranged again, be filled with first conductor 22 again, and make the surface recovery of described metal substrate 2 concordant and expose first conductor 22 is arranged; Utilize the chemical agent etching to remove equally the metal material of another surperficial its gross thickness 1/2 of remaining deficiency, to present second lead 23 (drawing do not show) identical with first lead 20, high heat conductive insulating glue 21 is arranged and fill second conductor 24 in surface coated again, make another surface same concordant also exposing of described metal substrate 2 that second conductor 24 be arranged, so to constitute the foundation structure of a brand-new multi-level high-thermal conductive metal base plate 2.

According to said metal substrates 2 structures; on the implementation; when metal substrate 2 is provided with some major and minor electronic building bricks; the heat energy that its running produces is transmitted on first,

second conductor

22,24 naturally via first,

second face lead

20,23 and the high heat conductive insulating glue 21 that circuit distributes; and to outdiffusion; so will make described metal substrate 2 surfaces not condense heat energy and insulation, quicken heat radiation effectiveness, and then obtain the real benefit of the some major and minor electronic building bricks of protection and reach.

Please continue and consult Fig. 5～shown in Figure 6, be to disclose the above-mentioned single metal substrate 2 of favourable usefulness to be the multi-level high-termal conductivity metal substrate kenel of structure that foundation structure is organized, wherein employed each metal substrate 2 structure are with above-mentioned, be included in described metal substrate 2 one surfaces and utilize the chemical agent etching to have to account for the depression of its gross thickness 1/2 above degree of depth, and inner bottom surface has first lead 20 of design, and utilize the chemical agent etching to remove to account on another surface its gross thickness less than the residual metal material of 1/2 degree of depth and form depression, and inner bottom surface has second lead 23 of design, respectively first, second lead 20, be coated with high heat conductive insulating glue 21 on 23 and filled up first,

second conductor

22,24, make described metal substrate 2 surfaces form concordant and expose and have required first,

second conductor

22,24, comprise as for increasing part, when 24 of first conductor 22 or second conductors are gone up when needing to lay wire body, utilize high heat conductive insulating glue 21 to be coated with on it once more, be added with and establish layer of metal plate 25, also be provided with high heat conductive insulating glue 21 between the metal substrate 2 that described metallic plate 25 is adjacent, after described a plurality of metal substrate 2 and metallic plate 25 are combined closely and are integral, can be formed with the 3rd lead (not shown) on described metallic plate 25 surfaces, utilize its side or front to be provided with and first again,

second conductor

22,24 the 3rd conductors 27 that link; So, make first, second and the

3rd conductor

22,24,27 on the metal substrate 2 form the multiple field conductors, and all have the characteristic of high heat conduction, in like manner, the structure that repeats to be increased just can reach multi-level high-thermal conductive metal base plate on metal substrate 2.

Use as for it; the heat energy that produces during equally with major and minor electronic building brick running distribute through circuit first, second reach the conduction of high heat conductive insulating glue 21 therebetween with the

3rd lead

20,23; outside to first, second and 22,24,27 diffusions of the 3rd conductor respectively; and make described metal substrate 2 no longer condense heat energy and insulation, to reach the real benefit that quickens heat radiation and protect some major and minor electronic building bricks.

More than explanation is just illustrative for the utility model, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from following claim and limited, can make many modifications, change, or equivalence, but but all will fall within the claim restricted portion of the present utility model.

Claims

1. multi-level high-thermal conductive metal base plate, it is characterized in that: include a metal substrate, a surface is provided with the depression that accounts for its gross thickness 1/2 above degree of depth therein, and described depression inner bottom surface is provided with first lead or the bus plane of design, be filled with first conductor in the described depression, be provided with high heat conductive insulating glue between described first conductor and described first lead or the bus plane surface, and the outer surface of described first conductor is concordant with metal substrate; Another surface of metal substrate is provided with the another depression of not enough its gross thickness 1/2, and described another depression inner bottom surface is provided with second lead of design, be filled with second conductor in the described another depression, be provided with high heat conductive insulating glue between described second conductor and described second lead, and the outer surface of described second conductor is concordant with metal substrate.

2. according to the described multilayer of claim 1 high-thermal conductive metal base plate that takes second place, it is characterized in that: described first lead and second lead are bus plane.

3. high-thermal conductive metal plate with multi-level high-thermal conductive metal base plate as claimed in claim 1, it is characterized in that: it is laminated with a plurality of described high-thermal conductive metal base plates and the surface is a metallic plate, and between per two adjacent metal substrates, be provided with high heat conductive insulating glue, also be provided with high heat conductive insulating glue between the metal substrate that described metallic plate is adjacent, described a plurality of metal substrate and metallic plate bind and are integral, described metal sheet surface is provided with the 3rd lead, and in described high-thermal conductive metal plate side or the front be provided with first, the 3rd conductor that second conductor connects.