CN100376127C - Heating element radiating structure - Google Patents
Heating element radiating structure Download PDFInfo
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- CN100376127C CN100376127C CNB2005100726620A CN200510072662A CN100376127C CN 100376127 C CN100376127 C CN 100376127C CN B2005100726620 A CNB2005100726620 A CN B2005100726620A CN 200510072662 A CN200510072662 A CN 200510072662A CN 100376127 C CN100376127 C CN 100376127C
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Abstract
A structure of heat-generating components, to a place giving no thermal effects to their peripheries as to be able to make the heats radiated to the external by a single heat-radiating member. The forming method of a heat-radiating structure has a step for providing in a printed wiring board 10 through holes 11, 12, 13 corresponding to heat-generating elements 14, 15, 16; a step of providing in a heat-radiating member 20 for heat radiating protrusive portions 25, 26, 27 corresponding to the through holes 11, 12, 13; and a step of so inserting these heat radiating protrusive portions 25, 26, 27 into the through holes 11, 12, 13 as to interpose thermal conductive materials 30, respectively in between the heat radiating protrusive portions 25, 26, 27 and the heat-generating elements 14, 15, 16, and as to guide the heat generated by the heat-generating elements 14, 15, 16 to the heat-radiating member 20 via the thermal conductive materials 30 and radiate the heat to the external.
Description
Technical field
The radiator structure of the heat generating components that the present invention relates to the heat generating components of electronic equipments such as thermoregulator, for example will dispel the heat from the heat that heater element produces effectively.
Background technology
In the exploitation of electronic equipments such as thermoregulator, be that purpose is studied to make more high performance device.The problem of wherein, the further miniaturization of obstruction electronic equipment, high performance receives publicity.That is, the high performance of electronic equipment causes the power consumption of electronic equipment to be risen, and meanwhile, the temperature of electronic unit rises, and surpasses the heat resisting temperature of electronic unit.In other words, existence can not be brought into play the problem of regulation performance.In addition, even when miniaturization, also have same problem, that is, must rise with the temperature that littler volume dispels the heat, device content easily is full of heat, electronic unit with the heat of amount surpasses the heat resisting temperature of electronic unit.
In addition, in thermoregulator as electronic equipment, the caloric value maximum of its power unit, and power unit uses the big parts of a plurality of caloric values.Therefore, for eliminating the influence of the heat between parts, the distance between parts need be set, be difficult to carry out miniaturization, in addition, when the big parts of whole caloric values were made hot countermeasure, it is complicated that operation becomes, infringement production efficiency.
Like this, how to improve the production efficiency of power unit, making its miniaturization and radiating efficiency is well from now on a problem, therefore, wishes to control the exploitation of heat dissipation technology this respect with the power unit modularization time.
In addition,, has following structure:, radiator is set respectively on this printed substrate for making the heat heat radiation of each heater element that is installed on the printed substrate as the radiator structure of existing heat generating components (heater element).Promptly, through hole and a plurality of screw hole are set on printed substrate, and corresponding through hole is installed heater element on the face of a side of printed substrate, in addition, jut and screw stop hole with open-work is set on radiator, jut is inserted in the through hole, with the position configuration of the corresponding heater element of radiator on printed substrate, then, to end by screw and the screw stop hole card that screw hole inserts, like this radiator is installed on the printed substrate, thermal conductive adhesive for example is filled into gap (with reference to patent documentation 1) between the element package of jut and heat generating components by injector by open-work.
Patent documentation 1: open flat 06-45393 communique in fact
In the radiator structure of above-mentioned existing heat generating components, owing to be radiator structure with respect to the heater element monomer, and utilize screw that printed substrate and radiator are installed,, be difficult to be transmitted to radiator so the heat that is produced by heater element also has the heat of conducting to printed substrate.In addition, closed radiator, so contacting to press and weaken between printed substrate and radiator is difficult to be transmitted on the radiator by the heat of heater element generation owing to tighten up a screw to twist at printed substrate.
Summary of the invention
The present invention develops in view of the above problems, its purpose is to provide a kind of radiator structure of heat generating components, its heat that can will produce from a plurality of heat generating components with single thermal component efficiently to around do not have the location guide of thermal impact and dispel the heat, in addition, the heat that is transmitted on the printed substrate from a plurality of heat generating components is dispelled the heat also same as described abovely.
For realizing described purpose, the invention provides a kind of radiator structure of heat generating components, it will be installed on the heat heat radiation that a plurality of heat generating components on the printed substrate produce, and it is characterized in that, comprise: through hole, its corresponding a plurality of heat generating components are located on the printed substrate; Single thermal component, it has can insert a plurality of heat transmission protuberances that through hole is provided with; Heat conductor, it is between heat transmission protuberance and described heat generating components, by thermal component is contacted with printed substrate, the heat that heat generating components is produced guides and heat radiation to thermal component by heat conducting material, is the direction of the resultant vector c of vector a and vector b from described heat generating components to the coverage of the heat of described printed substrate conduction, described vector a is the heat conducting vector on the facial parallel direction with described printed circuit board (PCB), described vector b is the heat conducting vector on the direction with described facial quadrature, and described thermal component comprises the coverage of described heat and the end of described thermal component is positioned at outside the coverage of described heat.
According to such structure, the heat that produces by heat generating components be situated between by heat conducting material from the heat conduction of heat transmission protuberance to thermal component, in this entire heat dissipation parts diffusion, dispel the heat.Like this, can with the heat that produces from a plurality of heat generating components efficiently to around do not have the location guide of thermal impact and dispel the heat.In addition, the heat that is transmitted on the printed substrate from a plurality of heat generating components also can be dispelled the heat same as described abovely.Can once assemble thermal component, printed substrate and a plurality of thermal component, realize high productivity.
At this, heat generating components is equivalent to for example to follow the rising of power consumption of electronic equipment and the heater element that generates heat, and it is the sheet material of principal component with aluminium for example that thermal component is equivalent to, be the sheet material of principal component with copper and be the sheet material of principal component with iron.
At this, heat conducting material is the material that makes heater element and thermal component carry out thermo-contact, it can be the material of easy deformation, heat conducting material also can be to produce expansion when being clipped by heater element and thermal component, contact area is increased, thereby improve heat conducting material, paste heat conductivity resin is fit to.This heat conductivity resin is the heat conduction filler to be sneaked into resin in the thermohardening epoxy resin etc.
In addition, the radiator structure of heat generating components of the present invention utilizes the heat conduction bonding agent that thermal component is bonded on the printed substrate on the basis of said structure.
According to said structure, can be with the heat that is transmitted to from heat generating components on the printed substrate, promptly the heat that is transmitted on the printed substrate from the lead terminal of heat generating components also can guide to thermal component with high thermoconductivity.
At this, the heat conduction bonding agent is equivalent to for example sneak into the thermal conductive adhesive of heat conduction filler in thermohardening epoxy resin.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, and the size of the corresponding heat generating components of heat transmission protuberance and the shape of heat generating components are selected.
According to said structure, be situated between by the high heat radiation protuberance of heat conductivity the hot heat conduction of a plurality of heat generating components to the heat radiation position, dispel the heat to air from the position of dispelling the heat, thereby obtain high radiating effect.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, thermal component is formed with single monolithic unit by heating panel and a plurality of protuberance and constitutes, and these protuberances is formed use the facial bonding of single monolithic unit and heating panel, is formed with single monolithic unit by each protuberance and forms the heat transmission protuberance.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, and the die stamping machining plate-like thermal component by use has the protuberance forming part forms heat transmission protuberance and this thermal component.
According to such structure, can provide the thermal component of the cheapness of corresponding printed substrate.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, and middle formation at the position of corresponding heat transmission protuberance limited heat conducting recess on the heating panel radiating surface.
Because the existence of the heat conducting recess of above-mentioned restriction reduces the heat that produces between each thermal component and mixes mutually.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, and the position of corresponding heat transmission protuberance is provided with the heat transmission fin on the radiating surface of heating panel.
According to said structure, the heat radiation protuberance high by heat conductivity arrives the heat radiation position with the hot heat conduction of a plurality of heat generating components, and dispelled the heat to air by the heat transmission fin from heat radiation position Jie, thereby obtains higher radiating effect.
In addition, the radiator structure of heat generating components of the present invention is on the basis of said structure, and the heat transmission fin according to its size decision heat dissipation capacity, is selected according to the caloric value of heat generating components respectively.
According to said structure, owing to select the heat transmission fin according to the caloric value of heat generating components, so obtain high radiating effect.
In addition, the radiator structure of heat generating components of the present invention is being equipped with the electronic unit that not wishing except that heat generating components is heated on the printed substrate on the basis of said structure, and this electronic unit is positioned at outside the thermal impact scope.
According to said structure, thermal component is not contacted do not wish the position of the heat of bearing printed substrate, simultaneously, to the electronic unit of not wishing to be heated for example the such electronic unit of electric capacity do not have thermal impact.
In addition, the invention provides a kind of radiator structure of heat generating components, the heat heat radiation with a plurality of heat generating components that are installed on the printed substrate produce is characterized in that, comprising: through hole, and its corresponding heat generating components is located on the described printed substrate; Single thermal component, it is provided with the hole portion of corresponding through hole; The heat transmission piece, it can insert the insertion section, and this insertion section is consistent with through hole and thermal component engaged with printed substrate constitute by the hole portion that makes thermal component; The heat conductivity link, it is connected the heat transmission piece with thermal component; Heat conducting material, it is between heat transmission piece and heat generating components.The heat that Jie is produced heat generating components by heat conducting material is to heat transmission piece and thermal component guiding and heat radiation, is the direction of the resultant vector c of vector a and vector b from described heat generating components to the coverage of the heat of described printed substrate conduction, described vector a is the heat conducting vector on the facial parallel direction with described printed circuit board (PCB), described vector b is the heat conducting vector on the direction with described facial quadrature, and described thermal component comprises the coverage of described heat and the end of described thermal component is positioned at outside the coverage of described heat.
According to said structure, the heat that produces from heat generating components is situated between by heat conducting material to the heat transmission piece and be situated between by the heat conductivity link to thermal component heat conduction, spreads on the whole at this thermal component, dispels the heat.Like this, can with the heat that produces from a plurality of heat generating components efficiently to around do not have the location guide of thermal impact and dispel the heat.In addition, the heat that is transmitted on the printed substrate from a plurality of heat generating components also can be dispelled the heat same as described abovely.Can once assemble thermal component, printed substrate and a plurality of thermal component, realize high productivity.
According to the radiator structure of heat generating components of the present invention, the heat that produces from heat generating components is situated between by heat conducting material to thermal component heat conduction, spreads on the whole at this thermal component, dispels the heat.Like this, can utilize heat that single thermal component will produce from a plurality of heat generating components efficiently to around do not have the location guide of thermal impact and dispel the heat.
Description of drawings
Fig. 1 is the assembling instruction figure of embodiment 1 of the radiator structure of heat generating components of the present invention;
Fig. 2 is the profile along the X-X line of Fig. 1;
Fig. 3 is the sectional arrangement drawing of embodiment 1 of the radiator structure of heat generating components of the present invention;
Fig. 4 is expression is transmitted to the coverage of the heat on the printed substrate from heater element a polar plot;
Fig. 5 is the sectional arrangement drawing of the variation of thermal component;
Fig. 6 is the key diagram of the manufacture method of thermal component;
Fig. 7 is the sectional arrangement drawing of other variation of thermal component;
Fig. 8 is the key diagram that thermal component engages to the printed substrate solder;
Fig. 9 is the plane graph of embodiment 2 of the radiator structure of heat generating components of the present invention;
Figure 10 is the back view of embodiment 2 of the radiator structure of heat generating components of the present invention;
Figure 11 is the profile along the Y-Y line of Fig. 9;
Figure 12 is the sectional arrangement drawing of embodiment 3 of the radiator structure of heat generating components of the present invention;
Figure 13 is among the embodiment 4 of radiator structure of heat generating components of the present invention, thermal component is bonded on the structure key diagram of printed wire board status;
Figure 14 is the sectional arrangement drawing of embodiment 4 of the radiator structure of heat generating components of the present invention.
Symbol description
10, printed wiring board (substrate);
11,12,13, through hole;
14,15,16, heater element (heat generating components);
18, do not wish the electronic unit that is heated;
20, thermal component;
20-1, the thermal component body;
21, heating panel;
22,23,24, protuberance forms uses single monolithic unit;
29, recess;
30, heat conducting material;
40, thermal conductive adhesive;
50, the heat transmission fin;
51,52, hole portion;
53, the piece insertion section;
54, the heat transmission piece;
55, the heat conductivity link.
Embodiment
The example that present invention will be described in detail with reference to the accompanying.
Fig. 1～Fig. 8 represents embodiments of the invention 1.Fig. 1 is the assembling instruction figure of embodiment 1 of the radiator structure of heat generating components of the present invention, and Fig. 2 is the profile along the X-X line of Fig. 1, and Fig. 3 is the sectional arrangement drawing of embodiment 1 of the radiator structure of heat generating components of the present invention.
In Fig. 1～Fig. 3, Reference numeral 10 is printed substrate (below be called substrate), and Reference numeral 20 is thermal components, and Reference numeral 30 is heat conducting materials.
On substrate 10, be formed with a plurality of (3) through hole 11,12,13.And, on the facial 10a of a side of substrate 10, corresponding through hole 11 is provided with the heater element 14 as heat generating components, corresponding through hole 12 is provided with the heater element 15 as heat generating components, corresponding through hole 13 is provided with the heater element 16 as heat generating components, these heater elements 14,15,16 are welded on the printing pad (not shown) that is formed on the substrate 10 by each lead terminal 14A, 15A, 16A with them, are installed on the substrate 10.
At this moment, the bottom surface sections 14C of the element package 14B of heater element 14 be positioned at through hole 11 directly over, the bottom surface sections 15C of the element package 15B of heater element 15 be positioned at through hole 12 directly over, the bottom surface sections 16C of the element package 16B of heater element 16 be positioned at through hole 13 directly over.
In addition, thermal component 20 is formed with single monolithic unit 22,23,24 by aluminum heating panel 21 and a plurality of (3) aluminum protuberance and constitutes, and protuberance forms with single monolithic unit 22 corresponding through holes 11, on through hole 11, can set arbitrarily size, highly in gamut.Protuberance forms with single monolithic unit 23 corresponding through holes 12, has the size that can seamlessly embed in this through hole 12, and its height dimension roughly thickness with substrate 10 is identical.In addition, protuberance forms with single monolithic unit 24 corresponding through holes 13, has the size that can seamlessly embed in this through hole 13, and its height dimension roughly thickness with substrate 10 is identical.
And protuberance forms and is bonded on the facial 21A of heating panel 21 1 sides with single monolithic unit 22,23,24, constitutes heat transmission protuberance 25,26,27 respectively.
Fig. 4 represents from the coverage of heater element 14,15,16 to the heat of substrate 10 conduction.The scope of this thermal impact (direction of thermal diffusion) is defined as the resultant vector c of vector b of the pyroconductivity of the vector a of pyroconductivity of substrate 10 horizontal (directions that are parallel to substrate 10 faces) and substrate 10 vertical (perpendicular to the directions of substrate 10 faces).
Therefore, as shown in Figure 3, thermal component 20 is the size that comprises the scope of the influence of representing resultant vector c at least, and the end of thermal component 20 is positioned at outside the resultant vector c.
And, by in this heat conductivity resin, increasing the character of thermohardening that thermal component 20 and heater element 14,15,16 is fixing, thus, can on heat conducting basis, improve the reliability of welding heater element 14,15,16.In addition, heat conducting material 30 also can use the heat exchange sheet that above-mentioned heat conduction cream is processed into sheet.
In addition, the contact device that substrate 10 is contacted with thermal component 20 can use the heat conducting material with cementability, has for example sneaked into the thermal conductive adhesive 40 of heat conduction filler in thermohardening epoxy resin.
Then, as shown in Figure 3, each heat transmission protuberance 25 at heating panel 21,26,27 facial mounting heat conducting material 30, adhesive-applying 40 on the facial 21a of heating panel 21 1 sides, through hole 11 to substrate 10,12, insert heat transmission protuberance 25 in 13,26,27, the facial 21a of heating panel 21 1 sides is bonded on the facial 10b of substrate 10 opposite sides, at this moment, heat transmission protuberance 25,26,27 damage (giving as security Collapse) heat conducting material 30 by pressure, heat conducting material 30 respectively with heat transmission protuberance 25,26,27 and heater element 13,14,15 element package 13B, 14B, the bottom surface sections 13C of 15B, 14C, 15C carries out the face contact.
In the embodiment 1 of the invention described above, the heat that produces by heater element 13,14,15 by heat conducting material 30 from 25,26,27 heat conduction of heat transmission protuberance to thermal component 20, spread on the whole at this thermal component 20, dispel the heat.
Like this, can utilize heat that a thermal component 20 will produce by a plurality of heater elements 13,14,15 efficiently to around do not have the location guide of thermal impact and dispel the heat.In addition, the heat that is transmitted on the substrate 10 from a plurality of heater elements 13,14,15 also can be dispelled the heat same as described abovely.Can once assemble thermal component 20, substrate 10 and a plurality of thermal component 13,14,15, realize high productivity.
In addition, in the embodiment 1 of the invention described above, bonding protuberance forms with single monolithic unit 22 on the facial 21a of thermal component 21 1 sides, 23,24 and constitute thermal component 20, utilize protuberance to form with single monolithic unit 22,23,24 form heat transmission protuberance 25,26,27, but as shown in Figure 5, facial 21a in heating panel 21 1 sides also can form heat transmission protuberance 25 with this heating panel 21,26,27, in addition, as Figure 6 and Figure 7, also can use model 41 with a plurality of protuberance forming parts 42, by the heat transmission sheet material (tabular thermal component) 43 of punch process aluminum, on heat radiation board 44, form a plurality of heat transmission protuberances 45 with this heat radiation board 44.
In addition, in the embodiment 1 of the invention described above, use thermal conductive adhesive 40 as the contact device that thermal component 20 is contacted with substrate 10, but also can utilize mechanical engagement, for example screw stubbornly closes, solder, clamp etc. substrate 10 is contacted with thermal component 20.In addition, when solder engages, as shown in Figure 8, also projection 46 can be set, projection 46 is carried out solder 47 in the end of substrate 10, in addition, also projection 46 can be inserted in the through hole (not shown) of substrate 10, carry out solder in the end of thermal component 20.
Embodiment 2
Fig. 9～Figure 11 represents embodiments of the invention 2.
Embodiments of the invention 2 are the radiator structures when with heater element 13,14,15 the such electronic unit 18 of not wishing to be heated of electric capacity being installed on substrate 10.
Promptly, on substrate 10, be formed with a plurality of through holes 11,12,13, on the facial 10a of substrate 10 1 sides, corresponding through hole 11 is provided as the heater element 14 of heat generating components, corresponding through hole 12 is provided as the heater element 15 of heat generating components, corresponding through hole 13 is provided as the heater element 16 of heat generating components, in addition, is provided with on the facial 10a of substrate 10 1 sides and does not wish the electronic unit 18 that is heated.And these heater elements 14,15,16 and electronic unit 18 are welded on the printing pad (not shown) that is formed on the substrate 10 by each lead terminal 14A, 15A, 16A, 18A with them, are installed on the substrate 10.
In addition, heat generating components 20 forms position 25b, the 26b that is positioned at corresponding heat transmission teat 25,26,27, the heat conducting recess 29 of restriction in the middle of the 27b on the facial 21b of the opposite side of the radiating surface that constitutes heating panel 21 on the basis of the structure of the heat generating components 20 of the above embodiments 1.
Then, as shown in figure 11, each heat transmission protuberance 25 at heating panel 21,26,27 facial mounting heat conducting material 30, simultaneously, facial 21a adhesive-applying 40 in heating panel 21 1 sides, through hole 11 to substrate 10,12, insert heat transmission protuberance 25 in 13,26,27, the facial 21a of heating panel 21 1 sides is bonded in the facial 10b of substrate 10 opposite sides, at this moment, heat transmission protuberance 25,26,27 damage heat conducting material 30 by pressure, heat conducting material 30 respectively with heat transmission protuberance 25,26,27 and heater element 14,15,16 element package 14B, 15B, the bottom surface sections 14C of 16B, 15C, the contact of 16C face.
In addition, as shown in figure 11, the end 20c of heat generating components 20 surpasses the scope by the thermal impact shown in the resultant vector c, and electronic unit 18 is positioned at outside the scope of thermal impact.
As mentioned above, according to embodiments of the invention 2, the heat that produces by heater element 14,15,16 by heat conducting material 30 from 25,26,27 heat conduction of heat transmission protuberance to thermal component 20, spread on the whole at this thermal component 20, dispel the heat, on the other hand, the heat that is produced by heater element 14,15,16 does not influence heating part 18.In addition, the heat that is transmitted on the substrate 10 from a plurality of thermal components 14,15,16 also can be dispelled the heat same as described abovely.
In addition, according to embodiments of the invention 2, owing to be formed with the heat conducting recess 29 of restriction of the centre of the position 25a, the 26a that are positioned at corresponding heat transmission protuberance 25,26,27,27a at the facial 21b of heating panel 21 opposite sides, mix mutually so reduce the heat of generation between each heat dissipation element 14,15,16.
According to embodiments of the invention 2, the coverage that is transmitted to the heat on the substrate 10 from heater element 14,15,16 be parallel to substrate 10 faces direction pyroconductivity vector a and with the direction of the resultant vector c of the vector b of the pyroconductivity of the direction of facial quadrature, because the end 20c of thermal component 20 is positioned at outside the scope of thermal impact at least, so can not make thermal component 20 contact substrates 10 not wish the position that is heated.
Embodiment 3
Figure 12 represents embodiments of the invention 3.
Embodiments of the invention 3 are on the basis of the embodiment 2 of the invention described above, form following radiator structure, under the state of removing recess 29, on position 25b, the 26b corresponding on the facial 21b of heating panel 21 opposite sides, 27b, engage heat transmission fin 50 respectively with heat transmission protuberance 25,26,27.
These heat transmission fin 50 determine heat dissipation capacity according to size separately, select according to the caloric value of heater element 14,15,16.
Embodiment 3 according to the invention described above, the heat that produces by heater element 14,15,16 by heat conducting material 30 from heat transmission protuberance 25,26,27 to thermal component 20 heat conduction, diffusion on these entire heat dissipation parts 20, dispel the heat, on the other hand, utilize each heat transmission fin 29 to dispel the heat.Therefore, the heat that is produced by heater element 14,15,16 does not influence heating part 18.Particularly, thus, obtain higher radiating effect because the existence of heat transmission fin 29 is dispelled the heat from the heat radiation position heat of heater element 14,15,16 to air.
Embodiment 4
Figure 13 and Figure 14 represent embodiments of the invention 4.
In embodiments of the invention 4, thermal component 20 has and is provided with corresponding through hole 11,12 hole portion 51,52 thermal component body 20-1, thermal component 20 is engaged with printed substrate 10, make hole portion 51,52 with through hole 11,12 unanimities, constitute piece insertion section 53, in these piece insertion sections 53, insert heat transmission piece 54, simultaneously, by heat conductivity link 55 these heat transmission pieces 54 are connected with thermal component body 20-1, make heat conducting material 30 between heat transmission piece 54 and heat generating components 20, by heat conducting material 30 with heater element 14,15 heat that produce are to heat generating components 20 guiding and heat radiation.
According to the embodiment 4 of the invention described above, the heat that produces by heater element 13,14 by thermal conductive adhesive 40 from heat transmission piece 54 via 55 heat conduction of heat conductivity link to thermal component 20, spread on the whole at this thermal component 20, dispel the heat.
Utilizability on the industry
In the radiator structure of heat generating components of the present invention, pass through heat conducting material by the heat that heat generating components produces Heat is transmitted on the thermal component, spreads at this whole thermal component, dispels the heat. Like this, can utilize Heat that single thermal component will be produced by a plurality of heat generating components efficiently to around do not have heat affecting Location guide and heat radiation. In addition, the heat that is transmitted on the printed substrate by a plurality of heat generating components also can be with upper State in the same manner and dispelled the heat. But once mounting thermal component, printed substrate and a plurality of heat generating components have Can realize the effect of high productivity, to radiator structure of the heat generating components of the electronic equipments such as thermoregulator etc. Useful.
Claims (10)
1. the radiator structure of a heat generating components dispels the heat the heat that a plurality of heat generating components that are installed on the printed substrate produce, and it is characterized in that, comprising: through hole, and its corresponding described heat generating components is located on the described printed substrate; Single thermal component, it has can insert a plurality of heat transmission protuberances that described through hole is provided with; Heat conducting material, it is between described heat transmission protuberance and described heat generating components, by described thermal component is contacted with described printed substrate, the heat that described heat generating components produces is dispelled the heat, is the direction of the resultant vector c of vector a and vector b from described heat generating components to the coverage of the heat of described printed substrate conduction, described vector a is the heat conducting vector on the facial parallel direction with described printed circuit board (PCB), described vector b is the heat conducting vector on the direction with described facial quadrature, and described thermal component comprises the coverage of described heat and the end of described thermal component is positioned at outside the coverage of described heat.
2. the radiator structure of heat generating components as claimed in claim 1 is characterized in that, utilizes the heat conduction bonding agent that described thermal component is bonded on the described printed substrate.
3. the radiator structure of heat generating components as claimed in claim 1 is characterized in that, the size of the corresponding described heat generating components of described heat transmission protuberance and the shape of described heat generating components are selected.
4. the radiator structure of heat generating components as claimed in claim 1, it is characterized in that, described thermal component is formed with single monolithic unit by heating panel and a plurality of protuberance and constitutes, these protuberances formation are bonded on the face of described heating panel with single monolithic unit, form with single monolithic unit by each described protuberance and form described heat transmission protuberance.
5. the radiator structure of heat generating components as claimed in claim 1 is characterized in that, the die stamping machining plate-like thermal component by use has the protuberance forming part forms described heat transmission protuberance and this thermal component.
6. the radiator structure of heat generating components as claimed in claim 4 is characterized in that, the centre at the position of corresponding described heat transmission protuberance on the radiating surface of described heating panel forms the heat conducting recess of restriction.
7. the radiator structure of heat generating components as claimed in claim 4 is characterized in that, the position of corresponding described heat transmission protuberance on the radiating surface of described heating panel is provided with the heat transmission fin.
8. the radiator structure of heat generating components as claimed in claim 7 is characterized in that, described heat transmission fin is selected according to the caloric value of described heat generating components according to its size decision heat dissipation capacity separately.
9. the radiator structure of heat generating components as claimed in claim 1 is characterized in that, the electronic unit that not wishing except that described heat generating components is heated is being installed on the described printed substrate, and this electronic unit is positioned at outside the described heat conduction scope.
10. the radiator structure of a heat generating components dispels the heat the heat that a plurality of heat generating components that are installed on the printed substrate produce, and it is characterized in that, comprising: through hole, and its corresponding described heat generating components is located on the described printed substrate; Single thermal component, it is provided with the hole portion of corresponding described through hole; The heat transmission piece, it can insert the insertion section, and this insertion section is consistent with described through hole and described thermal component engaged with described printed substrate constitute by the hole portion that makes described thermal component; The heat conductivity link, it is connected described heat transmission piece with described thermal component; Heat conducting material, its between described heat transmission piece and described heat generating components,
The heat that Jie is produced described heat generating components by described heat conducting material is to described heat transmission piece and guiding of described thermal component and heat radiation,
Is the direction of the resultant vector c of vector a and vector b from described heat generating components to the coverage of the heat of described printed substrate conduction, described vector a is the heat conducting vector on the facial parallel direction with described printed circuit board (PCB), described vector b is the heat conducting vector on the direction with described facial quadrature, and described thermal component comprises the coverage of described heat and the end of described thermal component is positioned at outside the coverage of described heat.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004145567A JP4433875B2 (en) | 2004-05-14 | 2004-05-14 | Heat dissipating structure of heat generating component and method of manufacturing heat dissipating member in this heat dissipating structure |
| JP145567/04 | 2004-05-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1697603A CN1697603A (en) | 2005-11-16 |
| CN100376127C true CN100376127C (en) | 2008-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100726620A Active CN100376127C (en) | 2004-05-14 | 2005-05-16 | Heating element radiating structure |
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|---|---|
| JP (1) | JP4433875B2 (en) |
| CN (1) | CN100376127C (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156610A (en) * | 2004-11-29 | 2006-06-15 | Nidec Copal Electronics Corp | Circuit board |
| FR2901347B1 (en) * | 2006-05-22 | 2008-07-18 | Valeo Vision Sa | THERMAL DISSIPATING COMPONENT AND DIODE LIGHTING AND / OR SIGNALING DEVICE EQUIPPED WITH SUCH A COMPONENT |
| US8575746B2 (en) | 2006-07-20 | 2013-11-05 | Samsung Electronics Co., Ltd. | Chip on flexible printed circuit type semiconductor package |
| JP5124347B2 (en) * | 2008-05-29 | 2013-01-23 | アピックヤマダ株式会社 | Semiconductor mounting substrate and manufacturing method thereof |
| JP5388598B2 (en) * | 2008-11-14 | 2014-01-15 | カルソニックカンセイ株式会社 | Element heat dissipation structure |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03187295A (en) * | 1989-12-15 | 1991-08-15 | Fujitsu Ltd | Head supporting arm |
| JPH05160306A (en) * | 1991-12-05 | 1993-06-25 | Fujitsu Ltd | Heat radiation structure |
| JPH05206338A (en) * | 1991-10-08 | 1993-08-13 | Lsi Logic Corp | Assembly of semiconductor device provided with heat sink |
| JPH05315712A (en) * | 1992-05-13 | 1993-11-26 | Ibiden Co Ltd | Substrate equipped with heat sink for mounting electronic component and manufacture thereof |
| US5548482A (en) * | 1994-08-26 | 1996-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit apparatus including clamped heat sink |
| JP2000196269A (en) * | 1998-12-25 | 2000-07-14 | Toshiba Corp | Circuit module |
| US6297959B1 (en) * | 1998-12-07 | 2001-10-02 | Pioneer Corporation | Radiation structure for heating element |
-
2004
- 2004-05-14 JP JP2004145567A patent/JP4433875B2/en not_active Expired - Fee Related
-
2005
- 2005-05-16 CN CNB2005100726620A patent/CN100376127C/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03187295A (en) * | 1989-12-15 | 1991-08-15 | Fujitsu Ltd | Head supporting arm |
| JPH05206338A (en) * | 1991-10-08 | 1993-08-13 | Lsi Logic Corp | Assembly of semiconductor device provided with heat sink |
| JPH05160306A (en) * | 1991-12-05 | 1993-06-25 | Fujitsu Ltd | Heat radiation structure |
| JPH05315712A (en) * | 1992-05-13 | 1993-11-26 | Ibiden Co Ltd | Substrate equipped with heat sink for mounting electronic component and manufacture thereof |
| US5548482A (en) * | 1994-08-26 | 1996-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit apparatus including clamped heat sink |
| US6297959B1 (en) * | 1998-12-07 | 2001-10-02 | Pioneer Corporation | Radiation structure for heating element |
| JP2000196269A (en) * | 1998-12-25 | 2000-07-14 | Toshiba Corp | Circuit module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005327940A (en) | 2005-11-24 |
| CN1697603A (en) | 2005-11-16 |
| JP4433875B2 (en) | 2010-03-17 |
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