FR3065114B1 - ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE - Google Patents
ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE Download PDFInfo
- Publication number
- FR3065114B1 FR3065114B1 FR1753150A FR1753150A FR3065114B1 FR 3065114 B1 FR3065114 B1 FR 3065114B1 FR 1753150 A FR1753150 A FR 1753150A FR 1753150 A FR1753150 A FR 1753150A FR 3065114 B1 FR3065114 B1 FR 3065114B1
- Authority
- FR
- France
- Prior art keywords
- electrical device
- electronic
- electronic unit
- raised portion
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
Abstract
L'invention a pour objet un dispositif électrique (10), notamment pour un convertisseur de tension, le dispositif électrique (10) comprenant : - une unité électronique (20) comprenant au moins un orifice traversant (22), - un composant électronique (30) supporté par l'unité électronique (20), au moins une partie d'une face (32) du composant électronique, dite face de contact, étant agencée en vis-à-vis du au moins un orifice traversant (22) de l'unité électronique (20), - une pièce (40) formant un drain thermique, réalisée en matériau conducteur thermiquement, la pièce (40) comprenant une portion en relief (42), dans lequel la portion en relief (42) de la pièce (40) coopère avec l'orifice traversant (22) de l'unité électronique (20) de sorte que la portion en relief (42) de la pièce (40) est en contact avec la face (32) de contact du composant électronique (30).The invention relates to an electrical device (10), in particular for a voltage converter, the electrical device (10) comprising: - an electronic unit (20) comprising at least one through orifice (22), - an electronic component ( 30) supported by the electronic unit (20), at least part of a face (32) of the electronic component, called the contact face, being arranged opposite the at least one through orifice (22) of the electronic unit (20), - a part (40) forming a heat sink, made of thermally conductive material, the part (40) comprising a raised portion (42), in which the raised portion (42) of the part (40) cooperates with the through hole (22) of the electronic unit (20) so that the raised portion (42) of the part (40) is in contact with the contact face (32) of the component electronic (30).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1753150A FR3065114B1 (en) | 2017-04-11 | 2017-04-11 | ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1753150 | 2017-04-11 | ||
FR1753150A FR3065114B1 (en) | 2017-04-11 | 2017-04-11 | ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3065114A1 FR3065114A1 (en) | 2018-10-12 |
FR3065114B1 true FR3065114B1 (en) | 2019-12-20 |
Family
ID=59031185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1753150A Active FR3065114B1 (en) | 2017-04-11 | 2017-04-11 | ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3065114B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3093396A1 (en) * | 2019-02-28 | 2020-09-04 | Valeo Systemes Thermiques | ELECTRONIC BOARD AND ASSOCIATED ASSEMBLY TO CONTROL A MOTOR-FAN GROUP OF A MOTOR VEHICLE |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920458A (en) * | 1997-05-28 | 1999-07-06 | Lucent Technologies Inc. | Enhanced cooling of a heat dissipating circuit element |
KR100555546B1 (en) * | 2004-01-08 | 2006-03-03 | 삼성전자주식회사 | IC cooling device and disc drive using the same |
JP4433875B2 (en) * | 2004-05-14 | 2010-03-17 | オムロン株式会社 | Heat dissipating structure of heat generating component and method of manufacturing heat dissipating member in this heat dissipating structure |
SE529673C2 (en) * | 2004-09-20 | 2007-10-16 | Danaher Motion Stockholm Ab | Circuit arrangement for cooling surface-mounted semiconductors |
US8592825B2 (en) * | 2010-07-27 | 2013-11-26 | Sumitomo Electric Industries Ltd. | Semiconductor device having Si-substrate and process to form the same |
FR2984679B1 (en) * | 2011-12-15 | 2015-03-06 | Valeo Sys Controle Moteur Sas | THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING CONNECTION BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A RADIATOR IN ALL OR METALLIC PORTION |
CN103167787B (en) * | 2013-03-13 | 2016-03-02 | 温州市三立电子科技有限公司 | Electric vehicle controller and comprise the vehicle of described electric vehicle controller |
JP6457206B2 (en) * | 2014-06-19 | 2019-01-23 | 株式会社ジェイデバイス | Semiconductor package and manufacturing method thereof |
-
2017
- 2017-04-11 FR FR1753150A patent/FR3065114B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3065114A1 (en) | 2018-10-12 |
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