JP6625496B2 - Electronic control unit - Google Patents

Description

  The present invention relates to an electronic control device.

  As a background of the present technical field, there is JP 2010-40583 A (Patent Document 1). This publication discloses that “the base 26 is adhered to the back surface of the circuit board 22 on which the electronic components 21 a, 21 b, and 21 c are mounted, and the radiator plate 28 is adhered to the lower surface of the base 26. And a plurality of circular openings 30a arranged in a zigzag pattern on the lower surface side of the resin sealing portion 30 while covering the upper and lower surfaces of the base 26 and the heat radiating plate 28. Thereby, heat generation of the electronic components 21a, 21b, 21c. Can be efficiently radiated from the plurality of openings 30 a through the circuit board 22, the base 26, and the heat radiating plate 28 in order, and the heat radiating plate 28 is formed at a portion of the resin sealing portion 30 where the opening 30 a is not formed. It is possible to suppress the occurrence of interface peeling between the heat radiating plate 28 and the resin sealing portion 30 by holding the heat radiating plate 28. As a result, it is possible to improve the heat radiating performance while ensuring the reliability. " Is (see Abstract).

JP-A-2010-40583

  When the electronic control device is mounted on an automobile, a construction machine, or a railway vehicle, the electronic control device needs to be reduced in size and weight. However, when the size of the electronic control device is reduced, the amount of heat generated per unit area increases, so that high heat dissipation is also required.

  Further, an electronic control device mounted in an engine room of an automobile, particularly near an engine in a high-temperature environment, or inside a transmission, is required to have higher heat dissipation and a longer life of a connection portion than other electronic control devices. .

  For such an electronic control device, as a configuration for efficiently dissipating the heat generated by the heat-generating components to be mounted, for example, in Patent Document 1, a ceramic substrate is bonded to a metal plate serving as a heat diffusion plate, There is disclosed an electronic control device in which a connection terminal and the whole except a part of a housing plate are integrally molded with a thermosetting resin.

  Further, the electronic control device of Patent Document 1 has a structure in which heat is radiated through a substrate on which heat-generating components are mounted and a metal heat diffusion plate, so that a ceramic substrate having higher thermal conductivity than an organic substrate is used. Used. Since the ceramic substrate is more expensive than the organic substrate, there is a problem that the cost of the electronic control device is increased.

  In addition, when the technology for improving heat dissipation by reducing a part of the sealing resin disclosed in the Patent Document 1 is used in an electronic control device installed in the atmosphere such as an engine room, In the disclosed structure, in the sealing resin injection process, the sealing resin cannot be sufficiently filled due to the flow resistance of the sealing resin in the region where the sealing resin layer is thinned, and the heat insulation by the air layer In some cases, a layer is formed, the thermal resistance increases, and the effect of improving heat dissipation cannot be sufficiently exhibited.

  Therefore, the present invention provides an electronic control device having good heat dissipation efficiency.

The present invention has been made in view of the above problems, and includes, for example, a substrate on which an electronic component is mounted, and a metal housing in which the substrate is sealed with a resin, which faces the electronic component of the metal housing. The surface opposite to the surface has a heat radiating portion, and the surface of the metal housing facing the electronic component has a plurality of protrusions in the direction of the electronic component and a plate-like shape facing the direction of the plurality of protrusions. and a member, the electronic component and the surface facing the metal housing, the heat radiating portion and between the electronic part, closest to the second to the first projection and the first projection of the plurality of projections An electronic control device having a groove formed between the projection and the projection .

  According to the present invention, it is possible to provide an electronic control device with good heat dissipation efficiency.

FIG. 1 is a perspective view schematically illustrating an example of an external appearance of an electronic control device according to a first embodiment of the present invention. FIG. 2 is a perspective view of a metal housing of the electronic control device according to the first embodiment of the present invention as viewed from a wiring board mounting surface side. It is the principal part perspective view which expanded the surface facing the heat generating component of the metal housing | casing in 1st Embodiment of this invention. It is an AA sectional view of an electronic control unit in a 1st embodiment of the present invention. FIG. 2 is an enlarged view of the vicinity of the heat-generating component in the electronic control unit AA cross-sectional view according to the first embodiment of the present invention. FIG. 9 is a perspective view of a metal housing of the electronic control device of Comparative Example 1 as viewed from a wiring board mounting side. FIG. 4 is a diagram illustrating a resin filling area ratio in a space between a heat generating component and a metal housing in the electronic control devices of Example 1 and Comparative Example 1. It is the perspective view which looked at the metal case of the electronic control unit in a 2nd embodiment of the present invention from the wiring board attachment surface side. It is the principal part perspective view which expanded the surface facing the heat generating component of the metal housing | casing in 2nd Embodiment of this invention. FIG. 13 is a perspective view of a metal housing of the electronic control device of Comparative Example 2 as viewed from a wiring board mounting side. FIG. 11 is a diagram illustrating a resin filling area ratio in a space between a heat generating component and a metal housing in the electronic control devices of Example 2 and Comparative Example 2. It is the perspective view which looked at the metal case of the electronic control unit in a 3rd embodiment of the present invention from the wiring board attaching surface. It is the perspective view which expanded the surface which faces the heat generating component in 3rd Embodiment of this invention. 9 is a resin filling area ratio in a space between a heat generating component and a metal housing in the electronic control devices of Example 3 and Comparative Example 2. It is a figure showing the modification of the metal case of the electronic control unit in a 3rd embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, functionally identical elements may be denoted by the same numbers. Although the drawings show specific embodiments and examples in accordance with the principle of the present invention, they are for understanding of the present invention, and are used to limit the present invention in a limited manner. It is not something that can be done.

  Although the embodiments described below are described in sufficient detail for those skilled in the art to carry out the present invention, other implementations and forms are possible and depart from the scope and spirit of the technical idea of the present invention. It is necessary to understand that the configuration, structure, dimensions, and various elements can be changed without performing the above. Therefore, the following description should not be construed as being limited thereto.

~ First embodiment ~
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view schematically showing an example of the electronic control device according to the first embodiment of the present invention. FIG. 2 is a perspective view of the electronic control unit according to the first embodiment of the present invention, in which the metal housing is viewed from a wiring board mounting side. FIG. 3 is an enlarged perspective view of a surface of the metal housing facing the heat-generating component according to the first embodiment of the present invention shown in FIG. FIG. 4 is an AA cross-sectional view of the electronic control unit according to the first embodiment of the present invention.

  As shown in FIGS. 1 to 4, in the electronic control device 1, a wiring board 6 on which a heat-generating component 5 is mounted is fixed to a metal housing 2, and the wiring board 6 is sealed with a resin 3. The metal housing 2 and the wiring board 6 are fixed by, for example, screws at fixing portions 7 at four corners. Transmission and reception of power and control signals between the outside and the electronic control unit 1 are performed via a plurality of connector pins 4 connected to a wiring board 6.

  Further, a metal housing 2 provided with a plurality of heat radiating fins 2a (heat radiating portions) is disposed at a position facing the heat generating components 5 (heat generating portions) such as electronic components mounted on the wiring board 6. The thickness of the sealing resin 3 in the region where the heat generating component 5 is arranged is smaller than the thickness of the region around the heat generating component 5. The metal housing 2 has a groove 2b (groove) substantially parallel to the radiation fin 2a in a region where the heat-generating component 5 is arranged. As a result, even if the sealing resin 3 is thinner than the thickness of the peripheral region of the heat-generating component 5, the area where the sealing resin 3 contacts the metal housing 2 below the radiating fin 2a is increased, so that heat is efficiently transferred to the radiating fin. Can tell.

  FIG. 5 is an enlarged view of the vicinity of the heat-generating component in the electronic control unit AA cross-sectional view according to the first embodiment of the present invention. As shown in FIG. 5, the heat generating component 5 includes a heat generating element 5a, a heat spreader 5b on which the heat generating element 5a is mounted, a terminal 5c, and a component sealing resin 5d. The heat generating component 5 is mounted on the wiring board 6 with a bonding material 9 such as solder. The heat generating component 5 and the wiring board 6 transmit and receive power, signals, and the like via the terminals 5 c and the solder 9. The heat spreader 5b is installed on the surface of the heat-generating component 5 opposite to the wiring board 6, and the surface is exposed on the groove 2b side. The heat generated by the heat generating element 5a and the like is conducted to the metal housing 2 provided with the groove 2b via the heat spreader 5b and the sealing resin 3, and is radiated by being transmitted to the outside from the radiation fin 2a.

  Such an electronic control unit 1 is manufactured by the following method. First, a bonding material 9 is supplied to a desired position on the wiring board 6 by screen printing or the like, and an electronic component is mounted thereon. The heat generating component 5 is a part of a mounted electronic component. After mounting the electronic component, the solder 9 is melted in a reflow furnace or the like, and the wiring board 6 and the terminal 5c of the heat generating component 5 are connected.

  After mounting the electronic components, the wiring board 6 is fixed to the metal housing 2. After fixing, the connector pins 4 are connected to the wiring board 6 by partial flow soldering, robot soldering, press-fitting, or the like. A waterproof adhesive 10 is supplied between the connector housing 8, which is a holder for the connector pins 4, and the metal housing 2 by dispensing or the like, and the connector housing 8 and the metal housing 2 are bonded.

  After the waterproof adhesive 10 is cured by heating or the like, it is fixed to a mold (not shown), and the sealing resin 3 is supplied and sealed by transfer molding or injection molding. The sealing resin 3 is provided with a gate between the two connector pin 4 fixing through holes 2 e so that the sealing resin 3 flows into the radiation fins 2 a and the grooves 2 b substantially in parallel. A resin inflow gate (not shown) is provided between the through-holes 2 e for passing the two connector pins 4 so that the sealing resin 3 flows into the heat radiation fins 2 a substantially in parallel. This prevents the glass fibers dispersed in the sealing resin 3 from being biased and causing a variation in strength in the electronic control unit 1.

  Further, when the electronic control device 1 is sealed with the sealing resin 3, the surface 21 of the metal housing 2 provided with the heat radiation fins 2 a is not covered with the sealing resin 3 so that the surface 21 is sealed. Heat dissipation can be improved as compared with the case where the resin is covered with a sealing resin.

  In the present embodiment, a wiring board 6 on which electronic components including a heat-generating component 5 are mounted is fixed to the metal housing 2, and a connector housing 8 having connector pins 4 for receiving power and communicating with the outside is connected to waterproof. After bonding the connector 8 and the metal housing 2 with the adhesive 10, the wiring board 6, the electronic component, and the metal housing are sealed with the sealing resin 3.

  The metal casing 2 has a groove 2b in a region opposite to the surface having the heat radiation fins 2a and facing the heat spreader 5b of the heat generating component 5. A groove 2b is provided on the side of the metal housing 2 on which the wiring board 6 is fixed, so that the unfilled portion of the sealing resin 3 between the heat spreader 5b of the heat generating component 5 and the metal housing 2 is less than 5% of the area of the heat spreader 5b. By doing so, it is possible to provide the electronic control device 1 that achieves both electromagnetic noise resistance and heat dissipation.

  As the first embodiment, an ASIC having lead-shaped terminals is used for the heat-generating component 5. As the bonding material 9, a solder having a composition of Sn (tin) -3.0 Ag (silver) -0.5 Cu (copper) (unit: wt%) is used, and the terminal 5 c of the ASIC is connected to the wiring board 6. An FR4 (printed circuit board) having a size of 72 mm x 86 mm, a thickness of 1.6 mm, an equivalent thermal conductivity in the in-plane direction of 23 W / mK, and an equivalent thermal conductivity in the vertical direction of 0.68 W / mK is used as the wiring board 6. .

  As the metal housing 2, a forged product having a thermal conductivity of 96 W / mK and a composition of ADC12 is used. Copper having a thermal conductivity of 260 W / mK is used as the connector pins 4. As the connector housing 8, PBT containing 30% of glass fiber is used. A thermosetting epoxy resin is used for the waterproof adhesive 10 between the metal housing 2 and the connector housing 8. The metal housing 2 and the wiring board 6 are fixed by screws at the fixing portion 7.

  The connector pins 4 and the wiring board 6 are connected using a solder having the same composition as the above-mentioned solder. The sealing resin 3 flows from a mold (not shown) substantially in parallel with the heat radiation fins 2 a of the metal housing 2.

  The appearance and the cross-sectional structure of the first embodiment are as shown in FIGS. The external dimensions of the heat generating component 5 excluding the terminals are 24 mm × 24 mm, and the external dimensions of the heat spreader 5 b are 12 mm × 12 mm. The grooves 2b provided in the region of the metal housing 2 facing the heat-generating components are 2 mm wide and 30 mm long, and are provided at intervals of 4 mm.

  FIG. 6 is a perspective view of the metal housing of the electronic control device of Comparative Example 1 as viewed from the side where the wiring board is mounted. As Comparative Example 1, the structure of the electronic control device 1 using the metal housing 2 having no groove is employed. The configuration of Example 1 and Comparative Example 1 is the same except for the presence or absence of the groove 2b.

  FIG. 7 is a diagram illustrating a resin filling area ratio in a space between a heat generating component and a metal housing in the electronic control devices of Example 1 and Comparative Example 1. In addition, the resin filling area ratio referred to in the present application refers to the area of the electronic control device that can be filled with the sealing resin when the electronic control device is viewed from the vertical direction with respect to the substrate. The figure shows the ratio of the area of the sealing resin layer filled in the electronic control device without the layer.

  As shown in FIG. 7, the resin filling area ratio between the heat generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having the groove 2 b of the first embodiment is smaller than that of the groove 2 b of the comparative example 1. It is 10% higher than the resin filling area ratio between the heat generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having no metal housing.

  In the electronic control device 1 in which the electronic components (heat generating components 5) mounted on the wiring board 6 are sealed with the sealing resin 3, the radiation fins 2a are provided at positions facing the electronic components mounted on the wiring board 6. The provided metal housing 2 is arranged. The thickness of the sealing resin 3 in the region where the electronic components are arranged is smaller than the thickness of the peripheral region. The metal housing 2 has a groove 2b substantially parallel to the heat radiation fin 2a in a region where the electronic components are arranged.

  By providing such an electronic control device 1, when the sealing resin 2 is injected into the electronic control device 1, the flow resistance of the sealing resin 3 between the electronic component and the metal housing causes the sealing of the groove 2 b to be performed. Since the flow resistance of the sealing resin 3 is small, the sealing resin 3 easily passes through the groove, and the resin spreads between the electronic component and the heat-generating component from the groove. As a result, the resin filling area ratio of the first embodiment can be higher than that of the comparative example 1.

  If the resin filling area ratio between the heat generating component 5 and the metal housing 2 is improved, the air layer existing between the heat generating component 5 and the metal housing 2 is reduced. As a result, the thermal resistance between the heat-generating component 5 and the metal housing 2 is reduced, and the heat dissipation is improved. Then, even if heat such as element operation or environmental temperature change is applied, heat can be efficiently radiated, so that the load of thermal stress can be suppressed, and the strain acting on the bonding material 9 is reduced. Thereby, a longer life of the bonding material 9 can be expected.

-2nd Embodiment-
A second embodiment will be described with reference to FIGS. FIG. 8 is a perspective view of a metal housing of the electronic control device according to the second embodiment of the present invention as viewed from a wiring board mounting surface side. FIG. 9 is an enlarged perspective view of a main part of a metal housing according to a second embodiment of the present invention, in which a surface facing a heat-generating component is enlarged.

  In the electronic control unit 1 according to the second embodiment, the heat radiation fins of the metal housing 2 of the electronic control device 1 are provided, and the surface 22 opposite to the surface 21 is provided with a protrusion 2c on the heat-generating component side. Has a groove 2b substantially parallel to the radiation fin 2a. Other configurations are the same as those of the first embodiment. Therefore, the description of the same parts as those of the first embodiment will not be repeated.

  The protrusion 2c formed from the surface 22 opposite to the surface 21 of the metal housing 2 provided with the heat radiation fins 2a toward the region where the heat generating component 5 is arranged is 16 mm × 16 mm and 1 mm thick. . The groove 2b provided in the projection 2c has a width of 1 mm. The depth of the groove 2b is the same as the surface 22 of the metal housing 2, that is, the depth is 1 mm. Three grooves 2b are provided at a pitch of 5 mm, which is the same pitch as the radiation fins 2a. Other configurations are the same as those of the first embodiment.

  FIG. 10 is a perspective view of a metal housing of the electronic control device of Comparative Example 2 as viewed from a wiring board mounting side. The configuration of Comparative Example 2 is the same as that of the metal housing 2 used in Example 2 except that it has no groove 2b.

  FIG. 11 is a diagram illustrating a resin filling area ratio in a space between the heat generating component and the metal housing in the electronic control devices of the second embodiment and the second comparative example. As shown in FIG. 11, the resin filling area ratio between the heat generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having the protrusion 2c provided with the groove 2b according to the second embodiment is a comparative example. The resin filling area ratio between the heat-generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having the protrusion 2c having no groove 2b is 7% higher.

  The flow resistance of the sealing resin 3 flowing between the region other than the groove 2 b of the protrusion 2 c provided on the metal housing 2 and the heat generating component 5 is equal to the flow resistance of the region of the groove 2 b of the protrusion 2 c provided on the metal housing 2. 5 is higher than the flow resistance of the sealing resin 3 flowing between them.

  Further, a gate is provided on a mold (not shown) so that the sealing resin 3 flows substantially parallel to the heat radiation fins 2a. Therefore, by providing the groove 2b, it is possible to improve the filling property of the sealing resin 3 between the heat-generating component 5 and the projection 2c, which is difficult to be filled with the resin 3.

  As described above, if the resin filling area ratio between the heat generating component 5 and the metal housing 2 is improved, the air layer existing between the heat generating component 5 and the metal housing 2 is reduced. As a result, the thermal resistance between the heat-generating component 5 and the metal housing 2 is reduced, and the heat dissipation is improved. Then, even if heat such as element operation or environmental temperature change is applied, heat can be efficiently radiated, so that the load of thermal stress can be suppressed, and the strain acting on the bonding material 9 is reduced. Thereby, a longer life of the bonding material 9 can be expected.

  Also, when the groove 2b provided on the projection 2c has the same pitch as the radiating fin 2a, and the center of the groove 2b and the center of the radiating fin 2a are the same, the metal casing 2 provided with the groove 2b is thinned. However, a reduction in the strength of the metal housing 2 can be prevented.

-Third embodiment-
A third embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a perspective view of the metal housing of the electronic control device according to the third embodiment of the present invention as viewed from the wiring board mounting surface. FIG. 13 is an enlarged perspective view of a surface facing a heat-generating component according to the third embodiment of the present invention.

  The radiation fin 2a of the metal casing 2 of the electronic control device 1 in the third embodiment is provided with a projection 2c on the heat-generating component 5 side on a surface 22 opposite to the surface 21. The projection 2c is a radiation fin. It has a groove 2b substantially parallel to 2a. A rectifying plate 2d for changing the flow direction of the resin 3 to the direction of the protrusion 2c is provided in a region other than the protrusion 2c on the surface 22 of the metal housing 2. Other configurations are the same as those of the first embodiment and the second embodiment.

  The protrusion 2c has a length and width of 16 mm × 16 mm and a height of 1 mm formed from the surface 22 opposite to the surface 21 of the metal housing 2 on which the heat radiation fins 2 a are provided, toward the region where the heat generating component 5 is arranged. . The groove 2b provided in the projection 2c has a width of 1 mm. The depth of the groove 2b is the same as the surface 22 of the metal housing 2, that is, 1 mm. The dimensions of the current plate 2d are 1 mm in width and 1.5 mm in height. A total of six straightening plates 2d are provided between the projections 2c and the through holes 2e for the connector pins 4 and the connector housing 8. The angle θ between the current plate 2d and the groove 2b is 45 degrees, 60 degrees, and 75 degrees, respectively. Other configurations are the same as those of the first and second embodiments.

  FIG. 14 is a diagram illustrating a resin filling area ratio in a space between a heat generating component and a metal housing in the electronic control devices of the third embodiment and the second comparative example. As shown in FIG. 14, the resin filling area ratio between the heat-generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having the protrusion 2 c with the groove 2 b and the rectifying plate 2 d of the third embodiment is: The resin filling area ratio between the heat generating component 5 and the metal housing 2 in the electronic control device 1 employing the metal housing 2 having the protrusion 2c without the groove 2b of the comparative example 1 is 10% higher. .

  This is because, by providing the rectifying plate 2d around the protrusion 2c having the groove 2b provided on the metal housing 2, the flow resistance of the sealing resin 3 is higher than that of the surroundings between the protrusion 2c and the metal housing 2. This is because the flow vector of the resin 3 can be directed. In addition, a plurality of rectifying plates 2d are provided with the protrusions 2c interposed therebetween, and the angle θ formed between the groove 2b and the rectifying plate 2d from the upstream side of the sealing resin 3 is increased, so that the number of the rectifying plates 2d is larger than in the case where one rectifying plate is provided. Of the sealing resin 3 can be poured between the projection 2c and the metal housing 2. As a result, the resin filling area ratio of the resin 3 between the protrusion 2c and the metal housing 2 can be improved.

  FIG. 15 is a modified view of the metal housing of the electronic control unit according to the third embodiment of the present invention. As shown in FIG. 15, it is needless to say that the function and effect of the present invention can be obtained as long as the position where the current plate 2 d is provided is a position where the flow direction of the sealing resin 3 can be directed to the protrusion 2 c. Nor.

  As described above, the viscosity and the position of the sealing resin 3 are changed by providing the groove 2b in the area facing the heat-generating component 5 on the surface 22 opposite to the surface 21 on which the radiation fins 2a of the metal housing 2 are provided. Without this, the resin filling area ratio of the resin 3 in the region between the heat generating component 5 and the metal housing 2 can be improved. Then, the heat exchange from the heat-generating component 5 to the radiating fin 2a can be efficiently performed by increasing the resin important area ratio.

  Furthermore, by providing the metal housing 2 with a rectifying plate 2d that changes the flow direction of the sealing resin 3 to the direction of the protrusion 2b of the metal housing 2, the flow direction of the sealing resin 3 can be directed to the protrusion. The filling rate of the sealing resin 3 in the region between the component 5 and the metal housing 2 can be improved.

  Note that the present invention is not limited to the above-described embodiments and examples, and the deformation of the substrate, the heat-generating component mounted on the substrate, and the surface opposite to the one surface of the substrate on which the heat-generating component is mounted is described. In order to suppress this, an electronic control device having various structures in which the whole or a part is sealed with a resin is included.

DESCRIPTION OF SYMBOLS 1 ... Electronic control device, 2 ... Metal housing, 2a ... Heat radiation fin, 2b ... Groove,
Reference numeral 2c: protrusion, 2d: rectifying plate, 2e: through hole, 21: one surface of the metal housing provided with the radiating fin 2a, 22: the metal housing provided with the radiating fin 2a Surface opposite to one surface, 3 ... sealing resin, 4 ... connector pin, 5 ... heating component, 5a ... heating element,
5b: heat spreader, 5c: terminal, 5d: sealing resin for heat-generating component, 6: wiring board, 7: connection portion between metal housing and wiring board, 8: connector housing , 9 ... joining material, 10 ... waterproof adhesive

Claims (8)

A board on which electronic components are mounted,
A metal housing in which the substrate is sealed with a resin,
The surface opposite to the surface of the metal housing facing the electronic component has a heat radiating portion,
The surface of the metal housing facing the electronic component has a plurality of protrusions in a direction toward the electronic component, and a plate-shaped member that faces in the direction of the plurality of protrusions,
The surface of the metal housing facing the electronic component is provided between the heat radiating portion and the electronic component, a first projection of the plurality of projections and a second projection closest to the first projection. An electronic control device having a groove formed between the projection and the projection. The electronic control device according to claim 1,
The electronic control device, wherein the groove is formed by arranging the first protrusion and the second protrusion of the plurality of protrusions in parallel. The electronic control device according to claim 1,
The electronic control device according to claim 1, wherein a thickness of the resin between the metal housing and the electronic component is smaller than a thickness of the resin between the metal housing and the substrate. The electronic control device according to claim 1,
The surface of the metal housing facing the electronic component has a through hole for exposing a terminal provided on the substrate,
The electronic control device, wherein the plate member is provided between the through hole and the plurality of protrusions. The electronic control device according to claim 1,
The surface of the metal housing facing the electronic component has two through holes for exposing terminals provided on the substrate on both sides of the electronic component,
The electronic control device, wherein the plate-shaped member is provided between the two through holes. The electronic control device according to claim 1,
The heat radiator has a plurality of fins,
The pitch of the groove is substantially the same as the pitch of the plurality of fins. A method for manufacturing an electronic control device for injecting a resin into a metal housing in which a substrate on which electronic components are mounted is fixed,
A heat radiator is provided on a surface opposite to the surface of the metal housing facing the electronic component, and the heat radiator and the electronic component are provided on the surface of the metal housing facing the electronic component. Using the metal housing having a groove in the surface between,
A method of manufacturing an electronic control device for injecting the resin from a longitudinal direction of the groove. It is a manufacturing method of the electronic control device of Claim 7, Comprising:
The surface of the metal housing facing the electronic component, a plurality of protrusions in the direction of the electronic component side, a plate-shaped member that directs the flow direction of the resin in the direction of the plurality of protrusions , A method for manufacturing an electronic control device having:

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