JP5388598B2 - Element heat dissipation structure - Google Patents

Element heat dissipation structure Download PDF

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JP5388598B2
JP5388598B2 JP2009010519A JP2009010519A JP5388598B2 JP 5388598 B2 JP5388598 B2 JP 5388598B2 JP 2009010519 A JP2009010519 A JP 2009010519A JP 2009010519 A JP2009010519 A JP 2009010519A JP 5388598 B2 JP5388598 B2 JP 5388598B2
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heat
heat dissipation
substrate
dissipation structure
radiator
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JP2010141279A (en
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忠夫 神頭
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Calsonic Kansei Corp
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Description

本発明は、素子の放熱構造の技術分野に属する。 The present invention belongs to the technical field of the heat dissipation structure of the element.

従来では、ＬＥＤランプを金属製の基板に実装し、絶縁性熱伝導シートを介して、放熱フィン上に載置しＬＥＤランプの放熱を行っている（例えば、特許文献１参照。）。   Conventionally, an LED lamp is mounted on a metal substrate and placed on a radiation fin via an insulating heat conductive sheet to radiate the LED lamp (see, for example, Patent Document 1).

特開２００２−０９３２０６号公報（第２−３頁、全図）Japanese Patent Laid-Open No. 2002-093206 (page 2-3, full view)

しかしながら、従来にあっては、さらなる冷却の要求が強く、素子の温度上昇を抑制するには、放熱器（放熱フィン）をより低温に冷却しなければならなかった。   However, in the past, there has been a strong demand for further cooling, and in order to suppress the temperature rise of the element, the radiator (radiating fin) has to be cooled to a lower temperature.

本発明は、上記問題点に着目してなされたもので、その目的とするところは、素子の温度上昇を抑制する放熱性能を向上できる素子の放熱構造を提供することにある。 The present invention has been made in view of the above problems, and an object is to provide a heat radiation structure of the device can be improved to suppress heat radiation performance the temperature rise of the element.

上記目的を達成するため、本発明では、基板に実装された素子の発熱を放熱手段へ伝達して、放熱を行う素子の放熱構造において、前記素子は、前記基板側の面に放熱部分が露呈するよう設けられ、前記基板は、実装面と該実装面の裏側とを貫通し、前記素子の放熱部分を実装面の裏側に露呈させる貫通穴が設けられ、該貫通穴の周囲を囲む形状に通電パターンを形成した素子固定手段を有し、前記放熱手段は、前記貫通穴を貫通して前記素子の放熱部分に熱伝導材を介して面接する突出部が設けられ、且つ放熱面積を大きくする放熱部が設けられ、前記素子の放熱部分と前記基板の素子固定手段とを接合する構造にしたことを特徴とする。 In order to achieve the above object, according to the present invention, in the heat dissipation structure of an element that transmits heat generated by an element mounted on a substrate to a heat dissipation means to dissipate heat, the element has a heat dissipation portion exposed on the surface on the substrate side. The substrate is provided with a through hole that penetrates the mounting surface and the back side of the mounting surface, and exposes the heat dissipation portion of the element to the back side of the mounting surface, and surrounds the periphery of the through hole. An element fixing means having an energization pattern is provided, and the heat radiating means is provided with a projecting portion penetrating the through hole and contacting the heat radiating portion of the element through a heat conductive material, and increases a heat radiating area. A heat dissipating part is provided, and the heat dissipating part of the element and the element fixing means of the substrate are joined.

よって、本発明にあっては、素子の温度上昇を抑制する放熱性能を向上できる。   Therefore, in this invention, the heat dissipation performance which suppresses the temperature rise of an element can be improved.

実施例１の素子の放熱構造を示す説明断面図である。FIG. 3 is an explanatory cross-sectional view showing a heat dissipation structure of the element of Example 1. 実施例１の素子の放熱構造を示す説明斜視図である。FIG. 3 is an explanatory perspective view showing a heat dissipation structure of the element of Example 1. 端子１１の傾斜部分の説明図である。3 is an explanatory diagram of an inclined portion of a terminal 11. FIG. 素子の放熱構造を示す説明図である。It is explanatory drawing which shows the thermal radiation structure of an element. 素子の放熱構造を示す説明図である。It is explanatory drawing which shows the thermal radiation structure of an element. 素子の放熱構造を示す説明図である。It is explanatory drawing which shows the thermal radiation structure of an element. 実施例２の素子の放熱構造を示す説明断面図である。6 is an explanatory cross-sectional view showing a heat dissipation structure of an element of Example 2. FIG. 実施例３の素子の放熱構造を示す説明断面図である。6 is an explanatory cross-sectional view showing a heat dissipation structure of an element of Example 3. FIG. 実施例４の素子の放熱構造を示す説明断面図である。6 is an explanatory cross-sectional view showing a heat dissipation structure of an element of Example 4. FIG. 実施例５の素子の放熱構造の説明斜視図である。10 is an explanatory perspective view of a heat dissipation structure for an element of Example 5. FIG. 実施例６の素子の放熱構造の説明断面図である。6 is an explanatory cross-sectional view of a heat dissipation structure for an element of Example 6. FIG. 図１１の一部拡大図である。FIG. 12 is a partially enlarged view of FIG. 11. 実施例６の素子の放熱構造を示す説明斜視図である。10 is an explanatory perspective view showing a heat dissipation structure of an element according to Example 6. FIG. 実施例７の素子の放熱構造の説明断面図である。10 is an explanatory cross-sectional view of a heat dissipation structure for an element according to Example 7. FIG. 図１４の一部拡大図である。FIG. 15 is a partially enlarged view of FIG. 14. 実施例７の素子の放熱構造を示す説明斜視図である。FIG. 10 is an explanatory perspective view showing a heat dissipation structure for an element of Example 7. 実施例８の素子の放熱構造の説明斜視図である。 FIG. 10 is an explanatory perspective view of a heat dissipation structure for an element according to Example 8 .

以下、本発明の素子の放熱構造を実現する実施の形態を、実施例１〜実施例８に基づいて説明する。 Hereinafter, the embodiments for implementing the heat radiation structure of the device of the present invention will be described with reference to Examples 1 to 8.

まず、構成を説明する。
図１は実施例１の素子の放熱構造を示す説明断面図である。図２は実施例１の素子の放熱構造を示す説明斜視図である。 First, the configuration will be described.
FIG. 1 is an explanatory cross-sectional view showing a heat dissipation structure of an element according to the first embodiment. FIG. 2 is an explanatory perspective view showing the heat dissipation structure of the element according to the first embodiment.

実施例１の素子の放熱構造は、素子１、熱伝導材２、基板３、放熱器４、ネジ５を備えている。
素子１は、端子１１、素子放熱部１２を備え、基板３に実装される電子部品である。例えば、半導体素子、LEDなどがあり、その良好な駆動状態、あるいは長期間使用するために冷却を必要とする素子である。
端子１１は、対向する側方２箇所から斜め下方に進出した形状であり、基板３の通電パターンに電気的に接続される。例えばはんだ付けで接合される。また、この端子１１は、図１に示すように、基板３への接続部、つまり先端が傾斜させた形状になっている。
素子放熱部１２は、素子の裏側、つまり基板側に露出させた金属部分である。図１においては、説明上、基板側に厚みを持つように示す。 The element heat dissipation structure of the first embodiment includes an element 1, a heat conductive material 2, a substrate 3, a radiator 4, and screws 5.
The element 1 is an electronic component that includes a terminal 11 and an element heat radiation unit 12 and is mounted on the substrate 3. For example, there are a semiconductor element, an LED, etc., which are in an excellent driving state or an element that needs cooling for long-term use.
The terminal 11 has a shape that extends obliquely downward from two opposite side portions, and is electrically connected to the energization pattern of the substrate 3. For example, it is joined by soldering. Further, as shown in FIG. 1, the terminal 11 has a shape in which a connecting portion to the substrate 3, that is, a tip is inclined.
The element heat radiation part 12 is a metal part exposed on the back side of the element, that is, on the substrate side. In FIG. 1, for the sake of explanation, the substrate side is shown to have a thickness.

熱伝導材２は、熱効率よく熱を伝達する部材である。例えば、接着性のあるシート状のものを例として挙げておく。
基板３は、端子部３１、貫通穴３２を備え、素子１が実装されるものである。実施例１では、基板３として回路基板（PCB基板）を用いる。
端子部３１は、素子１の端子１１に対応する位置大きさで、例えば通電パターンで形成したものである。これにより基板３に形成する回路と素子１の電気的接続を行う。 The heat conductive material 2 is a member that transfers heat efficiently. For example, an adhesive sheet is used as an example.
The substrate 3 includes a terminal portion 31 and a through hole 32, and the element 1 is mounted thereon. In the first embodiment, a circuit board (PCB board) is used as the board 3.
The terminal portion 31 has a position size corresponding to the terminal 11 of the element 1 and is formed by, for example, an energization pattern. Thereby, the circuit formed on the substrate 3 and the element 1 are electrically connected.

貫通穴３２は、素子１の両側に設けられる端子１１に対応させて、基板３に２対に設けられた端子部３１の間に設ける。また、この貫通穴３２は、素子の素子放熱部１２の位置、大きさに対応させた位置と大きさで設けられる。
放熱器４は、板状部４１、放熱フィン４２、突出部４３、取付孔４４を備えている。これらは一部材として形成される。
板状部４１は、基板３の下方に重ねるように配置する板状の部分である。
放熱フィン４２は、板状部４１から下方にフィンを複数突出させたもので、周囲空気との接触面積を大きくしたものである。そのため、フィン形状は、他の形状であってよい。 The through holes 32 are provided between the terminal portions 31 provided in two pairs on the substrate 3 so as to correspond to the terminals 11 provided on both sides of the element 1. Further, the through hole 32 is provided at a position and size corresponding to the position and size of the element heat radiation portion 12 of the element.
The radiator 4 includes a plate-like portion 41, a radiation fin 42, a protruding portion 43, and an attachment hole 44. These are formed as one member.
The plate-like portion 41 is a plate-like portion arranged so as to be stacked below the substrate 3.
The heat dissipating fin 42 has a plurality of fins projecting downward from the plate-like portion 41 and has a large contact area with the surrounding air. Therefore, the fin shape may be another shape.

突出部４３は、板状部４１の上面、つまり放熱フィン４２の側と反対側面から円柱状に突出させた部分である。この突出部４３は、基板３の貫通穴３２を通過できる直径で、その厚さは、基板３を貫通して、熱伝導材２を介して素子１の素子放熱部１２に接触できる厚さにする。
熱伝導材２の形状は、この突出部４３に合わせた円形とする。
取付孔４４、は、板状部４１の端を上下に貫通させた孔であり、ネジ５が貫通する。 The protruding portion 43 is a portion protruding in a columnar shape from the upper surface of the plate-like portion 41, that is, the side surface opposite to the side of the radiation fin 42. The protrusion 43 has a diameter that can pass through the through hole 32 of the substrate 3, and has a thickness that can penetrate the substrate 3 and come into contact with the element heat radiation portion 12 of the element 1 through the heat conductive material 2. To do.
The shape of the heat conductive material 2 is a circle that matches the protrusion 43.
The attachment hole 44 is a hole that vertically penetrates the end of the plate-like portion 41, and the screw 5 passes therethrough.

次に実施例１の素子の放熱構造の実装状態について説明する。
素子１は、両側へ進出させた端子１１を基板３の端子部３１にはんだ付けで接合して、実装する。この状態では、基板３の貫通穴３２を通して、素子の素子放熱部１２が下方に露出した状態となる。
放熱器４の突出部４３の上面には、突出部４３と同じ平面形状にした熱伝導材２を取り付ける。そして、この突出部４３及び熱伝導材２を基板３の貫通穴３２に下方から上方へ貫通させ、熱伝導材２が素子１の素子放熱部１２に面接する状態にする。熱伝導材２と素子放熱部１２との面接は接着していることが好ましい。放熱器４は、ネジ５により、基板３に固定される。基板３の下面には、このネジ５を固定する固定具を備えるようにする。図示は省略する。 Next, the mounting state of the element heat dissipation structure of Example 1 will be described.
The element 1 is mounted by soldering the terminal 11 advanced to both sides to the terminal portion 31 of the substrate 3 by soldering. In this state, the element heat radiation part 12 of the element is exposed downward through the through hole 32 of the substrate 3.
The heat conductive material 2 having the same planar shape as the protrusion 43 is attached to the upper surface of the protrusion 43 of the radiator 4. Then, the projecting portion 43 and the heat conducting material 2 are passed through the through hole 32 of the substrate 3 from below to above so that the heat conducting material 2 is in contact with the element heat radiating portion 12 of the element 1. It is preferable that the interview between the heat conductive material 2 and the element heat radiation portion 12 is bonded. The radiator 4 is fixed to the substrate 3 with screws 5. A fixing tool for fixing the screw 5 is provided on the lower surface of the substrate 3. Illustration is omitted.

図３は端子１１の傾斜部分の説明図である。
なお、素子１の基板３への実装と放熱器４の基板への取り付け順序は、逆であってもよい。その際には、素子１は、図３に示すように、端子１１の傾斜させた先端の傾斜を平面に近づけるようにして、基板３の実装面、つまり上面から上下位置を調整する。これによりはんだ付けによる端子接合の際に、素子放熱部１２と熱伝導材２が良好に面接する状態に実装するようにしてもよい。
なお、図１、図３にははんだ付け部分を符号６で示す。 FIG. 3 is an explanatory diagram of an inclined portion of the terminal 11.
The mounting order of the element 1 on the substrate 3 and the mounting order of the radiator 4 on the substrate may be reversed. At that time, as shown in FIG. 3, the element 1 adjusts the vertical position from the mounting surface, that is, the upper surface of the substrate 3 so that the inclined tip of the terminal 11 approaches the plane. Thus, when the terminals are joined by soldering, the element heat radiating portion 12 and the heat conducting material 2 may be mounted in a good surface contact state.
In FIG. 1 and FIG.

作用を説明する。
[素子の温度上昇を抑制する性能の向上作用]
実施例１の素子１は、その駆動により樹脂パッケージされている内部の例えば半導体や発光素子などが発熱する。この発熱は、素子１の下面に露出させた金属部分である素子放熱部１２に、素子内部で伝達される。
素子放熱部１２の熱は、基板３に設けた貫通穴３２の部分で、熱伝導材２を介して放熱器４の突出部４３に伝達され、放熱フィン４２により空気と熱交換される。 The operation will be described.
[Improvement in performance to suppress temperature rise of element]
In the element 1 according to the first embodiment, for example, a semiconductor or a light emitting element inside the resin package generates heat by driving. This heat generation is transmitted inside the element to the element heat radiating portion 12 which is a metal part exposed on the lower surface of the element 1.
The heat of the element heat radiating portion 12 is transmitted to the protrusion 43 of the radiator 4 through the heat conducting material 2 at the portion of the through hole 32 provided in the substrate 3, and heat exchange with the air is performed by the heat radiating fins 42.

なお、実施例１では、素子１に一つの放熱器４が割り当てられるため、熱伝導材２が多少の電気伝導性を有しても他の電気部品や回路パターンへ電気を伝えることはない。
このように実施例１では、素子１は、熱伝導材２を介するのみで放熱器４へ伝熱するため、より直接的に放熱を行うことになる。そのため部材間の伝熱損失が省略され、素子１の温度上昇を抑制する性能が向上する。 In the first embodiment, since one radiator 4 is assigned to the element 1, even if the heat conductive material 2 has some electrical conductivity, electricity is not transmitted to other electrical components and circuit patterns.
Thus, in Example 1, since the element 1 transfers heat to the radiator 4 only through the heat conducting material 2, heat is radiated more directly. Therefore, the heat transfer loss between members is omitted, and the performance of suppressing the temperature rise of the element 1 is improved.

実施例１の作用を明確にするために、さらに説明を加える。
図４は素子の放熱構造を示す説明図である。
実装した素子の放熱を行う構造としては、次のようなものを考えることができる。回路用基板(PCB基板）を直接冷却するものである。しかし、回路用基板(PCB基板）は樹脂製で、基板自体は熱伝導性が良好でない。そのため、図４に示すように、素子放熱部１２とはんだ部分６１で接合する回路パターンの銅箔部分３３を基板３に設ける。そして、基板３の素子と反対側の下面には、放熱器４ａとの接触面となるよう広く銅箔部分３５を設ける。 In order to clarify the operation of the first embodiment, further explanation will be added.
FIG. 4 is an explanatory view showing a heat dissipation structure of the element.
The following can be considered as a structure for radiating heat from the mounted element. The circuit board (PCB board) is directly cooled. However, the circuit board (PCB board) is made of resin, and the board itself has poor thermal conductivity. Therefore, as shown in FIG. 4, a circuit pattern copper foil portion 33 is provided on the substrate 3 to be joined to the element heat radiation portion 12 by the solder portion 61. And the copper foil part 35 is widely provided in the lower surface on the opposite side to the element of the board | substrate 3 so that it may become a contact surface with the heat radiator 4a.

そして、銅箔部分３３と銅箔部分３５を電気的に接続するよう基板３に貫通させたスルーホール３４を設ける。そして、このスルーホール３４内、及び銅箔部分３３と素子放熱部１２の間をはんだ部分６１で満たすように接合することにより、基板下面の銅箔部分３５が熱伝導材２ａを介して放熱器４ａへ熱を伝導する構成である。
この構造では、素子１の素子放熱部１２からの熱は、はんだを通して銅箔部分３３へ伝導し、スルーホール３４を介して下面の銅箔部分３５へ伝導する。そして、銅箔部分３５から熱伝導材２ａを介して放熱器４ａへ伝導し、放熱器４ａが空気中に放熱する。 And the through-hole 34 penetrated to the board | substrate 3 is provided so that the copper foil part 33 and the copper foil part 35 may be electrically connected. Then, the copper foil portion 35 on the lower surface of the substrate is radiated through the heat conductive material 2a by joining the through hole 34 and between the copper foil portion 33 and the element heat radiating portion 12 so as to be filled with the solder portion 61. It is the structure which conducts heat to 4a.
In this structure, the heat from the element heat radiation part 12 of the element 1 is conducted to the copper foil part 33 through the solder, and is conducted to the copper foil part 35 on the lower surface through the through hole 34. And it conducts from the copper foil part 35 to the heat radiator 4a through the heat conductive material 2a, and the heat radiator 4a radiates heat in the air.

この構造では、熱を伝達する部材が多いため、部材間の熱伝達損失が多い分、放熱器４ａをより低温にしなければならない。これに対して、実施例１では、熱伝達する部材数が少なく、効率的に放熱が行える。また、実施例１では、この構造と比較して熱を基板３の裏側へ伝達する必要がないので、スルーホール３４を設ける必要がなく、片面基板を使うことができるため、コスト低減になる。   In this structure, since there are many members that transfer heat, the heat dissipator 4a has to be cooled to a lower temperature because of the large heat transfer loss between the members. On the other hand, in Example 1, the number of members that transfer heat is small, and heat can be radiated efficiently. Further, in the first embodiment, it is not necessary to transfer heat to the back side of the substrate 3 as compared with this structure, so that it is not necessary to provide the through hole 34 and a single-sided substrate can be used, thereby reducing the cost.

また、実装した素子の放熱を行う構造としては、次のようなものを考えることもできる。
図５は素子の放熱構造を示す説明図である。
図５に示す放熱構造では、回路基板をPCB基板よりも薄いフレキシブル基板３ａ（FPC基板）を用い、フレキシブル基板３ａに設けた銅箔３６と素子放熱部１２をはんだ部分６２で接合する。フレキシブル基板３ａは接着剤７により放熱器４ａへ接合される。 In addition, the following structure can be considered as a structure for dissipating heat from the mounted element.
FIG. 5 is an explanatory view showing a heat dissipation structure of the element.
In the heat dissipation structure shown in FIG. 5, the circuit board is a flexible substrate 3 a (FPC substrate) thinner than the PCB substrate, and the copper foil 36 provided on the flexible substrate 3 a and the element heat dissipation portion 12 are joined by the solder portion 62. The flexible substrate 3a is bonded to the radiator 4a by the adhesive 7.

この構造では、素子１の素子放熱部１２からの熱は、はんだ部分６２、銅箔３６、フレキシブル基板３ａ、接着剤７、放熱器４ａの順に伝達する。
しかし、この構造では、フレキシブル基板３ａにおいて、熱伝導性が金属より劣るフィルム及び接着剤７を介して熱伝達を行うため、熱伝達損失が多くなり、その分、放熱器４ａをより低温にしなければならない。これに対して、実施例１では、素子放熱部１２と放熱器４の間は、熱伝導材２を介するのみであり、効率的に放熱が行える。
この構造では、フレキシブル基板３ａの基材に耐熱性が要求されるため、コストが増大することになる。
実施例１では、基板の基材へこのような要求がないため、コストは抑制される。 In this structure, the heat from the element heat radiation part 12 of the element 1 is transmitted in the order of the solder portion 62, the copper foil 36, the flexible substrate 3a, the adhesive 7, and the radiator 4a.
However, in this structure, in the flexible substrate 3a, heat transfer is performed through the film 7 and the adhesive 7 having a heat conductivity inferior to that of metal, so that heat transfer loss increases, and accordingly, the radiator 4a must be cooled to a lower temperature. I must. On the other hand, in Example 1, between the element thermal radiation part 12 and the heat radiator 4, only the heat conductive material 2 is interposed, and it can thermally radiate efficiently.
In this structure, heat resistance is required for the base material of the flexible substrate 3a, which increases the cost.
In Example 1, since there is no such requirement for the base material of the substrate, the cost is suppressed.

また、実装した素子の放熱を行う構造としては、次のようなものを考えることもできる。
図６は素子の放熱構造を示す説明図である。
図６に示す放熱構造では、回路基板をアルミ基板３ｂとする。アルミ基板３ｂは導電性があるため、上面に絶縁層８を設け、銅箔３６がその上に設けられる。アルミ基板３ｂと放熱器４ａは密着性、熱導電性を高めるために、熱伝導材２ａにより接合する。 In addition, the following structure can be considered as a structure for dissipating heat from the mounted element.
FIG. 6 is an explanatory view showing a heat dissipation structure of the element.
In the heat dissipation structure shown in FIG. 6, the circuit board is an aluminum substrate 3b. Since the aluminum substrate 3b is conductive, the insulating layer 8 is provided on the upper surface, and the copper foil 36 is provided thereon. The aluminum substrate 3b and the radiator 4a are joined by the heat conductive material 2a in order to improve adhesion and thermal conductivity.

この構造では、素子１の素子放熱部１２からの熱は、はんだ部分６２、銅箔３６、絶縁層８、アルミ基板３ｂ、熱伝導材２ａ、放熱器４ａの順に伝達する。
しかし、この構造では、熱を伝達する部材が多いため、部材間の熱伝達損失が多い分、放熱器４ａをより低温にしなければならない。これに対して、実施例１では、熱伝達する部材数が少なく、効率的に放熱が行える。
また、アルミ基板は高価であるが、実施例１ではPCB基板を用いてコストが抑制される。
このように実施例１では、熱が伝達する部材数を少なくして、より直接的に冷却を行う。また、コストに特段の増加がなく抑制されつつ行う。 In this structure, the heat from the element heat radiation portion 12 of the element 1 is transferred in the order of the solder portion 62, the copper foil 36, the insulating layer 8, the aluminum substrate 3b, the heat conductive material 2a, and the radiator 4a.
However, in this structure, since there are many members that transfer heat, the heat dissipator 4a has to be cooler because of the large heat transfer loss between the members. On the other hand, in Example 1, the number of members that transfer heat is small, and heat can be radiated efficiently.
Further, although the aluminum substrate is expensive, in the first embodiment, the cost is suppressed by using the PCB substrate.
Thus, in Example 1, it cools more directly by reducing the number of members to which heat is transmitted. In addition, the cost is controlled without any particular increase.

次に、効果を説明する。
実施例１の素子の放熱構造にあっては、下記に列挙する効果を得ることができる。 Next, the effect will be described.
In the heat dissipation structure of the element of Example 1, the effects listed below can be obtained.

(1)素子１の発熱を放熱器４へ伝達して、放熱を行う素子１の放熱構造において、基板３に実装され、基板側の面に素子放熱部１２が露呈するよう設けられた素子１と、実装面と実装面の裏側とを貫通する貫通穴３２が、素子１の素子放熱部１２を実装面の裏側に露呈させるように設けられた基板３と、貫通穴３２を貫通して素子１の素子放熱部１２に熱伝導材２を介して面接する突出部４３が設けられ、且つ放熱面積を大きくする放熱フィン４２が設けられた放熱器４を備えたため、素子の温度上昇を抑制する放熱性能を向上できる。   (1) In the heat dissipation structure of the element 1 that transmits the heat generated by the element 1 to the radiator 4 to dissipate heat, the element 1 is mounted on the substrate 3 and is provided so that the element heat dissipation portion 12 is exposed on the surface on the substrate side. And a through hole 32 penetrating the mounting surface and the back side of the mounting surface so as to expose the element heat radiating portion 12 of the element 1 to the back side of the mounting surface, and the element penetrating the through hole 32 1 is provided with a heat sink 4 provided with a projecting portion 43 that is in contact with the heat radiating portion 12 with the heat conducting material 2 interposed therebetween, and with a heat radiating fin 42 that increases the heat radiating area. Heat dissipation performance can be improved.

(10)素子１の発熱を放熱器４へ伝達して、放熱を行う素子１の放熱方法において、素子１の素子放熱部１２を基板側に露呈させるように、素子１を基板３に実装し、基板３には、実装面と実装面の裏側とを貫通する貫通穴３２を設け、実装した素子１の素子放熱部１２を基板３の裏側に露呈させ、放熱面積を大きくする放熱フィン４２が設けられた放熱器４に突出部４３を設け、突出部４３が貫通穴３２を貫通して素子１の素子放熱部１２に熱伝導材２を介して面接するようにし、素子１の発熱を基板３の貫通穴３２を貫通させた放熱器４の突出部４３へ伝達して放熱したため、素子の温度上昇を抑制する放熱性能を向上できる。   (10) The element 1 is mounted on the substrate 3 so that the element heat dissipation part 12 of the element 1 is exposed to the substrate side in the heat dissipation method of the element 1 that transmits the heat generated by the element 1 to the radiator 4 to dissipate heat. The substrate 3 is provided with through holes 32 that penetrate the mounting surface and the back side of the mounting surface, and the heat radiation fins 42 that expose the element heat radiation portion 12 of the mounted element 1 to the back side of the substrate 3 and increase the heat radiation area are provided. The provided radiator 4 is provided with a projecting portion 43, and the projecting portion 43 passes through the through-hole 32 so as to be in contact with the element heat radiating portion 12 of the element 1 through the heat conducting material 2, and the heat generation of the element 1 is substrate Since the heat is transmitted to the projecting portion 43 of the radiator 4 that has passed through the three through holes 32, the heat dissipation performance that suppresses the temperature rise of the element can be improved.

実施例２は、基板と放熱器を接着剤で接合した例である。
構成を説明する。
図７は実施例２の素子の放熱構造を示す説明断面図である。
実施例２では、基板３の下面と放熱器４の間の数箇所を接着剤９で接着する。
基板３の下面と放熱器４の間は多くの部分で間隙となる構造である。
その他構成は実施例１と同様であるので、説明を省略する。 Example 2 is an example in which a substrate and a radiator are joined with an adhesive.
The configuration will be described.
FIG. 7 is an explanatory cross-sectional view showing the heat dissipation structure of the element of the second embodiment.
In Example 2, several places between the lower surface of the substrate 3 and the radiator 4 are bonded with an adhesive 9.
The space between the lower surface of the substrate 3 and the radiator 4 is a gap in many parts.
Since other configurations are the same as those of the first embodiment, description thereof is omitted.

作用を説明する。
実施例１、実施例２の素子の放熱構造では、基板３に設けられる回路パターン（銅箔）は、放熱器４に熱を伝達しない。そのため、基板３と放熱器４は密着させる必要がない。そのため、実施例２のように、放熱器４の上面と基板３の下面の間に間隙を設け、部分的に接着する構成にしても、放熱性能に影響がない。そのため、コストが抑制する取付構造にすることができ、また、基板３と放熱器４の間に電子部品を実装することもできる。 The operation will be described.
In the heat dissipation structure of the element of Example 1 and Example 2, the circuit pattern (copper foil) provided on the substrate 3 does not transfer heat to the radiator 4. Therefore, the substrate 3 and the radiator 4 do not need to be in close contact with each other. Therefore, as in the second embodiment, even if a gap is provided between the upper surface of the radiator 4 and the lower surface of the substrate 3 so as to be partially bonded, the heat radiation performance is not affected. Therefore, it is possible to provide a mounting structure that suppresses costs, and it is also possible to mount electronic components between the substrate 3 and the radiator 4.

効果を説明する。
実施例２の素子の放熱構造にあっては、上記(1),(10)に加えて、以下の効果を有する。
(2)上記(1)において、基板３の実装面の裏側と、放熱器４の上面を離間させたため、部分的に接着剤９で接着するなど、さらにコストを抑制する構造にすることができる。
その他作用効果は実施例１と同様であるので説明を省略する。 Explain the effect.
In addition to the above (1) and (10), the element heat dissipation structure of Example 2 has the following effects.
(2) In the above (1), since the back side of the mounting surface of the substrate 3 and the upper surface of the radiator 4 are separated from each other, it is possible to make a structure that further suppresses costs, such as partially bonding with an adhesive 9. .
Since other functions and effects are the same as those of the first embodiment, description thereof is omitted.

実施例３は基板としてフレキシブル基板を用いた例である。
構成を説明する。
図８は実施例３の素子の放熱構造を示す説明断面図である。
実施例３では、基板としてフレキシブル基板３７を用いている。フレキシブル基板３７には、突出部４３を貫通させるための貫通穴３７１を設けるようにしる。そして、フレキシブル基板３７の下面は、接着剤９１により放熱器４５の上面に接着で接合する。なお、フレキシブル基板３７は基板３より薄くなるため、これに合わせて突出部４３の高さを変えるものとする。
その他構成は、実施例１と同様であるので説明を省略する。 Example 3 is an example in which a flexible substrate is used as the substrate.
The configuration will be described.
FIG. 8 is an explanatory cross-sectional view showing the heat dissipation structure of the element of Example 3.
In Example 3, the flexible substrate 37 is used as the substrate. The flexible substrate 37 is provided with a through hole 371 for allowing the protruding portion 43 to pass therethrough. The lower surface of the flexible substrate 37 is bonded to the upper surface of the radiator 45 by an adhesive 91 by bonding. Since the flexible substrate 37 is thinner than the substrate 3, the height of the protrusion 43 is changed in accordance with this.
Since other configurations are the same as those of the first embodiment, description thereof is omitted.

作用を説明する。
実施例３では、フレキシブル基板３７を用いているが、フレキシブル基板３７には熱を伝導する機能が要求されないために、フレキシブル基板３７の基材のコストを抑制する。
つまり、耐熱温度の低い基材の使用が可能となる。また、接着剤９１の耐熱温度も低いものが使用可能となり、コストが抑制する。
なお、フレキシブル基板３７と放熱器４５の固定は、空隙を空けて、部分的に接着するものであってもよい。
フレキシブル基板３７には、その配置、形状、立体的な回路構造に有利な点がある。このような条件であっても素子１の放熱を効率よく行える。 The operation will be described.
In the third embodiment, the flexible substrate 37 is used. However, since the flexible substrate 37 is not required to have a function of conducting heat, the cost of the base material of the flexible substrate 37 is suppressed.
That is, it is possible to use a base material having a low heat resistant temperature. Moreover, the adhesive 91 having a low heat-resistant temperature can be used, and the cost is suppressed.
Note that the flexible substrate 37 and the heat radiator 45 may be fixed by partially bonding them with a gap.
The flexible substrate 37 has advantages in its arrangement, shape, and three-dimensional circuit structure. Even under such conditions, the element 1 can dissipate heat efficiently.

効果を説明する。
実施例３の素子の放熱構造にあっては、上記(1),(10)に加えて、以下の効果を有する。
(3)上記(1)又は(2)において、基板はフレキシブル基板３７であるため、フレキシブル基板３７の基材の耐熱温度を低くできる。
その他作用効果は実施例１と同様であるので、説明を省略する。 Explain the effect.
In addition to the above (1) and (10), the element heat dissipation structure of Example 3 has the following effects.
(3) In the above (1) or (2), since the substrate is the flexible substrate 37, the heat resistant temperature of the base material of the flexible substrate 37 can be lowered.
Since other functions and effects are the same as those of the first embodiment, description thereof is omitted.

実施例４は、突出部を熱伝導材で形成した例である。
構成を説明する。
図９は実施例４の素子の放熱構造を示す説明断面図である。
実施例４では、放熱器４６の上面を、突出部を設けずに平面とする。そして、フレキシブル基板３７の下面と、放熱器４６の上面を接着性のある熱伝導材２１で接合する。そして、この熱伝導材２１の上面に、貫通穴３７１を貫通して素子１の素子放熱部１２に面接する突出部２１１を熱伝導材２１として設ける。
その他構成は、実施例３と同様であるので説明を省略する。 Example 4 is an example in which the protruding portion is formed of a heat conductive material.
The configuration will be described.
FIG. 9 is an explanatory cross-sectional view showing the heat dissipation structure of the element of Example 4.
In Example 4, the upper surface of the radiator 46 is a flat surface without providing a protrusion. Then, the lower surface of the flexible substrate 37 and the upper surface of the radiator 46 are joined by the heat conductive material 21 having adhesiveness. Then, on the upper surface of the heat conducting material 21, a protruding portion 211 that penetrates the through hole 371 and contacts the element heat radiating portion 12 of the element 1 is provided as the heat conducting material 21.
Since other configurations are the same as those of the third embodiment, the description thereof is omitted.

作用を説明する。
実施例４では、熱伝導材２１の一部として突出部２１１を設けているので、この突出部２１１が、その接着性で素子放熱部１２に密着する。貫通穴３７１が設けられるフレキシブル基板３７は、厚みが薄いため、熱伝導材２１で突出部２１１を形成できるほうが、製造が容易となる。これによりさらにコストが抑制される。
また、素子１の素子放熱部１２と放熱器４の固定、放熱器４とフレキシブル基板３７の固定を同一部材によるものとすることができ、さらにコストが抑制される。 The operation will be described.
In Example 4, since the protrusion part 211 is provided as a part of the heat conductive material 21, this protrusion part 211 adheres to the element heat radiation part 12 with the adhesiveness. Since the flexible substrate 37 provided with the through hole 371 is thin, it is easier to manufacture the protrusion 211 with the heat conductive material 21. This further reduces costs.
In addition, the element radiating portion 12 and the radiator 4 of the element 1 can be fixed and the radiator 4 and the flexible substrate 37 can be fixed by the same member, which further reduces the cost.

効果を説明する。実施例４の素子の放熱構造にあっては、上記(1),(3),(10)に加えて、以下の効果を有する。
(4)上記(3)において、突出部２１１は、熱伝導材２１と一体に形成され、熱伝導材２１は、接着性のある部材とし、素子１の素子放熱部１２への放熱器４６の固定、フレキシブル基板３７への放熱器４６の固定を行う構造にしたため、さらにコストを抑制することができる。
その他作用効果は実施例３と同様であるので説明を省略する。 Explain the effect. In addition to the above (1), (3), and (10), the element heat dissipation structure of Example 4 has the following effects.
(4) In the above (3), the projecting portion 211 is formed integrally with the heat conducting material 21, and the heat conducting material 21 is an adhesive member, and the radiator 46 is connected to the element heat radiating portion 12 of the element 1. Since the fixing and fixing of the radiator 46 to the flexible substrate 37 are performed, the cost can be further reduced.
Since other functions and effects are the same as those of the third embodiment, description thereof is omitted.

実施例５は、複数の素子を同一の基板に設置する例である。
構成を説明する。
図１０は実施例５の素子の放熱構造の説明斜視図である。
実施例５では、基板３８に端子部３１と貫通穴３２を複数配置し、複数の素子を基板３８へ実装する。
放熱器４７は、複数の素子１の放熱を行う大きさのものにし、上面に複数の突出部４３を設ける。突出部４３の上面には、熱伝導材２を設ける。
その他構成は、実施例１と同様であるので説明を省略する。 Example 5 is an example in which a plurality of elements are installed on the same substrate.
The configuration will be described.
FIG. 10 is an explanatory perspective view of a heat dissipation structure for an element according to the fifth embodiment.
In the fifth embodiment, a plurality of terminal portions 31 and through holes 32 are arranged on the substrate 38, and a plurality of elements are mounted on the substrate 38.
The radiator 47 is sized to radiate heat from the plurality of elements 1, and a plurality of protrusions 43 are provided on the upper surface. The heat conductive material 2 is provided on the upper surface of the protrusion 43.
Since other configurations are the same as those of the first embodiment, description thereof is omitted.

作用を説明する。
実施例５では、複数の素子１の熱を基板３８で放熱する。回路構成上、冷却を必要とする複数の素子１を基板３８に実装する必要がある場合には、このように共通の放熱器４７にしてもよい。共通の放熱器４７にすることで、作業が容易で、部品点数を減らすことになる。 The operation will be described.
In the fifth embodiment, the heat of the plurality of elements 1 is radiated by the substrate 38. When it is necessary to mount a plurality of elements 1 that require cooling on the substrate 38 due to the circuit configuration, the common radiator 47 may be used. By using the common radiator 47, the operation is easy and the number of parts is reduced.

効果を説明する。
実施例５の素子の放熱構造にあっては、上記(1)〜(4),(10)に加えて、以下の効果を有する。
(5)上記(1)〜(4)において、基板３８は、複数の貫通穴３２を備え、放熱器４７は、複数の突出部４３を備え、複数の素子１を共通の放熱器４７により放熱するため、作業を容易にし、部品点数を減らすことができる。 Explain the effect.
In addition to the above (1) to (4), (10), the element heat dissipation structure of Example 5 has the following effects.
(5) In the above (1) to (4), the substrate 38 includes a plurality of through holes 32, the radiator 47 includes a plurality of protrusions 43, and the plurality of elements 1 are radiated by the common radiator 47. Therefore, the work can be facilitated and the number of parts can be reduced.

実施例６は、環状の素子固定用銅箔部を設け、素子放熱部と接合する例である。
構成を説明する。
図１１は実施例６の素子の放熱構造の説明断面図である。図１２は図１１の一部拡大図である。図１３は実施例６の素子の放熱構造を示す説明斜視図である。
実施例６では、基板３の素子側の面で、貫通穴３２の周囲に、環状の素子固定用銅箔部３０１を設ける。素子固定用銅箔部３０１は、基板３に通電パターンとして設けられるものと同様の銅箔部分である。 Example 6 is an example in which an annular element fixing copper foil part is provided and joined to the element heat dissipation part.
The configuration will be described.
FIG. 11 is an explanatory sectional view of a heat dissipation structure for an element according to the sixth embodiment. FIG. 12 is a partially enlarged view of FIG. FIG. 13 is an explanatory perspective view showing a heat dissipation structure of an element according to the sixth embodiment.
In Example 6, an annular element fixing copper foil portion 301 is provided around the through hole 32 on the element side surface of the substrate 3. The element fixing copper foil portion 301 is a copper foil portion similar to that provided as an energization pattern on the substrate 3.

なお、実施例６では、図１１〜図１３に示すように、円形の素子放熱部１２、熱伝導材２、及び放熱器４の突出部４３の径方向の大きさの関係は、素子放熱部１２の外径より、熱伝導材２及び放熱器４の突出部４３の外径を小さくする。
さらに、円形の素子放熱部１２と素子固定用銅箔部３０１の径方向の大きさの関係は、素子固定用銅箔部３０１の内径より素子放熱部１２の外径を大きくし、素子固定用銅箔部３０１の外径より素子放熱部１２の外径を小さくする。
これにより、素子放熱部１２の外周端部は、素子固定用銅箔部３０１の内径側と面が対向する構成となる。 In Example 6, as shown in FIGS. 11 to 13, the relationship between the radial size of the circular element heat radiating portion 12, the heat conducting material 2, and the protrusion 43 of the radiator 4 is the element heat radiating portion. The outer diameter of the protrusion part 43 of the heat conductive material 2 and the radiator 4 is made smaller than the outer diameter of 12.
Furthermore, the relationship between the radial size of the circular element heat radiating portion 12 and the element fixing copper foil portion 301 is such that the outer diameter of the element heat radiating portion 12 is larger than the inner diameter of the element fixing copper foil portion 301 and the element fixing copper foil portion 301 is fixed. The outer diameter of the element heat radiation part 12 is made smaller than the outer diameter of the copper foil part 301.
As a result, the outer peripheral end of the element heat radiating portion 12 is configured such that the inner diameter side of the element fixing copper foil portion 301 faces the surface.

そして、実施例６では、まず、放熱器４の突出部４３を基板３の貫通穴３２に挿入するようにし、図１３に示すように、ネジ５で放熱器４を基板３に固定する。次に、基板３の貫通穴３２から突出している突出部４３の端面に設けられている熱伝導材２に素子１の素子放熱部１２を貼着する。熱伝導材２は接着性のある部材であることが作業性の点から望ましい。
そして、素子１の端子１１と基板３の端子部３１、素子放熱部１２と素子固定用銅箔部３０１をはんだ接合する。素子放熱部１２と素子固定用銅箔部３０１のはんだ部分６１は、環状のはんだ部分となる組付構成である。
その他構成は実施例１と同様であるので説明を省略する。 In Example 6, first, the protrusion 43 of the radiator 4 is inserted into the through hole 32 of the substrate 3, and the radiator 4 is fixed to the substrate 3 with screws 5 as shown in FIG. 13. Next, the element heat dissipating part 12 of the element 1 is attached to the heat conducting material 2 provided on the end surface of the protruding part 43 protruding from the through hole 32 of the substrate 3. It is desirable from the viewpoint of workability that the heat conductive material 2 is an adhesive member.
And the terminal 11 of the element 1 and the terminal part 31 of the board | substrate 3, the element thermal radiation part 12, and the copper foil part 301 for element fixation are solder-joined. The solder part 61 of the element heat radiating part 12 and the element fixing copper foil part 301 has an assembled structure to be an annular solder part.
Since other configurations are the same as those of the first embodiment, description thereof is omitted.

作用を説明する。
実施例６では、素子１と基板３のはんだ付けは、概ね所定温度の炉内で一様に行われる。その際、素子１の下面が環状に接合されるため、素子１が安定する。これによって、素子１が傾いてはんだ接合されることが防止される。
そして、接合された素子放熱部１２と素子固定用銅箔部３０１ははんだ部分６１を介して熱伝導するため、素子の放熱性が向上する。 The operation will be described.
In Example 6, the soldering of the element 1 and the substrate 3 is performed uniformly in a furnace at a predetermined temperature. At that time, since the lower surface of the element 1 is joined in an annular shape, the element 1 is stabilized. This prevents the element 1 from being tilted and soldered.
And since the element heat dissipation part 12 and the copper foil part 301 for element fixation which were joined are thermally conducted via the solder part 61, the heat dissipation of an element improves.

また、熱伝導材２は弾性を有するため、素子１と充分に密着させると、素子１を上方へ付勢する力、つまり素子１を基板３から離間させる力を加えることになる。これに対して、実施例６では、環状のはんだ部分６１で接合した素子固定用銅箔部３０１がこの付勢力を充分に受ける。そのため、素子１の端子１１と基板３の端子部３１とのはんだ部分６に応力が生じ、クラックやはんだ部分６及び端子部３１の剥離を生じさせることが確実に防止される。つまり、端子１１のはんだ部分６の応力を軽減する。   In addition, since the heat conducting material 2 has elasticity, when it is sufficiently in close contact with the element 1, a force that urges the element 1 upward, that is, a force that separates the element 1 from the substrate 3 is applied. On the other hand, in Example 6, the element fixing copper foil portion 301 joined by the annular solder portion 61 sufficiently receives this urging force. Therefore, stress is generated in the solder portion 6 between the terminal 11 of the element 1 and the terminal portion 31 of the substrate 3, and it is reliably prevented that the crack and the solder portion 6 and the terminal portion 31 are separated. That is, the stress of the solder portion 6 of the terminal 11 is reduced.

また、素子１と基板３、放熱器４等が一体となった構造の全体に振動が加わる場合、素子１は放熱器４の突出部４３から熱伝導材２を介して、素子１を上方へ付勢する力、つまり素子１を基板３から離間させる力が加わることになる。
これに対しても、環状のはんだ部分６１で接合した素子固定用銅箔部３０１がこの付勢力を充分に受ける。そのため、端子１１のはんだ部分６の応力を軽減する。 In addition, when vibration is applied to the entire structure in which the element 1, the substrate 3, the radiator 4, and the like are integrated, the element 1 moves the element 1 upward from the protrusion 43 of the radiator 4 through the heat conductive material 2. A biasing force, that is, a force for separating the element 1 from the substrate 3 is applied.
Also against this, the element fixing copper foil portion 301 joined by the annular solder portion 61 sufficiently receives this urging force. Therefore, the stress of the solder portion 6 of the terminal 11 is reduced.

効果を説明する。
実施例６の素子の放熱構造にあっては、上記(1)〜(5),(10)に加えて、以下の効果を有する。
(6)上記(1)〜(5)において、基板３は、貫通穴３２の周囲を囲む形状に通電パターンを形成した素子固定用銅箔部３０１を備え、素子１の素子放熱部１２と基板３の素子固定用銅箔部３０１をはんだ部分６１で接合する構造にしたため、端子部分のはんだクラックや剥離を防止することができ、はんだ接合時に素子が傾いて接合することを防止することができる。
その他作用効果は実施例１と同様であるので説明を省略する。 Explain the effect.
The element heat dissipation structure of Example 6 has the following effects in addition to the above (1) to (5) and (10).
(6) In the above (1) to (5), the substrate 3 includes the element fixing copper foil portion 301 in which the energization pattern is formed in a shape surrounding the periphery of the through hole 32, and the element heat radiation portion 12 of the element 1 and the substrate Since the element fixing copper foil portion 301 is joined by the solder portion 61, solder cracks and peeling of the terminal portion can be prevented, and the device can be prevented from being inclined and joined at the time of solder joining. .
Since other functions and effects are the same as those of the first embodiment, description thereof is omitted.

実施例７は、環状の素子固定用銅箔部を基板の貫通穴の内壁まで延長させた例である。
構成を説明する。
図１４は実施例７の素子の放熱構造の説明断面図である。図１５は図１４の一部拡大図である。図１６は実施例７の素子の放熱構造を示す説明斜視図である。
実施例７では、環状の素子固定用銅箔部３０１の内周方向の端部を、基板３の貫通穴３２の内壁となるように下方、つまり放熱器４側へ延長した形状の内壁部３０２を設ける。内壁部３０２は、素子固定用銅箔部３０１と一体で、基板３に同様の銅箔部分である。なお、内壁部３０２は円筒形状で、基板３の貫通穴３２の内壁に密着する通電パターンとして設けられる。
この内壁部３０２の下端は、図１４、図１５に示すように、貫通穴３２の内部に位置させる。
その他構成は、実施例６と同様であるので説明を省略する。 Example 7 is an example in which an annular element fixing copper foil portion is extended to the inner wall of the through hole of the substrate.
The configuration will be described.
FIG. 14 is an explanatory sectional view of a heat dissipation structure for an element according to the seventh embodiment. FIG. 15 is a partially enlarged view of FIG. FIG. 16 is an explanatory perspective view showing a heat dissipation structure of an element according to the seventh embodiment.
In Example 7, the inner wall portion 302 having a shape in which the end portion in the inner circumferential direction of the annular element fixing copper foil portion 301 is extended downward, that is, toward the radiator 4 so as to be the inner wall of the through hole 32 of the substrate 3. Is provided. The inner wall portion 302 is an integral part of the element fixing copper foil portion 301 and is a copper foil portion similar to the substrate 3. The inner wall 302 has a cylindrical shape and is provided as an energization pattern that is in close contact with the inner wall of the through hole 32 of the substrate 3.
The lower end of the inner wall portion 302 is positioned inside the through hole 32 as shown in FIGS.
Since other configurations are the same as those of the sixth embodiment, the description thereof is omitted.

作用を説明する。
実施例７では、基板３に設けた素子固定用銅箔部３０１を、貫通穴３２の内壁まで延長する内壁部３０２を設けている。この素子固定用銅箔部３０１及び内壁部３０２は、通電パターン同様の銅箔部分であり、基板３に固着しているので、面積を増やすことによって、素子１を基板３から離間させる方向の力を、さらに強く受けるようになる。これにより、素子１の端子１１と基板３の端子部３１とのはんだ部分６に生じる応力がさらに軽減され、クラックやはんだ部分６及び端子部３１の剥離を生じさせることがさらに確実に防止される。 The operation will be described.
In Example 7, an inner wall 302 that extends the element fixing copper foil 301 provided on the substrate 3 to the inner wall of the through hole 32 is provided. The element fixing copper foil portion 301 and the inner wall portion 302 are copper foil portions that are similar to the energization pattern, and are fixed to the substrate 3. Therefore, by increasing the area, the force in the direction in which the element 1 is separated from the substrate 3. Will be more strongly received. Thereby, the stress generated in the solder portion 6 between the terminal 11 of the element 1 and the terminal portion 31 of the substrate 3 is further reduced, and the occurrence of cracks and peeling of the solder portion 6 and the terminal portion 31 is further reliably prevented. .

効果を説明する。
実施例７の素子の放熱構造にあっては、上記(1)〜(6),(10)に加えて、以下の効果を有する。
(7)上記(6)において、素子固定用銅箔部３０１は、内周側の端部を貫通穴の内壁まで延長する内壁部３０２を設けたため、端子部分のはんだクラックや剥離を防止することができる。 Explain the effect.
The element heat dissipation structure of Example 7 has the following effects in addition to the above (1) to (6) and (10).
(7) In the above (6), the element fixing copper foil portion 301 is provided with the inner wall portion 302 that extends the end portion on the inner peripheral side to the inner wall of the through hole, thereby preventing solder cracks and peeling of the terminal portion. Can do.

実施例８は、基板に複数の貫通穴と素子固定用銅箔部を設け、複数の素子を同一の基板に設置する例である。
構成を説明する。
図１７は実施例８の素子の放熱構造の説明斜視図である。
実施例８では、基板３８に端子部３１と貫通穴３２を複数配置し、貫通穴３２の周囲に、環状の素子固定用銅箔部３０１を設ける。そして、複数の素子１を基板３８へ実装する。
放熱器４７は、複数の素子１の放熱を行う大きさのものにし、上面に複数の突出部４３を設ける。突出部４３の上面には、熱伝導材２を設ける。
その他構成は、実施例６と同様であるので説明を省略する。 Example 8 is an example in which a plurality of through holes and element fixing copper foil portions are provided on a substrate, and a plurality of elements are installed on the same substrate.
The configuration will be described.
FIG. 17 is an explanatory perspective view of a heat dissipation structure for an element according to the eighth embodiment.
In Example 8, a plurality of terminal portions 31 and through holes 32 are arranged on the substrate 38, and an annular element fixing copper foil portion 301 is provided around the through holes 32. Then, the plurality of elements 1 are mounted on the substrate 38.
The radiator 47 is sized to radiate heat from the plurality of elements 1, and a plurality of protrusions 43 are provided on the upper surface. The heat conductive material 2 is provided on the upper surface of the protrusion 43.
Since other configurations are the same as those of the sixth embodiment, the description thereof is omitted.

作用を説明する。
回路構成上、複数の素子１を基板３８に実装する場合に、このように共通の放熱器４７にすると、作業が容易で、部品点数を減らすことになる。そして、この共通化により放熱器４７が大きくなるが、その振動が素子１のはんだ部分６にクラックや剥離を生じさせることがないように、各素子１の素子放熱部１２と基板３の素子固定用銅箔部３０１のはんだ部分６１で応力の軽減を充分に行う。 The operation will be described.
In the case of mounting a plurality of elements 1 on the board 38 in terms of circuit configuration, if the common radiator 47 is used in this way, the operation is easy and the number of parts is reduced. The heat sink 47 becomes larger by this commonization, but the element heat radiation portion 12 of each element 1 and the element fixing of the substrate 3 are fixed so that the vibration does not cause cracks or peeling in the solder portion 6 of the element 1. The stress is sufficiently reduced by the solder portion 61 of the copper foil portion 301 for use.

効果を説明する。
実施例８の素子の放熱構造にあっては、上記(1)〜(4),(10)に加えて、以下の効果を有する。
(5)´上記(1)〜(4)において、基板３８は、複数の貫通穴３２と、貫通穴３２の周囲を囲む形状に通電パターンを形成した素子固定用銅箔部３０１を備え、素子１の放熱器４７と基板３の素子固定用銅箔部３０１をはんだ部分６１で接合する構造にし、放熱器４７は、複数の突出部４３を備え、複数の素子１を共通の放熱器４７により放熱するため、作業を容易にし、部品点数を減らすことができる。また、共通化により大きくなった放熱器４７の振動等により素子１の端子部分のはんだ部分６で生じる応力を軽減することができる。 Explain the effect.
The element heat dissipation structure of Example 8 has the following effects in addition to the above (1) to (4), (10).
(5) ′ In the above (1) to (4), the substrate 38 includes a plurality of through holes 32 and an element fixing copper foil portion 301 in which an energization pattern is formed in a shape surrounding the through holes 32. 1 heat sink 47 and the element fixing copper foil portion 301 of the substrate 3 are joined by a solder portion 61. The heat sink 47 includes a plurality of protrusions 43, and the plurality of elements 1 are connected by a common heat sink 47. Since heat is dissipated, the work can be facilitated and the number of parts can be reduced. Further, the stress generated in the solder portion 6 of the terminal portion of the element 1 due to the vibration of the radiator 47 that has become larger due to the common use can be reduced.

以上、本発明の素子の放熱構造を実施例１〜実施例８に基づき説明してきたが、具体的な構成については、これらの実施例に限られるものではなく、特許請求の範囲の各請求項に係る発明の要旨を逸脱しない限り、設計の変更や追加等は許容される。As mentioned above, although the thermal radiation structure of the element of this invention has been demonstrated based on Examples 1-8, it is not restricted to these Examples about a concrete structure, Each claim of a claim Design changes and additions are permitted without departing from the spirit of the invention.

例えば、実施例では、放熱手段として、放熱器を用いたが、ユニットなどの筐体やブラケットを用いるようにしてもよい。
また例えば、実施例６〜実施例８の基板３は、フレキシブル基板であってもよい。



For example, in the embodiment, a radiator is used as the heat radiating means, but a housing such as a unit or a bracket may be used.
For example, the board | substrate 3 of Example 6-Example 8 may be a flexible substrate.



１ 素子
１１ 端子
１２ 素子放熱部
２ 熱伝導材
２ａ 熱伝導材
２１ 熱伝導材
２１１ 突出部
３ 基板
３１ 端子部
３２ 貫通穴
３３ 銅箔部分
３４ スルーホール
３５ 銅箔部分
３６ 銅箔
３７ フレキシブル基板
３７１ 貫通穴
３８ 基板
３ａ フレキシブル基板
３ｂ アルミ基板
３０１ 素子固定用銅箔部
３０２ 内壁部
４ 放熱器
４１ 板状部
４２ 放熱フィン
４３ 突出部
４４ 取付孔
４ａ 放熱器
４５ 放熱器
４６ 放熱器
４７ 放熱器
５ ネジ
６ はんだ部分
６１ はんだ部分
６２ はんだ部分
７ 接着剤
８ 絶縁層
９ 接着剤
９１ 接着剤 DESCRIPTION OF SYMBOLS 1 Element 11 Terminal 12 Element thermal radiation part 2 Thermal conduction material 2a Thermal conduction material 21 Thermal conduction material 211 Protrusion part 3 Substrate 31 Terminal part 32 Through hole 33 Copper foil part 34 Through hole 35 Copper foil part 36 Copper foil 37 Flexible board 371 penetration Hole 38 Substrate 3a Flexible substrate 3b Aluminum substrate 301 Element fixing copper foil portion 302 Inner wall portion
4 radiator 41 plate-like part 42 radiation fin 43 protrusion 44 mounting hole 4a radiator 45 radiator 46 radiator 47 radiator 5 screw 6 solder part 61 solder part 62 solder part 7 adhesive 8 insulating layer 9 adhesive 91 adhesion Agent

Claims (6)

基板に実装された素子の発熱を放熱手段へ伝達して、放熱を行う素子の放熱構造において、
前記素子は、前記基板側の面に放熱部分が露呈するよう設けられ、
前記基板は、実装面と該実装面の裏側とを貫通し、前記素子の放熱部分を実装面の裏側に露呈させる貫通穴が設けられ、該貫通穴の周囲を囲む形状に通電パターンを形成した素子固定手段を有し、
前記放熱手段は、前記貫通穴を貫通して前記素子の放熱部分に熱伝導材を介して面接する突出部が設けられ、且つ放熱面積を大きくする放熱部が設けられ、
前記素子の放熱部分と前記基板の素子固定手段とを接合する構造にした、
ことを特徴とする素子の放熱構造。 In the heat dissipation structure of the element that transmits heat to the heat dissipation means to dissipate heat generated by the element mounted on the board,
The element is provided such that a heat radiation portion is exposed on the surface on the substrate side,
The substrate is provided with a through hole that penetrates the mounting surface and the back side of the mounting surface, and exposes the heat dissipation portion of the element to the back side of the mounting surface, and an energization pattern is formed in a shape surrounding the periphery of the through hole Having element fixing means,
The heat dissipating means is provided with a projecting portion that passes through the through-hole and is in contact with the heat dissipating portion of the element via a heat conductive material, and a heat dissipating portion that increases the heat dissipating area
The heat dissipation part of the element and the element fixing means of the substrate are joined.
An element heat dissipation structure. 請求項１に記載の素子の放熱構造において、
前記素子固定手段は、内周側の端部を前記貫通穴の内壁まで延長した、
ことを特徴とする素子の放熱構造。 In the heat dissipation structure of the element according to claim 1,
The element fixing means extends the inner peripheral end to the inner wall of the through hole,
An element heat dissipation structure. 請求項１又は請求項２に記載の素子の放熱構造において、
前記基板の実装面の裏側と、前記放熱手段の上面を離間させた、
ことを特徴とする素子の放熱構造。 In the heat dissipation structure of the element according to claim 1 or claim 2,
The back side of the mounting surface of the substrate and the upper surface of the heat dissipating means are spaced apart,
An element heat dissipation structure. 請求項１乃至請求項３のいずれか１項に記載の素子の放熱構造において、
前記基板は、フレキシブル基板である、
ことを特徴とする素子の放熱構造。 In the element heat dissipation structure according to any one of claims 1 to 3,
The substrate is a flexible substrate.
An element heat dissipation structure. 請求項４に記載の素子の放熱構造において、
前記突出部は、前記熱伝導材と一体に形成され、
前記熱伝導材は、接着性のある部材とし、前記素子の放熱部分への前記放熱手段の固定、前記フレキシブル基板への前記放熱手段の固定を行う構造にした、
ことを特徴とする素子の放熱構造。 In the heat dissipation structure of the element according to claim 4,
The protrusion is formed integrally with the heat conductive material,
The heat conducting material is an adhesive member, and has a structure for fixing the heat dissipation means to the heat dissipation portion of the element and fixing the heat dissipation means to the flexible substrate.
An element heat dissipation structure. 請求項１乃至請求項５のいずれか１項に記載の素子の放熱構造において、
前記基板は、複数の前記貫通穴を備え、
前記放熱手段は、複数の前記突出部を備え、
複数の素子を共通の放熱手段により放熱する、
ことを特徴とする素子の放熱構造。 In the heat dissipation structure of the element according to any one of claims 1 to 5,
The substrate includes a plurality of the through holes,
The heat dissipation means includes a plurality of the protruding portions,
Dissipate multiple elements by common heat dissipation means,
An element heat dissipation structure.
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