CN208016097U - A kind of good Double-layer flexible circuit board of thermal diffusivity - Google Patents
A kind of good Double-layer flexible circuit board of thermal diffusivity Download PDFInfo
- Publication number
- CN208016097U CN208016097U CN201820242611.0U CN201820242611U CN208016097U CN 208016097 U CN208016097 U CN 208016097U CN 201820242611 U CN201820242611 U CN 201820242611U CN 208016097 U CN208016097 U CN 208016097U
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- flexible board
- flexible
- board
- layer
- circuit board
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Abstract
The utility model discloses a kind of good Double-layer flexible circuit boards of thermal diffusivity, including the first flexible board, strain line is ironed in the upper surface of first flexible board equipped with copper, copper irons strain line and is fitted closely with the first flexible board, the left side of first flexible board is equipped with plug division, the right end of plug division is fixedly connected with the left end of the first flexible board, and the lower section of the first flexible board is equipped with the second flexible board, and the second flexible board is fitted closely with the first flexible board.The good Double-layer flexible circuit board of this kind of thermal diffusivity, it is closely welded with wire conduction line in the inner wall of copper foil layer, pass through wire conduction line, by the circuit communication of the first flexible board and the second flexible board, it can be effectively in complicated circuit, the first flexible board and the second flexible board is set to work asynchronously, so as to improve the working efficiency of Double-layer flexible circuit board, simultaneously, in the inside of hollow cavity, setting is equipped with heat emission hole, by the heat emission hole through setting, the air in the hot-air and air that are generated in wiring board can be swapped.
Description
Technical field
The utility model is related to Double-layer flexible circuit board technical field, specially a kind of good Double-layer flexible line of thermal diffusivity
Road plate.
Background technology
Flexible circuit board is also known as " soft board ", is the printed circuit made of insulating substrate flexible, can be with free bend, volume
Around, fold, have the advantages that many pcb boards do not have, the solution of miniaturization of electronic products and movement requirement can be met, it is soft
Property wiring board is as conducting medium, it is possible to provide excellent electrical property can realize the transmission of driving current between chip and panel
And the electrical connection between PCB.
But existing flexible circuit board be easy to cause working efficiency using single arrangement in complicated circuit
Low problem, meanwhile, the compact internal structure of flexible circuit board, heat is difficult to distribute, so that heat dissipation effect is bad.
Utility model content
The purpose of this utility model is to provide a kind of good Double-layer flexible circuit boards of thermal diffusivity, to solve above-mentioned background
It is proposed in complicated circuit in technology, be easy to cause that working efficiency is low and the bad problem of heat dissipation effect.
To achieve the above object, the utility model provides the following technical solutions：A kind of good Double-layer flexible line of thermal diffusivity
Strain line is ironed in the upper surface of road plate, including the first flexible board, first flexible board equipped with copper, and the copper irons strain line and the first flexibility
Plate fits closely, and the left side of first flexible board is equipped with plug division, the left end of the right end of the plug division and the first flexible board
It is fixedly connected, the lower section of first flexible board is equipped with the second flexible board, and second flexible board is closely pasted with the first flexible board
It closes, the right end of first flexible board is equipped with pad, and the pad is closely welded with the first flexible board, the upper surface of the pad
Equipped with chip, the chip is fitted closely with pad, and the lower section of first flexible board is equipped with conductive layer, the conductive layer and the
One flexible board is bonded by viscose, and the lower section of the conductive layer is equipped with hollow cavity, and the hollow cavity is fitted closely with conductive layer, institute
The upper surface for stating the first flexible board is equipped with metal conduction hole, and the metal conduction hole, which is run through, to be arranged in the first flexible board, described
Metal conduction hole is internally provided with glue-line, and the glue-line is bonded with metal conduction hole by viscose, the metal conduction hole it is interior
Portion is equipped with copper foil layer, and the copper foil layer insertion is arranged in metal conduction hole.
Further, the left side of first flexible board is equipped with buckle frame, the right end and the first flexible board of the buckle frame
Left end be fixedly connected.
Further, the outer surface of the pad is equipped with location hole, and the location hole, which runs through, to be arranged in pad, and is positioned
There are two hole is set.
Further, the hollow cavity is internally provided with heat emission hole, and the heat emission hole is dissipated through being arranged in hollow cavity
Hot hole is equipped with nine, and is equally spaced in hollow cavity.
Further, the upper surface of first flexible board is equipped with protective film, the protective film and the first flexible board
It fits closely.
Further, the lower section of the conductive layer is equipped with adhesive layer, and the adhesive layer is bonded with conductive layer by viscose.
Further, the hollow cavity is internally provided with stickiness silicon particle, and the stickiness silicon particle insertion is arranged hollow
In chamber, and stickiness silicon particle is equipped with nine.
Further, the inner wall of the copper foil layer is equipped with wire conduction line, and the wire conduction line and copper foil layer are tight
Close welding.
Compared with prior art, the utility model has the beneficial effects that：The good Double-layer flexible circuit board of this kind of thermal diffusivity,
It is closely welded with wire conduction line in the inner wall of copper foil layer, it is by wire conduction line, the first flexible board and second is flexible
The circuit communication of plate can make the first flexible board and the second flexible board work asynchronously effectively in complicated circuit, so as to
The working efficiency of Double-layer flexible circuit board is improved, meanwhile, in the inside of hollow cavity, setting is equipped with heat emission hole, by running through setting
Heat emission hole, the air in the hot-air and air that are generated in wiring board can be swapped, to make Double-layer flexible circuit
The heat dissipation performance of plate is good, meanwhile, nine heat emission holes are equidistantly equipped with, radiating efficiency, and hollow cavity can be effectively improved
Be internally embedded and be provided with stickiness silicon particle, by the way that nine stickiness silicon particles are arranged, flexible circuit board can be made to be more easy to crimp, together
When make the stable structure of flexible circuitry intralamellar part, to prevent flexible circuit board from generating micro-crack, existed by protective film setting
The upper surface of first flexible board can prevent Double-layer flexible circuit board from bonding dust, to avoid the work of Double-layer flexible circuit board
It is lowered by as quality.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the flexible circuit board sectional view of the utility model；
Fig. 3 is the internal structure chart in the metal conduction hole of the utility model；
Fig. 4 is the flexible circuit board circuit diagram of the utility model.
In figure：1, the first flexible board, 101, copper iron strain line, 102, buckle frame, 103, plug division, the 104, second flexible board,
105, location hole, 106, pad, 107, chip, 2, hollow cavity, 201, heat emission hole, 202, protective film, 203, adhesive layer, 204,
Conductive layer, 205, stickiness silicon particle, 3, metal conduction hole, 301, copper foil layer, 302, wire conduction line, 303, glue-line.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of good Double-layer flexible circuit of thermal diffusivity
Strain line 101 is ironed in the upper surface of plate, including the first flexible board 1, the first flexible board 1 equipped with copper, and copper irons strain line 101 and the first flexible board
1 fits closely, and the left side of the first flexible board 1 is equipped with plug division 103, and the right end of plug division 103 and the left end of the first flexible board 1 are consolidated
The lower section of fixed connection, the first flexible board 1 is equipped with the second flexible board 104, and the second flexible board 104 is fitted closely with the first flexible board 1,
The right end of first flexible board 1 is equipped with pad 106, pad 106 and the first closely welding of flexible board 1, and the upper surface of pad 106 is set
There is chip 107, chip 107 to be fitted closely with pad 106, the lower section of the first flexible board 1 is equipped with conductive layer 204, conductive layer 204 with
First flexible board 1 is bonded by viscose, and the lower section of conductive layer 204 is equipped with hollow cavity 2, and hollow cavity 2 is closely pasted with conductive layer 204
It closes, the upper surface of the first flexible board 1 is equipped with metal conduction hole 3, and metal conduction hole 3, which is run through, to be arranged in the first flexible board 1, metal
Via hole 3 is internally provided with glue-line 303, and glue-line 303 is bonded with metal conduction hole 3 by viscose, and the inside in metal conduction hole 3 is set
There are copper foil layer 301, the insertion of copper foil layer 301 to be arranged in metal conduction hole 3.
Further, the left side of the first flexible board 1 is equipped with buckle frame 102, buckles the right end and the first flexible board 1 of frame 102
Left end be fixedly connected, and buckle frame 102 be closed frame can be inserted in plug division 103 by closed buckle frame 102
When connecing, avoid pull wiring board and make plug division 103 occur loosen phenomenon.
Further, the outer surface of pad 106 is equipped with location hole 105, and location hole 105, which runs through, to be arranged in pad 106, and
There are two location hole 105 is set, by two location holes 105, wiring board can be positioned and be fixed, to prevent wiring board
Position shifts in drawing process.
Further, hollow cavity 2 is internally provided with heat emission hole 201, and heat emission hole 201 is dissipated through being arranged in hollow cavity 2
Hot hole 201 is equipped with nine, and is equally spaced in hollow cavity 2, can be by circuit by the heat emission hole 201 through setting
Air in the hot-air and air that are generated in plate swaps, to keep the heat dissipation performance of Double-layer flexible circuit board good, together
When, nine heat emission holes 201 are equidistantly equipped with, radiating efficiency can be effectively improved.
Further, the upper surface of the first flexible board 1 is equipped with protective film 202, and protective film 202 and the first plate 1 are close
Fitting can prevent Double-layer flexible circuit board from bonding dust, to avoid Double-layer flexible circuit board by protective film 202
Work quality is lowered by.
Further, the lower section of conductive layer 204 is equipped with adhesive layer 203, and adhesive layer 203 is viscous by viscose with conductive layer 204
It closes, by adhesive layer 203, the internal structure of flexible circuit board can be made to be bonded close, to make flexible circuit board working performance
It improves.
Further, hollow cavity 2 is internally provided with stickiness silicon particle 205, and the insertion of stickiness silicon particle 205 is arranged in hollow cavity
In 2, and stickiness silicon particle 205 is equipped with nine, by the way that nine stickiness silicon particles 205 are arranged, flexible circuit board can be made to be more easy to roll up
Song, while making the stable structure of flexible circuitry intralamellar part, to prevent flexible circuit board from generating micro-crack.
Further, the inner wall of copper foil layer 301 is equipped with wire conduction line 302, wire conduction line 302 and copper foil layer
301 close welding, by wire conduction line 302, by the circuit communication of the first flexible board 1 and the second flexible board 104, Neng Gouyou
Effect in complicated circuit, so that the first flexible board 1 and the second flexible board 104 is worked asynchronously, so as to improve Double-layer flexible line
The working efficiency of road plate.
Operation principle：First, 103 grafting of plug division is worked, it, can be in grafting then by closed buckle frame 102
Portion 103 carry out grafting when, avoid pull wiring board and make plug division 103 occur loosen phenomenon, then, the appearance of pad 106
Face is provided with location hole 105, by two location holes 105, wiring board can be positioned and be fixed, to prevent wiring board
Position shifts in drawing process, and and then, after the completion of grafting, electric signal is by setting in the first flexible board upper surface
Copper iron strain line 101, and electric signal synchronizes and passes through metal conduction hole 3, by the way that the wire inside metal conduction hole 3 is arranged
The circuit communication of first flexible board 1 and the second flexible board 104 can be made by conductive line 302 effectively in complicated circuit
One flexible board 1 and the second flexible board 104 synchronous working, to which electric signal is quickly transferred on chip 107, then, protection
Film 202 is fitted closely with the first flexible board 1, by protective film 202, can prevent Double-layer flexible circuit board from bonding dust,
To avoid the work quality of Double-layer flexible circuit board from being lowered by.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (8)
1. a kind of good Double-layer flexible circuit board of thermal diffusivity, including the first flexible board (1), it is characterised in that：Described first is soft
Strain line (101) is ironed in the upper surface of property plate (1) equipped with copper, and the copper irons strain line (101) and fitted closely with the first flexible board (1), institute
The left side for stating the first flexible board (1) is equipped with plug division (103), a left side for the right end and the first flexible board (1) of the plug division (103)
End is fixedly connected, and the lower section of first flexible board (1) is equipped with the second flexible board (104), second flexible board (104) and the
One flexible board (1) fits closely, and the right end of first flexible board (1) is equipped with pad (106), the pad (106) and first
Flexible board (1) closely welds, and the upper surface of the pad (106) is equipped with chip (107), the chip (107) and pad (106)
It fits closely, the lower section of first flexible board (1) is equipped with conductive layer (204), the conductive layer (204) and the first flexible board
(1) it is bonded by viscose, the lower section of the conductive layer (204) is equipped with hollow cavity (2), the hollow cavity (2) and conductive layer (204)
It fits closely, the upper surface of first flexible board (1) is equipped with metal conduction hole (3), and the metal conduction hole (3) is through setting
In the first flexible board (1), the metal conduction hole (3) is internally provided with glue-line (303), and the glue-line (303) is led with metal
Through-hole (3) is bonded by viscose, and the metal conduction hole (3) is internally provided with copper foil layer (301), and the copper foil layer (301) is embedding
Enter to be arranged in metal conduction hole (3).
2. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：Described first is soft
Property plate (1) left side be equipped with buckle frame (102), the left end of right end and the first flexible board (1) of the buckle frame (102) fixes company
It connects.
3. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：The pad
(106) outer surface is equipped with location hole (105), and the location hole (105), which is run through, to be arranged in pad (106), and location hole
(105) there are two setting.
4. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：The hollow cavity
(2) be internally provided with heat emission hole (201), the heat emission hole (201) is through being arranged in hollow cavity (2), and heat emission hole (201) is set
There are nine, and is equally spaced in hollow cavity (2).
5. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：Described first is soft
Property plate (1) upper surface be equipped with protective film (202), the protective film (202) fits closely with first line plate (1).
6. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：The conductive layer
(204) lower section is equipped with adhesive layer (203), and the adhesive layer (203) is bonded with conductive layer (204) by viscose.
7. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：The hollow cavity
(2) be internally provided with stickiness silicon particle (205), the stickiness silicon particle (205) is embedded to be arranged in hollow cavity (2), and stickiness
Silicon particle (205) is equipped with nine.
8. the good Double-layer flexible circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that：The copper foil layer
(301) inner wall is equipped with wire conduction line (302), and the wire conduction line (302) is closely welded with copper foil layer (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820242611.0U CN208016097U (en) | 2018-02-09 | 2018-02-09 | A kind of good Double-layer flexible circuit board of thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820242611.0U CN208016097U (en) | 2018-02-09 | 2018-02-09 | A kind of good Double-layer flexible circuit board of thermal diffusivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208016097U true CN208016097U (en) | 2018-10-26 |
Family
ID=63885432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820242611.0U Expired - Fee Related CN208016097U (en) | 2018-02-09 | 2018-02-09 | A kind of good Double-layer flexible circuit board of thermal diffusivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208016097U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163583A (en) * | 2020-02-17 | 2020-05-15 | 文柏新 | Flexible printed circuit board |
-
2018
- 2018-02-09 CN CN201820242611.0U patent/CN208016097U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163583A (en) * | 2020-02-17 | 2020-05-15 | 文柏新 | Flexible printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20220209 |
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| CF01 | Termination of patent right due to non-payment of annual fee |