CN209643249U

CN209643249U - A kind of radiator structure of double pcb boards

Info

Publication number: CN209643249U
Application number: CN201920057990.0U
Authority: CN
Inventors: 陆舟; 于华章
Original assignee: Feitian Technologies Co Ltd
Current assignee: Feitian Technologies Co Ltd
Priority date: 2019-01-14
Filing date: 2019-01-14
Publication date: 2019-11-15
Anticipated expiration: 2029-01-14

Abstract

The utility model discloses a kind of radiator structure of double pcb boards, it include: the first pcb board, the second pcb board, cooling fin, conductive structure, wherein, cooling fin, the first pcb board and the second pcb board stack gradually placement, first pcb board is equipped with fluting, and conductive structure is arranged between cooling fin and the second pcb board and passes through fluting the second pcb board of contact and cooling fin.By the utility model, solve the problems, such as unilateral heat dissipation in the case of two pieces of pcb boards stackings, overall dimensions that are space-saving while reducing product.

Description

A kind of radiator structure of double pcb boards

Technical field

The utility model relates to a kind of radiator structure more particularly to a kind of radiator structures of double pcb boards.

Background technique

Pcb board is mostly to be placed in cabinet in such a way that monolithic or muti-piece tile, but monolithic pcb board has been unable to satisfy at present Demand of the user to product working performance mostly uses two pieces of cooperative modes of pcb board in recent years.Two pieces of pcb boards are to tile Although mode combination cooling fin structure good heat dissipation effect, occupied space is big；Two pieces of pcb boards and cooling fin are simply with heap Folded mode is placed in cabinet, and the pcb board heat dissipation effect remote apart from cooling fin is bad, and temperature raising causes chip frequency reducing to run, Influence product working performance；And two pieces of pcb boards are placed in a stacked fashion in cabinet and are respectively mounted cooling fin outside two pieces of pcb boards Product thickness while wasting space is caused also to greatly increase with the structure of fan.

Utility model content

The purpose of this utility model is to overcome the deficiencies in the prior art, provide a kind of radiator structure of double pcb boards.

The utility model provides a kind of radiator structure of double pcb boards, comprising: the first pcb board, the second pcb board and heat dissipation Piece, which is characterized in that further include conductive structure, wherein the cooling fin, first pcb board and second pcb board are successively It stacks and places, fluting is equipped on first pcb board, the conductive structure setting is in the cooling fin and second heat dissipation Between plate and pass through fluting contact second pcb board and the cooling fin.

Euthermic chip is equipped between the conductive structure and second pcb board, the conductive structure passes through the fever Chip contacts second pcb board.

The euthermic chip is equipped between the cooling fin and first pcb board, the cooling fin passes through the fever Chip contacts first pcb board.

Heat Conduction Material is equipped between the euthermic chip and the conductive structure.

The Heat Conduction Material is heat conductive silica gel or phase transformation silica gel or liquid metal.

The conductive structure is heat conducting pipe or metal heat-conducting block.

The shape of the heat conducting pipe is concave.

The material of the heat conducting pipe or metal heat-conducting block is copper or aluminium alloy.

The lateral surface of the cooling fin is equipped with gear piece.

The gear piece is placed in the air duct that cooling fin and casing are formed.

The utility model compared with prior art, has the advantage that

The utility model provides a kind of radiator structure of double pcb boards, passes through fluting using conductive structure and solves two pieces of PCB Unilateral heat dissipation problem when sheetpile is folded, overall dimensions that are space-saving while reducing product.

Detailed description of the invention

Fig. 1 is the radiator structure for double pcb boards that a kind of conductive structure that the utility model embodiment one provides is heat conducting pipe A kind of implementation schematic diagram；

Fig. 2 is the heat dissipation for double pcb boards that a kind of conductive structure that the utility model embodiment one provides is metal heat-conducting block Another implementation schematic diagram of structure.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those skilled in the art are obtained without making creative work The every other embodiment obtained, fall within the protection scope of the utility model.

Embodiment one

The utility model embodiment one provides a kind of radiator structure of double pcb boards, as depicted in figs. 1 and 2, including first Pcb board 1, the second pcb board 2, cooling fin 3, euthermic chip 4, Heat Conduction Material 5, conductive structure 6.Cooling fin 3,1 and of the first pcb board Second pcb board 2 stacks gradually placement, and 1 is equipped with fluting 7 on the first pcb board, and conductive structure 6 is arranged in cooling fin 3 and second Between pcb board 2 and pass through 7 the second pcb board 2 of contact of fluting and cooling fin 3；

Optionally, euthermic chip 4 is equipped between conductive structure 6 and the second pcb board 2, conductive structure 6 passes through euthermic chip 4 Contact the second pcb board 2；Preferably, Heat Conduction Material 5 is equipped between euthermic chip 4 and conductive structure 6；

Optionally, euthermic chip 3 is equipped between cooling fin 3 and the first pcb board, cooling fin 3 passes through the contact of euthermic chip 4 the One pcb board 1；Preferably, Heat Conduction Material 5 is equipped between euthermic chip 4 and cooling fin 3；

Preferably, the outside of cooling fin 3 is equipped with gear piece 8, and gear piece 8 is placed in the air duct that cooling fin 3 and casing are formed；

Preferably, Heat Conduction Material 5 can be heat conductive silica gel or phase transformation silica gel or liquid metal；

Preferably, conductive structure 6 can be heat conducting pipe or metal heat-conducting block (as shown in Figure 2), and wherein heat conducting pipe is hollow simultaneously Equipped with heat-conducting medium, the material of heat conducting pipe and metal heat-conducting block can be copper or aluminium alloy；Heat conducting pipe can be concave (such as Fig. 1 It is shown)；

The radiating principle of the utility model are as follows: when the first pcb board 1 and the second pcb board 2 work at the same time, on two pieces of pcb boards Euthermic chip 4 give out a large amount of heat, the euthermic chip 4 of the first pcb board 1 conducts heat to heat dissipation by Heat Conduction Material 5 Piece 3, euthermic chip 4 on the second pcb board 2 then conduct heat to cooling fin 3 by conductive structure 6, a cross air blasting in air duct, The heat for taking away gear piece 8, achievees the effect that heat dissipation.

The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not It is confined to this, anyone skilled in the art can readily occur in technical scope disclosed by the utility model Change or replacement, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should It is subject to the protection scope in claims.

Claims

1. a kind of radiator structure of double pcb boards, including the first pcb board (1), the second pcb board (2) and cooling fin (3), feature exists In further including conductive structure (6), the cooling fin (3), first pcb board (1) and second pcb board (2) stack gradually Place, be equipped with fluting (7) on first pcb board (1), the conductive structure (6) setting the cooling fin (3) with it is described Between second pcb board (2) and pass through the fluting (7) contact second pcb board (2) and the cooling fin (3).

2. the radiator structure of double pcb boards as described in claim 1, which is characterized in that the conductive structure (6) and described second Euthermic chip (4) are equipped between pcb board (2), the conductive structure (6) contacts the 2nd PCB by the euthermic chip (4) Plate (2).

3. the radiator structure of double pcb boards as claimed in claim 2, which is characterized in that the cooling fin (3) and described first The euthermic chip (4) are equipped between pcb board (1), the cooling fin (3) passes through the euthermic chip (4) contact described first Pcb board (1).

4. the radiator structure of double pcb boards as claimed in claim 2 or claim 3, which is characterized in that the euthermic chip (4) with it is described Heat Conduction Material (5) are equipped between conductive structure (6).

5. the radiator structure of double pcb boards as claimed in claim 4, which is characterized in that the Heat Conduction Material (5) is heat conductive silica gel Or phase transformation silica gel or liquid metal.

6. the radiator structure of pcb boards as described in claim 1 double, which is characterized in that the conductive structure (6) be heat conducting pipe or Metal heat-conducting block.

7. the radiator structure of double pcb boards as claimed in claim 6, which is characterized in that the shape of the heat conducting pipe is concave.

8. the radiator structure of pcb boards as claimed in claim 6 double, which is characterized in that the heat conducting pipe or metal heat-conducting block Material is copper or aluminium alloy.

9. the radiator structure of double pcb boards as described in claim 1, which is characterized in that set on the lateral surface of the cooling fin (3) There are gear piece (8).

10. the radiator structure of double pcb boards as claimed in claim 9, which is characterized in that the gear piece (8) is placed in cooling fin (3) In the air duct formed with casing.