CN209659709U - A kind of pcb board with radiator structure - Google Patents
A kind of pcb board with radiator structure Download PDFInfo
- Publication number
- CN209659709U CN209659709U CN201822105422.1U CN201822105422U CN209659709U CN 209659709 U CN209659709 U CN 209659709U CN 201822105422 U CN201822105422 U CN 201822105422U CN 209659709 U CN209659709 U CN 209659709U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- copper sheet
- exchanging chamber
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000010521 absorption reaction Methods 0.000 claims abstract description 27
- 239000000498 cooling water Substances 0.000 claims abstract description 24
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of pcb boards with radiator structure, including substrate and pedestal, the upper end of the substrate offers foundation trench, the slot bottom of the foundation trench is fixedly connected with heat absorption copper sheet, the substrate is mounted in foundation trench by clamping mechanism, the lower end of the substrate offsets with heat absorption copper sheet, heat exchanging chamber is offered in the substrate, the heat exchanging chamber is located at the underface of heat absorption copper sheet, if the heat absorption copper sheet is uniformly and equidistantly connected with dry plate heat conduction copper sheet in matrix close to the side of heat exchanging chamber, the one end of the heat conduction copper sheet far from heat absorption copper sheet extends through the slot bottom of foundation trench and the chamber top of heat exchanging chamber and into heat exchanging chamber, cooling water is filled in the heat exchanging chamber, if being uniformly and equidistantly connected with dry plate heat dissipation scales in matrix in the cooling water, the bottom that the other end of the heat dissipation scales passes through substrate is arranged.The utility model adequately radiates to substrate, improves the heat dissipation effect of pcb board, and improves utilization rate.
Description
Technical field
The utility model relates to printed-board technology field more particularly to a kind of pcb boards with radiator structure.
Background technique
Electronic component on television set on pcb board can generate heat at work, especially for powerful television set, more
It needs to radiate in time, causes temperature excessively high in order to avoid heat dissipation is bad, cause failure.Pcb board generally comprise substrate (such as copper-clad plate or
More substrates) and the insulating layer (such as green paint) that is covered on substrate, in order to improve heat dissipation performance, in the prior art, generally by PCB
The insulating layer of the non-electronic component side of the heat dissipation region of plate scrapes off, so that substrate is exposed.Substrate exposure for a long time in order to prevent
It is oxidized, influences heat dissipation and other performances, tin layers can be set on the surface of exposed substrate, tin layers generally pass through wave-soldering etc.
Welding procedure is set to the surface of substrate.In the prior art, it is often scraped as much as possible in the non-electronic component side of heat dissipation region
From insulating layer, so that substrate bare area becomes larger, the thermal diffusivity of pcb board is improved, but such that substrate surface needs are set
The tin layers area set also increases, and increases tin cream cost, and is easy to form heap tin or even tin in welding, leads to not pass through
The acceptance of work of pcb board, existing pcb board heat dissipation effect are bad.
Utility model content
Purpose of the utility model is to solve the bad problems of pcb board heat dissipation effect in the prior art, and propose
A kind of pcb board with radiator structure.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of pcb board with radiator structure, including substrate and pedestal, the upper end of the substrate offers foundation trench, described
The slot bottom of foundation trench is fixedly connected with heat absorption copper sheet, and the substrate is mounted in foundation trench by clamping mechanism, the lower end of the substrate
It offsets with heat absorption copper sheet, heat exchanging chamber is offered in the substrate, the heat exchanging chamber is located at the underface of heat absorption copper sheet, the heat absorption
If copper sheet is uniformly and equidistantly connected with dry plate heat conduction copper sheet in matrix close to the side of heat exchanging chamber, the heat conduction copper sheet is far from heat absorption
One end of copper sheet extends through the slot bottom of foundation trench and the chamber top of heat exchanging chamber and into heat exchanging chamber, filled with cooling in the heat exchanging chamber
Water, if being uniformly and equidistantly connected with dry plate heat dissipation scales in matrix in the cooling water, the other end of the heat dissipation scales is passed through
The bottom of substrate is arranged.
Preferably, the clamping mechanism includes two engaging slots, and the slot bottom of the engaging slot is fixedly connected with spring, described
The other end of spring is fixedly connected with clamping block, and the clamping block far from one end of spring passes through the notch of engaging slot and to extension
It stretches, and two clamping blocks offset close to one end of substrate one end corresponding with substrate.
Preferably, radiating groove is offered between two adjacent heat dissipation scales.
Preferably, the upper end of the substrate is coated with insulating layer.
Preferably, the slot bottom of the engaging slot is fixedly connected with telescopic rod, and the other end of the telescopic rod is fixedly connected on
On the correspondence side wall of clamping block.
Compared with prior art, the utility model provides a kind of pcb board with radiator structure, has following beneficial to effect
Fruit:
1, the pcb board with radiator structure passes through setting heat absorption copper sheet, telescopic rod, heat exchanging chamber, heat conduction copper sheet, cooling
Water and heat dissipation scales, substrate is contacted with heat absorption copper sheet, since cooling water temperature is lower in heat exchanging chamber, generates heat when substrate is run
When, heat is adsorbed by heat absorption copper sheet, and is transferred heat in cooling water by heat conduction copper sheet, when room temperature is lower than the temperature of cooling water
When spending, cooling water pass through again insertion cooling water in heat dissipation scales the heat in cooling water is discharged into air, to substrate into
Row adequately heat dissipation, improves the heat dissipation effect of pcb board；
2, the pcb board with radiator structure passes through setting engaging slot, spring and clamping block, bullet of the clamping block in spring
Opposite pressure is done under power effect, so that two pieces of clamping blocks grip substrate, applicable substrate model is more
It is wide in range, it can radiate to different substrates, improve utilization rate.
It is not directed to part in the device to be the same as those in the prior art or can be realized by using the prior art, the utility model
It is adequately radiated to substrate, improves the heat dissipation effect of pcb board, and improve utilization rate.
Detailed description of the invention
Fig. 1 be the utility model proposes a kind of pcb board with radiator structure structural schematic diagram；
Fig. 2 is the enlarged drawing of part A in Fig. 1.
In figure: 1 substrate, 2 pedestals, 3 foundation trenches, 4 heat absorption copper sheets, 5 telescopic rods, 6 heat exchanging chambers, 7 heat conduction copper sheets, 8 cooling waters, 9
Heat dissipation scales, 10 engaging slots, 11 springs, 12 clamping blocks, 13 radiating grooves, 14 insulating layers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Referring to Fig.1-2, a kind of pcb board with radiator structure, including substrate 1 and pedestal 2, pedestal 2 are cooling material system
At the upper end of substrate 1 offers foundation trench 3, and the slot bottom of foundation trench 3 is fixedly connected with heat absorption copper sheet 4, and substrate 1 is pacified by clamping mechanism
In foundation trench 3, lower end and the heat absorption copper sheet 4 of substrate 1 offset, and heat exchanging chamber 6 are offered in substrate 1, heat exchanging chamber 6 is located at heat-sink copper
The underface of plate 4, if heat absorption copper sheet 4 is uniformly and equidistantly connected with dry plate heat conduction copper sheet 7 in matrix close to the side of heat exchanging chamber 6,
The one end of heat conduction copper sheet 7 far from heat absorption copper sheet 4 extends through the slot bottom of foundation trench 3 and the chamber top of heat exchanging chamber 6 and into heat exchanging chamber 6,
Cooling water 8 is filled in heat exchanging chamber 6, if being uniformly and equidistantly connected with dry plate heat dissipation scales 9 in matrix in cooling water 8, radiate squama
The bottom that the other end of piece 9 passes through substrate 1 is arranged, and substrate 1 is contacted with heat absorption copper sheet 4, due to 8 temperature of cooling water in heat exchanging chamber 6
It is lower, when substrate 1 run generate heat when, heat is adsorbed by heat absorption copper sheet 4, and by heat conduction copper sheet 7 transfer heat to it is cold
But in water 8, when room temperature is lower than the temperature of cooling water 8, cooling water 8 will be cooled down by the heat dissipation scales 9 in insertion cooling water 8 again
Heat in water 8 is discharged into air, is adequately radiated to substrate 1, and the heat dissipation effect of pcb board is improved.
Clamping mechanism includes two engaging slots 10, and the slot bottom of engaging slot 10 is fixedly connected with spring 11, spring 11 it is another
End is fixedly connected with clamping block 12, and clamping block 12 passes through the notch of engaging slot 10 far from one end of spring 11 and extends outwardly, and
Two clamping blocks 12 offset close to one end of substrate 1 one end corresponding with substrate 1, and clamping block 12 is under the elastic force effect of spring 11
Opposite pressure is done, so that two pieces of clamping blocks 12 grip substrate 1, applicable 1 model of substrate is more wide in range,
It can radiate to different substrates 1, improve utilization rate.
Radiating groove 13 is offered between two adjacent heat dissipation scales 9, the contact surface with air is increased by radiating groove 13
Product improves heat dissipation effect.
The upper end of substrate 1 is coated with insulating layer 14, is insulated by insulating layer 14.
It is the prior art that the slot bottom of engaging slot 10, which is fixedly connected with telescopic rod 5(telescopic rod, can be passive according to Impact direction
Stretch, just do not repeat herein), the other end of telescopic rod 5 is fixedly connected on the correspondence side wall of clamping block 12, engaging
When block 12 drives movement by spring 11, telescopic rod 5 follows clamping block 12 to move synchronously, so that the movement of clamping block 12 is more steady
It is fixed.
In the utility model, substrate 1 is contacted with heat absorption copper sheet 4, since 8 temperature of cooling water is lower in heat exchanging chamber 6, works as substrate
When 1 operation generates heat, heat is adsorbed by heat absorption copper sheet 4, and is transferred heat in cooling water 8 by heat conduction copper sheet 7, and room is worked as
When temperature is lower than the temperature of cooling water 8, cooling water 8 passes through the heat dissipation scales 9 in insertion cooling water 8 for the heat in cooling water 8 again
It is discharged into air, is adequately radiated to substrate 1, improve the heat dissipation effect of pcb board；Bullet of the clamping block 12 in spring 11
Opposite pressure is done under power effect, so that two pieces of clamping blocks 12 grip substrate 1, applicable 1 model of substrate
It is more wide in range, it can radiate to different substrates 1, improve utilization rate.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. a kind of pcb board with radiator structure, including substrate (1) and pedestal (2), which is characterized in that the substrate (1) it is upper
End offers foundation trench (3), and the slot bottom of the foundation trench (3) is fixedly connected with heat absorption copper sheet (4), and the substrate (1) passes through engaging machine
Structure is mounted in foundation trench (3), and lower end and heat absorption copper sheet (4) of the substrate (1) offset, and offers heat exchange in the substrate (1)
Chamber (6), the heat exchanging chamber (6) are located at the underface of heat absorption copper sheet (4), side of heat absorption copper sheet (4) close to heat exchanging chamber (6)
If being uniformly and equidistantly connected with dry plate heat conduction copper sheet (7) in matrix, the one end of the heat conduction copper sheet (7) far from heat absorption copper sheet (4)
Extend through the slot bottom of foundation trench (3) and the chamber top of heat exchanging chamber (6) and into heat exchanging chamber (6), filled with cold in the heat exchanging chamber (6)
But water (8), the cooling water (8) is if interior be uniformly and equidistantly connected with dry plate heat dissipation scales (9), the heat dissipation scales in matrix
(9) bottom that the other end passes through substrate (1) is arranged.
2. a kind of pcb board with radiator structure according to claim 1, which is characterized in that the clamping mechanism includes
The slot bottom of two engaging slots (10), the engaging slot (10) is fixedly connected with spring (11), and the other end of the spring (11) is solid
Surely it is connected with clamping block (12), the clamping block (12) passes through the notch of engaging slot (10) and outside far from the one end of spring (11)
Extend, and two clamping blocks (12) offset close to one end one end corresponding with substrate (1) of substrate (1).
3. a kind of pcb board with radiator structure according to claim 1, which is characterized in that two adjacent heat dissipation squamas
Radiating groove (13) are offered between piece (9).
4. a kind of pcb board with radiator structure according to claim 1, which is characterized in that the upper end of the substrate (1)
It is coated with insulating layer (14).
5. a kind of pcb board with radiator structure according to claim 2, which is characterized in that the engaging slot (10)
Slot bottom is fixedly connected with telescopic rod (5), and the other end of the telescopic rod (5) is fixedly connected on the correspondence side wall of clamping block (12)
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822105422.1U CN209659709U (en) | 2018-12-14 | 2018-12-14 | A kind of pcb board with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822105422.1U CN209659709U (en) | 2018-12-14 | 2018-12-14 | A kind of pcb board with radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209659709U true CN209659709U (en) | 2019-11-19 |
Family
ID=68518090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822105422.1U Expired - Fee Related CN209659709U (en) | 2018-12-14 | 2018-12-14 | A kind of pcb board with radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209659709U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114125606A (en) * | 2021-11-23 | 2022-03-01 | 安徽杰夫多媒体有限公司 | High heat dissipating's audio amplifier |
-
2018
- 2018-12-14 CN CN201822105422.1U patent/CN209659709U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114125606A (en) * | 2021-11-23 | 2022-03-01 | 安徽杰夫多媒体有限公司 | High heat dissipating's audio amplifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191119 |