CN111601467A - Precise manufacturing method of high-heat-dissipation 5G circuit board - Google Patents

Precise manufacturing method of high-heat-dissipation 5G circuit board Download PDF

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Publication number
CN111601467A
CN111601467A CN202010626915.9A CN202010626915A CN111601467A CN 111601467 A CN111601467 A CN 111601467A CN 202010626915 A CN202010626915 A CN 202010626915A CN 111601467 A CN111601467 A CN 111601467A
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China
Prior art keywords
box body
circuit layer
heat
circuit board
holes
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CN202010626915.9A
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Chinese (zh)
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CN111601467B (en
Inventor
卢小燕
李永红
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Suining Haixiang Electronic Technology Co ltd
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Suining Haixiang Electronic Technology Co ltd
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Publication of CN111601467A publication Critical patent/CN111601467A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a precise manufacturing method of a high-heat-dissipation 5G circuit board, which comprises the following steps of: s6, drilling a plurality of through holes (7) on the first circuit layer (5) by a drilling machine; s7, inserting copper pipes (8) matched with the through holes (7) into the through holes (7) to ensure that the copper pipes (8) are in interference fit with the through holes (7); s8, adhering a first solder mask layer (9) on the top of the first circuit layer (5) and in the gap thereof, and adhering a second solder mask layer (10) on the bottom of the second circuit layer (6) and in the gap thereof; s9, taking four tooth-type radiators (11), coating glue on the bottom surfaces of the substrates of the tooth-type radiators (11) by using a glue coating machine, and then respectively attaching the substrates of the four tooth-type radiators (11) to the four end faces of the box, thereby realizing the manufacture of the high-heat-dissipation type 5G circuit board. The invention has the beneficial effects that: the manufacturing method is simple, the heat dissipation efficiency is high, and the service life of the 5G circuit board is prolonged.

Description

Precise manufacturing method of high-heat-dissipation 5G circuit board
Technical Field
The invention relates to the technical field of 5G circuit board production, in particular to a precise manufacturing method of a high-heat-dissipation 5G circuit board.
Background
At present, the industrial substitute of the printed circuit board in China mainly represents the product substitution in the sub-industry, the market share of the rigid circuit board is shriveled, and the market share of the flexible circuit board is continuously expanded. The development of electronic products towards high density inevitably leads to higher hierarchy and smaller BGA hole pitch, thereby putting higher requirements on the heat resistance of materials. In the strategic transformation period of the current industrial chain integration and collaborative development innovation, the product heat dissipation, precise layout, packaging design and the like brought by the development of high density, new functionalization and intellectualization, light weight, thinness and thinness of the circuit board also provide more severe requirements for the innovation of the upstream CCL industry.
The 5G circuit board is applied to a large number of small electronic products and forms an indispensable important component of the electronic products, and the existing processing method of the 5G circuit board comprises the following steps: the method comprises the steps of firstly, using a common hard copper-clad substrate such as a resin glass fiber cloth substrate as a core layer board, then respectively arranging a first circuit layer and a second circuit layer on the top surface and the bottom surface of the copper substrate, drilling a through hole on the first circuit layer, ensuring that the through hole sequentially penetrates through the first circuit layer, the substrate and the second circuit layer, filling resin into the through hole to electrically connect the first circuit layer and the second circuit layer, then bonding a first solder mask layer on the top of the first circuit layer, bonding a second solder mask layer on the bottom of the second circuit layer, and finally processing the 5G circuit board. Because the first circuit layer and the second circuit layer have very large heat productivity, the circuit layer is damaged after working for a period of time, and then the whole IC board can not be used after being used for a period of time, and the defect of short service life exists. Therefore, a method for manufacturing a high heat dissipation type 5G circuit board is needed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a precise manufacturing method of a high-heat-dissipation 5G circuit board with simple manufacturing method and high heat dissipation efficiency.
The purpose of the invention is realized by the following technical scheme: a precise manufacturing method of a high-heat-dissipation 5G circuit board comprises the following steps:
s1, taking a box made of heat conducting materials, and sawing the box into two halves along the horizontal direction to obtain an upper box body and a lower box body;
s2, filling foam copper into the cavity of the lower box body, soaking heat conduction oil on the foam copper to ensure that the height of the foam copper is equal to that of the cavity in the box, and then paving a prepreg on the top surface of the upper box body;
s3, heating the prepreg by using a hot pressing head for 2-4 min, then buckling the lower end face of the upper box body on the top of the prepreg, applying 9-12N of pressure to the top surface of the upper box body, maintaining the pressure for 2-4 min, and after the prepreg is solidified, connecting the upper box body and the lower box body into a whole by using the prepreg;
s4, taking two copper foils, etching a first circuit layer on one copper foil, and etching a second circuit layer on the other copper foil;
s5, gluing the bottom surface of the first circuit layer by using a glue spreader, and then adhering the first circuit layer to the top surface of the upper box body; gluing the bottom surface of the second circuit layer by using a glue spreader, and then bonding the second circuit layer to the bottom surface of the lower box body;
s6, drilling a plurality of through holes on the first circuit layer by using a drilling machine, and ensuring that the through holes penetrate through the upper box body, the foamy copper, the lower box body and the second circuit layer;
s7, inserting copper pipes matched with the through holes into the through holes to ensure that the copper pipes are in interference fit with the through holes;
s8, adhering a first solder mask layer on the top of the first circuit layer and in the gap thereof, and adhering a second solder mask layer on the bottom of the second circuit layer and in the gap thereof;
s9, taking four tooth-type radiators, coating glue on the bottom surfaces of the substrates of the tooth-type radiators by a glue coating machine, and then respectively attaching the substrates of the four tooth-type radiators to the four end faces of the box, thereby realizing the manufacture of the high-heat-dissipation type 5G circuit board.
The box in step S1 is a rectangular box.
The box of the step S1 is surrounded by heat-conducting glue.
The invention has the following advantages: the manufacturing method is simple, the heat dissipation efficiency is high, and the service life of the 5G circuit board is prolonged.
Drawings
FIG. 1 is a schematic structural view of a lower case;
FIG. 2 is a schematic view of the lower case after filling with copper foam;
FIG. 3 is a schematic view of the upper case being fastened to the top of the lower case;
FIG. 4 is a schematic view of the box after bonding a circuit layer thereto;
FIG. 5 is a schematic view after a through hole is formed;
FIG. 6 is a schematic view of a copper tube inserted into a through hole;
FIG. 7 is a schematic structural diagram of a finished 5G circuit board;
FIG. 8 is an enlarged view of part I of FIG. 2;
in the figure, 1-an upper box body, 2-a lower box body, 3-foam copper, 4-a prepreg, 5-a first circuit layer, 6-a second circuit layer, 7-a through hole, 8-a copper pipe, 9-a first solder mask layer, 10-a second solder mask layer and 11-a tooth-type radiator.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
the first embodiment is as follows: a precise manufacturing method of a high-heat-dissipation 5G circuit board comprises the following steps:
s1, taking a box made of heat conducting materials, wherein the box is a rectangular box and is surrounded by heat conducting glue, sawing the box into two halves along the horizontal direction to obtain an upper box body 1 and a lower box body 2, and the structure of the lower box body is shown in figure 1;
s2, filling foam copper 3 into the cavity of the lower box body 2, soaking the foam copper 3 in heat conduction oil to ensure that the height of the foam copper 3 is equal to that of the cavity in the box, and then laying a prepreg 4 on the top surface of the upper box body 1 as shown in figures 2 and 8;
s3, heating the prepreg 4 by using a hot pressing head for 2min, then buckling the lower end face of the upper box body 1 on the top of the prepreg 4, applying 9N pressure to the top surface of the upper box body 1, maintaining the pressure for 2min, and after the prepreg is solidified, connecting the upper box body 1 and the lower box body 2 into a whole by using the prepreg 4 as shown in FIG. 3;
s4, taking two copper foils, etching a first circuit layer 5 on one copper foil, and etching a second circuit layer 6 on the other copper foil;
s5, applying glue on the bottom surface of the first circuit layer 5 by using a glue applicator, and then bonding the first circuit layer 5 on the top surface of the upper box body 1; gluing the bottom surface of the second circuit layer 6 by using a gluing machine, and then adhering the second circuit layer 6 to the bottom surface of the lower box body 2 as shown in fig. 4;
s6, drilling a plurality of through holes 7 on the first circuit layer 5 by using a drilling machine, wherein the through holes 7 penetrate through the upper box body 1, the copper foam 3, the lower box body 2 and the second circuit layer 6 as shown in FIG. 5;
s7, inserting copper pipes 8 matched with the through holes 7 into the through holes 7 to ensure that the copper pipes 8 and the through holes 7 are in interference fit as shown in FIG. 6;
s8, adhering a first solder mask layer 9 on the top of the first circuit layer 5 and in the gap thereof, and adhering a second solder mask layer 10 on the bottom of the second circuit layer 6 and in the gap thereof;
s9, taking four tooth-like heat sinks 11, applying glue on the bottom surfaces of the substrates of the tooth-like heat sinks 11 by using a glue applicator, and then respectively attaching the substrates of the four tooth-like heat sinks 11 to the four end surfaces of the box, thereby implementing the manufacturing of the high heat dissipation type 5G circuit board as shown in fig. 7.
After the first circuit layer 5 and the second circuit layer 6 work for a period of time, a large amount of heat is generated on the first circuit layer 5 and the second circuit layer 6, the heat on the first circuit layer 5 is transferred to the upper box body 1, the upper box body 1 directly transfers part of the heat to the heat conduction oil on the foam copper 3, the heat conduction oil plays a role of absorbing the heat, and the heat on the other part of the upper box body 1 is directly transferred to the tooth-type radiator 11, so that the first circuit layer 5 radiates heat in two ways, and the temperature on the first circuit layer 5 is reduced in a short time; simultaneously, the heat on the second circuit layer 6 is transferred to the lower box body 2, the lower box body 2 directly transfers part of the heat to the heat conduction oil on the foamy copper 3, and the other part of the heat is transferred to the tooth-type heat radiator 11, so that the second circuit layer 6 radiates heat in two ways, and the temperature on the second circuit layer 6 is reduced in a short time.
Therefore, the first circuit layer 5 and the second circuit layer 6 of the 5G circuit board manufactured by the manufacturing method can independently dissipate heat at the same time, so that compared with the traditional 5G circuit board, the heat dissipation efficiency is greatly improved, and the service life of the 5G circuit board is greatly prolonged. In addition, first circuit layer 5 and 1 large tracts of land contact of last box body, second circuit layer 6 and 2 large tracts of land contacts of box body down, and the box body contacts with 3 faces of foamy copper and face again to increased the radiating surface, further improved radiating efficiency, had the high characteristics of radiating rate.
Example two: the invention discloses a precise manufacturing method of a high-heat-dissipation 5G circuit board, which is different from the first embodiment in that: s3, heating the prepreg 4 by using a hot-pressing head for 4min, buckling the lower end face of the upper box body 1 on the top of the prepreg 4, applying 12N pressure to the top surface of the upper box body 1, maintaining the pressure for 4min, and connecting the upper box body 1 and the lower box body 2 into a whole by using the prepreg 4 after the prepreg is solidified.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (3)

1. A precise manufacturing method of a high-heat-dissipation 5G circuit board is characterized by comprising the following steps: it comprises the following steps:
s1, taking a box made of heat conducting materials, and sawing the box into two halves along the horizontal direction to obtain an upper box body (1) and a lower box body (2);
s2, filling foam copper (3) into the cavity of the lower box body (2), soaking the foam copper (3) with heat conduction oil to ensure that the height of the foam copper (3) is equal to that of the cavity in the box, and then laying a prepreg (4) on the top surface of the upper box body (1);
s3, heating the prepreg (4) by using a hot pressing head for 2-4 min, buckling the lower end face of the upper box body (1) on the top of the prepreg (4), applying 9-12N pressure to the top surface of the upper box body (1), maintaining the pressure for 2-4 min, and after the prepreg is solidified, connecting the upper box body (1) and the lower box body (2) into a whole by using the prepreg (4);
s4, two copper foils are used, a first circuit layer (5) is etched on one copper foil, and a second circuit layer (6) is etched on the other copper foil;
s5, gluing the bottom surface of the first circuit layer (5) by using a glue spreader, and then adhering the first circuit layer (5) to the top surface of the upper box body (1); gluing the bottom surface of the second circuit layer (6) by using a gluing machine, and then adhering the second circuit layer (6) to the bottom surface of the lower box body (2);
s6, drilling a plurality of through holes (7) on the first circuit layer (5) by using a drilling machine, and ensuring that the through holes (7) penetrate through the upper box body (1), the foamy copper (3), the lower box body (2) and the second circuit layer (6);
s7, inserting copper pipes (8) matched with the through holes (7) into the through holes (7) to ensure that the copper pipes (8) are in interference fit with the through holes (7);
s8, adhering a first solder mask layer (9) on the top of the first circuit layer (5) and in the gap thereof, and adhering a second solder mask layer (10) on the bottom of the second circuit layer (6) and in the gap thereof;
s9, taking four tooth-type radiators (11), coating glue on the bottom surfaces of the substrates of the tooth-type radiators (11) by using a glue coating machine, and then respectively attaching the substrates of the four tooth-type radiators (11) to the four end faces of the box, thereby realizing the manufacture of the high-heat-dissipation type 5G circuit board.
2. The precision manufacturing method of the high-heat-dissipation 5G circuit board according to claim 1, characterized in that: the box in step S1 is a rectangular box.
3. The precision manufacturing method of the high-heat-dissipation 5G circuit board according to claim 1, characterized in that: the box of the step S1 is surrounded by heat-conducting glue.
CN202010626915.9A 2020-07-02 2020-07-02 Precise manufacturing method of high-heat-dissipation 5G circuit board Active CN111601467B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566358A (en) * 2020-12-01 2021-03-26 吉安满坤科技股份有限公司 Preparation method of multilayer circuit board for 5G communication and multilayer circuit board thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096910A (en) * 2009-10-30 2011-05-12 Panasonic Electric Works Co Ltd Circuit board structure, circuit module using the same, and method of manufacturing the circuit module
CN103062263A (en) * 2012-12-06 2013-04-24 浙江大学 Energy storage type temperature control device and method of elevator braking unit
JP2016082235A (en) * 2014-10-09 2016-05-16 古河電気工業株式会社 Mounting structure of led light emission element package to foamed resin metal coating composite sheet board and foamed resin metal coating composite sheet board for led lighting equipment
CN205755051U (en) * 2016-07-06 2016-11-30 四川海英电子科技有限公司 A kind of novel high heat-conduction circuit board
US20170150651A1 (en) * 2015-11-19 2017-05-25 Boyd Corporation Densified foam for thermal insulation in electronic devices
CN206864189U (en) * 2017-06-22 2018-01-09 杜伟钗 A kind of mobile hard disk to be radiated using semiconductor chilling plate
CN108712825A (en) * 2018-08-01 2018-10-26 四川海英电子科技有限公司 A kind of production method of heat-conduction circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096910A (en) * 2009-10-30 2011-05-12 Panasonic Electric Works Co Ltd Circuit board structure, circuit module using the same, and method of manufacturing the circuit module
CN103062263A (en) * 2012-12-06 2013-04-24 浙江大学 Energy storage type temperature control device and method of elevator braking unit
JP2016082235A (en) * 2014-10-09 2016-05-16 古河電気工業株式会社 Mounting structure of led light emission element package to foamed resin metal coating composite sheet board and foamed resin metal coating composite sheet board for led lighting equipment
US20170150651A1 (en) * 2015-11-19 2017-05-25 Boyd Corporation Densified foam for thermal insulation in electronic devices
CN205755051U (en) * 2016-07-06 2016-11-30 四川海英电子科技有限公司 A kind of novel high heat-conduction circuit board
CN206864189U (en) * 2017-06-22 2018-01-09 杜伟钗 A kind of mobile hard disk to be radiated using semiconductor chilling plate
CN108712825A (en) * 2018-08-01 2018-10-26 四川海英电子科技有限公司 A kind of production method of heat-conduction circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566358A (en) * 2020-12-01 2021-03-26 吉安满坤科技股份有限公司 Preparation method of multilayer circuit board for 5G communication and multilayer circuit board thereof
CN112566358B (en) * 2020-12-01 2021-08-13 吉安满坤科技股份有限公司 Preparation method of multilayer circuit board for 5G communication and multilayer circuit board thereof

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