CN111601467B - Precise manufacturing method of high-heat-dissipation 5G circuit board - Google Patents

Precise manufacturing method of high-heat-dissipation 5G circuit board Download PDF

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Publication number
CN111601467B
CN111601467B CN202010626915.9A CN202010626915A CN111601467B CN 111601467 B CN111601467 B CN 111601467B CN 202010626915 A CN202010626915 A CN 202010626915A CN 111601467 B CN111601467 B CN 111601467B
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circuit layer
box body
holes
heat
layer
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CN202010626915.9A
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CN111601467A (en
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卢小燕
李永红
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Suining Haixiang Electronic Technology Co ltd
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Suining Haixiang Electronic Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a precise manufacturing method of a high heat dissipation 5G circuit board, which comprises the following steps: s6, drilling a plurality of through holes (7) on the first circuit layer (5) by adopting a drilling machine; s7, inserting copper pipes (8) matched with the through holes (7) into the through holes (7), and ensuring interference fit between the copper pipes (8) and the through holes (7); s8, bonding a first solder mask layer (9) on the top of the first circuit layer (5) and in a gap between the first circuit layer and the first solder mask layer, and bonding a second solder mask layer (10) on the bottom of the second circuit layer (6) and in a gap between the second circuit layer and the second circuit layer; s9, four tooth-shaped radiators (11) are taken, glue is coated on the bottom surface of the base plate of the tooth-shaped radiator (11) by a glue coating machine, and then the base plate of the four tooth-shaped radiators (11) is respectively attached to the four end faces of the box, so that the manufacturing of the high-heat-dissipation type 5G circuit board is realized. The beneficial effects of the invention are as follows: the manufacturing method is simple, the heat dissipation efficiency is high, and the service life of the 5G circuit board is prolonged.

Description

Precise manufacturing method of high-heat-dissipation 5G circuit board
Technical Field
The invention relates to the technical field of 5G circuit board production, in particular to a precise manufacturing method of a high-heat-dissipation 5G circuit board.
Background
At present, the industrial substitutes of the printed circuit boards in China are mainly represented by product substitutes in sub-industries, the market share of the rigid circuit boards is shrinking, and the market share of the flexible circuit boards is continuously expanding. The development of the electronic products to high density will lead to higher layering and smaller BGA hole spacing, so that higher requirements on heat resistance of materials are also put forward. In the strategic transformation period of the current industrial chain integration and collaborative development innovation, the high density of the circuit board and the new functionalization and intelligence of the circuit board, and the heat dissipation, the precise layout, the packaging design and the like of products brought by the light, thin and small development also put forward more stringent requirements for the innovation of the upstream CCL industry.
The 5G circuit board is applied to a large number of small electronic products, and forms an essential component of the electronic products, and the existing processing method of the 5G circuit board comprises the following steps: firstly, a common hard copper-clad substrate such as a resin glass fiber cloth substrate is used as a core plate, then a first circuit layer and a second circuit layer are respectively arranged on the top surface and the bottom surface of the copper substrate, through holes are drilled in the first circuit layer, the through holes are ensured to sequentially penetrate through the first circuit layer, the substrate and the second circuit layer, resin is plugged into the through holes so that the first circuit layer and the second circuit layer are electrically connected, then a first solder mask layer is bonded on the top of the first circuit layer, and meanwhile, a second solder mask layer is bonded on the bottom of the second circuit layer, so that a 5G circuit board is finally processed. Because the first circuit layer and the second circuit layer generate very large heat, the circuit layer is damaged after a period of operation, and then the whole IC board cannot be used after a period of use, and the defect of short service life exists. Therefore, a method for manufacturing a high heat dissipation type 5G circuit board is needed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a precise manufacturing method of a high-heat-dissipation 5G circuit board, which is simple in manufacturing method and high in heat dissipation efficiency.
The aim of the invention is achieved by the following technical scheme: a precise manufacturing method of a high heat dissipation 5G circuit board comprises the following steps:
s1, taking a box made of a heat conducting material, and sawing the box into two halves along the horizontal direction to obtain an upper box body and a lower box body;
s2, filling foam copper into a cavity of the lower box body, immersing heat conduction oil on the foam copper to ensure that the height of the foam copper is equal to the height of the cavity in the box, and paving a prepreg on the top surface of the upper box body;
s3, heating the prepreg by adopting a hot press head for 2-4 min, buckling the lower end face of the upper box body on the top of the prepreg, applying 9-12N pressure to the top surface of the upper box body, and after the prepreg is solidified, connecting the upper box body and the lower box body into a whole by the prepreg;
s4, taking two copper foils, etching a first circuit layer on one copper foil, and etching a second circuit layer on the other copper foil;
s5, gluing the bottom surface of the first circuit layer by using a gluing machine, and then adhering the first circuit layer to the top surface of the upper box body; coating glue on the bottom surface of the second circuit layer by using a glue coater, and then bonding the second circuit layer on the bottom surface of the lower box body;
s6, drilling a plurality of through holes on the first circuit layer by adopting a drilling machine, so as to ensure that the through holes penetrate through the upper box body, the foam copper, the lower box body and the second circuit layer;
s7, inserting copper pipes matched with the through holes into the through holes, and ensuring interference fit between the copper pipes and the through holes;
s8, bonding a first solder mask layer on the top of the first circuit layer and in a gap between the first circuit layer and the second circuit layer, and bonding a second solder mask layer on the bottom of the second circuit layer and in a gap between the second circuit layer and the second circuit layer;
and S9, taking four tooth-shaped radiators, coating glue on the bottom surface of the base plate of the tooth-shaped radiator by using a glue coater, and respectively attaching the base plate of the tooth-shaped radiator to the four end faces of the box, thereby realizing the manufacture of the high-heat-dissipation type 5G circuit board.
The box in the step S1 is a rectangular box.
The box in the step S1 is surrounded by heat conducting glue.
The invention has the following advantages: the manufacturing method is simple, the heat dissipation efficiency is high, and the service life of the 5G circuit board is prolonged.
Drawings
FIG. 1 is a schematic view of the structure of a lower case;
FIG. 2 is a schematic view of the lower case after filling the lower case with copper foam;
FIG. 3 is a schematic view of the upper shell snapped onto the top of the lower shell;
FIG. 4 is a schematic illustration of the bonding of the circuit layers to the cassette;
FIG. 5 is a schematic view of the through hole;
FIG. 6 is a schematic illustration of the copper tubing inserted into the through hole;
FIG. 7 is a schematic diagram of a finished 5G circuit board;
FIG. 8 is an enlarged partial view of the portion I of FIG. 2;
in the figure, 1-upper box body, 2-lower box body, 3-foam copper, 4-prepreg, 5-first circuit layer, 6-second circuit layer, 7-through hole, 8-copper pipe, 9-first solder mask layer, 10-second solder mask layer and 11-tooth radiator.
Detailed Description
The invention is further described below with reference to the accompanying drawings, the scope of the invention not being limited to the following:
embodiment one: a precise manufacturing method of a high heat dissipation 5G circuit board comprises the following steps:
s1, taking a box made of heat conducting materials, wherein the box is a rectangular box, the box is surrounded by heat conducting glue, the box is sawed into two halves along the horizontal direction, and an upper box body 1 and a lower box body 2 are obtained, and the structure of the lower box body is shown in figure 1;
s2, filling foam copper 3 into a cavity of the lower box body 2, immersing heat conduction oil on the foam copper 3 to ensure that the height of the foam copper 3 is equal to the height of the cavity in the box, and paving a prepreg 4 on the top surface of the upper box body 1 as shown in fig. 2 and 8;
s3, heating the prepreg 4 by adopting a hot press head, after heating for 2min, buckling the lower end face of the upper box body 1 on the top of the prepreg 4, applying 9N pressure to the top surface of the upper box body 1, and after maintaining the pressure for 2min, connecting the upper box body 1 and the lower box body 2 into a whole by the prepreg 4 after solidification of the prepreg, wherein the upper box body 1 is shown in figure 3;
s4, taking two copper foils, etching a first circuit layer 5 on one copper foil, and etching a second circuit layer 6 on the other copper foil;
s5, gluing the bottom surface of the first circuit layer 5 by using a gluing machine, and then adhering the first circuit layer 5 to the top surface of the upper box body 1; applying glue to the bottom surface of the second circuit layer 6 using a glue applicator, and then adhering the second circuit layer 6 to the bottom surface of the lower case 2 as shown in fig. 4;
s6, drilling a plurality of through holes 7 on the first circuit layer 5 by adopting a drilling machine as shown in FIG. 5, and ensuring that the through holes 7 penetrate through the upper box body 1, the foam copper 3, the lower box body 2 and the second circuit layer 6;
s7, inserting copper pipes 8 matched with the through holes 7 into the through holes 7, and ensuring that the copper pipes 8 are in interference fit with the through holes 7 as shown in FIG. 6;
s8, bonding a first solder mask layer 9 on the top of the first circuit layer 5 and in a gap between the first circuit layer and the first solder mask layer, and bonding a second solder mask layer 10 on the bottom of the second circuit layer 6 and in a gap between the second circuit layer and the second solder mask layer;
s9, four tooth-shaped radiators 11 are taken, glue is coated on the bottom surface of the base plate of the tooth-shaped radiator 11 by a glue coater, and then the base plate of the tooth-shaped radiator 11 is respectively attached to the four end faces of the box, so that the manufacturing of the high-heat-dissipation type 5G circuit board is realized as shown in FIG. 7.
When the first circuit layer 5 and the second circuit layer 6 work for a period of time, a large amount of heat is generated on the first circuit layer 5 and the second circuit layer 6, the heat on the first circuit layer 5 is transferred to the upper box body 1, the upper box body 1 directly transfers a part of heat to heat conduction oil on the copper foam 3, the heat conduction oil plays a role in absorbing the heat, and the heat on the other part of the upper box body 1 is directly transferred to the tooth radiator 11, so that the first circuit layer 5 dissipates the heat in two ways, and the temperature on the first circuit layer 5 is reduced in a short time; meanwhile, the heat on the second circuit layer 6 is transferred to the lower box body 2, part of the heat is directly transferred to the heat conduction oil on the foam copper 3 by the lower box body 2, and the other part of the heat is transferred to the tooth-shaped radiator 11, so that the second circuit layer 6 dissipates heat in two ways, and the temperature on the second circuit layer 6 is reduced in a short time.
Therefore, the first circuit layer 5 and the second circuit layer 6 of the 5G circuit board manufactured by the manufacturing method can simultaneously and independently dissipate heat, so that compared with the traditional 5G circuit board, the heat dissipation efficiency is greatly improved, and the service life of the 5G circuit board is greatly prolonged. In addition, the first circuit layer 5 is in large-area contact with the upper box body 1, the second circuit layer 6 is in large-area contact with the lower box body 2, and the box body is in surface-to-surface contact with the foam copper 3, so that the heat dissipation surface is increased, the heat dissipation efficiency is further improved, and the heat dissipation efficiency is high.
Embodiment two: the difference between the embodiment and the first embodiment is that: s3, heating the prepreg 4 by adopting a hot press head, after heating for 4min, buckling the lower end face of the upper box body 1 at the top of the prepreg 4, applying 12N pressure to the top surface of the upper box body 1, and after maintaining the pressure for 4min, connecting the upper box body 1 and the lower box body 2 into a whole by the prepreg 4 after solidification of the prepreg.
The foregoing is merely a preferred embodiment of the invention, and it is to be understood that the invention is not limited to the form disclosed herein but is not to be construed as excluding other embodiments, but is capable of numerous other combinations, modifications and environments and is capable of modifications within the scope of the inventive concept, either as taught or as a matter of routine skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.

Claims (2)

1. A precise manufacturing method of a high heat dissipation 5G circuit board is characterized by comprising the following steps: it comprises the following steps:
s1, taking a box formed by heat conducting glue, and sawing the box into two halves along the horizontal direction to obtain an upper box body (1) and a lower box body (2);
s2, filling foam copper (3) into a cavity of the lower box body (2), immersing heat conduction oil on the foam copper (3) to ensure that the height of the foam copper (3) is equal to the height of the cavity in the box, and paving a prepreg (4) on the top surface of the lower box body (2);
s3, heating the prepreg (4) by adopting a hot press head for 2-4 min, buckling the lower end face of the upper box body (1) on the top of the prepreg (4), applying 9-12N pressure to the top surface of the upper box body (1), maintaining the pressure for 2-4 min, and connecting the upper box body (1) with the lower box body (2) into a whole by the prepreg (4) after the prepreg is solidified;
s4, taking two copper foils, etching a first circuit layer (5) on one copper foil, and etching a second circuit layer (6) on the other copper foil;
s5, gluing the bottom surface of the first circuit layer (5) by using a gluing machine, and then adhering the first circuit layer (5) to the top surface of the upper box body (1); coating glue on the bottom surface of the second circuit layer (6) by using a glue coater, and then adhering the second circuit layer (6) to the bottom surface of the lower box body (2);
s6, drilling a plurality of through holes (7) on the first circuit layer (5) by adopting a drilling machine, and ensuring that the through holes (7) penetrate through the upper box body (1), the foam copper (3), the lower box body (2) and the second circuit layer (6);
s7, inserting copper pipes (8) matched with the through holes (7) into the through holes (7), and ensuring interference fit between the copper pipes (8) and the through holes (7);
s8, bonding a first solder mask layer (9) on the top of the first circuit layer (5) and in a gap between the first circuit layer and the first solder mask layer, and bonding a second solder mask layer (10) on the bottom of the second circuit layer (6) and in a gap between the second circuit layer and the second circuit layer;
s9, four tooth-shaped radiators (11) are taken, glue is coated on the bottom surface of the base plate of the tooth-shaped radiator (11) by a glue coating machine, and then the base plate of the four tooth-shaped radiators (11) is respectively attached to the four end faces of the box, so that the manufacturing of the high-heat-dissipation type 5G circuit board is realized.
2. The precise manufacturing method of the high-heat-dissipation 5G circuit board according to claim 1, wherein the method comprises the following steps: the box in the step S1 is a rectangular box.
CN202010626915.9A 2020-07-02 2020-07-02 Precise manufacturing method of high-heat-dissipation 5G circuit board Active CN111601467B (en)

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CN111601467B true CN111601467B (en) 2023-07-04

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CN112566358B (en) * 2020-12-01 2021-08-13 吉安满坤科技股份有限公司 Preparation method of multilayer circuit board for 5G communication and multilayer circuit board thereof

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JP5455028B2 (en) * 2009-10-30 2014-03-26 パナソニック株式会社 Circuit board structure
CN103062263A (en) * 2012-12-06 2013-04-24 浙江大学 Energy storage type temperature control device and method of elevator braking unit
JP2016082235A (en) * 2014-10-09 2016-05-16 古河電気工業株式会社 Mounting structure of led light emission element package to foamed resin metal coating composite sheet board and foamed resin metal coating composite sheet board for led lighting equipment
WO2017087969A1 (en) * 2015-11-19 2017-05-26 Boyd Corporation Densified foam for thermal insulation in electronic devices
CN205755051U (en) * 2016-07-06 2016-11-30 四川海英电子科技有限公司 A kind of novel high heat-conduction circuit board
CN206864189U (en) * 2017-06-22 2018-01-09 杜伟钗 A kind of mobile hard disk to be radiated using semiconductor chilling plate
CN108712825B (en) * 2018-08-01 2019-12-10 四川海英电子科技有限公司 Manufacturing method of heat conduction circuit board

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