CN207116949U - A high-power power distribution cabinet that is easy to dissipate heat - Google Patents

Abstract

The utility model discloses an easy heat dissipation high-power distribution cabinet, which comprises a cabinet body, an air draft device is arranged on the cabinet body, the air draft device is connected with an air draft pipe, the tail end of the air draft pipe penetrates through the cabinet body and is communicated with the interior of the cabinet body, the bottom surface of the cabinet body is provided with a heat insulation plate, the heat insulation plate and the bottom surface of the cabinet body are both provided with mounting holes, semiconductor refrigeration sheets used for refrigerating the interior of the cabinet body are inserted into the mounting holes, the hot end surfaces of the semiconductor refrigeration sheets are positioned outside the cabinet body, and the hot end surfaces of the semiconductor refrigeration sheets; this high-power switch board radiating effect of easily dispelling heat is good.

Description

A high-power power distribution cabinet that is easy to dissipate heat

technical field

The utility model relates to a high-power power distribution cabinet which is easy to dissipate heat.

Background technique

A distribution cabinet is a box in which electrical appliances and their circuits are placed to distribute electrical energy. Collectively referred to as the power distribution center. They are centrally installed in the substation of the enterprise, and distribute the electric energy to the lower-level power distribution equipment in different locations.

Because the internal components of the high-power power distribution cabinet will generate a lot of heat when they are powered on, accidents are likely to occur in the unattended situation, resulting in loss of personnel and property. However, the current heat dissipation effect of the power distribution cabinet is general. of technicians wish they could do better.

Utility model content

The technical problem to be solved by the utility model is to provide a high-power power distribution cabinet with good heat dissipation effect and easy heat dissipation.

In order to solve the above problems, the utility model adopts the following technical solutions:

A high-power power distribution cabinet that is easy to dissipate heat, including a cabinet body, an exhaust device is arranged on the cabinet body, the exhaust device is connected with an exhaust pipe, and the end of the exhaust pipe passes through the cabinet body and communicates with the inside of the cabinet body , the bottom of the cabinet is provided with a heat insulation board, and the heat insulation board and the bottom of the cabinet are provided with installation holes, and the installation holes are inserted with a semiconductor refrigeration sheet for cooling the inside of the cabinet, and the semiconductor refrigeration sheet The hot end surface is located outside the cabinet, and the hot end surface of the semiconductor refrigeration sheet is located under the heat insulation board.

As a preference, heat dissipation fins are provided on the cold end surface of the semiconductor refrigerating sheet, and the ends of the radiating fins pass through the installation holes and are located inside the cabinet. Increased heat transfer area.

As a preference, an extruded aluminum heat sink is arranged on the hot end surface of the semiconductor refrigerating sheet, and the heat on the hot end surface of the semiconductor refrigerating sheet can be better transferred to the outside air by providing the extruded aluminum radiator.

Preferably, the heat dissipation fins and the aluminum extruded heat sink are respectively bonded to the cold end surface and the hot end surface of the semiconductive cooling sheet, and the heat dissipation fins and the aluminum extruded radiator are respectively connected to the cold end surface and the hot end surface of the semiconductive cooling sheet reliably and stably Good sex.

As a preference, a temperature switch is provided in the cabinet, the temperature switch is connected with a universal shaped hose, the other end of the universal shaped hose is fixedly connected with the inner surface of the cabinet, the exhaust device, the semiconductor refrigeration sheet and the temperature The switches are connected in series in sequence. When the temperature in the cabinet reaches the operating temperature of the temperature switch, the temperature switch will automatically switch on the circuit, so that the semiconductor refrigeration sheet and the exhaust device will start to work immediately. It is connected to the shaped hose, which can facilitate the user to put the temperature switch close to the components with high heat generation.

Preferably, the side surface of the semiconductor refrigerating sheet is bonded to the heat insulation board, the connection between the semiconductor refrigerating sheet and the heat insulating board is stable, and the semiconductor refrigerating sheet and the heat insulating board are not easily separated.

Preferably, the cabinet body is connected with the heat insulation board by bolts, the cabinet body and the heat insulation board are connected stably, and the assembly and disassembly are convenient.

The beneficial effects of the utility model are: the hot air in the cabinet can be quickly sucked away by setting the exhaust device on the cabinet body, and the cooperation with the semiconductor refrigeration sheet can have an excellent heat dissipation effect, and the hot end surface of the semiconductor refrigeration sheet is located at Outside the cabinet, with the heat insulation board, it can effectively prevent the heat generated by the hot end surface of the semiconductor cooling chip from affecting the components inside the cabinet. The outlet installation hole is located inside the cabinet body, and the heat exchange area can be effectively increased by providing heat dissipation fins on the cold end surface of the semiconductor refrigeration sheet. An extruded aluminum heat sink is arranged on the hot end surface of the semiconductor refrigeration sheet, and the heat on the hot end surface of the semiconductor refrigeration sheet can be better transferred to the outside air through the arrangement of the aluminum extruded radiator. The heat dissipation fins and aluminum extruded radiators are respectively bonded to the cold end surface and the hot end surface of the semiconductor refrigeration sheet, and the heat dissipation fins and the aluminum extrusion radiator are respectively connected to the cold end surface and the hot end surface of the semiconductor refrigeration sheet reliably and with good stability. There is a temperature switch inside the cabinet, and the temperature switch is connected with a universal shaped hose. The other end of the universal shaped hose is fixedly connected to the inner surface of the cabinet. When the operating temperature of the temperature switch is reached, the temperature switch will automatically switch on the circuit, so that the semiconductor refrigeration sheet and the exhaust device will start to work immediately. The temperature switch is close to the components with high heat generation. The side of the semiconductor refrigeration sheet is bonded to the heat insulation board, the connection between the semiconductor refrigeration sheet and the heat insulation board is stable, and the semiconductor refrigeration sheet and the heat insulation board are not easy to separate. The cabinet body is connected with the heat insulation board by bolts, the cabinet body and the heat insulation board are connected stably, and the assembly and disassembly are convenient.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. For example, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

Figure 1 is a schematic diagram of the internal structure of a high-power power distribution cabinet that is easy to dissipate heat in the utility model;

Fig. 2 is a partial structural schematic diagram of a high-power power distribution cabinet that is easy to dissipate heat in the utility model.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example.

Example 1

As shown in Figure 1-2, a high-power power distribution cabinet that is easy to dissipate heat includes a cabinet body 1. An air pump 2 is arranged on the cabinet body 1. The air pump 2 is connected to the cabinet body 1 by bolts. The air pump 2 Connected with an exhaust pipe 3, the end of the exhaust pipe 3 runs through the cabinet body 1 and communicates with the interior of the cabinet body 1. The bottom surface of the cabinet body 1 is provided with a heat insulation board 4, and the heat insulation board 4 and the cabinet body 1 Bottom surfaces are provided with mounting holes 5, and the mounting holes 5 are inserted with semiconductor cooling sheets 6 for cooling the interior of the cabinet body 1. The hot end surface of the semiconductor cooling sheet 6 is located outside the cabinet body 1, and the hot end surface of the semiconductor cooling sheet 6 Located under the heat insulation board 4, the hot air in the cabinet 1 can be quickly sucked out by installing an air pump 2 on the top of the cabinet 1, and the cooperation with the semiconductor cooling sheet 6 can achieve an excellent heat dissipation effect, and the semiconductor cooling sheet The hot end surface of 6 is located outside the cabinet body 1, and the heat insulation board 4 can effectively prevent the heat generated by the hot end surface of the semiconductor cooling chip 6 from affecting the components inside the cabinet body 1.

The beneficial effects of this embodiment are as follows: the hot air in the cabinet can be quickly sucked away by providing an air pump on the cabinet body, and the cooperation with the semiconductor refrigeration sheet can have an excellent heat dissipation effect, and the hot end surface of the semiconductor refrigeration sheet is located at Outside the cabinet, with the heat insulation board, it can effectively prevent the heat generated by the hot end surface of the semiconductor cooling chip from affecting the components inside the cabinet.

Example 2

As shown in Figure 1-2, a high-power power distribution cabinet that is easy to dissipate heat includes a cabinet body 1. An air pump 2 is arranged on the cabinet body 1. The air pump 2 is connected to the cabinet body by bolts. The air pump 2 is connected to There is an exhaust pipe 3, and the end of the exhaust pipe 3 runs through the cabinet body 1 and communicates with the interior of the cabinet body 1. The bottom surface of the cabinet body 1 is provided with a heat insulation board 4, and the heat insulation board 4 and the bottom surface of the cabinet body 1 Both are provided with mounting holes 5, and the mounting holes 5 are inserted with a semiconductor cooling chip 6 for cooling the interior of the cabinet body 1. The hot end surface of the semiconductor cooling chip 6 is located outside the cabinet body 1, and the hot end surface of the semiconductor cooling chip 6 is located at Below the heat insulation board 4, a heat dissipation fin 7 is arranged on the cold end surface of the semiconductor refrigeration sheet 6, and the end of the heat dissipation fin 7 passes through the installation hole 4 and is located inside the cabinet body 1, and passes through the cold end surface of the semiconductor refrigeration sheet 6. The heat dissipation fins 7 are arranged on the top, which can effectively increase the heat exchange area. An extruded aluminum heat sink 8 is arranged on the hot end surface of the semiconductor refrigerating sheet 7 , and the heat on the hot end surface of the semiconductor refrigerating sheet 6 can be better transferred to the outside air by being provided with the extruded aluminum radiator 8 . The heat dissipation fins 7 and the aluminum extruded radiator 8 are respectively bonded to the cold end surface and the hot end surface of the semiconductive cooling fin 6, and the heat dissipation fins 7 and the aluminum extruded radiator 8 are respectively connected to the cold end surface and the hot end surface of the semiconductive cooling fin 6 Reliable and stable. The cabinet 1 is provided with a temperature switch 9, the temperature switch 9 is connected with a universal shaped hose 10, the other end of the universal shaped hose 10 is bonded to the inner surface of the cabinet 1, and the air pump 2 , the semiconductor refrigerating sheet 6 and the temperature switch 9 are connected in series successively, and when the temperature in the cabinet 1 reaches the operating temperature of the temperature switch 9, the temperature switch 9 is automatically connected to the circuit, so that the semiconductor refrigerating sheet 6 and the air pump 2 start working immediately, The degree of automation is high, and the cabinet body 1 and the temperature switch 9 are connected by a universal shaped hose 10, which can facilitate the user to bring the temperature switch 9 close to components with large heat generation. The side surfaces of the semiconductor refrigerating sheet 6 are bonded to the heat insulating plate 4 , the semiconductor refrigerating sheet 6 is stably connected to the insulating plate 4 , and the semiconductor refrigerating sheet 6 is not easily separated from the insulating plate 4 . The cabinet body 1 is connected with the heat insulation board 4 by bolts, and the cabinet body 1 and the heat insulation board 4 are connected stably, and the disassembly and assembly are convenient. By installing an air pump 2 on the cabinet body 1, the hot air in the cabinet body 1 can be quickly sucked away, and the cooperation with the semiconductor cooling sheet 6 can achieve an excellent heat dissipation effect, and the hot end surface of the semiconductor cooling sheet 6 is located in the cabinet body 1, the heat insulation board 4 can effectively prevent the heat generated by the hot end surface of the semiconductor cooling plate 6 from affecting the components inside the cabinet body 1.

The beneficial effects of this embodiment are as follows: the hot air in the cabinet can be quickly sucked away by providing an air pump on the cabinet body, and the cooperation with the semiconductor refrigeration sheet can have an excellent heat dissipation effect, and the hot end surface of the semiconductor refrigeration sheet is located at Outside the cabinet, with the heat insulation board, it can effectively prevent the heat generated by the hot end surface of the semiconductor cooling chip from affecting the components inside the cabinet. The cold end surface of the semiconductor cooling chip is equipped with a heat dissipation fin, and the end of the heat dissipation fin is installed The hole is located inside the cabinet, and the heat exchange area can be effectively increased by providing heat dissipation fins on the cold end surface of the semiconductor refrigeration sheet. An extruded aluminum heat sink is arranged on the hot end surface of the semiconductor refrigeration sheet, and the heat on the hot end surface of the semiconductor refrigeration sheet can be better transferred to the outside air through the arrangement of the aluminum extruded radiator. The heat dissipation fins and aluminum extruded radiators are respectively bonded to the cold end surface and the hot end surface of the semiconductor refrigeration sheet, and the heat dissipation fins and the aluminum extrusion radiator are respectively connected to the cold end surface and the hot end surface of the semiconductor refrigeration sheet reliably and with good stability. There is a temperature switch inside the cabinet, and the temperature switch is connected with a universal shaped hose. When the operating temperature of the temperature switch is reached, the temperature switch is automatically connected to the circuit, so that the semiconductor refrigeration sheet and the air pump start to work immediately, with a high degree of automation, and the connection between the cabinet and the temperature switch is through a universal shaped hose, which is convenient for the user to install The temperature switch is close to the components with high heat generation. The side of the semiconductor refrigeration sheet is bonded to the heat insulation board, the connection between the semiconductor refrigeration sheet and the heat insulation board is stable, and the semiconductor refrigeration sheet and the heat insulation board are not easy to separate. The cabinet body is connected with the heat insulation board by bolts, the cabinet body and the heat insulation board are connected stably, and the assembly and disassembly are convenient.

The above is only a specific embodiment of the utility model, but the scope of protection of the utility model is not limited thereto, and any change or replacement that is not thought of through creative work should be covered within the scope of protection of the utility model .

Claims (7)

1. A high-power power distribution cabinet that is easy to dissipate heat, including a cabinet body, characterized in that: an exhaust device is arranged on the cabinet body, the exhaust device is connected with an exhaust pipe, and the end of the exhaust pipe runs through the cabinet body and It communicates with the inside of the cabinet, and the bottom of the cabinet is provided with a heat insulation board, and both the heat insulation board and the bottom of the cabinet are provided with installation holes, and the installation holes are inserted with semiconductor refrigeration chips for cooling the interior of the cabinet, The hot end surface of the semiconductor cooling sheet is located outside the cabinet, and the hot end surface of the semiconductor cooling sheet is located below the heat insulation board. 2. A high-power power distribution cabinet that is easy to dissipate heat according to claim 1, characterized in that: the cold end surface of the semiconductor cooling plate is provided with a heat dissipation fin, and the end of the heat dissipation fin passes through the installation hole and is located in the cabinet. body interior. 3. A high-power power distribution cabinet that is easy to dissipate heat according to claim 2, wherein an extruded aluminum heat sink is arranged on the hot end surface of the semiconductor cooling fin. 4. A high-power power distribution cabinet that is easy to dissipate heat according to claim 3, wherein the heat dissipation fins and the extruded aluminum heat sink are respectively bonded to the cold end surface and the hot end surface of the semiconductor cooling fin. 5. A high-power power distribution cabinet that is easy to dissipate heat according to claim 4, wherein a temperature switch is installed in the cabinet, and the temperature switch is connected with a universal shaping hose, and the universal shaping soft The other end of the tube is fixedly connected to the inner surface of the cabinet, and the air exhaust device, the semiconductor cooling plate and the temperature switch are connected in series in sequence. 6. A high-power power distribution cabinet that is easy to dissipate heat according to claim 5, characterized in that: the side of the semiconductor cooling plate is glued to the heat insulation board. 7. A high-power power distribution cabinet that is easy to dissipate heat according to claim 6, wherein the cabinet body is connected with a heat shield by bolts.