CN102858141A - Dispersive heat radiation type thermostat for field instruments - Google Patents

Dispersive heat radiation type thermostat for field instruments Download PDF

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Publication number
CN102858141A
CN102858141A CN201210335800XA CN201210335800A CN102858141A CN 102858141 A CN102858141 A CN 102858141A CN 201210335800X A CN201210335800X A CN 201210335800XA CN 201210335800 A CN201210335800 A CN 201210335800A CN 102858141 A CN102858141 A CN 102858141A
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CN
China
Prior art keywords
heat dissipation
heat radiation
subspace
semiconductor chilling
chilling plate
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CN201210335800XA
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Chinese (zh)
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CN102858141B (en
Inventor
张荣标
楚孔旭
王东宏
陈克元
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江苏大学
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Priority to CN201210335800.XA priority Critical patent/CN102858141B/en
Publication of CN102858141A publication Critical patent/CN102858141A/en
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Publication of CN102858141B publication Critical patent/CN102858141B/en

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Abstract

The invention discloses a dispersive heat radiation type thermostat for field instruments. A heat radiation passage is externally disposed on the top of the box body, a plurality of parallel heat radiation fins are arranged in the heat radiation passage, a fan is arranged at one end of the heat radiation passage, space on the top in the box body is divided into a plurality of subspace heat radiation boxes, the bottom of each subspace heat radiation box is a shared double-rail support structure, the lower portions of the heat radiation fins are nested on the top wall in the box body and are semiconductor cooling fins arranged in the subspace heat radiation boxes, cooling guide fins are arranged on the lower portions of the semiconductor cooling fins, heat surfaces of the semiconductor cooling fins are connected with the heat radiation fins, and the cold surfaces of the semiconductor cooling fins are connected with the cooling guide fins. The semiconductor cooling fins and the cooling guide fins are arranged in each subspace heat radiation box. Temperature detection and control modules arranged below the cooling guide fins and electronic instruments to be radiated are arranged in the subspace heat radiation boxes, and the temperature detection and control modules are connected with the semiconductor cooling fins via a power source driving module. The dispersive heat radiation type thermostat is capable of effectively isolating heat and cold transfer, and realizes heat radiation of the electronic instruments working in the outdoor environment.

Description

The field apparatus insulating box of distributing heat radiation

Technical field

The present invention relates to a kind of instrument Thermotank device, particularly work in the instrument Thermotank device of wild environment, be used for realizing reducing the device fault that high temperature causes to working in the heat radiation of electronic instrument under the open-air atmosphere.

Background technology

Hot environment has a significant impact the normal operation of electronic instrument, particularly be placed in open-air electronic instrument, under hot summer daylight, the in addition heating of instrument itself, can make operational environment reach quite high temperature, have a strong impact on the normal operation of electronic instrument, cause the electronic instrument fault, in some occasion even can produce certain potential safety hazard.

For this situation, people adopt the instrument incubator, and the electronic instrument that is placed in the incubator is operated under the more suitable temperature environment.The part but traditional incubator comes with some shortcomings: with regard to refrigeration modes, traditional incubator adopts external hanging type compressor air-conditioning refrigeration, and the compressor air-conditioning volume is large, and can not be placed in the incubator, there is not special safeguard measure easily stolen, simultaneously, the involving great expense of air-conditioning; On the refrigeration radiating method, traditional incubator adopts the integral type refrigeration radiating, and to the unified refrigeration radiating that has living space of whole casing, without specific aim, radiating efficiency is low, and power consumption is large; In the configuration aspects of incubator, traditional incubator take the inner space as integral type, not with the spatial mode blocking, can not solve modularization internal heat equilibrium problem, and energy waste is larger.

Summary of the invention

The objective of the invention is the deficiency for the instrument incubator of existing field condition, propose the field apparatus insulating box of the distributing heat radiation that a kind of volume is little, power consumption is little, refrigeration radiating efficient is high.

The technical solution used in the present invention is: comprise casing, casing is equipped with heat dissipation channel outside the top, be provided with a plurality of fin side by side in the heat dissipation channel, one end of heat dissipation channel is provided with fan, headroom in the casing has been separated a plurality of subspaces heat dissipation tank, every sub spaces heat dissipation tank bottom is the Double-rail support structure that shares, the fin bottom is on the roof that is inlaid in the casing and is arranged in the semiconductor chilling plate of subspace heat dissipation tank, the semiconductor chilling plate bottom is cool guide sheet, the hot side of semiconductor chilling plate is connected with fin, huyashi-chuuka (cold chinese-style noodles) is connected with cool guide sheet, in every sub spaces heat dissipation tank semiconductor chilling plate and cool guide sheet are arranged all, and temperature detection and the control module that is positioned at the cool guide sheet below and the electronic instrument that needs heat radiation are all arranged in every sub spaces heat dissipation tank, and temperature detection and control module connect semiconductor chilling plate by electric power driving module.

Beneficial effect of the present invention is as follows:

1, the present invention is directed to the Instrument Design of field condition, the refrigeration radiating mode adopts semiconductor refrigerating technology to the casing refrigeration radiating, but not the compressor air-conditioning refrigeration is safe, greatly reduces power consumption, and it is also convenient to install.

2, the present invention is directed to the characteristics that semiconductor chilling plate can only have to small volume space refrigeration, the instrument container that volume is larger is partitioned into the subspace heat dissipation tank of respective numbers as required, the only refrigeration radiating of antithetical phrase space heat elimination packing list has satisfied the condition of work of semiconductor chilling plate.

3, the present invention is having the electronic device of strict demand to put into the subspace heat dissipation tank to operating ambient temperature, and such as CPU etc., it is outside that other electronic devices that operating ambient temperature is not required then are placed on the subspace heat dissipation tank.This subspace heat dissipation tank that passes through has improved refrigerating efficiency with the isolated also mode of separate refrigeration of internal and external environment, has saved the energy and adjusting time.

4, the fin of the semiconductor chilling plate among the present invention discharges side by side, all in the heat dissipation channel of insulating box outside, and fin fin direction is axially settled by heat dissipation channel, only need a fan just can form air circulation in the heat dissipation channel, realization is to the heat radiation of all fin, and do not need each fin to add radiator fan.The existence of heat dissipation channel had both guaranteed the circulation of air to have played again the protection to fin, had avoided the exposed damage of fin.

5, the present invention adds the one layer of heat preservation thermal insulation layer at subspace heat dissipation tank inwall, and this insulation layer material adopts compressed sponge.Can effectively isolate cold and hot transmission, make heat dissipation tank interior refrigeration in subspace better.

6, the heat dissipation tank top, subspace among the present invention all links to each other with casing with dorsal surface, has saved material.The right edge of positive side is connected with right flank by hinge, but positive side is the switching door structure, makes things convenient for the taking and placing of electronic instrument, does not need dismounting.The bottom has Double-rail support to support the subspace heat dissipation tank, has reinforced structural stability.

7, the cool guide sheet of the semiconductor chilling plate refrigerating system among the present invention is at the top of subspace heat dissipation tank, and the cold air of cool guide sheet periphery descends, hot air rising, and this has just formed cross-ventilation automatically, and does not need to add the fan belt moving air flow again.

Description of drawings

Fig. 1 is overall structure profile of the present invention;

Fig. 2 is the stereochemical structure enlarged drawing of Fig. 1 neutron space heat elimination case 6 internal structures and associated member thereof;

Fig. 3 is the mounting structure enlarged drawing of fin 3 of the present invention, semiconductor chilling plate 4, cool guide sheet 5 and heat insulating mattress 16, electric wire 17;

Fig. 4 is the internal structure enlarged drawing of heat dissipation channel 2 among Fig. 1;

Among the figure: 1. casing; 2. heat dissipation channel; 3. fin; 4. semiconductor chilling plate; 5. cool guide sheet; 6. subspace heat dissipation tank; 7. fan; 8. circuit breaker; 9. Double-rail support structure; 11. temperature detection and control module; 12. electronic device; 13. hinge; 14. sponge; 15. handle; 16. heat insulating mattress; 17. electric wire.

Embodiment

The field apparatus insulating box of distributing heat radiation of the present invention is the insulating box for the design of field condition apparatus, insulating box is to improve on the basis of original instrument container, change semiconductor chilling plate refrigeration into, independently dispel the heat in the by stages, replacement traditional compressor air-conditioning heat dissipation.

Referring to Fig. 1-4, the present invention includes casing 1 and external heat dissipation channel 2 at casing 1 top, in heat dissipation channel 2, there are a plurality of fin 3 to settle side by side, at heat dissipation channel 2 one end provided with fans 7, drive airflow radiating.Headroom in the casing 1 has been separated a plurality of subspaces heat dissipation tank 6, and every sub spaces heat dissipation tank 6 bottoms are the Double-rail support structures 9 that share.Be semiconductor chilling plate 4 below the fin 3, semiconductor chilling plate 4 is inlaid on the tank wall of the top layer in the casing 1 and is positioned at subspace heat dissipation tank 6, and the semiconductor chilling plate 4 outer heat insulating mattresss 16 that are with are protected, and prevent that semiconductor chilling plate 4 is compressed.Cool guide sheet 5 is below semiconductor chilling plate 4, and cool guide sheet 5 peripheries are cabinet spaces of subspace heat dissipation tank 6.Every sub spaces heat dissipation tank 6 is independently opened up, a public casing between they face mutually, and subspace heat dissipation tank 6 is wide and high equal, and length is set according to internal electronic device 12 volumes.Heat dissipation tank 6 tops in subspace all link to each other with casing 1 with the back side, and the bottom is supported by Double-rail support structure 9.The electronic instrument 12 that every sub spaces heat dissipation tank 6 an interior semiconductor chilling plate 4 and one and half cool guide sheets 5 all installed, every sub spaces heat dissipation tank 6 inside also are equipped with temperature detection and the control module 11 that is positioned at cool guide sheet 5 belows and need to dispel the heat.Part beyond the subspace heat dissipation tank 6 is non-refrigeration radiating space, and non-refrigeration radiating spatial volume is large, is used for settling circuit breaker 8 grades not need the electronic device of low-temperature working environment.

Different from the instrument insulating box of traditional air conditioner refrigerating, insulating box of the present invention adopts the casing 1 internal refrigeration storage heat radiation of 4 pairs of insulating boxs of semiconductor chilling plate.Semiconductor chilling plate 4 volumes are little, the machinery-free moving component, install very convenient.After semiconductor chilling plate 4 powered on, semiconductor chilling plate 4 hot sides can be emitted heat, and huyashi-chuuka (cold chinese-style noodles) then absorbs heat, utilized huyashi-chuuka (cold chinese-style noodles) can reach the effect of refrigeration radiating.But semiconductor chilling plate 4 can only be to the space refrigeration heat radiation of small volume, and the excessive refrigeration of volume is very not obvious.And the volume of the casing 1 of field instrumentation case very large (being generally 400-600L) has little effect with semiconductor chilling plate 4, if with a plurality of semiconductor chilling plates then cost can corresponding rising.In order to address the above problem, the present invention carries out piecemeal with bulky casing 1 inside, as required casing 1 inside is partitioned into the subspace heat dissipation tank 6 of respective numbers, and semiconductor chilling plate 4 is installed in every sub spaces heat radiation box 6.By subspace heat dissipation tank 6 isolation internal and external environments, give the heat radiation of subspace heat dissipation tank 6 separate refrigeration by semiconductor chilling plate 4.The model of semiconductor chilling plate 4 is selected, to decide according to the cold gross power of product that can satisfy temperature difference requirement, it must guarantee the summation of refrigeratory capacity when working temperature greater than the gross power of target heat load in the heat dissipation tank of subspace, otherwise can't reach requirement.The maximum refrigeratory capacity that is semiconductor chilling plate 4 is Cmax, the thermal power of subspace heat dissipation tank 6 each electronic instruments 12 Pi only satisfies condition The time, could satisfy the refrigeration requirement, reach modularization internal heat balance.Heat dissipation tank 6 volumes in subspace are set according to electronic device 12 sizes of putting into wherein.Can the selection of semiconductor chilling plate 4 models be to decide according to the cold gross power of product that satisfy temperature difference requirement, and it must guarantee that the summation of refrigeratory capacity when working temperature is greater than the gross power of subspace heat dissipation tank 6 interior target electronic device 12 heat loads.Need the part of thermal component electronic device 12 small volumes, be placed in the little subspace heat dissipation tank 6 of volume, semiconductor chilling plate 4 is selected model TEC1-12708.And need the larger part of thermal component 12 volumes, and corresponding subspace heat dissipation tank 6 volumes are large, and semiconductor chilling plate 4 is selected and is produced cold power relatively large TES1-12712.Semiconductor chilling plate 4 is placed in the top tank wall of casing 1, is with heat insulating mattress 16 fixing and protections outward, prevents that semiconductor chilling plate 4 is extruded.These do not need the device of low-temperature working environment then to be placed on outside the subspace heat dissipation tank 6 to need not thermal component such as circuit breaker 8 and circuit electric wire.The general layout of this local refrigeration radiating had both satisfied the refrigeration condition of semiconductor chilling plate 4, had reduced again the refrigeration radiating space, only to the space refrigeration heat radiation of needs refrigeration, had greatly improved refrigerating efficiency.

Referring to Fig. 2, the top of subspace heat dissipation tank 6 all links to each other with casing 1 with the back side, has saved top and backing material.Positive right edge is connected with right flank by hinge 13, and the front is provided with handle 15, and the front is equivalent to the door of subspace heat dissipation tank 6, and by the positive folding of handle 15 controls, door has made things convenient for the taking and placing of electronic instrument 12.Heat dissipation tank 6 bottoms in subspace are supported by Double-rail support structure 9.Inwall at subspace heat dissipation tank 6 has one deck compressed sponge 14, and it is the thermal insulation separation thermosphere, the effectively inside and outside cold and hot transmission of separaant space heat elimination case 6.Are cool guide sheets 5 at the top of subspace heat dissipation tank 6, by the 6 inner conduction coolings heat radiations of cool guide sheet 5 antithetical phrase space heat elimination casees, the electronic instrument 12 that need to be operated under the low temperature environment is placed in the subspace heat dissipation tank 6.

Referring to Fig. 3,4, semiconductor chilling plate 4 connects electric wires 17, and the hot side of semiconductor chilling plate 4 is connected connections with fin, and huyashi-chuuka (cold chinese-style noodles) is connected connections with cool guide sheet, and the centre is screwed in together between fin 3 and the cool guide sheet 5 by the heat-conducting silicone grease stickup.After giving semiconductor chilling plate 4 power supplies by electric wire 17, the hot side of semiconductor chilling plate 4 can generate heat, and huyashi-chuuka (cold chinese-style noodles) can absorb heat.Semiconductor chilling plate 4 is embedded in the top layer tank wall of casing 1 of insulating box, peripherally prevents that by heat insulating mattress 16 fixing and protections the extruding of semiconductor chilling plate 4 from causing damage, and heat insulating mattress 16 can effectively isolate cold and hot transmission, makes refrigeration better.Must give the hot side good heat radiating during semiconductor chilling plate 4 work, semiconductor chilling plate 4 is being easy to damage without working under the radiating condition, fin 3 links to each other with the hot side of semiconductor chilling plate 4, fin 3 is installed in the heat dissipation channel 2 of outside, insulating box 1 top side by side, the fin of fin 3 is pressed the passage axial direction and is arranged, and guarantees the air-flow conducting.Head at heat dissipation channel 2 is equipped with radiator fan 7, is driven in the heat dissipation channels 2 radiating airflow by fan 7, to fin 3 heat radiations.Cool guide sheet 5 links to each other with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 4, is installed in the top in the subspace heat dissipation tank 6.Owing to the density reason, the cold air of cool guide sheet 5 peripheries sinks, and the bottom hot air rising in the subspace heat dissipation tank 6 has formed cross-ventilation automatically, need not to add fan 7 and drives Air Flow.This structure has realized outside concentrated heat radiation, the inner respectively high efficiency instrument insulating box of refrigeration.

The present invention can realize the control to temperature, is realized by temperature detection and control module 11.Temperature detection and control module 11 all have been installed in every sub spaces heat dissipation tank 6, temperature detection and control module 11 connect semiconductor chilling plate 4 by electric power driving module, the temperature inside the box of the corresponding subspace of Real-Time Monitoring heat dissipation tank 6, the temperature that is higher than setting when the temperature that detects subspace heat dissipation tank 6, for example 25 when spending, electric power driving module corresponding to temperature detection and control module 11 controls worked antithetical phrase space heat elimination case 6 refrigeration radiatings to semiconductor chilling plate 4; When temperature detection and control module 11 monitored space temperature and be lower than the temperature of setting, for example 25 when spending, and temperature detection and the corresponding semiconductor chilling plate 4 of control module 11 controls quit work.So, make and keep a stable space temperature in the subspace heat dissipation tank 6 always.By antithetical phrase space heat elimination case 6 difference temperature detection, refrigeration radiating reaches heat balance respectively, and this method is efficient, energy-conservation.

To sum up; the present invention can be not deviate from the multi-form enforcement of essential characteristic of the present invention; the present embodiment combines semiconductor refrigerating technology, automation detection and control technology, for field environmental protection system for field device provides constant temperature protection, and has the characteristics of energy-conservation, safety, environmental protection.Improved the refrigeration radiating mode of insulating box, had great application prospect.The present invention not only is confined to the insulating box for wild environment, can be applied to as required instrument insulating box under the multiple environment.

Claims (6)

1. the field apparatus insulating box of distributing heat radiation, comprise casing (1), it is characterized in that: casing (1) is equipped with heat dissipation channel (2) outside the top, be provided with a plurality of fin (3) side by side in the heat dissipation channel (2), one end of heat dissipation channel (2) is provided with fan (7), headroom in the casing (1) has been separated a plurality of subspaces heat dissipation tanks (6), every sub spaces heat dissipation tank (6) bottom is the Double-rail support structure (9) that shares, fin (3) bottom is on the roof that is inlaid in the casing (1) and is arranged in the semiconductor chilling plate (4) of subspace heat dissipation tank (6), semiconductor chilling plate (4) bottom is cool guide sheet (5), the hot side of semiconductor chilling plate (4) is connected 3 with fin) connect, huyashi-chuuka (cold chinese-style noodles) is connected 5 with cool guide sheet) connect, semiconductor chilling plate (4) and cool guide sheet (5) are all arranged in every sub spaces heat dissipation tank (6), and temperature detection and the control module (11) that is positioned at cool guide sheet (5) below and the electronic instrument (12) that needs heat radiation are all arranged in every sub spaces heat dissipation tank (6), and temperature detection and control module (11) connect semiconductor chilling plate (4) by electric power driving module.
2. the field apparatus insulating box of distributing according to claim 1 heat radiation, it is characterized in that: the top of subspace heat dissipation tank (6) and the back side all link to each other with casing (1), positive right edge is connected with right flank by hinge (13), and the front is provided with handle (15).
3. the field apparatus insulating box of distributing according to claim 1 heat radiation, it is characterized in that: the inwall of subspace heat dissipation tank (6) is provided with one deck compressed sponge (14).
4. the field apparatus insulating box of distributing heat radiation according to claim 1 is characterized in that: the outer heat insulating mattress (16) that is arranged with of semiconductor chilling plate (4).
5. the field apparatus insulating box of distributing according to claim 1 heat radiation, it is characterized in that: subspace heat dissipation tank (6) the interior arrangement of casing (1) does not in addition need the electronic device of low-temperature working environment.
6. the field apparatus insulating box of distributing according to claim 1 heat radiation, it is characterized in that: when temperature detection and control module (11) detect temperature in the subspace heat dissipation tank (6) and be higher than design temperature, semiconductor chilling plate (4) work that temperature detection and control module (11) control is corresponding, antithetical phrase space heat elimination case (6) refrigeration radiating; When temperature detection and control module (11) detected temperature in the subspace heat dissipation tank (6) and be lower than design temperature, semiconductor chilling plate (4) corresponding to temperature detection and control module (11) control quit work.
CN201210335800.XA 2012-09-12 2012-09-12 Dispersive heat radiation type thermostat for field instruments CN102858141B (en)

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CN102858141B CN102858141B (en) 2015-03-04

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103353564A (en) * 2013-07-08 2013-10-16 工业和信息化部电子第五研究所 Intermittent life testing device
CN104174448A (en) * 2014-08-18 2014-12-03 合肥工业大学 Natural convection type high-precision thermostat
CN105208820A (en) * 2015-10-20 2015-12-30 南京中网卫星通信股份有限公司 Water-proof and dust-proof communication box
CN107943145A (en) * 2017-12-21 2018-04-20 大连中工策控科技有限公司 A kind of easy to remove and heat dissipation industrial personal computer
CN109163199A (en) * 2018-07-27 2019-01-08 合肥金新允电子技术有限公司 A kind of wall-mounted installation structure of touch panels of household

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101409374A (en) * 2008-11-19 2009-04-15 南京科迅科技有限公司 Constant temperature cabinet for accumulator and temperature-controlling method thereof
CN102320420A (en) * 2011-05-27 2012-01-18 公安部第一研究所 Incubator based on semiconductor refrigeration

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101409374A (en) * 2008-11-19 2009-04-15 南京科迅科技有限公司 Constant temperature cabinet for accumulator and temperature-controlling method thereof
CN102320420A (en) * 2011-05-27 2012-01-18 公安部第一研究所 Incubator based on semiconductor refrigeration

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103353564A (en) * 2013-07-08 2013-10-16 工业和信息化部电子第五研究所 Intermittent life testing device
CN103353564B (en) * 2013-07-08 2015-07-15 工业和信息化部电子第五研究所 Intermittent life testing device
CN104174448A (en) * 2014-08-18 2014-12-03 合肥工业大学 Natural convection type high-precision thermostat
CN105208820A (en) * 2015-10-20 2015-12-30 南京中网卫星通信股份有限公司 Water-proof and dust-proof communication box
CN107943145A (en) * 2017-12-21 2018-04-20 大连中工策控科技有限公司 A kind of easy to remove and heat dissipation industrial personal computer
CN109163199A (en) * 2018-07-27 2019-01-08 合肥金新允电子技术有限公司 A kind of wall-mounted installation structure of touch panels of household

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