CN105208820A - Water-proof and dust-proof communication box - Google Patents
Water-proof and dust-proof communication box Download PDFInfo
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- CN105208820A CN105208820A CN201510676628.8A CN201510676628A CN105208820A CN 105208820 A CN105208820 A CN 105208820A CN 201510676628 A CN201510676628 A CN 201510676628A CN 105208820 A CN105208820 A CN 105208820A
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Abstract
The invention relates to a water-proof and dust-proof communication box with a temperature control function. The water-proof and dust-proof communication box mainly comprises a box cover, a box body, hasps, hinges and a semi-conductor temperature controller, and is characterized in that the hinges and the hasps are arranged at the joint between the box cover and the box body; a sealing strip is also arranged at the joint between the box cover and the box body; the semi-conductor temperature controller is arranged in the box body. The sealing strip can be used for keeping the communicate box dust-proof and water-proof, the semi-conductor temperature controller can be used for solving both the leak tightness problem for heat dissipation of a fan and the problem that the communicate box cannot work normally at an isothermal environment in the prior art. Therefore, the stability and the leak tightness of the whole system are guaranteed.
Description
Technical field
The present invention relates to a kind of water proof and dust proof communication box with function of temperature control, belong to satellite communication field.
Background technology
For adapting to the requirement that satellite communication equipment uses in the wild, often various communication equipment being concentrated and being placed in a chest, being easy to carry.So, be called as portable satellite communications equipment box.Owing to using in the wild, this satellite communication equipment case must meet the requirement of water proof and dust proof, also will have good heat radiation, heat-insulating property simultaneously.
But this type of satellite communication equipment case generally all have employed fan cooling at present, in case, air and case outer air produce and exchange, its poor sealing, the rainwater of rainy weather or steam, and the dust of fair weather infiltrates in case; Because box equipment is more, wind path is not smooth, and radiating effect is also bad; In the winter time during severe cold weather, just can not use when temperature serviceability temperature minimum lower than certain communication equipment.
Summary of the invention
In order to solve above-mentioned Problems existing, the invention discloses a kind of water proof and dust proof communication equipment box with temp. control function.Casing seals completely, really reaches water proof and dust proof object; Adopt semiconductor heat-dissipating Technology design semiconductor temperature-control device, case inner air and outer air is separated; Arrange two temperature detect switch (TDS)s in parallel in case to implement to control to the temperature inside the box, when the temperature inside the box is elevated to the temperature of setting, semiconductor temperature-control device starts heat radiation automatically; Because semiconductor temperature-control device can reversely use, by changing the sense of current of powering to semiconductor temperature-control device, when the temperature inside the box is lower than the temperature arranged, semiconductor temperature-control device starts intensification automatically.
A kind of water proof and dust proof communication box with function of temperature control, wherein mainly comprise: case lid, casing, hasp, hinge, semiconductor temperature-control device, it is characterized in that: described hinge and hasp are arranged on case lid and casing junction, described case lid and casing joint are also provided with sealing strip, and described semiconductor temperature-control device is arranged in casing.Sealing strip can ensure the dustproof and waterproof of communication box, and semiconductor temperature-control device can solve the sealing problem of prior art fan heat radiation, but also solves the problem that cannot normally work under communication box is in isothermal environment.Ensure that stability and the sealing of whole system.
As a modification of the present invention, described semiconductor temperature-control device is made up of fan, support, heat absorbing sheet, fin, semiconductor chilling plate, and described fan is connected with support by screw, and screw is fixed on dividing plate; Heat absorbing sheet, fin are connected by screw, and semiconductor chilling plate is clamped in wherein formed one; Semiconductor chilling plate heat-absorbent surface and heat absorbing sheet bottom surface are developed, radiating surface and fin bottom surface are developed, heat absorbing sheet part is put into casing, be fixed by screws on dividing plate, after adopting this design, by the problem that heat absorbing sheet can regulate communication the temperature inside the box too low, improve temperature, the too high problem of communication the temperature inside the box can be solved by fin, reduce temperature, fan can promote air circulation in communication box, ensures temperature-averaging in communication box, there will not be the problem of certain communication equipment overheat.
As a modification of the present invention, be provided with heat-conducting glue fat between described radiating surface and fin, after adopting this design, heat-conducting glue fat can increase heat trnasfer, increases the speed of heat trnasfer, improving heat radiation efficiency.
As a modification of the present invention, described dividing plate is provided with hole, and its hole size is identical with fin, after adopting this design, increases the integraty of semiconductor temperature-control device, improves the stability of communication box.
As a modification of the present invention, described fin bottom periphery is provided with sealing gasket, and after adopting this design, sealing gasket can increase sealing, ensures waterproof and the anti-dust performance of communication box.
As a modification of the present invention, described semiconductor temperature-control device is also provided with open type temperature detect switch (TDS) and closed type temperature detect switch (TDS), described open type temperature detect switch (TDS) and the parallel connection of closed type temperature detect switch (TDS) are serially connected on semiconductor temperature-control device, after adopting this design, in the energized state, when the temperature in casing rises to temperature (high temperature) of setting, open type temperature detect switch (TDS) is connected automatically, semiconductor chilling plate is started working, and reduces the temperature in casing.When the temperature (low temperature) that the temperature in casing is reduced to setting below time, open type temperature detect switch (TDS) disconnects automatically, semiconductor chilling plate quits work, when the temperature in casing is lower than temperature (low temperature) that sets, closed type temperature detect switch (TDS) is connected automatically, semiconductor chilling plate starts reverse work, raises the temperature in casing.When the temperature in casing is elevated to more than the temperature of setting, closed type temperature detect switch (TDS) disconnects automatically, and semiconductor chilling plate quits work.
As a modification of the present invention, the described casing left and right sides is provided with perforate, receptacle boxes is installed, described screw is connected with receptacle boxes through wall box, outside receptacle boxes and casing, binding face arranges sealing strip, after adopting this design, by receptacle boxes, the equipment of communication box inside is monitored and associative operation.
As a modification of the present invention, described receptacle boxes is provided with various waterproof plug socket, waterproof power switch, WIFI antenna, indicator light, button, after adopting this design, equipment connection in waterproof plug socket and casing, monitoring outlay is by WIFI radio communication implementing monitoring, waterproof power switch can control the general supply of communication box equipment, and indicator light prompting correlated communication equipment working condition, button operates communication equipment.
As a modification of the present invention, described receptacle boxes outer surface plates one deck waterproof membrane, after adopting this design, ensure that the water proofing property of receptacle boxes, also improves the water resistance of communication box.
A kind of water proof and dust proof communication equipment box with temp. control function.Casing seals completely, really reaches water proof and dust proof object; Adopt semiconductor heat-dissipating Technology design semiconductor temperature-control device, case inner air and outer air is separated; Arrange two temperature detect switch (TDS)s in parallel in case to implement to control to the temperature inside the box, when the temperature inside the box is elevated to the temperature of setting, semiconductor temperature-control device starts heat radiation automatically; Because semiconductor temperature-control device can reversely use, by changing the sense of current of powering to semiconductor temperature-control device, when the temperature inside the box is lower than the temperature arranged, semiconductor temperature-control device starts intensification automatically, solve in prior art, the problem that communication box cannot work at low ambient temperatures, solves the heat radiation of communication box and the contradictory problems of water proof and dust proof.
Accompanying drawing explanation
Fig. 1 front view of the present invention,
Fig. 2 left side view of the present invention,
Fig. 3 partial enlarged drawing of the present invention,
Fig. 4 front of the present invention cut away view,
Fig. 5 semiconductor temperature-control device of the present invention partial view,
Reference numerals list: 1-case lid, 2-casing, 3-dividing plate, 4-screw, 5-inside casing, 6-waterproof plug socket, 7-receptacle boxes, 8-WIFI antenna, 9-waterproof membrane, 10-hasp, 11-hinge, 12-button, 13-indicator light, 14-waterproof power switch, 15-sealing strip, 16-sealing strip, 17-liner frame, 18-sealing strip, 19-screw, 20-fan, 21-support, 22-screw, 23-screw, 24-screw, 25-sealing gasket, 26-heat absorbing sheet, 27-fin, 28-semiconductor chilling plate, 29-screw, 30-open type temperature detect switch (TDS), 31-closed type temperature detect switch (TDS), 32-wire.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further.
embodiment 1:
Visible by reference to the accompanying drawings, a kind of water proof and dust proof communication box with function of temperature control, wherein mainly comprise: case lid 1, casing 2, hasp 10, hinge 11, semiconductor temperature-control device, it is characterized in that: described hinge 11 and hasp 10 are arranged on case lid 1 and casing 2 junction, described case lid 1 and casing 2 joint are also provided with sealing strip 15, and described semiconductor temperature-control device is arranged in casing 2.Sealing strip can ensure the dustproof and waterproof of communication box, and semiconductor temperature-control device can solve the sealing problem of prior art fan heat radiation, but also solves the problem that cannot normally work under communication box is in isothermal environment.Ensure that stability and the sealing of whole system.
embodiment 2:
As a modification of the present invention, described semiconductor temperature-control device is made up of fan 20, support 21, heat absorbing sheet 26, fin 27, semiconductor chilling plate 28, and described fan 20 is connected with support 21 by screw 22, and screw 23 is fixed on dividing plate 3; Heat absorbing sheet 26, fin 27 are connected by screw 29, and semiconductor chilling plate 28 is clamped in wherein formed one; Semiconductor chilling plate 28 heat-absorbent surface and heat absorbing sheet 26 bottom surface are developed, radiating surface and fin 27 bottom surface are developed, heat absorbing sheet 26 part is put into casing, be fixed on dividing plate 3 by screw 24, after adopting this design, by the problem that heat absorbing sheet can regulate communication the temperature inside the box too low, improve temperature, the too high problem of communication the temperature inside the box can be solved by fin, reduce temperature, fan can promote air circulation in communication box, ensures temperature-averaging in communication box, there will not be the problem of certain communication equipment overheat.All the other design features are identical with embodiment 1 with advantage.
embodiment 3:
As a modification of the present invention, be provided with heat-conducting glue fat between described radiating surface and fin 27, after adopting this design, heat-conducting glue fat can increase heat trnasfer, increases the speed of heat trnasfer, improving heat radiation efficiency.All the other structures are identical with embodiment 1 with advantage.
embodiment 4:
As a modification of the present invention, described dividing plate 3 is provided with hole, and its hole size is identical with fin 27, after adopting this design, increases the integraty of semiconductor temperature-control device, improves the stability of communication box.All the other structures are identical with embodiment 1 with advantage.
embodiment 5:
As a modification of the present invention, described fin 27 bottom periphery is provided with sealing gasket 25, and after adopting this design, sealing gasket can increase sealing, ensures waterproof and the anti-dust performance of communication box.All the other structures are identical with embodiment 1 with advantage.
embodiment 6:
As a modification of the present invention, described semiconductor temperature-control device is also provided with open type temperature detect switch (TDS) 30 and closed type temperature detect switch (TDS) 31, described open type temperature detect switch (TDS) 30 and closed type temperature detect switch (TDS) 31 parallel connection are serially connected on semiconductor temperature-control device, after adopting this design, in the energized state, when the temperature in casing rises to temperature (high temperature) of setting, open type temperature detect switch (TDS) is connected automatically, semiconductor chilling plate is started working, and reduces the temperature in casing.When the temperature (low temperature) that the temperature in casing is reduced to setting below time, open type temperature detect switch (TDS) disconnects automatically, semiconductor chilling plate quits work, when the temperature in casing is lower than temperature (low temperature) that sets, closed type temperature detect switch (TDS) is connected automatically, semiconductor chilling plate starts reverse work, raises the temperature in casing.When the temperature in casing is elevated to more than the temperature of setting, closed type temperature detect switch (TDS) disconnects automatically, and semiconductor chilling plate quits work.All the other structures are identical with embodiment 1 with advantage.
embodiment 7:
As a modification of the present invention, described casing 2 left and right sides is provided with perforate, receptacle boxes 7 is installed, screw 19 is connected with receptacle boxes 7 through casing 2 sidewall, outside receptacle boxes 7 with casing 2, binding face arranges sealing strip 18, after adopting this design, by receptacle boxes, the equipment of communication box inside is monitored and associative operation.All the other structures are identical with embodiment 1 with advantage.
embodiment 8:
As a modification of the present invention, described receptacle boxes 7 is provided with waterproof plug socket 6, waterproof power switch 11, WIFI antenna 8, indicator light 13, button 12, after adopting this design, equipment connection in waterproof plug socket and casing, monitoring outlay is by WIFI radio communication implementing monitoring, waterproof power switch can control the general supply of communication box equipment, and indicator light prompting correlated communication equipment working condition, button operates communication equipment.
embodiment 9:
As a modification of the present invention, described receptacle boxes 7 outer surface plates one deck waterproof membrane 9, after adopting this design, ensure that the water proofing property of receptacle boxes, also improves the water resistance of communication box.
Technical characteristic described in embodiment 2,3,4,5,6,7,8,9 at least one and embodiment 1 can also be combined into new execution mode by the present invention.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned technological means, also comprises the technical scheme be made up of above technical characteristic combination in any.
Claims (9)
1. one kind has the water proof and dust proof communication box of function of temperature control, wherein mainly comprise: case lid (1), casing (2), hasp (10), hinge (11), semiconductor temperature-control device, it is characterized in that: described hinge (11) and hasp (10) are arranged on case lid (1) and casing (2) junction, described case lid (1) and casing (2) joint are also provided with sealing strip (15), and described semiconductor temperature-control device is arranged in casing (2).
2. the water proof and dust proof communication box with function of temperature control according to claim 1, it is characterized in that: described semiconductor temperature-control device is made up of fan (20), support (21), heat absorbing sheet (26), fin (27), semiconductor chilling plate (28), described fan (20) is connected with support (21) by screw (22), and screw (23) is fixed on dividing plate (3); Heat absorbing sheet (26), fin (27) by screw (29) connect, and semiconductor chilling plate (28) is clamped in wherein formed one; Semiconductor chilling plate (28) heat-absorbent surface and heat absorbing sheet (26) bottom surface are developed, and radiating surface and fin (27) bottom surface are developed, and heat absorbing sheet (26) part is put into casing, is fixed on dividing plate (3) by screw (24).
3. the water proof and dust proof communication box with function of temperature control according to claim 2, is characterized in that: be provided with heat-conducting glue fat between described radiating surface and fin (27).
4. the water proof and dust proof communication box with function of temperature control according to claim 2, is characterized in that: described dividing plate (3) is provided with hole, and its hole size is identical with fin (27).
5. the water proof and dust proof communication box with function of temperature control according to claim 2, is characterized in that: described fin (27) bottom periphery is provided with sealing gasket (25).
6. the water proof and dust proof communication box with function of temperature control according to claim 1, it is characterized in that: described semiconductor temperature-control device is also provided with open type temperature detect switch (TDS) (30) and closed type temperature detect switch (TDS) (31), described open type temperature detect switch (TDS) (30) and closed type temperature detect switch (TDS) (31) parallel connection are serially connected on semiconductor temperature-control device.
7. the water proof and dust proof communication box with function of temperature control according to claim 1, it is characterized in that: described casing (2) left and right sides is provided with perforate, receptacle boxes (7) is installed, screw (19) is connected with receptacle boxes (7) through casing (2) sidewall, arranges sealing strip (18) at receptacle boxes (7) and casing (2) outside binding face.
8. the water proof and dust proof communication box with function of temperature control according to claim 7, it is characterized in that: described receptacle boxes (7) is provided with waterproof plug socket (6), waterproof power switch (11), WIFI antenna (8), indicator light (13), button (12).
9. the water proof and dust proof communication box with function of temperature control according to claim 7, is characterized in that: described receptacle boxes (7) outer surface plates one deck waterproof membrane (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510676628.8A CN105208820A (en) | 2015-10-20 | 2015-10-20 | Water-proof and dust-proof communication box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510676628.8A CN105208820A (en) | 2015-10-20 | 2015-10-20 | Water-proof and dust-proof communication box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105208820A true CN105208820A (en) | 2015-12-30 |
Family
ID=54956143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510676628.8A Pending CN105208820A (en) | 2015-10-20 | 2015-10-20 | Water-proof and dust-proof communication box |
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| Country | Link |
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| CN (1) | CN105208820A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888493A (en) * | 1994-09-20 | 1996-04-02 | Hitachi Ltd | Electronic apparatus |
| CN2442479Y (en) * | 2000-08-02 | 2001-08-08 | 金存林 | Machine box of electric equipment |
| CN2930221Y (en) * | 2006-07-27 | 2007-08-01 | 杭州柯林电子设备有限公司 | Easy heat radiation programmable controller box |
| CN2932930Y (en) * | 2006-06-12 | 2007-08-08 | 庄智远 | Unidirectional cold source flow cooling and temperature control device |
| CN102858141A (en) * | 2012-09-12 | 2013-01-02 | 江苏大学 | Dispersive heat radiation type thermostat for field instruments |
| CN203136414U (en) * | 2013-01-24 | 2013-08-14 | 南京中网卫星通信股份有限公司 | Outdoor satellite communication cabinet |
| CN204538007U (en) * | 2015-04-30 | 2015-08-05 | 佛山市顺德区美的电热电器制造有限公司 | The heat abstractor of power device |
| CN205124188U (en) * | 2015-10-20 | 2016-03-30 | 南京中网卫星通信股份有限公司 | Waterproof dustproof communication box with temperature control function |
-
2015
- 2015-10-20 CN CN201510676628.8A patent/CN105208820A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888493A (en) * | 1994-09-20 | 1996-04-02 | Hitachi Ltd | Electronic apparatus |
| CN2442479Y (en) * | 2000-08-02 | 2001-08-08 | 金存林 | Machine box of electric equipment |
| CN2932930Y (en) * | 2006-06-12 | 2007-08-08 | 庄智远 | Unidirectional cold source flow cooling and temperature control device |
| CN2930221Y (en) * | 2006-07-27 | 2007-08-01 | 杭州柯林电子设备有限公司 | Easy heat radiation programmable controller box |
| CN102858141A (en) * | 2012-09-12 | 2013-01-02 | 江苏大学 | Dispersive heat radiation type thermostat for field instruments |
| CN203136414U (en) * | 2013-01-24 | 2013-08-14 | 南京中网卫星通信股份有限公司 | Outdoor satellite communication cabinet |
| CN204538007U (en) * | 2015-04-30 | 2015-08-05 | 佛山市顺德区美的电热电器制造有限公司 | The heat abstractor of power device |
| CN205124188U (en) * | 2015-10-20 | 2016-03-30 | 南京中网卫星通信股份有限公司 | Waterproof dustproof communication box with temperature control function |
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Application publication date: 20151230 |
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| WD01 | Invention patent application deemed withdrawn after publication |