CN203369017U - PCB plate tray with refrigerator - Google Patents
PCB plate tray with refrigerator Download PDFInfo
- Publication number
- CN203369017U CN203369017U CN 201320300450 CN201320300450U CN203369017U CN 203369017 U CN203369017 U CN 203369017U CN 201320300450 CN201320300450 CN 201320300450 CN 201320300450 U CN201320300450 U CN 201320300450U CN 203369017 U CN203369017 U CN 203369017U
- Authority
- CN
- China
- Prior art keywords
- refrigerator
- metal tray
- groove
- pcb board
- conductive pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a PCB plate tray with a refrigerator. The PCB plate tray comprises a metal tray and the refrigerator fixed on the bottom of the metal tray, wherein a groove is arranged on the upper surface of the metal tray, a sealed bag is fixed in the groove and filled with a cooling liquid, a thermal conductive pad covers the opening surface of the groove, the upper surface of the thermal conductive pad is coincident with the upper surface of the metal tray, the lower surface of the thermal conductive pad is closely contacted with the sealed bag, and the sealed bag is closely contacted with the inner-side surfaces of the groove. The cooling liquid is arranged in the groove of the metal tray and the refrigerator is fixed on the bottom of the metal tray, so that the heat generated by a high power consumption device is quickly transferred to the cooling liquid, and the cooling liquid is cooled by the refrigerator, so that the working efficiency of the high power consumption device is improved, the service life of the high power consumption device is prolonged, and meanwhile the radiation problem of the PCB plate with the high power consumption device in the frame type whole machine design is well solved.
Description
Technical field
The utility model relates to the electronic radiation field, is specifically related to a kind of pcb board pallet that is provided with refrigerator.
Background technology
Communication equipment often adopts the overall design of rack.In the overall design of rack, pcb board is arranged on pallet by screw and fixed bolt.In use, the pallet that pcb board is installed is inserted to corresponding groove position.The design of this rack, the heat radiation of pcb board realizes with the complete machine fan.Construct an air channel through each groove position veneer in cabinet.At present, along with the increase of pcb board processing speed, the power consumption that single groove position produces is increasing, and the heat radiation of pcb board solves difficulty and also becomes large.
Heat dissipation design for pcb board is a system engineering.At present comparatively common, be to adopt the mode to large power consumption device installation of heat radiator to realize.During installation of heat radiator, main difficulty is on layout.When device layout, consider to facilitate on the basis of PCB layout, pyrotoxin is evenly distributed on windward side as far as possible, avoid blocking fully the heater members heat radiation of lower wind direction.Referring to Fig. 1, in implementation procedure, on single pcb board 11, need the device of heat radiation when more, just be difficult to accomplish the above said windward side that is evenly distributed on, avoid air channel to stop.For the selection of radiator 12, the size of its size and thermal resistance has directly determined heat dispersion.For the radiator 12 of material of the same race (thermal resistance is identical), front face area is larger, and radiating effect is better.But can not large radiator 12 heat radiations of unconfined use.In general design, necessarily have some temperature sensors 13 on single pcb board 11, such as crystal oscillator etc., and this class device is mostly that tall and big power consumption device 14 peripheries are used.The too large radiator of area may cover these temperature sensors 13, affects its heat radiation.In addition, the device on same pcb board 11, it highly is difficult to all consistent, in the situation that have certain altitude device 15, if the larger radiator 12 of service regeulations just has structural interference.If customize irregular radiator 12, not only increase the assembling difficulty, but also can increase production cost.
The utility model content
The purpose of this utility model is to overcome the defect existed in prior art, and a kind of pcb board pallet that is provided with refrigerator is provided, and especially is suitable for improving the pcb board pallet of the radiating efficiency of the single pcb board that high power consumption device is housed in the rack overall design.
For achieving the above object, the technical solution of the utility model has been to provide a kind of pcb board pallet that is provided with refrigerator, comprise metal tray and the refrigerator that is fixed in the metal tray bottom surface, the metal tray upper surface is provided with groove, is fixed with sealing bag in groove, is marked with cooling fluid in sealing bag, the slot opening face is coated with heat conductive pad, the heat conductive pad upper surface overlaps with the metal tray upper surface, heat conductive pad lower surface and sealing bag close contact, inboard each face close contact of sealing bag and groove.By refrigerating fluid being set in the metal tray groove and the fixing refrigerator in the metal tray bottom surface, can be so that the heat that tall and big power consumption device produces be delivered in cooling fluid fast, refrigerator freezes cooling fluid again, so can improve the operating efficiency of high power consumption device, extend its useful life, also solved well the heat dissipation problem of the pcb board that high power consumption device is housed in the rack overall design simultaneously.
As preferably, sealing bag is bonded in inside grooves, such design can so that sealing bag can be stable be fixed on inside grooves, strengthen the stability that the utility model is used.
As preferably, described refrigerator is fixed under the metal tray bottom recesses, and directly over groove, heat conductive pad contacts with high power consumption device on pcb board, and such design can be strengthened the heat radiation to tall and big power consumption device, reaches desirable effect.
As preferably, described refrigerator is semiconductor cooler, semiconductor cooler comprises the housing be arranged on the metal tray bottom surface and is arranged on the semiconductor chilling plate in housing, the cold end surface of semiconductor chilling plate is towards the metal tray bottom surface, cold end surface and hot end surface at semiconductor chilling plate are respectively equipped with cooling fan and radiator fan, also be provided with the conduction cooling module between semiconductor chilling plate and cooling fan, also be provided with radiating module between semiconductor chilling plate and radiator fan.Such design can be so that refrigerator be more light and handy and intelligence is convenient to install and use.
Advantage of the present utility model and beneficial effect are: by refrigerating fluid being set in the metal tray groove and the fixing refrigerator in the metal tray bottom surface, can be so that the heat that tall and big power consumption device produces be delivered in cooling fluid fast, refrigerator freezes cooling fluid again, so can improve the operating efficiency of high power consumption device, extend its useful life, also solved well the heat dissipation problem of the pcb board that high power consumption device is housed in the rack overall design simultaneously.
The accompanying drawing explanation
Fig. 1 is the components and parts heat radiation layout structure schematic diagram of existing veneer pcb board;
Fig. 2 is STRUCTURE DECOMPOSITION schematic diagram of the present utility model;
Fig. 3 is the structural representation of refrigerator.
In figure: 1, metal tray; 2, heat conductive pad; 3, sealing bag; 4, groove; 5, refrigerator; 11, pcb board; 12, radiator; 13, temperature sensor; 14, high power consumption device; 15, certain altitude device; 21, housing; 22, semiconductor chilling plate; 23, cooling fan; 24, radiator fan; 25, conduction cooling module; 26, radiating module.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples are only for the technical solution of the utility model more clearly is described, and can not limit protection range of the present utility model with this.
As shown in Figure 1 to Figure 3, a kind of pcb board pallet that is provided with refrigerator, comprise metal tray 1 and the refrigerator 5 that is fixed in metal tray 1 bottom surface, metal tray 1 upper surface is provided with groove 4, is fixed with sealing bag 3 in groove 4, in sealing bag 3, is marked with cooling fluid, groove 4 opening surfaces are coated with heat conductive pad 2, heat conductive pad 2 upper surfaces overlap with metal tray 1 upper surface, heat conductive pad 2 lower surfaces and sealing bag 3 close contacts, sealing bag 3 and inboard each face close contact of groove 4.
Described sealing bag 3 is bonded in groove 4 inside, sealing bag 3 and heat conductive pad 2 preferably by thermal conductivity good material make, silica gel for example, used the heat transfer efficiency of silica gel between can reinforcing member.
Described refrigerator 5 is fixed under metal tray 1 bottom recesses 4, and directly over groove 4, heat conductive pad 2 contacts with high power consumption device 14 on pcb board.
Described refrigerator 5 is semiconductor cooler, semiconductor cooler comprises the housing 21 be arranged on metal tray 1 bottom surface and is arranged on the semiconductor chilling plate 22 in housing, the cold end surface of semiconductor chilling plate 22 is towards metal tray 1 bottom surface, cold end surface and hot end surface at semiconductor chilling plate 22 are respectively equipped with cooling fan 23 and radiator fan 24, also be provided with conduction cooling module 25 between semiconductor chilling plate 22 and cooling fan 23, between semiconductor chilling plate 22 and radiator fan 24, also be provided with radiating module 26.
In actual use procedure, pcb board 11 is placed on the upper surface of a kind of pcb board pallet that is provided with refrigerator of the utility model, by rational design, high power consumption device 14 places, place can be designed to groove 4 places, place, make the heat conductive pad 2 of groove 4 opening parts can contact with high power consumption device 14, will inevitably produce a large amount of heats when high power consumption device 14 work, high-efficiency heat conduction due to heat conductive pad 2, can be very fast heat be transmitted on sealing bag 3, because having with hot good material, makes sealing bag 3, heat can be passed in cooling fluid again fast.Cooling fluid preferred water or Acetic Acid Glacil sodium solution, because this type of specific heat of liquid is higher, absorbs temperature after identical heat and relatively raise lower.
In the situation that high power consumption device 14 continues heat production, the temperature of cooling fluid continues to raise, the also heating of groove 4 of sealing bag 3 close contacts.So the bottom surface of our metal tray 1 under groove 4 is provided with a refrigerator 5, under the lasting refrigeration work state of refrigerator 5, metal tray 1 bottom surface temperature can reduce, groove 4 temperature, sealing bag 3 temperature, coolant temperature and heat conductive pad 2 temperature are reduced successively, and final high power consumption device 14 temperature in the process of whole system heat exchange maintains in a relatively low scope.So, guarantee the operating efficiency of high power consumption device 14, also extended its useful life.The final heat dissipation problem that has solved well the pcb board that high power consumption device is housed in the rack overall design.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (4)
1. a pcb board pallet that is provided with refrigerator, comprise metal tray and the refrigerator that is fixed in the metal tray bottom surface, it is characterized in that: the metal tray upper surface is provided with groove, be fixed with sealing bag in groove, be marked with cooling fluid in sealing bag, the slot opening face is coated with heat conductive pad, and the heat conductive pad upper surface overlaps with the metal tray upper surface, heat conductive pad lower surface and sealing bag close contact, inboard each face close contact of sealing bag and groove.
2. the pcb board pallet that is provided with refrigerator as claimed in claim 1, it is characterized in that: sealing bag is bonded in inside grooves.
3. the pcb board pallet that is provided with refrigerator as claimed in claim 1 or 2, it is characterized in that: described refrigerator is fixed under the metal tray bottom recesses, and directly over groove, heat conductive pad contacts with high power consumption device on pcb board.
4. the pcb board pallet that is provided with refrigerator as described as any one in claims 1 to 3, it is characterized in that: described refrigerator is semiconductor cooler, semiconductor cooler comprises the housing be arranged on the metal tray bottom surface and is arranged on the semiconductor chilling plate in housing, the cold end surface of semiconductor chilling plate is towards the metal tray bottom surface, cold end surface and hot end surface at semiconductor chilling plate are respectively equipped with cooling fan and radiator fan, also be provided with the conduction cooling module between semiconductor chilling plate and cooling fan, also be provided with radiating module between semiconductor chilling plate and radiator fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320300450 CN203369017U (en) | 2013-05-27 | 2013-05-27 | PCB plate tray with refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320300450 CN203369017U (en) | 2013-05-27 | 2013-05-27 | PCB plate tray with refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203369017U true CN203369017U (en) | 2013-12-25 |
Family
ID=49816723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320300450 Expired - Fee Related CN203369017U (en) | 2013-05-27 | 2013-05-27 | PCB plate tray with refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203369017U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111142197A (en) * | 2018-11-05 | 2020-05-12 | 华为机器有限公司 | Optical device, optical module and optical communication equipment |
-
2013
- 2013-05-27 CN CN 201320300450 patent/CN203369017U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111142197A (en) * | 2018-11-05 | 2020-05-12 | 华为机器有限公司 | Optical device, optical module and optical communication equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106445037B (en) | Partial immersion type liquid cooling server cooling system | |
| CN204904105U (en) | Electronic equipment constant temperature equipment | |
| CN202420024U (en) | Temperature-controllable water-cooling type small semiconductor cold-hot dual-purpose box | |
| CN201975384U (en) | Anti-condensation semiconductor refrigeration CPU (Central Processing Unit) temperature controller | |
| CN206923223U (en) | A kind of photovoltaic DC-to-AC converter with radiator structure | |
| CN105759923A (en) | Separating type radiating device and method for closed industrial computer | |
| CN202948389U (en) | Semiconductor central processing unit (CPU) radiator | |
| CN201215638Y (en) | Computer capable of temperature regulation | |
| CN204761938U (en) | Electronic equipment constant temperature system | |
| CN205196222U (en) | Forced -air cooling heat dissipation device with water -cooled tube | |
| CN206728481U (en) | A kind of housings close formula charging pile | |
| CN203369017U (en) | PCB plate tray with refrigerator | |
| CN208336301U (en) | A kind of air-cooled electric automobile battery box body combined with liquid-cooling heat radiation that radiates | |
| CN101896045B (en) | Natural heat dissipation outdoor cabinet | |
| CN203788358U (en) | Semiconductor refrigeration camera and semiconductor refrigeration device thereof | |
| CN206865940U (en) | A kind of Electromechanical Control heat abstractor | |
| CN203645739U (en) | High-definition hemispheric network camera | |
| CN206162308U (en) | Mix refrigeration sealed cabinet | |
| CN204257782U (en) | A kind of high energy density liquid heat radiation and heated power battery system | |
| CN204578960U (en) | A kind of optical fiber temperature-measurement formula high power switching power supply cooling system | |
| CN103434185B (en) | A kind of cold pressing oil press | |
| CN204131907U (en) | With the airborne electronic module cooling device of cool storage function | |
| CN207909861U (en) | A kind of chip radiator of liquid metal and water composite radiating | |
| CN205721604U (en) | A kind of computer heat radiating device that can work independently | |
| CN206531339U (en) | A kind of refrigerator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20140527 |