CN205608642U - Take semiconductor refrigeration system's computer mainframe - Google Patents
Take semiconductor refrigeration system's computer mainframe Download PDFInfo
- Publication number
- CN205608642U CN205608642U CN201620403931.0U CN201620403931U CN205608642U CN 205608642 U CN205608642 U CN 205608642U CN 201620403931 U CN201620403931 U CN 201620403931U CN 205608642 U CN205608642 U CN 205608642U
- Authority
- CN
- China
- Prior art keywords
- refrigeration system
- semiconductor refrigeration
- computer
- connects
- cooling piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a take semiconductor refrigeration system's computer mainframe. Calorific capacity of traditional each chip of computer is huge, and prior art can not satisfy the operation requirement, and the heat can not give off, causes the acceleration loss of hardware. A take semiconductor refrigeration system's computer mainframe which constitutes and includes: the computer box, install power (13) that semiconductor refrigeration system used in computer box (14), the power -on that semiconductor refrigeration system used is crossed wire (5) and is connected each semiconductor refrigeration piece (11), is each semiconductor refrigeration piece constitution CPU refrigeration piece (11 respectively 1 ), mainboard refrigeration piece (11 2 ), display card refrigeration piece (11 3 ), power refrigeration piece (11 5 )With hard disk refrigeration piece (11 4 ), still connecting respectively on each ceramic -insulated piece temperature sensor (6), each temperature sensor passes through the wire and connects simultaneously in temperature controller (12). The utility model discloses be applied to take semiconductor refrigeration system's computer mainframe.
Description
Technical field:
This utility model relates to refrigerating field, particularly to the computer host box of band semiconductor refrigeration system.
Background technology:
Traditional computer heat radiation is to use pure air-cooled technology, is provided with cpu fan and power supply fan etc. in casing,
Dispel the heat for high heat unit, utilize fan to accelerate the flowing of air in casing, the air in casing is discharged to outside casing；But
Being as the raising of the performances such as locking CPU on computer motherboard, the requirement to heat radiation is the strictest；When making to use tricks continuously
Calculation machine, or when computer overclocking is run, owing to the caloric value of each chip of computer is huge, pure air-cooled technology can not expire
Foot uses requirement, and heat can not distribute in time, causes the acceleration of hardware to be lost, and time serious, also can cause computer motherboard
Burn.
Summary of the invention:
The purpose of this utility model is to provide the computer host box of a kind of band semiconductor refrigeration system.
Above-mentioned purpose is realized by following technical scheme:
The computer host box of a kind of band semiconductor refrigeration system, its composition includes: computer box, described computer
Being provided with the power supply of semiconductor refrigeration system in casing, the power supply of described semiconductor refrigeration system connects each by wire
Semiconductor chilling plate, described each semiconductor chilling plate constitutes respectively CPU cooling piece, mainboard cooling piece, video card cooling piece, electricity
Source cooling piece and hard disk cooling piece, be also respectively connected with temperature sensor, described each temperature on described each ceramic insulation sheet
Degree sensor is simultaneously coupled to temperature controller by wire.
The computer host box of described band semiconductor refrigeration system, described semiconductor chilling plate is by one group of PN
Becoming, the both sides of described semiconductor chilling plate are connected to metallic conductor, the method for described metallic conductor composite module
Constitute；The outside of the cold side metal conductor outside the cold end of described semiconductor chilling plate connects ceramic insulation sheet, described half
Connect outside conductor cooling piece hot side metal conductor and have hot-side heat dissipation device.
The computer host box of described band semiconductor refrigeration system, the power supply of described semiconductor refrigeration system, can
With shared computer power supply, it is also possible to install the most separately；The connection wire of one group of described PN junction by with choke line
Circle and overtemperature relay connect, and described choking-winding and described overtemperature relay are connected to the two of commutator
End, the front end of described commutator connects again transformator, and described transformator is connected to 220V circuit.
The computer host box of described band semiconductor refrigeration system, the metal outside the cold end of described semiconductor chilling plate
The outside of conductor connects ceramic insulation sheet, and the outside of the described metallic conductor outside semiconductor chilling plate hot junction connects heat
End radiator.
The computer host box of described band semiconductor refrigeration system, the hot junction that described semiconductor chilling plate connects connects
Metallic conductor material be p-type Ag(1-X) Cu(X) TiTe material, the gold that the cold end that described semiconductor chilling plate connects connects
Belonging to conductive material is N-type Bi-Sb alloy material,
The beneficial effects of the utility model:
The computer of band semiconductor refrigeration system the most of the present utility model, simple in construction, each element institute such as computer motherboard
The heat sent is derived by semiconductor chilling plate, and uses semiconductor chilling plate heat dissipation design, is effectively improved heat dispersion
And radiating efficiency, make locking CPU on computer motherboard fully dispel the heat, it is to avoid hardware causes loss because of high temperature, extend and calculate
Machine service life.
The computer of band semiconductor refrigeration system of the present utility model, forces owing to using semiconductor chilling plate to carry out to dissipate
Heat, makes radiating efficiency improve 90%, and cooling effect is obvious.
The computer of band semiconductor refrigeration system of the present utility model, uses temperature sensor to control semiconductor chilling plate work
Making, temperature sensor is arranged on semiconductor chilling plate the position near main heat source CPU, controls the reliability of work more
Height, energy-saving effect is obvious.
The computer of band semiconductor refrigeration system of the present utility model, the volume of semiconductor chilling plate is little, can make body
The long-pending cooling piece little less than 1cm；Lightweight, miniature refrigerator tends to be so small to have only several grams or tens grams.Mechanical transmission
Part, noiselessness in work, aneroid, gas working media, thus free from environmental pollution, cooling parameters is not by direction in space and gravity
Impact, under the conditions of big mechanical overload, it is possible to normally work;By regulating the size of operating current, conveniently adjusted system
Cooling rate rate；By the switching sense of current, cooling piece can be made to be changed into from refrigerating state and to heat duty；Speed of action is fast, makes
Use the life-span long, and easily controllable；Install easily.The computer of band semiconductor refrigeration system the most of the present utility model, it is not necessary to appoint
What cold-producing medium, can work continuously, and semiconductor chilling plate has two kinds of functions, can freeze, and can heat again, and semiconductor chilling plate is
Electric current transducing matrix part, by the control of input current, can realize high-precision temperature and control, add temperature measurement and control
Means, it is easy to realize remote control, program control, computer control, it is simple to composition automatic control system.Band the most of the present utility model is partly led
The computer of system cooling system, the temperature range of semiconductor chilling plate, from positive temperature 90 DEG C;To negative temperature 130 DEG C;Can be real
Existing, used semiconductor chilling plate comprises organizes PN junction more, makes, after PN junction switches on power, work as electric current after using ceramic package
Form electron hole when being flowed to quasiconductor by the N-type semiconductor of semiconductor PN and absorb heat, outside be typically copper, aluminum or
Other metallic conductors, finally clamp as hamburger with the usual sheet of two panels.
Accompanying drawing illustrates:
Accompanying drawing 1 is the component structure schematic diagram of this utility model band semiconductor refrigeration system.
Accompanying drawing 2 is the structural representation of the computer of this utility model band semiconductor refrigeration system.
In figure: 1 transformator；2 commutators；3 overtemperature relays；4 choking-windings；5 wires；6 —
Sensor；7 hot-side heat dissipation devices；8 metallic conductors；9 PN junctions；10 ceramic insulation sheets；11 cooling pieces；11-1
CPU cooling piece；11-2 mainboard cooling piece；11-3 video card cooling piece；11-4 hard disk cooling piece；11-5 electricity
Source cooling piece；12 temperature controllers；13 refrigeration power supplys；14 computer box；
Detailed description of the invention:
Embodiment 1:
The computer host box of a kind of band semiconductor refrigeration system, its composition includes: computer box, described computer
Being provided with the power supply 13 of semiconductor refrigeration system in casing 14, the power supply of described semiconductor refrigeration system passes through wire 5
Connecting each semiconductor chilling plate 11, described each semiconductor chilling plate constitutes respectively CPU cooling piece 11-1, mainboard cooling piece
11-2, video card cooling piece 11-3, power supply cooling piece 11-5 and hard disk cooling piece 11-4, also divide on described each ceramic insulation sheet
Not being connected to temperature sensor 6, described each temperature sensor is simultaneously coupled to temperature controller 12 by wire.
Embodiment 2:
According to the computer host box of the band semiconductor refrigeration system described in embodiment 1, described semiconductor chilling plate by
One group of PN junction 9 is constituted, and the both sides of described semiconductor chilling plate are connected to metallic conductor 8, described metallic conductor group
The method of compound module is constituted；The outside of the cold side metal conductor outside the cold end of described semiconductor chilling plate connects ceramic insulation
Sheet 10, connects outside described semiconductor chilling plate hot side metal conductor and has hot-side heat dissipation device 7.
Embodiment 3:
According to the computer host box of the band semiconductor refrigeration system described in embodiment 2, described semiconductor refrigeration system
Power supply, can be with shared computer power supply, it is also possible to install the most separately；The connection wire of one group of described PN junction leads to
Cross and be connected with choking-winding 4 and overtemperature relay 3, and described choking-winding and described overtemperature relay are connected to
The two ends of commutator 2, the front end of described commutator connects again transformator 1, and described transformator is connected to 220V circuit.
Embodiment 4:
According to the computer host box of the band semiconductor refrigeration system described in embodiment 2, described semiconductor chilling plate is cold
The outside of the metallic conductor outside end connects ceramic insulation sheet, the described metallic conductor outside semiconductor chilling plate hot junction
Outside connects hot-side heat dissipation device.
Embodiment 5:
According to the computer host box of the band semiconductor refrigeration system described in embodiment 2, described semiconductor chilling plate is even
The metallic conductor material that the hot junction connect connects is p-type Ag(1-X) Cu(X) TiTe material, described semiconductor chilling plate connects
The metallic conductor material that cold end connects is N-type Bi-Sb alloy material.
Claims (5)
1. a computer host box for band semiconductor refrigeration system, its composition includes: computer box, it is characterized in that: described
Computer casing body in the power supply of semiconductor refrigeration system is installed, the power supply of described semiconductor refrigeration system is by leading
Line connects each semiconductor chilling plate, and described each semiconductor chilling plate constitutes respectively CPU cooling piece, mainboard cooling piece, video card
Cooling piece, power supply cooling piece and hard disk cooling piece, be also respectively connected with temperature sensor, institute on described each ceramic insulation sheet
The each temperature sensor stated is simultaneously coupled to temperature controller by wire.
The computer host box of band semiconductor refrigeration system the most according to claim 1, is characterized in that: described quasiconductor
Cooling piece is made up of one group of PN junction, and the both sides of described semiconductor chilling plate are connected to metallic conductor, and described metal is led
The method of body composite module is constituted；The outside of the cold side metal conductor outside the cold end of described semiconductor chilling plate connects pottery
Porcelain insulating sheet, connects outside described semiconductor chilling plate hot side metal conductor and has hot-side heat dissipation device.
The computer host box of band semiconductor refrigeration system the most according to claim 2, is characterized in that: described quasiconductor
The power supply of refrigeration system, can be with shared computer power supply, it is also possible to install the most separately；The company of one group of described PN junction
Connect wire by being connected with choking-winding and overtemperature relay, and described choking-winding and described overtemperature relay are distinguished
Being connected to the two ends of commutator, the front end of described commutator connects again transformator, and described transformator is connected to 220V electricity
Road.
The computer host box of band semiconductor refrigeration system the most according to claim 2, is characterized in that: described quasiconductor
The outside of the metallic conductor outside the cold end of cooling piece connects ceramic insulation sheet, the described gold outside semiconductor chilling plate hot junction
The outside connection belonging to conductor has hot-side heat dissipation device.
The computer host box of band semiconductor refrigeration system the most according to claim 2, is characterized in that: described quasiconductor
The metallic conductor material that the hot junction that cooling piece connects connects is p-type Ag(1-X) Cu(X) TiTe material, described semiconductor refrigerating
The metallic conductor material that the cold end that sheet connects connects is N-type Bi-Sb alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620403931.0U CN205608642U (en) | 2016-05-06 | 2016-05-06 | Take semiconductor refrigeration system's computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620403931.0U CN205608642U (en) | 2016-05-06 | 2016-05-06 | Take semiconductor refrigeration system's computer mainframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205608642U true CN205608642U (en) | 2016-09-28 |
Family
ID=56969531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620403931.0U Expired - Fee Related CN205608642U (en) | 2016-05-06 | 2016-05-06 | Take semiconductor refrigeration system's computer mainframe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205608642U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107678524A (en) * | 2017-10-11 | 2018-02-09 | 西安交通大学 | A kind of chip-cooling system |
| CN108008786A (en) * | 2017-12-04 | 2018-05-08 | 江苏商贸职业学院 | A kind of heat-radiating chassis for computer |
-
2016
- 2016-05-06 CN CN201620403931.0U patent/CN205608642U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107678524A (en) * | 2017-10-11 | 2018-02-09 | 西安交通大学 | A kind of chip-cooling system |
| CN108008786A (en) * | 2017-12-04 | 2018-05-08 | 江苏商贸职业学院 | A kind of heat-radiating chassis for computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201590983U (en) | Multi-air duct radiation device for ATR sealed case | |
| CN2831423Y (en) | Active radiator of large-scale integrated chip | |
| CN201075884Y (en) | Radiating device and electronic equipment cabinet | |
| CN100592857C (en) | Heat radiating device | |
| CN101470449B (en) | Cooling control system and cooling control method | |
| CN205608642U (en) | Take semiconductor refrigeration system's computer mainframe | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN104302157A (en) | Airborne electronic module cooling device with cold accumulation function and operating method | |
| CN100463148C (en) | Heat radiator | |
| CN2932237Y (en) | Semiconductor thermoelectricity cooled heat pump | |
| CN204442828U (en) | A kind of PCB of high efficiency and heat radiation | |
| CN201830603U (en) | Cooling system used for vehicle-mounted and ship-based large-sized intelligent display | |
| CN202261069U (en) | Inverter cooling system based on semiconductor refrigeration | |
| CN2504569Y (en) | Splitting thermoelectric cooling module | |
| CN202474599U (en) | Automatic cooling outdoor intelligent distribution box | |
| CN208635415U (en) | A kind of refrigeration unit | |
| CN109103160A (en) | A kind of high-power chip cooling system based on liquid metal | |
| CN2515800Y (en) | Cooling radiating assembly of central processor for notebook computer | |
| CN104577809A (en) | Radiator for switchboard copper bar | |
| CN203748171U (en) | Temperature control device used in cabinet | |
| CN109245555B (en) | Synchronous rectification high-frequency switch power supply | |
| CN106855738A (en) | A kind of computer cabinet | |
| CN205091697U (en) | Take refrigerating system's computer | |
| CN204206716U (en) | Semiconductor refrigerating thermostatically-controlled equipment | |
| CN206314152U (en) | A kind of heat abstractor for interchanger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20190506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |