CN101146428A

CN101146428A - Heat radiation module

Info

Publication number: CN101146428A
Application number: CNA200610062681XA
Authority: CN
Inventors: 陈运生
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2006-09-15
Filing date: 2006-09-15
Publication date: 2008-03-19
Anticipated expiration: 2026-09-15
Also published as: CN101146428B

Abstract

A heat dissipating module is used for dissipating heat of heat-generating electric element and includes a heat collecting module, a heat tube and a fin group. The heat collecting module has an upper surface and a lower surface. One end of the heat tube is connected with the fin group and the other end is in thermal connection with lower surface of the heat collecting module. A concave groove is formed on the upper surface of the heat collecting module and is used for holding a heat-generating electric element therein. The concave groove on the heat collecting module can realize tri-dimensional contact with the heat-generating electric element to increase contact area therebetween and reduce thermal resistance, thereby increasing heat conducting efficiency.

Description

The heat radiation module

Technical field

The present invention relates to a kind of heat radiation module, particularly a kind of heat radiation module that is used for the heat-generating electronic elements heat radiation.

Background technology

Along with improving constantly of central processing unit electronic component power such as (CPU), heat dissipation problem more and more is subject to people's attention, and is all the more so in computer.In order in limited space, to take away the heat that system produces efficiently, generally finned radiator or heat-pipe type radiator are placed on the electronic component electronic element radiating.For the heat that electronic component is produced is passed on the radiator apace, generally between radiator and electronic component, establish a heat-collecting block, this heat-collecting block system is made by high conductivity material such as copper, utilizes the rapid heat transferred that equably electronic component is produced of its high-termal conductivity to heat pipe.Heat-collecting block directly has influence on the speed that the electronic component heat distributes with the quality that contacts between the electronic component.Because the volume of electronic component is less, and heat-collecting block be a plate-like structure with electronic component between formation face contact, thereby the contact area size between heat-collecting block and the electronic component is basically by the decision of the surface area of electronic component, thereby contact area is limited, and then influences its heat dispersion.Therefore how to improve the heat-collecting block structure, increase itself and the contact area of electronic component, and then the lifting heat dispersion, designer's urgent problem become.

Summary of the invention

In view of this, be necessary to provide the heat radiation module of a kind of lifting in fact with the heat-generating electronic elements contact area.

This heat radiation module is used for heat-generating electronic elements is dispelled the heat, comprise heat-collecting block, heat pipe and fins group, this heat-collecting block has upper surface and lower surface on the other side, this heat pipe one end and this fins group hot link, the other end and this heat-collecting block lower surface hot link, this heat-collecting block upper surface is provided with a groove, is used for ccontaining this heat-generating electronic elements.

This heat radiation module is used for heat-generating electronic elements is dispelled the heat, comprise heat-collecting block, base, heat pipe and fins group, this heat-collecting block is arranged on the base, this heat pipe is connected between heat-collecting block and the fins group, the formation groove caves on a wherein surface of this heat-collecting block, this groove has bottom surface and several sides, and this groove is accommodated heat-generating electronic elements in it, and the bottom surface of this groove and side coat the outer surface of this heat-generating electronic elements.

Compared with prior art, the groove on this heat-collecting block can be realized three-dimensional contacting with heat-generating electronic elements, increases contact area therebetween, reduces thermal resistance therebetween, thereby improves the heat conduction efficiency of entire heat dissipation module.

Description of drawings

With reference to the accompanying drawings, in conjunction with the embodiments the present invention is further described.

Fig. 1 is the dispel the heat three-dimensional exploded view of module one better embodiment and related elements of the present invention.

Fig. 2 is the three-dimensional exploded view of another angle of Fig. 1.

Fig. 3 is the assembly drawing of Fig. 1.

Fig. 4 is the structural representation of heat-collecting block.

Fig. 5 is the cut-away view that heat-collecting block combines with related elements.

Embodiment

Please also refer to Fig. 1 to Fig. 3, this heat radiation module comprises base 10, heat pipe 30, fins group 90 and heat-collecting block 50.

A storage tank 14 is established in the substantial middle position of base 10, in order to ccontaining heat-collecting block 50.Form an installing hole 16 respectively around the storage tank 14, in order to putting spring screw 40, so that base 10 is locked on the motherboard (not shown).In the bending of the bottom surface of base 10 one bent type groove 12 is set, in order to ccontaining heat pipe 30.Storage tank 14 on the base 10 runs through connection mutually with this song type groove 12, thereby makes the heat pipe 30 that is placed in the bent type groove 12 can be directly and heat-collecting block 50 hot links that are placed in the storage tank 14.

Fins group 90 is arranged in parallel to be provided with by number of plate-shaped fin 92 and forms the runner 94 that 92 formation of adjacent fin are passed through for forced draft (wind direction is shown in arrow among Fig. 3).Wherein the base of each fin 92 forms a square breach 96, and each breach 96 fuses and forms the accommodation space of a U-shaped.Heat pipe 30 comprises the condensation end 32 that the evaporation ends 31 that places in the bent type groove 12 and spontaneous evaporation end 31 extend, this evaporation ends 31 also form bent type shape with bent type groove 12 corresponding settings, this condensation end 32 is placed in the breach 96 formed accommodation spaces of each fin 92, thus with fins group 90 hot links.This heat pipe 30 is a flat, with the contact area of increase with heat-collecting block 50 and fins group 90.

Be the structural representation of heat-collecting block 50 as shown in Figure 4.Heat-collecting block 50 bulk that is square is made by the high metal of conductive coefficient such as copper etc.This heat-collecting block 50 places in the storage tank 14, it has lower surface 52 and the upper surface 54 relative with lower surface 52, lower surface 52 is connected with heat pipe 30, usually between the lower surface 52 of heat-collecting block 50 and heat pipe 30, also fill one deck thermal interfacial material 20, it is more tight that heat-collecting block 50 is contacted with heat pipe 30, reduces thermal resistance therebetween.The upper surface 54 of heat-collecting block 50 is provided with a groove 56, and this groove 56 is in order to ccontaining heat-generating electronic elements 80, as the central processing unit (Fig. 5) of computer.This groove 56 has four sides 57 and a bottom surface 58, forms circular arc chamfering between the adjacent two sides 57.These sides 57 are vertical with bottom surface 58, thereby side 57 surrounds a space that becomes cuboid substantially with bottom surface 58, the height of the size of bottom surface 58 and side 57 is substantially by the surface area of this heat-generating electronic elements 80 and highly decide, make this groove 56 can enough ccontaining this heat-generating electronic elements 80 in it.Generally, between each contact-making surface of this heat-generating electronic elements 80 and this groove 56, also can fill one deck thermal interfacial material 70, be beneficial to the transmission of heat.

During assembling, the evaporation ends 31 of heat pipe 30 is placed in the bent type groove 12 of base 10, condensation end 32 links to each other with fins group 30.Heat-collecting block 50 is positioned in the storage tank 14 on the base 10, and heat-generating electronic elements 80 is contained in the groove 56 of its upper surface 54, the part that the evaporation ends 31 of heat pipe 30 is located at storage tank 14 and the lower surface of heat-collecting block 50 52 are by thermal interfacial material 20 hot links, and this thermal interfacial material 20 can reduce contact heat resistance.One deck thermal interfacial material 20a also is sticked in the end face of base 10 and the terminal corresponding position of the evaporation ends 31 of heat pipe 30, in order to contacting as the South Bridge chip group of computer, north bridge chipset etc., thereby it is dispelled the heat with another heat-generating electronic elements (figure do not show).Last available Spring screws 40 locks base 10 on motherboard by pilot hole 16.The heat that heat-generating electronic elements 80 produces is delivered to heat pipe 30 through heat-collecting block 50, be delivered to fins group 90 through superheater tube 30 then, and borrow forced draft that fins group 90 is brushed, thereby the heat that heat-generating electronic elements 80 is produced can be discharged in time, guarantees that this heat-generating electronic elements 80 working under normal temperature.

Owing to form groove 56 structures on the heat-collecting block 50, heat-generating electronic elements 80 is buried be overlying in the heat-collecting block 50, not only the bottom surface 58 of groove 56 contacts with heat-generating electronic elements 80, its each side 57 also contacts with heat-generating electronic elements 80, thereby constitute the three-dimensional promptly three-dimensional coating way of contact, increased the contact area with heat-generating electronic elements 80, thereby the heat transferred that can more apace heat-generating electronic elements 80 be produced go out, the heat dispersion of entire heat dissipation module is improved.

Claims

One kind the heat radiation module, be used for heat-generating electronic elements is dispelled the heat, comprise heat-collecting block, heat pipe and fins group, it is characterized in that: this heat-collecting block has first surface and second surface on the other side, this heat pipe one end and this fins group hot link, the first surface hot link of the other end and this heat-collecting block, the second surface of this heat-collecting block is provided with a groove, and this heat-generating electronic elements is housed in this groove.
2. heat radiation module as claimed in claim 1 is characterized in that: also comprise the base that is used for fixing heat-collecting block, this base is provided with storage tank with ccontaining this heat-collecting block, and heat pipe places on this base and this heat-collecting block hot link.
3. heat radiation module as claimed in claim 2 is characterized in that: this base is provided with the bent type groove of ccontaining this heat pipe, and this song type groove is connected with the storage tank of ccontaining this heat-collecting block.
4. heat radiation module as claimed in claim 3 is characterized in that: this fins group is made up of some fins, and a wherein side of each fin forms breach, and these breach fuse and form the accommodation space of ccontaining heat pipe.
5. heat radiation module as claimed in claim 4, it is characterized in that: this heat pipe comprises the condensation end that evaporation ends and spontaneous evaporation end extend, this evaporation ends is that this condensation end places in the accommodation space that is formed by breach on the fins group in bent type shape and the bent type groove that places this base.
6. as any described heat radiation module of claim 1 to 5, it is characterized in that: one deck thermal interfacial material has been sticked between the first surface of this heat pipe and heat-collecting block.
One kind the heat radiation module, be used for heat-generating electronic elements is dispelled the heat, comprise heat-collecting block, base, heat pipe and fins group, it is characterized in that: this heat-collecting block is arranged on the base, this heat pipe is connected between heat-collecting block and the fins group, a wherein surface of this heat-collecting block formation groove that caves in, and this groove has bottom surface and several sides, this groove is accommodated heat-generating electronic elements in it, and the bottom surface of this groove and side coat the outer surface of this heat-generating electronic elements.
8. heat radiation module as claimed in claim 7, it is characterized in that: this base is provided with storage tank, and this heat pipe is a flat, comprises evaporation ends and condensation end, the evaporation ends of this heat pipe is housed in this storage tank and with this heat-collecting block and contacts, and this fins group is combined on the condensation end of this heat pipe.
9. heat radiation module as claimed in claim 8 is characterized in that: between the outer surface of this heat-generating electronic elements and the bottom surface of this groove and the side, and be provided with thermal interfacial material between this heat pipe and this heat-collecting block.
10. heat radiation module as claimed in claim 9 is characterized in that: the storage tank of this base forms bent type shape, and the evaporation ends of this heat pipe is while and another heat-generating electronic elements hot link also.