CN100472399C - Heat sink with spring lamination structure and cooling method - Google Patents
Heat sink with spring lamination structure and cooling method Download PDFInfo
- Publication number
- CN100472399C CN100472399C CNB2005100729031A CN200510072903A CN100472399C CN 100472399 C CN100472399 C CN 100472399C CN B2005100729031 A CNB2005100729031 A CN B2005100729031A CN 200510072903 A CN200510072903 A CN 200510072903A CN 100472399 C CN100472399 C CN 100472399C
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- elastic
- piece structure
- elastic piece
- heat
- heat radiation
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- 238000001816 cooling Methods 0.000 title 1
- 238000003475 lamination Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 4
- 230000000191 radiation effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012634 fragment Substances 0.000 description 3
- 230000000750 progressive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat radiation device with elastic plate structure consists of heat source, heat radiation interface material contacting with said heat source, heat radiation module connected to heat radiation interface material and elastic plate structure. It is featured as setting elastic plate on heat radiation chip and using chassis to exert an action force uniformly on heat radiation chip for increasing heat radiation effect. The heat radiation method utilizing said device is also disclosed.
Description
Technical field
The present invention relates to a kind of heat abstractor and heat dissipating method, particularly relate to and being applied in the electronic installation with elastic piece structure, a kind of heat abstractor and heat dissipating method with elastic piece structure, but the auxiliary heat dissipation chip reaches great heat radiation effect.
Background technology
Along with the computer core technology is brought in constant renewal in progressive, the speed of processor Front Side Bus and display chip is speeded day by day, computer requirements is made towards the mainboard architecture of dynamical processor of high-frequency and display chip gradually at present, because usefulness increases, what thereupon will solve is exactly heat dissipation problem, heat dissipation problem is not only at central processing unit, other chip is for example: north bridge, the heat dissipation problem of display chip is also quite important, the design of forced convertion aspect is often only emphasized in existing radiating module design, but ignore the design of conduction aspect, see also Fig. 1, this figure is the relation of contact pressure (Contact Force) and thermal-conduction resistance (Thermal Resistance), and as seen from the figure, contact pressure is big more, thermal-conduction resistance is then more little, so can obtain preferable radiating effect.
Summary of the invention
In view of this, the invention provides a kind of heat abstractor and heat dissipating method with elastic piece structure, by contact pressure to improve radiating efficiency.
Elastic piece structure of the present invention includes: a bottom and two elastic, this bottom comprises two fixed parts, this two fixed part is located at two flanks of this bottom respectively, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of this bottom crooked extend and each other before and after be separated from each other, the present invention utilizes casing that this two elastic is exerted pressure, the pressure stroke of utilizing casing to exert pressure to make this two elastic to produce provides this bottom acquisition uniform pressure.
Elastic of the present invention is the arch state by this crooked extension in two side direction top, bottom, and this bottom is to be ㄇ shape attitude and to comprise a fixed part, and this fixed part is located at two sides of this bottom.
And heat abstractor of the present invention comprises: a thermal source; Contact a heat radiation interface material of this thermal source; Contact a radiating module of this heat radiation interface material; And replace an elastic piece structure of this radiating module towards this thermal source direction, wherein this elastic piece structure comprises: a bottom; And two elastic, this bottom comprises two fixed parts, this two fixed part is located at two flanks of this bottom respectively, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of bottom crooked extend and each other before and after be separated from each other, by this elastic is exerted pressure, make this bottom obtain uniform pressure.
And the step of heat dissipating method comprises: an elastic piece structure, a heat radiation interface material and a radiating module is superimposed in regular turn on a thermal source, and wherein this elastic piece structure comprises: a bottom; And two elastic, this bottom comprises two fixed parts, this two fixed part is located at two flanks of this bottom respectively, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of this bottom crooked extend and each other before and after be separated from each other, by this elastic is exerted pressure, make this bottom obtain uniform pressure, and then this radiating module is imposed an acting force towards this thermal source direction.
For above and other objects of the present invention, feature and advantage can be become apparent, hereinafter enumerate preferred embodiment especially, and cooperate appended diagram, be described in detail below.
Description of drawings
Fig. 1 is the graph of a relation of contact pressure and thermal resistance;
Fig. 2 is a shell fragment synoptic diagram of the present invention;
Fig. 3 is the user mode figure of shell fragment of the present invention;
Fig. 4 is applied to user mode figure on the electronic installation for shell fragment of the present invention:
Fig. 5 is the process flow diagram of heat dissipating method of the present invention.
Embodiment
See also Fig. 2, a kind of elastic piece structure 1 includes a bottom 11 and two elastic 12,13, this bottom 11 includes fixed part 111 and breakthrough portion 112, fixed part is located at two flanks of this bottom 11 respectively, the elastic 12,13 of present embodiment with one in front and one in back, about the form that is crisscross arranged, fixed part 111 by this bottom 11 reaches the crooked extension of central interior upward, in addition, the square section of this breakthrough portion 112 of present embodiment is ㄇ shape attitude haply, in order to allowing heat pipe (heat pipe) 22 by (see figure 3), and this elastic 12,13 is the arch state.
Please consult Fig. 3, Fig. 4 simultaneously, heat abstractor 2 is located in the electronic installation 4, comprise radiating module 20 and elastic piece structure 1, wherein, radiating module 20 comprises elements such as fan 21, heat pipe 22 and radiating block (thermalblock) 23, and the radiating block 23 of radiating module 20 is to be arranged on the thermal source 30 (for example heat radiation chip) by a heat dissipation interface material 24, and this elastic piece structure 1 utilizes fixed part 111 to be fixedly arranged on this radiating module 20, and its fixed form can adopt welding, rivets or lock with the fixture (not shown).Between the top of elastic 12,13 and the bottom radiating module 20 distance L is arranged, as shown in Figure 4.The present invention exerts pressure by 40 pairs of these elastic piece structures 1 of casing that are positioned at elastic piece structure 1 top, when elastic piece structure 1 is under pressure, can be by this elastic 12,13 produce pressure stroke, pressure stroke is the downforce executed of casing 40 on average, make this bottom 11 obtain uniform pressure, and continue directly to transmit pressure downwards to thermal source 30, the data presentation of Fig. 1 before the foundation, contact pressure is big more, and thermal-conduction resistance is then more little, so can obtain preferable radiating effect, as can be known, transmit pressure to thermal source 30 by this elastic piece structure 1, thermal-conduction resistance can reduce, and can obtain preferable heat radiation result.
In addition, when the contact pressure that is produced when 1 pair of thermal source 30 of elastic piece structure is not enough or excessive, can be by elastic 12,13 height that change elastic piece structure 1, that is the distance L of the top and bottom of change elastic 12,13, make the Level Change of elastic piece structure 1 can influence the decrement of elastic 12,13, thus to improve or to reduce contact pressure, in addition, also can utilize the thickness degree that changes elastic piece structure 1, improve or reduce contact pressure with the same principle of the decrement that influences elastic 12,13.Moreover the present invention provides auxiliary thermal source 30 heat radiations except that being applied to, and also can be applicable on the radiating fin (not shown), with identical heat-conduction principle, quickens the radiating effect of radiating fin.
Fig. 5 is according to the process flow diagram of heat dissipating method of the present invention, at first, an one heat radiation interface material 24 and a radiating module 20 is superimposed in regular turn on a thermal source 30 (step S1), in order to obtain preferable radiating effect, so utilize an elastic piece structure this radiating module 20 to be imposed an acting force (step S2) towards these thermal source 30 directions, increasing the contact pressure between thermal source 30, heat radiation interface material 24 and the radiating module 20, and then reduce its thermal-conduction resistance and increase heat conduction efficiency therebetween.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; when the change that can do some and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (11)
1. an elastic piece structure is used for a heat abstractor, includes:
One bottom comprises two fixed parts, and this two fixed part is located at two flanks of this bottom respectively; And
Two elastic, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of this bottom crooked extend and each other before and after be separated from each other, by this two elastic is exerted pressure, make this bottom acquisition uniform pressure.
2. elastic piece structure as claimed in claim 1, wherein, this bottom also includes a breakthrough portion, and this breakthrough portion is ㄇ shape attitude.
3. elastic piece structure as claimed in claim 1, wherein, this elastic is the arch state.
4. a heat abstractor is applied in the electronic installation, and this heat abstractor comprises:
One heat radiation interface material contacts a thermal source;
One radiating module contacts this heat radiation interface material; And
One elastic piece structure is replaced this radiating module towards this thermal source direction;
Wherein this elastic piece structure comprises:
One bottom comprises two fixed parts, and this two fixed part is located at two flanks of this bottom respectively; And
Two elastic, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of this bottom crooked extend and each other before and after be separated from each other, by this two elastic is exerted pressure, make this bottom acquisition uniform pressure.
5. heat abstractor as claimed in claim 4, it also comprises a casing, holds this heat radiation interface material, this radiating module and this elastic piece structure.
6. heat abstractor as claimed in claim 5, wherein, this elastic piece structure is resisted against between this casing and this radiating module.
7. heat abstractor as claimed in claim 4, wherein, this bottom also includes a breakthrough portion, and this breakthrough portion is ㄇ shape attitude.
8. heat abstractor as claimed in claim 4, wherein, this elastic is the arch state.
9. heat dissipating method comprises:
One elastic piece structure, a heat radiation interface material and a radiating module is superimposed in regular turn on a thermal source, and wherein this elastic piece structure comprises:
One bottom comprises two fixed parts, and this two fixed part is located at two flanks of this bottom respectively; And
Two elastic, this each elastic be this two fixed part by this bottom reach upward respectively the central interior of this bottom crooked extend and each other before and after be separated from each other, by this elastic is exerted pressure, make this bottom acquisition uniform pressure; And
Towards this thermal source direction this radiating module is imposed an acting force.
10. heat dissipating method as claimed in claim 9, wherein, this bottom also includes a breakthrough portion, and this breakthrough portion is ㄇ shape attitude.
11. heat dissipating method as claimed in claim 9, wherein, this elastic is the arch state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100729031A CN100472399C (en) | 2005-05-23 | 2005-05-23 | Heat sink with spring lamination structure and cooling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100729031A CN100472399C (en) | 2005-05-23 | 2005-05-23 | Heat sink with spring lamination structure and cooling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1869873A CN1869873A (en) | 2006-11-29 |
| CN100472399C true CN100472399C (en) | 2009-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100729031A Expired - Fee Related CN100472399C (en) | 2005-05-23 | 2005-05-23 | Heat sink with spring lamination structure and cooling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100472399C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI340205B (en) | 2008-11-27 | 2011-04-11 | Asustek Comp Inc | Fastener for heat sinker and an elastic frame of the fastener |
| CN108253083A (en) * | 2018-01-15 | 2018-07-06 | 江苏冠达通电子科技有限公司 | A kind of novel 3D display module |
| CN117500149B (en) * | 2023-12-27 | 2024-04-26 | 荣耀终端有限公司 | Vapor chamber, circuit board assembly and electronic equipment |
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2005
- 2005-05-23 CN CNB2005100729031A patent/CN100472399C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1869873A (en) | 2006-11-29 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090325 |