CN210270796U - Embedded control platform - Google Patents
Embedded control platform Download PDFInfo
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- CN210270796U CN210270796U CN201921734608.1U CN201921734608U CN210270796U CN 210270796 U CN210270796 U CN 210270796U CN 201921734608 U CN201921734608 U CN 201921734608U CN 210270796 U CN210270796 U CN 210270796U
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- heat dissipation
- control platform
- upper cover
- embedded control
- mainboard
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Abstract
The utility model relates to an industrial personal computer, in particular to an embedded control platform, which comprises a mainboard, a hard disk and a case, wherein the case comprises a front panel and a rear panel, and the case also comprises a heat dissipation cover, and the heat dissipation cover comprises an upper cover and two side covers; the CPU and the chip set on the mainboard are arranged on the back of the mainboard, and the back of the mainboard is fixedly arranged on the heat dissipation cover; the upper cover is provided with a convex block at the position corresponding to the CPU and is contacted with the CPU; the upper cover and the two side covers of the radiating cover are provided with a plurality of radiating fins. The utility model optimizes the heat dissipation design of the CPU, improves the heat dissipation efficiency, and simplifies the installation steps; the built-in highly integrated mainboard adapts to the mainstream demand of industrial field and has abundant input and output interfaces.
Description
Technical Field
The utility model relates to an industrial computer, an embedded control platform specifically says so.
Background
Along with the development of computers and automation technology, the level of the whole informatization of the Chinese economic society is obviously improved, and more key industries begin to use industrial personal computer products in a large range. The stable working state, rich interface expansion and strong adaptability to harsh environment of the system are used as a product terminal platform and are widely applied.
Considering the abominable operational environment such as high temperature and high humidity, dust that probably exist, traditional industrial computer product mostly chooses for use a general industry mainboard of a section, cooperates the sealed quick-witted case of full aluminium system, and both pass through "aluminium system radiating block + heat conduction cushion" combination with mainboard heat and reach quick-witted case outside heat dissipation. Limited by fixed mainboard layout and case height, the radiating effect is general and design, installation are all comparatively complicated, still have certain perfect space of upgrading.
Meanwhile, with the development of the industry, when the industrial personal computer is used as a terminal platform on site, a large amount of peripherals such as a serial port, a USB port and the like are required to be connected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an embedded control platform that the radiating efficiency is high, the interface is abundant. The method is realized by the following technical scheme:
an embedded control platform comprises a mainboard, a hard disk and a case, wherein the case comprises a front panel and a rear panel, and the case also comprises a heat dissipation cover, and the heat dissipation cover comprises an upper cover and two side covers; the CPU and the chip set on the mainboard are arranged on the back of the mainboard, and the back of the mainboard is fixedly arranged on the heat dissipation cover; a lug is arranged at the position of the upper cover corresponding to the CPU and is contacted with the CPU; the upper cover and the two side covers of the radiating cover are provided with a plurality of radiating fins.
Furthermore, in the above technical solution, the coastline on both sides of the main board is provided with exposed 10 RS-232 serial ports, 4 USB3.0 interfaces, 2 USB2.0 interfaces, and the like.
Furthermore, in the above technical scheme, the hard disk adopts a pop-up design, the case is connected with the hard disk frame through the shock absorption rubber mat, and the hard disk is installed on the hard disk frame.
Furthermore, in the above technical scheme, the heat dissipation fins on the upper cover and the two side covers are arranged at equal intervals, and the longitudinal sections of the heat dissipation fins are isosceles trapezoids.
Furthermore, in the above technical solution, a plurality of sets of symmetrical notches are arranged on the side surface between every two heat dissipation fins on the upper cover, forming a zigzag shape.
Furthermore, in the above technical solution, the heat dissipation fins at the two ends of the upper cover are designed in a symmetrical closed-type.
Further, in the above technical solution, the distance between the middle points of the tops of the two longitudinal sections of the upper cover is 7-8cm, the distance between the two adjacent ends of the top is 4-5cm, and the distance between the two adjacent ends of the bottom is 3-4 cm.
Furthermore, in the above technical scheme, the height of the two heat dissipation fins covered on the two sides is 1-2cm, the distance between two adjacent ends of the top of the longitudinal section is 1-2cm, and the distance between two adjacent ends of the bottom is 0.3-0.5 cm.
Further, in the above technical solution, the upper cover is provided with 20-30 heat dissipation fins, and the side covers are respectively provided with 7-15 heat dissipation fins.
Furthermore, in the above technical solution, the heat dissipation cover further includes a stack of mounting brackets, which are respectively fixed on the two side covers of the heat dissipation cover.
The utility model optimizes the heat dissipation design of the CPU, improves the heat dissipation efficiency, and simplifies the installation steps; a highly integrated mainboard is arranged in the device, so that the device is suitable for mainstream requirements of industrial fields and has abundant input and output interfaces; the design of the pop-up hard disk greatly simplifies the maintenance workload of the field equipment. All electrical components are protected in a compact and closed aluminum case, have good vibration resistance and dust resistance, can be embedded in the case of a customer or independently applied, and have strong compatibility.
Drawings
FIG. 1 is a general schematic diagram of an embedded control platform;
FIG. 2 is a schematic view of an upper mold-opening heat-dissipating cover of the embedded control platform;
FIG. 3 is a partial view of fins of an upper cover of a mold-opening heat sink of an embedded control platform;
FIG. 4 is a schematic diagram of a CPU part of an embedded control platform;
FIG. 5 is a partial schematic diagram of a CPU of a motherboard of an embedded control platform;
FIG. 6 is a schematic diagram of an embedded control platform motherboard interface;
fig. 7 is a schematic diagram of a pop-up hard disk structure of an embedded control platform.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings.
As shown in fig. 1, 4 and 5, the present invention includes a motherboard 1, a hard disk 2 and a chassis, wherein the chassis includes a front panel and a rear panel, and further includes a heat dissipation cover 3, which includes an upper cover 31 and two side covers 32; the CPU and the chip set 5 on the mainboard are arranged on the back of the mainboard, and the back of the mainboard is fixed on the heat dissipation cover 3; the upper cover 32 is provided with a locking projection 33 at a position corresponding to the CPU so as to be in direct contact with the CPU. Compared with the design of the similar products, the design of the aluminum radiating block and the heat conducting rubber pad is omitted, the height of the whole machine is reduced, the product is more compact, the installation process is simplified, and meanwhile, the heating source is directly contacted with the radiating upper cover of the case, and the radiating efficiency is greatly improved.
As shown in fig. 6, the coastline on both sides of the motherboard is provided with exposed 10 RS-232 serial ports, 4 USB3.0 interfaces, 2 USB2.0 interfaces, and the like. The device can be used for connecting a large number of field peripherals, and has one more time of I/O interfaces compared with similar products, so that the field of final use of the product is greatly expanded.
As shown in fig. 7, the hard disk 2 is installed in a pop-up manner, the case is connected with the hard disk frame through the damping rubber pad 21, a hole is formed in the corresponding position of the rear panel of the case, the elastic sheet switch 22 is led out, and when a customer uses and maintains the hard disk on site, the hard disk can be taken out only by popping the exposed elastic sheet of the hard disk frame, so that the hard disk is very convenient and fast. The maintenance difficulty of the whole machine is reduced, and the installation and debugging time of a client is greatly shortened.
As shown in fig. 2, the upper cover 31 and the two side covers 32 of the heat dissipation cover are provided with a plurality of heat dissipation fins 34 at equal intervals, and the longitudinal sections of the heat dissipation fins 34 form an isosceles trapezoid. As shown in fig. 3, a plurality of sets of symmetrical notches are arranged on the side surface between every two heat dissipation fins on the upper cover, the notches are zigzag, and the heat dissipation surface area is increased within the straight line section of the two heat dissipation fin paper pieces.
The distance between the middle points of the tops of the longitudinal sections of every two radiating fins 34 of the upper cover is 7-8cm, the distance between the two adjacent ends of the tops is 4-5cm, and the distance between the two adjacent ends of the bottoms is 3-4 cm.
The height of the two radiating fins covered on the two side covers is 1-2cm, the distance between two adjacent ends of the top of the longitudinal section is 1-2cm, and the distance between two adjacent ends of the bottom of the longitudinal section is 0.3-0.5 cm. The upper cover is provided with 20-30 radiating fins, and the side covers are respectively provided with 7-15 radiating fins.
In this embodiment, the distance between the middle points of the top of the longitudinal sections of the two heat dissipation fins 34 of the upper cover is 7cm, the distance between the two adjacent ends of the top is 4.81cm, and the distance between the two adjacent ends of the bottom is 3 cm. The height of the two radiating fins covered on the two sides is 1cm, the distance between the two adjacent ends of the top of the longitudinal section is 1.41cm, and the distance between the two adjacent ends of the bottom is 0.35 cm. The upper cover is provided with 24 radiating fins, the side covers are respectively provided with 10 radiating fins, and 8 groups of small radiating fins are arranged between the two radiating fins of the upper cover. As shown in fig. 3, the heat dissipation fins at the two ends of the upper cover are symmetrically designed to prevent foreign matters from entering.
The utility model discloses a pair of installing support 4 is fixed respectively and is covered in the heat dissipation lid both sides, makes things convenient for on-the-spot fixed mounting.
Claims (10)
1. The utility model provides an embedded control platform, includes mainboard, hard disk and quick-witted case, panel, its characterized in that around the quick-witted case includes: the chassis also comprises a heat dissipation cover, wherein the heat dissipation cover comprises an upper cover and two side covers;
the CPU and the chip set on the mainboard are arranged on the back of the mainboard, and the back of the mainboard is fixedly arranged on the heat dissipation cover; a lug is arranged at the position of the upper cover corresponding to the CPU and is contacted with the CPU;
the upper cover and the two side covers of the radiating cover are provided with a plurality of radiating fins.
2. An embedded control platform according to claim 1, wherein: the coastline on both sides of the mainboard is provided with exposed 10 RS-232 serial ports, 4 USB3.0 interfaces, 2 USB2.0 interfaces and the like.
3. An embedded control platform according to claim 1, wherein: the hard disk adopts a pop-up design, the case is connected with the hard disk frame through the shock absorption rubber mat, and the hard disk is arranged on the hard disk frame.
4. An embedded control platform according to claim 1, wherein: the radiating fins on the upper cover and the radiating fins on the two side covers are arranged at equal intervals, and the longitudinal sections of the radiating fins are isosceles trapezoids.
5. An embedded control platform according to claim 4, wherein: and a plurality of groups of symmetrical notches are arranged on the side surface between every two radiating fins on the upper cover to form a zigzag shape.
6. An embedded control platform according to claim 4, wherein: the heat dissipation fins at the two ends of the upper cover are in a symmetrical closed-up design.
7. An embedded control platform according to claim 4, wherein: the distance between the middle points of the tops of the longitudinal sections of the two radiating fins on the upper cover is 7-8cm, the distance between the two adjacent ends of the tops is 4-5cm, and the distance between the two adjacent ends of the bottoms is 3-4 cm.
8. An embedded control platform according to claim 1, wherein: the height of the two radiating fins covered on the two side covers is 1-2cm, the distance between two adjacent ends of the top of the longitudinal section is 1-2cm, and the distance between two adjacent ends of the bottom of the longitudinal section is 0.3-0.5 cm.
9. An embedded control platform according to claim 1, wherein: the upper cover is provided with 20-30 radiating fins, and the side covers are respectively provided with 7-15 radiating fins.
10. An embedded control platform according to claim 1, wherein: the heat dissipation cover further comprises a pair of mounting brackets which are respectively fixed on the two side covers of the heat dissipation cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921734608.1U CN210270796U (en) | 2019-10-16 | 2019-10-16 | Embedded control platform |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921734608.1U CN210270796U (en) | 2019-10-16 | 2019-10-16 | Embedded control platform |
Publications (1)
Publication Number | Publication Date |
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CN210270796U true CN210270796U (en) | 2020-04-07 |
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Family Applications (1)
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CN201921734608.1U Active CN210270796U (en) | 2019-10-16 | 2019-10-16 | Embedded control platform |
Country Status (1)
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CN (1) | CN210270796U (en) |
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2019
- 2019-10-16 CN CN201921734608.1U patent/CN210270796U/en active Active
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