CN201464967U - Compact fanless industrial computer mainframe - Google Patents

Compact fanless industrial computer mainframe Download PDF

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Publication number
CN201464967U
CN201464967U CN2009200741766U CN200920074176U CN201464967U CN 201464967 U CN201464967 U CN 201464967U CN 2009200741766 U CN2009200741766 U CN 2009200741766U CN 200920074176 U CN200920074176 U CN 200920074176U CN 201464967 U CN201464967 U CN 201464967U
Authority
CN
China
Prior art keywords
cpu
mainboard
radiating fin
industrial computer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200741766U
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Chinese (zh)
Inventor
周济
段华叶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI ANOVO CO Ltd
Original Assignee
SHANGHAI ANOVO CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI ANOVO CO Ltd filed Critical SHANGHAI ANOVO CO Ltd
Priority to CN2009200741766U priority Critical patent/CN201464967U/en
Application granted granted Critical
Publication of CN201464967U publication Critical patent/CN201464967U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a compact fanless industrial computer mainframe, comprising a case, an industrial computer mainboard arranged on the inner side of the lower cover of the case, various interfaces integrated on the mainboard, a CPU, a south bridge and a north bridge, wherein the CPU and the north bridge are coated with thermal conductive adhesive, a radiating fin support which is matched with the hole site and the size of the CPU and the north bridge is fixed on the mainboard, the radiating fin support is provided with CPU radiating fins, and the lower surface of the CPU radiating fin is attached on the thermal conductive adhesive coated on the upper surface of the CPU and the north bridge; the upper surface of the CPU radiating fin is also coated with thermal conductive adhesive; after an aluminum alloy upper cover and an aluminum alloy lower cover are fixedly assembled, the thermal conductive adhesive coated on the upper surface of the CPU radiating fin is rightly attached with the inner surface of the aluminum alloy upper cover; a hard disk is fixed on the left side of the lower cover of the case through a hard disk fixing frame; and the mainboard is a MINI-ITX series mainboard. The industrial computer mainboard designed through the utility model, is free from the traditional fan radiating method, and has compact and firm the structure and small and exquisite shape.

Description

A kind of close-coupled does not have the fan industrial computer host
Technical field
The utility model relates to a kind of industrial computer host, and being specifically related to a kind of close-coupled does not have the fan industrial computer host.
Background technology
Computing machine has greatly changed our life in nearest decades.In industry, computing machine has also obtained application corresponding, Here it is industrial computer.Industrial computer is mainly used in aspects such as Industry Control, test.As truck-mounted computer etc.Because the chain rate of production line is more abominable usually, such as unfavorable factors such as vibrations, dust, greasy dirt and high temperature, has caused industrial computer particularly to pay attention to security protection on structural design,, avoid causing damage to keep the stability that industrial computer is carried out.And heat dissipation problem is in the industrial computer one particularly one of important problem.
Traditional master radiating device all is to realize by fan.As publication number is the Chinese patent of the Heat Dissipating Device of Industry Computer Hose of CN2685963, and the motherboard in the main frame is provided with the plural slot of the interface card of can planting, and its back side panel is provided with plural number and connects louvre; The heat abstractor of motherboard top comprises striding is located at the latter half of interior support body of main frame, at least be provided with a fan base sheet and a fan on the support body, each fan base sheet one side is snapped in the support body bottom side, the opposite side clinching is in spacer, fan is fixed in the bottom surface of fan base sheet, the inlet scoop of each fan is down facing to each interface card and motherboard, and exhaust outlet outwards extends plural number and connects louvre.So, the heat that the heat and the cooling mechanism suction of motherboard in the industrial computer main frame and the generation of interface card can be come is discharged outside main frame by each fan rapidly together, improves its radiating effect.But also have many problems: 1, the existence of fan has increased the volume of cabinet; 2, during fan work, can produce noise; 3, many these parts of fan have increased the cost of industrial computer host.
The utility model content
The purpose of this utility model is in order to provide a kind of close-coupled not have the fan industrial computer host, with the problems referred to above of solution prior art, and to have proposed a kind of brand-new design concept.
The purpose of this utility model can be achieved through the following technical solutions.
A kind of close-coupled does not have the fan industrial computer host, comprises cabinet, is installed on integrated various interface, CPU and north and south bridge on the industrial computer mainboard, mainboard of cabinet lower cover inboard; CPU on the described mainboard and north bridge are main heat generating components; On CPU and north bridge coated with heat-conducting glue; One is mounted on the mainboard with the heat radiator support of CPU and position, north bridge hole and size coupling; On the heat radiator support CPU radiating fin is installed; CPU radiating fin lower surface proper and CPU and the applying of north bridge heat-conducting glue that upper surface covers; The CPU radiating fin upper surface is also coated with heat-conducting glue; Behind aluminium alloy loam cake and the lower cover mount, the heat-conducting glue of CPU radiating fin upper surface and aluminium alloy upper interior surface are fitted just; Hard disk is fixed in cabinet lower cover left side by the hard disk fixed mount, to avoid CPU and north bridge; Described mainboard is a MINI-ITX series mainboard.
The physical dimension of described cabinet is: 208mm * 190mm * 53mm.
Described mainboard CPU radiating fin adopts aluminum alloy material, and the assembling back closely contacts with the aluminium alloy casing, and the heat that CPU and north bridge are distributed is directly conducted to casing by radiating block, in time heat is derived by the aluminium alloy casing.
The industrial computer host that designs by the utility model, abandoned traditional fan radiating mode, adopt sealing aluminium alloy to reinforce casing and CPU aluminium alloy radiating block integral heat sink mode, compact conformation is firm, profile is small and exquisite. and shell double as heat sinking function, fully used heat conduction, heat radiation, thermal convection principle, structure versatility height, consider the replaceable structure of MINI-ITX series mainboard simultaneously, had good sealing and dustproof heat radiation and anti-electromagnetic interference performance.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Among the figure: 1, lower cover 2, mainboard 3, CPU 4, north bridge
5, heat-conducting glue 6, heat radiator support 7, CPU radiating fin
8, hard disk 9, loam cake.
Embodiment
Further specify design feature of the present utility model below in conjunction with accompanying drawing and specific embodiment.
A kind of close-coupled does not as shown in Figure 1 have the fan industrial computer host, comprises cabinet, is installed on integrated various interface, CPU3 and north and south bridge on the industrial computer mainboard 2, mainboard 2 of cabinet lower cover 1 inboard; CPU3 on the described mainboard and north bridge 4 are main heat generating components; On CPU3 and north bridge 4 coated with heat-conducting glue 5; One is mounted on the mainboard 2 with the heat radiator support 6 of CPU3 and position, north bridge 4 hole and size coupling; CPU radiating fin 7 is installed on the heat radiator support 6; CPU radiating fin 7 lower surfaces proper and CPU3 and 5 applyings of north bridge 4 heat-conducting glues that upper surface covers; CPU radiating fin 7 upper surfaces are also coated with heat-conducting glue 5; Behind aluminium alloy loam cake 1 and lower cover 9 mounts, the heat-conducting glue 5 and aluminium alloy loam cake 1 inside surface of CPU radiating fin 6 upper surfaces are fitted just; Hard disk 8 is fixed in cabinet lower cover left side by the hard disk fixed mount, to avoid CPU3 and north bridge 4.Described mainboard is a MINI-ITX series mainboard.
The no fan heat dissipation design of the utility model uniqueness, shell double as heat sinking function adopts unique mainboard heat radiator and the incorporate integral heat sink mode of casing, has good sealing and dustproof heat dispersion, structure versatility height.

Claims (2)

1. a close-coupled does not have the fan industrial computer host, comprises cabinet, is installed on integrated various interface, CPU and north and south bridge on the industrial computer mainboard, mainboard of cabinet lower cover inboard; It is characterized in that: on CPU and north bridge coated with heat-conducting glue; One is mounted on the mainboard with the heat radiator support of CPU and position, north bridge hole and size coupling; On the heat radiator support CPU radiating fin is installed; CPU radiating fin lower surface proper and CPU and the applying of north bridge heat-conducting glue that upper surface covers; The CPU radiating fin upper surface is also coated with heat-conducting glue; Behind aluminium alloy loam cake and the lower cover mount, the heat-conducting glue of CPU radiating fin upper surface and aluminium alloy upper interior surface are fitted just; Hard disk is fixed in cabinet lower cover left side by the hard disk fixed mount; Described mainboard is a MINI-ITX series mainboard.
2. a kind of close-coupled according to claim 1 does not have the fan industrial computer host, it is characterized in that: described cabinet physical dimension is: 208mm * 190mm * 53mm.
CN2009200741766U 2009-06-26 2009-06-26 Compact fanless industrial computer mainframe Expired - Fee Related CN201464967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200741766U CN201464967U (en) 2009-06-26 2009-06-26 Compact fanless industrial computer mainframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200741766U CN201464967U (en) 2009-06-26 2009-06-26 Compact fanless industrial computer mainframe

Publications (1)

Publication Number Publication Date
CN201464967U true CN201464967U (en) 2010-05-12

Family

ID=42392315

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200741766U Expired - Fee Related CN201464967U (en) 2009-06-26 2009-06-26 Compact fanless industrial computer mainframe

Country Status (1)

Country Link
CN (1) CN201464967U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101945562A (en) * 2010-08-13 2011-01-12 天津凯发电气股份有限公司 Case of electrified railway protection measurement and control device
CN102541213A (en) * 2012-01-18 2012-07-04 研华科技(中国)有限公司 Extractable module box
CN107039979A (en) * 2017-04-30 2017-08-11 广州开能电气实业有限公司 A kind of APF modules with natural heat dissipation ability
CN109270998A (en) * 2017-12-27 2019-01-25 黄河科技学院 The spherical host cabinet of computer circulating type heat dissipation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101945562A (en) * 2010-08-13 2011-01-12 天津凯发电气股份有限公司 Case of electrified railway protection measurement and control device
CN101945562B (en) * 2010-08-13 2012-07-25 天津凯发电气股份有限公司 Case of electrified railway protection measurement and control device
CN102541213A (en) * 2012-01-18 2012-07-04 研华科技(中国)有限公司 Extractable module box
CN102541213B (en) * 2012-01-18 2013-08-28 研华科技(中国)有限公司 Extractable module box
CN107039979A (en) * 2017-04-30 2017-08-11 广州开能电气实业有限公司 A kind of APF modules with natural heat dissipation ability
CN109270998A (en) * 2017-12-27 2019-01-25 黄河科技学院 The spherical host cabinet of computer circulating type heat dissipation
CN109270998B (en) * 2017-12-27 2020-08-21 浙江博拓里尼机械股份有限公司 Spherical host computer box of radiating of computer surrounding type

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100512

Termination date: 20120626