CN2713643Y - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
CN2713643Y
CN2713643Y CN 200420084739 CN200420084739U CN2713643Y CN 2713643 Y CN2713643 Y CN 2713643Y CN 200420084739 CN200420084739 CN 200420084739 CN 200420084739 U CN200420084739 U CN 200420084739U CN 2713643 Y CN2713643 Y CN 2713643Y
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China
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fan
power supply
host computer
water
heat
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CN 200420084739
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Chinese (zh)
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黄庭强
陈涵敦
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大众电脑股份有限公司
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Publication of CN2713643Y publication Critical patent/CN2713643Y/en

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Abstract

The utility model relates to a heat sink which is applied to a computer mainframe. The rear side of the computer mainframe is provided with a radiator. The heat radiating effect is increased through a power supplier fan contained by a power supplier of the computer mainframe matching with the air amount discharged by a system fan arranged under the heat radiator to simultaneously blow the radiator.

Description

散热装置 The heat dissipation device

技术领域 FIELD

本实用新型为一种散热装置,应用于一计算机主机,并对此计算机主机内的一电子组件进行散热,此电子组件可为中央处理器。 The present invention as a heat dissipation device, applied to a host computer, and this cooling of electronic components in a host computer, the electronic component may be a central processing unit.

背景技术 Background technique

计算机由许多的电子组件所组成,其包括有主机板、电源供应器、硬盘机、软盘机及光驱等组件,以通过这些电子组件而执行一些计算机预设的功能,例如:文件的编辑、程序的运算、影片的播放等。 Many computer by the electronic components of the composition which comprises a motherboard, power supply, hard disk drive, floppy disk drive and optical components, some of the computer to perform predetermined functions of these electronic components, for example: document editing program the operation, video playback and so on.

这些计算机内的电子组件在运行过程中无可避免地会产生热能,而这些热能必须通过其它途径如热传导、热对流或热辐射将热能散发至周围环境,不至于使电子组件温度过高而影响产品的稳定性与可靠性。 These electronic components within the computer during operation will inevitably produce heat, which heat must be through other means such as heat conduction, convection or radiation heat to heat dissipation to the surrounding environment, so that the electronic components will not affect the high temperature stability and reliability of the product. 而在计算机系统中,其中又以主要执行运算的组件—中央处理器(CPU)的散热问题最为重要,因此中央处理器的散热问题为计算机厂商所欲努力克服的问题。 In computer systems, among which the main components that perform operations - heat issues central processing unit (CPU) is the most important, the central processor heat problem for computer makers desired efforts to overcome the problem.

随着处理器技术的进步,中央处理器(Central Processing Unit,CPU)的工作频率已增加到3--4GHz以上,且其发热功率更达115W以上,如果中央处理器所产生的热能不能充分排除,势必影响计算机的功能,缩短其使用寿命,因此,散热问题随着计算机运算频率的提高而日趋严重。 With the advances in processor technology, central processing unit (Central Processing Unit, CPU) operating frequency has increased 3--4GHz more, and the heating power of more than 115W, if the heat generated by the central processor can not be fully ruled out It is bound to affect the function of the computer, and shorten its life, so as to improve the heat dissipation problem of computing the frequency and growing.

传统用来解决中央处理器散热的技术手段,主要是利用散热器与散热风扇作搭配,其中的散热器由金属材质制成,散热器包括有一底座,底座上具有多个垂直并排的散热鳍片,底座直接设置于中央处理器上与其接触,当中央处理器执行工作所产生的热能会经由底座而传递至散热鳝片上,散热风扇设置于散热鳍片上,利用散热风扇所产生的气流吹入散热鳍片内,利用散热风扇所产生的气流与高温的散热鳍片进行热交换,而将散热器上的热量带走,进而降低中央处理器的温度来达到散热的目的。 Means for Solving the conventional central processor of heat, mainly for the radiator and the cooling fan with which the heat sink is made of a metal material, the heat sink comprises a base having a plurality of vertical cooling fins on the base side by side base disposed directly in contact with the central processor, the central processor to perform the work of the heat generated will be transmitted to the heat radiating plate via the base when eel, fan disposed in the cooling fins, the use of air flow generated by the fan blowing cooling the fin, the heat radiation fins and the high temperature gas stream using heat generated by the fan heat exchanger, and the heat away from the heat sink, thereby reducing the temperature of a central processor to achieve the purpose of cooling.

随着中央处理器工作频率的提高,散热风扇的时钟也跟着增加,而市场上也陆续推出4500转、5400转、7200转、甚至10000转以上的风扇,以降低计算机主机内的温度,进而延长电子组件的使用寿命。 With the improvement of the operating frequency of the central processor, clock cooling fan will also increase, also launched on the market 4500 rpm, 5400, 7200, or even 10,000 rpm or more fans to lower the temperature inside the host computer, thereby extending the life of electronic components.

虽然这些高转速的风扇压制了中央处理器的热量,但却压制不住其令人烦扰的噪音,所以,中央处理器在高频运行时,除了原本的散热问题外,噪音问题也成为亟需克服的课题。 Although these high speed fan heat pressing the central processor, but it could not suppress disturbing noise, therefore, the central processor is running at a high frequency, in addition to the original heat problem, the noise problem has become urgent to overcome the problem.

由于液体的散热效果比气体的散热效果佳,因此,目前厂商们纷纷推出各种水冷式散热系统,将水冷式散热系统结合原本的散热器及散热风扇,通过液体(通常是利用蒸馏水)的循环将热能带走,以提高其散热效果。 Since the cooling effect of the liquid gas ratio of good cooling effect, therefore, the current manufacturers have introduced a variety of water-cooled cooling system, the cooling system in conjunction with water-cooled radiator and a cooling fan originally through a liquid (typically with distilled water) circulation thermal energy away, in order to improve the thermal effect.

请参考图1所示,为传统计算机主机中水冷式散热系统的系统架构图,此计算机主机中主要包含有一中央处理器(图中未示)、设置于中央处理器上的一致冷片(cold plate)10、一电源供应器20、一散热器30与一水冷模块40。 With reference to FIG, a conventional host computer system architecture diagram of a water-cooled cooling system, the host computer 1 comprises a main central processing unit (not shown), a refrigeration is provided to the central processor chip (cold plate) 10, a power supply 20, a water-cooled heat sink 30 and a module 40.

此中央处理器是设置于一主机板50上,当使用者在执行应用程序或是功能选项时,即是由中央处理器进行讯号处理及数据计算。 This central processor is disposed on a motherboard 50, while the user is executing the application program or options, i.e., the signal is processed by the central processor and the data calculated.

此水冷模块40中包含有一泵(图中未示)、一用以储存液体的集水槽(图中未示)与软式水管41。 This water-cooling module 40 includes a pump (not shown), a sump for storing a liquid (not shown) with soft hose 41. 软式水管41中充满液体,并会连接至中央处理器上的致冷片10,通过泵的驱动使液体于软式水管41中循环,以带走中央处理器所产生的热能。 Soft hose filled with the liquid 41, and will be connected to the central processor refrigeration sheet 10, the liquid driving the pump by cycle in soft water pipe 41, to carry away the heat generated by the central processor.

另一硬式水管42连接水冷模块40与电源供应器20后端的散热器30,以通过电源供应器20的风扇所吹出的气流冷却此散热器30及设置于散热器30内的水管41,而达到散热的效果。 Another hard water cooling pipe 42 is connected to the rear end of the module 40 and the power supply 20 heat sink 30, the airflow blown out by the fan power supply 20 and cooling the heat sink 30 is provided in the radiator 30 to the water pipe 41 to achieve cooling effect.

此水冷式散热系统中仅使用单一风扇(即电源供应器20的风扇)运转时所产生的气流吹拂散热器30及设置于散热器30内的硬式水管42,以带走硬式水管42中液体的热能。 This water-cooled cooling systems using a single fan only (i.e., the fan power supply 20) is generated by air flow during operation and the heat sink 30 is provided in the blowing hard water pipe 30 of the radiator 42, to carry away the liquid 42 in the hard water heat. 因此,在设计时,往往需通过增加整个散热器30的厚度w,以达到所需的散热效果。 Thus, in the design, often need w by increasing the thickness of the entire heat sink 30, to achieve the desired cooling effect.

然而,当散热器30的厚度w增加时,伴随而来的便是整个计算机主机体积的增加,即增加整个计算机主机所需占据的空间,对于目前计算机主机朝向轻薄短小的趋势发展而言,散热器30厚度w的增加将是一大缺点。 However, when the thickness w of the heat sink 30, is accompanied by increasing the overall volume of the host computer, i.e., to increase the space occupied by the whole required host computer, the host computer for the current trend toward the development of compact size, the heat increasing the thickness w 30 will be a major drawback. 此外,散热器30下方的空间亦无法摆设其它组件,将会导致其下方空间的浪费。 In addition, the space below the radiator 30 will not be able furnishings other components, it will lead to waste of space underneath.

除了上述缺点外,传统散热系统其组成组件众多导致成本偏高;另以装配层面方向来考量,由于电源供应器20会造成装配时的干扰,因此,需先拆除计算机主机中的电源供应器20及其它会造成干扰的组件,再将已模块化的致冷片10、散热器30、水冷模块40、软式水管41及硬式水管42一并装入计算机主机中,最后,再将先前所拆除的组件装回计算机主机内,才完成整个安装的过程。 In addition to these drawbacks, conventional cooling system consisting of many components leads to high cost; the other direction to fit dimension to consider, since the power supply 20 can cause interference during assembly, therefore, need to remove the power supply to the host computer 20 and other components may cause interference, then the sheet 10 has a modular refrigeration, heat sink 30, water modules 40, soft pipe 41 and the rigid pipe 42 together with the host computer was charged last, and then removal of previously the assembly back inside the host computer, to complete the entire installation process. 而此装配过程显得异常繁琐,徒增组装配置上的困难。 And this assembly process was extremely tedious, inviting difficulty in an assembled configuration. 再者,如果日后进行计算机主机内部组件升级替换或维修作业时,也将产生不必要的困扰。 Furthermore, if the host computer for future upgrade internal components to replace or repair work, it will produce unnecessary distress.

发明内容 SUMMARY

鉴于以上传统技术的问题,本实用新型的主要目的在于提供一种散热装置,具有装配简易并具有良好散热性能等优势,本实用新型的散热装置应用于一计算机主机,此计算机主机后侧设置有一散热器,通过计算机主机内的一电源供应器所包含的一电源供应器风扇,并搭配其下方设置的一系统风扇所排出的风量同时吹拂此散热器,以达到较佳的散热效果。 In view of the above problems of the conventional art, the main object of the present invention is to provide a heat dissipating device having easy assembly and good thermal performance and other advantages, the present invention is applied to a computer host heat dissipation device, this rear side is provided with a host computer radiator, by a power supply within the host computer contains a power supply fan, and air volume discharged with a system fan disposed below the heat sink while blowing this, in order to achieve a better heat dissipation effect.

此散热装置是应用于一计算机主机,而此计算机主机包含有一散热器、一电源供应器、一水冷模块及一系统风扇。 This heat sink is applied to a host computer, and this computer main body includes a heat sink, a power supply, a module, and a water cooling system fan. 此散热器贴附于计算机主机的后侧,而此电源供应器是设置于计算机主机的内部,以提供其内部的组件运行时所需的电能。 This heat sink is attached to the rear side of the host computer, and this power supply is disposed inside the host computer, to provide the required run-time component of its internal energy.

此电源供应器内具有一电源供应器风扇,此电源供应器风扇是设置于计算机主机的后侧并对应于散热器的上半部,通过此电源供应器风扇的运转以排出电源供应器产生的热能。 Within this power supply having a power supply fan, the fan power supply is disposed on the rear side of the upper half of the host computer and corresponds to the heat sink, through this operation of the power supply of the fan to discharge the generated power supply heat.

一水冷模块对应于主机板上的中央处理器而设置,此水冷模块包含有一水管,此水管由水冷模块延伸至散热器中,并构成一循环的回路,以通过水管中循环的液体以带走中央处理器运行时产生的热能。 A water-cooled central processing module corresponding to the set on the motherboard, this module includes a water cooling pipe, this pipe extending from the water-cooled heat sink to the module, and constitute a circulation loop for circulating water through the liquid to take heat generated by the central processor is running.

此系统风扇是设置于电源供应器的电源供应器风扇的下方,且对应于散热器的下半部,如此一来,由电源供应器风扇及系统风扇运转时排出的风量可一并吹拂至散热器及水管,以增加散热的效果。 This system fan is disposed below the power supply of the power supply fans, and corresponds to the lower half of the radiator, this way, the air volume discharged during operation by the power supply fans and fan systems may be blown to the heat sink together and plumbing devices, to increase the cooling effect.

该电子组件为一中央处理器。 The electronic component is a central processing unit.

该水冷模块还包含有一致冷板贴附于该电子组件。 The module also includes a water-cooled cold plate is attached to the same electronic component.

该水冷模块还包含有一泵及一集水槽,该泵驱动该水管中的液体于该水管内循环。 The water-cooling module further comprises a pump and a sump, the water pump driving the fluid circulating inside the pipe.

该散热器包含有数个平行且间隔设置的散热鳍片,而该水管弯曲地设置于各该散热鳍片间。 The radiator comprises several parallel and spaced cooling fins, and the bent pipe is disposed between each of the fin.

该计算机主机对应于该系统风扇处还设置有一开孔。 This corresponds to the host computer system is also provided with a fan at the opening.

还包含有一电磁遮蔽件对应于该开孔处,且设置于该散热器与该系统风扇之间,该电磁遮蔽件包含有数个通风孔,使该系统风扇运转时产生的风量由各该通风孔排出。 Air flow further comprises an electromagnetic shielding member corresponding to the opening at the radiator and disposed between the fan system, the electromagnetic shielding member comprises several vents, so that the system is generated by the fan during operation of the vent holes each discharge.

还包含有一屏蔽,该屏蔽为一设置于该散热器外的盒体,且具有一个以上的排风孔,以防止外界灰尘进入于该计算机主机,且保持气流的畅通。 Further comprising a mask that is a member disposed on the outer box of the heat sink, and having one or more outlet holes, to prevent external dust from entering to the host computer, and maintaining smooth airflow.

该屏蔽还包含有一个以上平行设置的叶片,且各该叶片与该盒体呈一角度,以形成各该排风孔。 The shield further comprises more than one blade arranged in parallel, each of the blade and substantially at an angle to the cartridge, to form each of the outlet holes.

由于此散热装置同时利用两个风扇(电源供应器所包含的电源供应器风扇及系统风扇)对散热器进行散热,因此,整个散热器的长度增加、厚度变薄,可有效利用到原本散热器下方闲置的空间,而不致造成空间的浪费,且由于散热器的厚度变薄,可缩小整个计算机主机的体积,以使产品符合轻薄短小的需求。 Because of this heat dissipation device while using two fans (fans and power supply system fan power supply included) for radiator cooling, and therefore, the overall length of the radiator is increased, reducing the thickness, the heat sink can be effectively utilized to original unused space below, without causing waste of space, and the thinner the thickness of the heat sink, can reduce the entire volume of the host computer, so that the products meet the demands slim and light.

附图说明 BRIEF DESCRIPTION

图1为传统计算机主机中水冷式散热系统的系统架构图;图2A及图2B分别为本实用新型的散热装置的立体分解图及组合图;图3为水冷模块的示意图;图4为散热器的示意图;图5为系统风扇、散热器与电磁遮蔽件相对位置的示意图;图6为电磁遮蔽件的示意图;及图7为屏蔽的示意图。 Figure 1 is a conventional host computer system architecture diagram of a water-cooled cooling system; FIGS. 2A and 2B are respectively a perspective exploded view of the novel heat sink, and combinations of the present utility FIG.; FIG. 3 is a schematic view of a water-cooled module; FIG. 4 is a radiator schematic; FIG. 5 is a system fan, the radiator and the electromagnetic shield member is a schematic view of the relative position; FIG. 6 is a schematic view of an electromagnetic shielding member; and FIG. 7 is a schematic view of the shield.

其中,附图标记说明:10--致冷板 20--电源供应器 30--散热器40--水冷模块 41--软式水管 42--硬式水管50--主机板 60--计算机主机 61--主机板611--中央处理器 62--电源供应器621--电源供应器风扇 63--水冷模块631--水管 631a--右方水管 631b--左方水管632--致冷板 64--系统风扇 65--散热器 Wherein, reference numerals DESCRIPTION: 10-- refrigeration power supply board 20-- 30-- 40-- cooled radiator module 41-- Soft Water Hard Water 50-- 42-- 60-- host computer motherboard 61-- 62-- central processor motherboard 611-- 621-- power supply fan power supply module 63-- 631-- water cooled pipes 631b-- leftward rightward 631a-- refrigerant pipe 632-- 64-- 65-- radiator fan system board

651--散热鳍片 66--开孔 67--电磁遮蔽件671--通风孔 69--屏蔽 691--叶片L--长度 w--厚度 w'--厚度具体实施方式为使对本实用新型的目的、构造特征及其功能有进一步的了解,配合附图详细说明如下。 651-- electromagnetic radiation fins 66-- 67-- opening vents shielding member 69-- 671-- 691-- shield blades L-- length w-- thickness w '- DETAILED DESCRIPTION To make the thickness of the present invention new objects, structural features and functions of further understanding the following detailed description with accompanying drawings.

请参考图2A及图2B所示,分别为本实用新型的散热装置的立体分解图及组合图;并请参考图3及图4所示,分别为水冷模块63及散热器65的示意图。 Please refer to FIGS. 2A and 2B, respectively, a perspective exploded view and assembled view of the new heat dissipation device of the present utility; and Please refer to FIG. 3 and FIG. 4, a schematic view of a water-cooled heat sink 65 and module 63 respectively.

此散热装置是应用于一计算机主机60内,以通过一水冷模块63、一电源供应器62内的电源供应器风扇621、一系统风扇64与一散热器65的装配,而对主机板61上的电子组件进行散热,以防止电子组件因过热而造成的损坏。 This is applied to the heat dissipating means is a host computer 60, through a water cooling module 63, the power supply 621 in a fan power supply 62, a system fan assembly 64 and a heat sink 65, and the motherboard 61 of the electronic components for heat dissipation to prevent damage to the electronic components due to overheating.

在此实施例中,此电子组件即为主机板61上的主要发热组件—中央处理器611,此水冷模块63贴附于中央处理器611上,而水冷模块63的水管631由中央处理器611的位置延伸至散热器65,并构成一循环的回路,以通过水冷模块63中液体的循环,而带走中央处理器611运行时所产生的热能。 In this embodiment, the electronic component is the main heat-generating components on the motherboard 61 - central processor 611, this water cooling module 63 is attached to the central processor 611, and the water cooling pipe module 63163 by the central processor 611 position extends to the heat sink 65, and constitute a circulation loop for circulating water through the fluid module 63, the central processor 611 to carry away the heat generated during operation. 而本实用新型不限于使用在中央处理器611的散热,亦可用于计算机主机60内其它发热组件的散热。 The present invention is not limited to use in the heat of a central processing unit 611, heat dissipation of other components within the host computer 60 can also be used.

本实用新型的特点在于:此散热装置利用计算机主机60内原本即有的电源供应器62的电源供应器风扇621,搭配装设于其下方的系统风扇64,通过二者运行时所排出的风量同时吹拂计算机主机60后端的散热器65,进而达到散热的效果。 The present invention is characterized in that: the host computer using this heat sink 60 had the power supply i.e. some of the fan power supply of 62,162, with the fan system mounted thereon below 64, the air volume discharged by both runtime while the rear end of the host computer 60 blows the radiator 65, thus achieving the cooling effect.

由于是利用电源供应器风扇621及系统风扇64所排出的风量对散热器65进行散热,因此,整个散热器65的长度L增加、厚度w'变薄,以减少整个计算机主机60所占的体积,避免不必要的空间浪费。 Since the power supply using the discharged air volume fan system 621 and fan 64 for cooling a radiator 65, and therefore, the overall length L of the heat sink 65 increases, the thickness w 'is thinned to reduce the overall volume occupied by the host computer 60 , to avoid unnecessary waste of space.

以下将详述各组件的详细结构及其相对的关系。 The following relationship will be described in detail the structure of the components and their relative.

此计算机主机60内的主机板61上设置有许多电子组件或是芯片组等,通过这些电子组件的运行以达成计算机预设的功能。 Main board of the host computer 61 in this electronic component 60, or many other chipset, these electronic components by running the computer to achieve predetermined functions. 而主机板61上最重要且主要发热的组件即为中央处理器611,此中央处理器611依据所接收的指令,进行讯号处理及数据计算,以产生相对应的讯号输出。 The most important and the main board 61 is the main heat-generating components of the central processor 611, it received this instruction central processing unit 611 based on, for signal processing and calculation of data, to generate a corresponding output signal.

此电源供应器62用以提供整个计算机主机60运行时所需的电能,而其位置设置于计算机主机60后侧上方的角落,并与其它的电子组件构成电性连接,以将电能传输至其它组件。 This power supply 62 to provide the required host computer 60 running the entire electric power, and their position on the corners of the host computer 60 is provided above the rear side, and configured to electrically connect the other electronic components, power transmission to the other to components. 由于此电源供应器62运行时也会产生热能,因此,在电源供应器62内设置有一电源供应器风扇621,以通过电源供应器风扇621的运转而将电源供应器62产生的热能排出。 Since this operation will produce heat when the power supply 62, therefore, provided in the power supply 62 has a power supply fan 621 to the thermal energy generated by the power supply 62 is discharged by operation of the power supply fan 621.

此水冷模块63对应于主机板61上中央处理器611的位置而设置,以通过液体传导中央处理器611运行时所产生的热能,进而帮助其散热。 This water cooling module 63 on the motherboard 61 to the position corresponding to the central processor 611 and provided to the liquid by thermal energy generated by the central processor 611 conduction runtime, thus helping their heat dissipation.

如图3所示,此水冷模块63包含有:水管631、致冷板632、泵(图中未示)及集水槽(图中未示)。 3, the module 63 includes a water cooling: pipe 631, a refrigeration plate 632, a pump (not shown) and a sump (not shown).

此水管631中充满液体(通常为蒸馏水),且由中央处理器611的位置延伸至散热器65,并构成一循环的回路,而水管631内液体循环的方向如图2所示:图面中右方水管631a内的液体因带走中央处理器611产生的热能,而具有较高的温度,当水管631经过散热器65、电源供应器风扇621及系统风扇64的散热后,水管631内液体的温度会降低,此时,图面中左方水管631b内的液体具有较低的温度,以再度进入水冷模块63,而与中央处理器611进行热传导。 The pipe 631 is filled with a liquid (usually distilled water), and extends to the radiator 65 by the position of the central processor 611, and form a circulation circuit, while the direction of liquid circulation pipe 631 shown in Figure 2: Figure surface the liquid in the tube 631a by the right away heat generated by the central processor 611, and have a higher temperature, when the pipe 631 through the radiator 65, the fan 621 and the power supply cooling system fan 64, the inner pipe 631 liquid temperature decreases, when the water is left in the inner surface of the tube in FIG 631b having a lower temperature, cooled to re-enter the module 63, the thermal conduction with the central processor 611. 本较佳实施例中的水管631是采用质地坚硬不易弯曲的硬管,当然亦可使用较为柔软具有挠曲特性的软管,本实用新型并未局限其可能实施的状态。 631 cases of water present in the preferred embodiment is the use of stiff texture of hard rigid tube, of course, also be used having a relatively soft hose deflection characteristic, the present invention is not limited to the state of its possible embodiments.

如图3所示,此致冷板632设置于水冷模块63的一侧并贴附于中央处理器611,通过泵驱动水管631中的液体于水管631内循环经致冷版632内流道,以传导中央处理器611运行时所产生的热能。 3, the cold plate 632 disposed on a side Thanks cooled modules 63 and attached to a central processing unit 611, drives the liquid pipe 631 in the water pipe 631 through the refrigerant circulation flow path plate 632 by a pump, to heat conductive central processing unit 611 runs produced.

此散热器65贴附于计算机主机60的后侧,如图4所示,其包含有数个平行且间隔设置的散热鳍片651,而水冷模块63所延伸的水管631弯曲地设置于各散热鳍片651间,且各个散热鳍片651的排列方向与水管631的方向相垂直。 This heat sink 65 is attached to the rear side of the host computer 60, as shown in FIG 4 comprising several cooling fins 651 arranged in parallel and spaced, and water-cooled pipes 631 extending module 63 provided to the respective curved heat radiating fins between 651 and pipe 631 arrangement direction of the direction of the respective heat-dissipating fins 651 perpendicular.

此电源供应器62内的电源供应器风扇621对应于散热器65的上半部,以通过电源供应器风扇621运转时产生的风量对散热器65的上半部及水管631进行散热;而电源供应器风扇621的下方设置有一系统风扇64,此系统风扇64用以对计算机主机60内其它电子组件进行散热,且其位置对应于散热器65的下半部。 Power supply fan 621 in this power supply 62 corresponds to the upper half of the heat sink 65, to generate the air volume during operation of the power supply fan 621 and the upper half of the pipe 631 is dissipated through the heat sink 65; and the power below the supply fan system 621 is provided with a fan 64, a fan 64 for the system to other electronic components within the host computer 60 for cooling, and the position corresponding to the lower half 65 of the heat sink. 如此一来,电源供应器风扇621及系统风扇64运转时排出的风量可一并吹拂至散热器65,以增加散热的效率。 Thus, the amount of air discharged when the power supply fan 621 and the fan system 64 may be operated in conjunction blown to the radiator 65, to increase the efficiency of heat dissipation.

此计算机主机60对应于系统风扇64处设置有一开孔66,使系统风扇64运转时产生的风量由此开孔66排出而吹拂至散热器65。 This host computer 60 corresponds to a fan system 64 is provided with a hole 66, so that air flow generated when the fan 64 is operated to open the system 66 is discharged to the heat sink 65 and blows.

请参考图5所示,在系统风扇64与散热器65间设置有一电磁遮蔽件67,以防止外界电磁幅射的干扰。 Please refer to FIG. 5, in the system the fan 64 and the radiator 65 is provided with an electromagnetic shield 67 to prevent interference of external electromagnetic radiation. 请参考图6所示,此电磁遮蔽件67上设置有数个通风孔671,使系统风扇64运转时产生的风量由各通风孔671排出,而吹拂至散热器65的上。 Please refer to FIG. 6, the electromagnetic shield member 671 is provided with several ventilation holes 67, so that air flow generated when the fan 64 is operated by the system vent 671 is discharged, and blown to the radiator 65.

此散热器65与系统风扇64分别结合于电磁遮蔽件67的两侧,以通过此电磁遮蔽件67使系统风扇64与散热器65固设于计算机主机60上。 This system radiator 65 and the fan 64 respectively coupled to both sides of the electromagnetic shield 67, through the electromagnetic shielding member 67 of the system 64 and the radiator fan 65 is fixed on the host computer 60.

此散热器65的外围设置有一屏蔽69,请参考图7所示,为屏蔽69的示意图。 This peripheral heat sink 65 is provided with a shielding 69, refer to FIG. 7, a schematic diagram 69 of the shield. 此屏蔽69为一设置于散热器65外围的盒体,其包含有数个平行设置的叶片691,且各叶片691与此盒体呈一角度以形成数个排风孔,而使电源供应器风扇621及系统风扇64运行时产生的气流可通过此排风孔而排出,并保持计算机主机60后端的美观。 This shield 69 is disposed on a periphery of the cartridge body 65 of heat sink 691 comprising several blades arranged in parallel, and each blade 691 with this angle to form a generally box plurality of outlet holes, the fan power supply 621 and the gas flow generating system 64 runs the fan may be discharged through this ventilation hole 60 and holding the rear end of the host computer aesthetics.

当然,此屏蔽69并不仅限于设置在散热器65之外,而亦可设置于其它凸出计算机主机60后端的组件的外围,而同样可以达到通风且美观的目的。 Of course, this is not limited to the shield 69 disposed outside the radiator 65, and may also be provided to other components of the host computer 60 protruding rear end of the peripheral, and can also achieve ventilation and aesthetic purposes.

此外欲进行组装时,直接将已模块化的水冷模块63、水管631、系统风扇64及散热器65由开孔66处穿入而装设于计算机主机60内,并将屏蔽69锁固于计算机主机60后端即可。 Further when to be assembled directly modularized water cooling module 63, plumbing 631, system fan 64 and the radiator 65 from the penetration hole 66 and is mounted on the host computer 60, and the shield 69 locked in the computer 60 to the back-end host. 因此,无须更动变换内部组件的配置位置,甚至拆卸计算机主机60内部原本的电源供应器20与主机板等组件,相比之下本实用新型明显具有装配简易的优势。 Thus, no conversion modifier arranged positions the internal components, and even access to the inside of the original host computer 60 power supply 20 and the motherboard and other components, in contrast to the present invention clearly has the advantage of ease of assembly.

以上所述仅为本实用新型其中的较佳实施例而已,并非用来限定本实用新型的实施范围;即凡依本实用新型所作的等效变化与修改,皆为本实用新型专利范围所涵盖。 The above embodiment of the present invention wherein only the preferred embodiments only, not intended to limit the scope of the present invention; i.e., all modifications and variations equivalent under this invention made by the present invention are all covered by the scope of patent .

Claims (9)

1.一种散热装置,安装于一计算机主机,该计算机主机包含有执行计算机预设功能的一电子组件,其中该计算机主机内具有一用以提供电能的电源供应器,而该电源供应器内具有一电源供应器风扇,设置于该计算机主机的后侧,一水冷模块对应于该电子组件设置,该水冷模块包含有一水管,一散热器贴附于该计算机主机的后侧,该电源供应器风扇对应于该散热器的上半部,且该水管弯曲地设置于该散热器中,其特征在于:该计算机主机内具有一并列于该电源供应器风扇的系统风扇,而该系统风扇对应于该散热器的下半部,由该电源供应器风扇及该系统风扇排出的风一并吹至该散热器及该水管。 1. A heat dissipation device attached to a host computer, the host computer includes a computer perform a preset function of electronic components, and having a power supply for providing power to the host computer, and the internal power supply a power supply having a fan disposed at a rear side of the host computer, a water-cooling module disposed corresponding to the electronic components, the module includes a water-cooled pipe, a heat sink attached to the rear side of the host computer, the power supply the upper half of the fan corresponding to the heat sink, and the bent pipe provided in the heat sink, wherein: the computer system having a fan parallel to the power supply of the fan within the host, which corresponds to the system fan lower half of the radiator, discharged by the fans and the power supply system together with the fan air is blown to the radiator and the water tube.
2.如权利要求1所述的散热装置,其特征在于,该电子组件为一中央处理器。 2. The heat dissipation device as claimed in claim 1, wherein the electronic component is a central processing unit.
3.如权利要求1所述的散热装置,其特征在于,该水冷模块还包含有一致冷板贴附于该电子组件。 3. The heat dissipation device as claimed in claim 1, wherein the module further comprises a water-cooled cold plate is attached to the same electronic component.
4.如权利要求1所述的散热装置,其特征在于,该水冷模块还包含有一泵及一集水槽,该泵驱动该水管中的液体在该水管内循环。 The heat dissipation device as claimed in claim 1, wherein the water-cooling module further comprises a pump and a sump, the water pump driving the fluid circulating in the pipe.
5.如权利要求1所述的散热装置,其特征在于,该散热器包含有数个平行且间隔设置的散热鳍片,而该水管弯曲地设置于各该散热鳍片间。 The heat dissipation apparatus according to claim 1, wherein the heat sink comprises several parallel and spaced cooling fins, and the bent pipe is disposed between each of the fin.
6.如权利要求1所述的散热装置,其特征在于,该计算机主机对应于该系统风扇处还设置有一开孔。 6. The heat dissipation device as claimed in claim 1, wherein the host computer system corresponding to the fan arranged at a further opening.
7.如权利要求6所述的散热装置,其特征在于,还包含有一电磁遮蔽件对应于该开孔处,且设置于该散热器与该系统风扇之间,该电磁遮蔽件包含有数个通风孔。 7. The heat dissipation device as claimed in claim 6, wherein, further comprising an electromagnetic shielding member corresponding to the opening at the radiator and disposed between the fan system, the electromagnetic shielding member comprises several ventilation hole.
8.如权利要求1所述的散热装置,其特征在于,还包含有一屏蔽,该屏蔽为一设置于该散热器外的盒体,且具有一个以上的排风孔。 8. The heat dissipation device as claimed in claim 1, characterized by further comprising a mask that is a member disposed on the outer box of the heat sink, and having one or more outlet holes.
9.如权利要求8所述的屏蔽,其特征在于,该屏蔽还包含有一个以上平行设置的叶片,且各该叶片与该盒体呈一角度。 9. A shield according to claim 8, wherein the shield further comprises more than one blade arranged in parallel, each of the blade and substantially at an angle to the cartridge.
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