CN2713643Y - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
CN2713643Y
CN2713643Y CN 200420084739 CN200420084739U CN2713643Y CN 2713643 Y CN2713643 Y CN 2713643Y CN 200420084739 CN200420084739 CN 200420084739 CN 200420084739 U CN200420084739 U CN 200420084739U CN 2713643 Y CN2713643 Y CN 2713643Y
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CN
China
Prior art keywords
radiator
main frame
power supply
supply unit
fan
Prior art date
Application number
CN 200420084739
Other languages
Chinese (zh)
Inventor
黄庭强
陈涵敦
Original Assignee
大众电脑股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大众电脑股份有限公司 filed Critical 大众电脑股份有限公司
Priority to CN 200420084739 priority Critical patent/CN2713643Y/en
Application granted granted Critical
Publication of CN2713643Y publication Critical patent/CN2713643Y/en

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Abstract

The utility model relates to a heat sink which is applied to a computer mainframe. The rear side of the computer mainframe is provided with a radiator. The heat radiating effect is increased through a power supplier fan contained by a power supplier of the computer mainframe matching with the air amount discharged by a system fan arranged under the heat radiator to simultaneously blow the radiator.

Description

Heat abstractor

Technical field

The utility model is a kind of heat abstractor, is applied to a main frame, and the electronic building brick in this main frame is dispelled the heat, and this electronic building brick can be central processing unit.

Background technology

Computer is made up of many electronic building bricks, it includes assemblies such as motherboard, power supply unit, Winchester disk drive, floppy drive and CD-ROM drive, to carry out the default function of some computers by these electronic building bricks, for example: the broadcast of the editor of file, the computing of program, film etc.

Electronic building brick in these computers can produce heat energy unavoidablely in running, and these heat energy must be distributed to surrounding environment with heat energy by other approach such as heat conduction, thermal convection or thermal radiation, are unlikely to make the electronic building brick temperature too high and influence the stability and the reliability of product.And in computer system, wherein important with the heat dissipation problem of the assembly-central processing unit (CPU) of main execution computing again, so the heat dissipation problem of the central processing unit problem of making great efforts to overcome for computer vendors institute desire.

Along with the processor development of technology, central processing unit (Central Processing Unit, CPU) operating frequency has been increased to more than the 3--4GHz, and its heating power more reaches more than the 115W, if the heat energy that central processing unit produced can not fully be got rid of, certainly will influence the function of computer, shorten its useful life, therefore, heat dissipation problem is on the rise along with the raising of Computing frequency.

Tradition is with solving the technological means that central processing unit dispels the heat, mainly be to utilize radiator and radiator fan to arrange in pairs or groups, radiator is wherein made by metal material, radiator includes a base, the radiating fin that has a plurality of tile verticallies on the base, base directly is arranged on the central processing unit and is in contact with it, when heat energy that the central processing unit execution work is produced can be passed to via base on the heat radiation eel sheet, radiator fan is arranged on the radiating fin, the air-flow that utilizes radiator fan to produce is blown in the radiating fin, utilize the air-flow that radiator fan produces and the radiating fin of high temperature to carry out heat exchange, and the heat on the radiator is taken away, and then the temperature of reduction central processing unit reaches the purpose of heat radiation.

Raising along with the central processing unit operating frequency, the clock of radiator fan also and then increases, and also release 4500 commentaries on classics, 5400 commentaries on classics, 7200 commentaries on classics even the above fan of 10000 commentaries on classics on the market successively, with the temperature in the reduction main frame, and then the useful life of prolongation electronic building brick.

Though these high-revolving fans have been suppressed the heat of central processing unit, compacting is its noise that makes us bothering incessantly, so when central processing unit moved at high frequency, except heat dissipation problem originally, noise problem also becomes needed the problem that overcomes badly.

Because the radiating effect of liquid is than the excellent in heat dissipation effect of gas, therefore, the various water-cooled cooling systems of the numerous and confused release of manufacturers at present, with radiator and the radiator fan of water-cooled cooling system in conjunction with script, heat energy is taken away in circulation by liquid (normally utilizing distilled water), to improve its radiating effect.

Please refer to shown in Figure 1, be the system architecture diagram of water-cooled cooling system in the traditional calculations machine host, consist predominantly of a central processing unit (not shown) in this main frame, be arranged at a refrigerating sheet (cold plate) 10, one power supply unit 20, a radiator 30 and a water-cooled module 40 on the central processing unit.

This central processing unit is to be arranged on the motherboard 50, as user during at executive utility or function choosing-item, promptly is to carry out signal by central processing unit to handle and data computation.

Include a pump (not shown), a water leg (not shown) and a soft water pipe 41 in order to storaging liquid in this water-cooled module 40.Full of liquid in the soft water pipe 41, and can be connected to refrigerating sheet 10 on the central processing unit, the driving by pump circulates liquid in soft water pipe 41, to take away the heat energy that central processing unit is produced.

Another rigid water pipe 42 connects the radiator 30 of water-cooled modules 40 and power supply unit 20 rear ends, cools off this radiator 30 and is arranged at water pipe 41 in the radiator 30 with the air-flow that fan was blown out by power supply unit 20, and reach the effect of heat radiation.

The air-flow that only uses single fan (being the fan of power supply unit 20) running the time to be produced in this water-cooled cooling system brushes radiator 30 and is arranged at rigid water pipe 42 in the radiator 30, to take away the heat energy of liquid in the rigid water pipe 42.Therefore, when design, often need be by increasing the thickness w of entire radiator 30, to reach required radiating effect.

Yet, when the thickness w of radiator 30 increases, incident is the increase of whole main frame volume, promptly increase the required space that occupies of whole main frame, for the compact trend development, the increase of radiator 30 thickness w will be a big shortcoming for present main frame.In addition, other assembly also can't be furnished in the space of radiator 30 belows, will cause its waste of side space down.

Except above-mentioned shortcoming, the traditional heat-dissipating system numerous costs that cause of its composition assembly are higher; Consider with the assembling bedding angle in addition, because the interference when power supply unit 20 can cause assembling, therefore, power supply unit 20 in the need elder generation dismounting main frame and other can cause the assembly of interference, again modular refrigerating sheet 10, radiator 30, water-cooled module 40, soft water pipe 41 and rigid water pipe 42 are packed in the lump in the main frame, at last, the more previous assembly of removing is reinstalled in the main frame, just finish the process of whole erection.And this assembling process seems loaded down with trivial details unusually, increases the difficulty on the assembled configuration on foot.Moreover, if carry out in the future that main frame intraware upgrading is replaced or during maintenance activity, also will produce unnecessary puzzlement.

Summary of the invention

Problem in view of above conventional art, main purpose of the present utility model is to provide a kind of heat abstractor, it is simple and easy and have an advantage such as excellent heat dispersion performance to have assembling, heat abstractor of the present utility model is applied to a main frame, this main frame rear side is provided with a radiator, a power supply unit fan that is comprised by the power supply unit in the main frame, and the air quantity that the system fan that is provided with of its below of arranging in pairs or groups is discharged brushes this radiator simultaneously, to reach preferable radiating effect.

This heat abstractor is to be applied to a main frame, and this main frame includes a radiator, a power supply unit, a water-cooled module and a system fan.This radiator is attached at the rear side of main frame, and this power supply unit is the inside that is arranged at main frame, required electric energy so that its inner assembly operating to be provided.

Have a power supply unit fan in this power supply unit, this power supply unit fan is to be arranged at the rear side of main frame and corresponding to the first half of radiator, and the running by this power supply unit fan is to discharge the heat energy that power supply unit produces.

One water-cooled module is provided with corresponding to the central processing unit on the motherboard, this water-cooled module includes a water pipe, this water pipe is extended in the radiator by the water-cooled module, and constitutes the loop of a circulation, with the heat energy that produces when taking away the central processing unit operation by the liquid that circulates in the water pipe.

This system fan is the below that is arranged at the power supply unit fan of power supply unit, and Lower Half corresponding to radiator, thus, the air quantity of discharging during by power supply unit fan and system fan running can brush in the lump to radiator and water pipe, to increase the effect of heat radiation.

This electronic building brick is a central processing unit.

This water-cooled module also includes a cold plate and is attached at this electronic building brick.

This water-cooled module also includes a pump and a water leg, and the liquid that this pump drives in this water pipe circulates in this water pipe.

This radiator includes several radiating fins parallel and that be provided with at interval, and this water pipe is arranged at respectively between this radiating fin agley.

This main frame also is provided with a perforate corresponding to this system fan place.

Also include an ELECTROMAGNETIC OBSCURANT spare corresponding to this tapping, and be arranged between this radiator and this system fan, this ELECTROMAGNETIC OBSCURANT spare includes several ventilation holes, and the air quantity that produces when making this system fan running is by respectively this ventilation hole discharge.

Also include a shielding, this shielding is one to be arranged at the outer box body of this radiator, and has more than one vent, enters in this main frame to prevent extraneous dust, and keeps the unimpeded of air-flow.

This shielding also includes the blade that be arranged in parallel more than, and respectively this blade and this box body are an angle, to form respectively this vent.

Because this heat abstractor utilizes two fans (power supply unit fan and system fan that power supply unit comprised) that radiator is dispelled the heat simultaneously, therefore, the length of entire radiator increases, the thickness attenuation, can effectively use idle space, radiator below originally, and the unlikely waste that causes the space, and, can dwindle the volume of whole main frame, so that product meets compact demand owing to the thickness attenuation of radiator.

Description of drawings

Fig. 1 is the system architecture diagram of water-cooled cooling system in the traditional calculations machine host;

Fig. 2 A and Fig. 2 B are respectively the three-dimensional exploded view and the constitutional diagram of heat abstractor of the present utility model;

Fig. 3 is the schematic diagram of water-cooled module;

Fig. 4 is the schematic diagram of radiator;

Fig. 5 is the schematic diagram of system fan, radiator and ELECTROMAGNETIC OBSCURANT spare relative position;

Fig. 6 is the schematic diagram of ELECTROMAGNETIC OBSCURANT spare; And

Fig. 7 is the schematic diagram of shielding.

Wherein, description of reference numerals:

10--cold plate 20--power supply unit 30--radiator

The rigid water pipe of the soft water pipe 42--of 40--water-cooled module 41--

50--motherboard 60--main frame 61--motherboard

611--central processing unit 62--power supply unit

621--power supply unit fan 63--water-cooled module

The right-hand water pipe 631b--of 631--water pipe 631a--left water pipe

632--cold plate 64--system fan 65--radiator

651--radiating fin 66--perforate 67--ELECTROMAGNETIC OBSCURANT spare

671--ventilation hole 69--shielding 691--blade

L--length w--thickness w '--thickness

Embodiment

For making the purpose of this utility model, structural feature and function thereof are had further understanding, conjunction with figs. is described in detail as follows.

Please refer to shown in Fig. 2 A and Fig. 2 B, be respectively the three-dimensional exploded view and the constitutional diagram of heat abstractor of the present utility model; And please refer to Fig. 3 and shown in Figure 4, be respectively the schematic diagram of water-cooled module 63 and radiator 65.

This heat abstractor is to be applied in the main frame 60, with assembling by power supply unit fan 621, a system fan 64 and a radiator 65 in a water-cooled module 63, the power supply unit 62, and the electronic building brick on the motherboard 61 is dispelled the heat, to prevent that electronic building brick is because of the overheated damage that causes.

In this embodiment, this electronic building brick is the main heat generating component-central processing unit 611 on the motherboard 61, this water-cooled module 63 is attached on the central processing unit 611, and the water pipe 631 of water-cooled module 63 extends to radiator 65 by the position of central processing unit 611, and constitute one the circulation the loop, with circulation, and take away the heat energy that is produced when central processing unit 611 moves by liquid in the water-cooled module 63.And the utility model is not limited to use the heat radiation at central processing unit 611, also can be used for the heat radiation of other heat generating component in the main frame 60.

Characteristics of the present utility model are: this heat abstractor utilizes the power supply unit fan 621 of the power supply unit 62 that originally promptly has in the main frame 60, collocation is installed in the system fan 64 of its below, the air quantity of being discharged when moving by the two brushes the radiator 65 of main frame 60 rear ends simultaneously, and then reaches the effect of heat radiation.

Owing to be that the air quantity that utilizes power supply unit fan 621 and system fan 64 to be discharged dispels the heat to radiator 65, therefore, the length L of entire radiator 65 increases, thickness w ' attenuation, to reduce the shared volume of whole main frame 60, avoids unnecessary space waste.

The detailed structure of each assembly and relative relation thereof below will be described in detail in detail.

Motherboards 61 in this main frame 60 are provided with many electronic building bricks or chipset etc., and the operation by these electronic building bricks is to reach the default function of computer.And most important and assembly main heating is central processing unit 611 on the motherboard 61, and this central processing unit 611 carries out signal and handles and data computation according to the instruction that is received, to produce corresponding signal output.

This power supply unit 62 required electric energy when 60 operations of whole main frame to be provided, and its position is arranged at the corner of main frame 60 back side top, and constitute with other electronic building brick and to electrically connect, with electric energy transmitting to other assembly.Owing to also can produce heat energy during these power supply unit 62 operations, therefore, in power supply unit 62, be provided with a power supply unit fan 621, discharge with the heat energy that power supply unit 62 is produced by the running of power supply unit fan 621.

This water-cooled module 63 is provided with corresponding to the position of central processing unit 611 on the motherboard 61, the heat energy that is produced with by liquid conductive central processing unit 611 operation the time, and then help its heat radiation.

As shown in Figure 3, this water-cooled module 63 includes: water pipe 631, cold plate 632, pump (not shown) and water leg (not shown).

Full of liquid (being generally distilled water) in this water pipe 631, and the position by central processing unit 611 extends to radiator 65, and constitute one the circulation the loop, and the direction of water pipe 631 interior liquid circulations as shown in Figure 2: the liquid in the drawing in the right-hand water pipe 631a is because of taking away the heat energy that central processing unit 611 produces, and has higher temperature, when water pipe 631 process radiators 65, after the heat radiation of power supply unit fan 621 and system fan 64, the temperature of liquid can reduce in the water pipe 631, at this moment, liquid in the drawing in the left water pipe 631b has lower temperature, entering water-cooled module 63 once again, and carry out heat conduction with central processing unit 611.Water pipe 631 in this preferred embodiment is to adopt the hard unbending hard tube of quality, also can use comparatively soft flexible pipe with flexural property certainly, and the utility model does not limit to its state that may implement.

As shown in Figure 3, this cold plate 632 is arranged at a side of water-cooled module 63 and is attached at central processing unit 611, the liquid that drives in the water pipe 631 by pump circulates in water pipe 631 through refrigeration version 632 inner flow passages, the heat energy that is produced during with 611 operations of conduction central processing unit.

This radiator 65 is attached at the rear side of main frame 60, as shown in Figure 4, it includes several radiating fins 651 parallel and that be provided with at interval, and the water pipe 631 that water-cooled module 63 is extended is arranged at 651 of each radiating fins agley, and the direction of the orientation of each radiating fin 651 and water pipe 631 is perpendicular.

Power supply unit fan 621 in this power supply unit 62 is corresponding to the first half of radiator 65, and the air quantity that produces with by 621 runnings of power supply unit fan the time dispels the heat to the first half and the water pipe 631 of radiator 65; And the below of power supply unit fan 621 is provided with a system fan 64, and this system fan 64 is in order to dispelling the heat to other electronic building bricks in the main frame 60, and its position is corresponding to the Lower Half of radiator 65.Thus, the air quantity of discharging when power supply unit fan 621 and system fan 64 runnings can brush in the lump to radiator 65, to increase the efficient of heat radiation.

This main frame 60 is provided with a perforate 66 corresponding to system fan 64 places, and the air quantity that produces when making system fan 64 runnings perforate 66 is thus discharged and brushed to radiator 65.

Please refer to shown in Figure 5ly, be provided with an ELECTROMAGNETIC OBSCURANT spare 67 in system fan 64 and 65 in radiator, with the interference that prevents that the external electromagnetic width of cloth from penetrating.Please refer to shown in Figure 6ly, this ELECTROMAGNETIC OBSCURANT spare 67 is provided with several ventilation holes 671, and the air quantity that produces when making system fan 64 runnings is discharged by each ventilation hole 671, and brushes to radiator 65.

This radiator 65 and system fan 64 are incorporated into the both sides of ELECTROMAGNETIC OBSCURANT spare 67 respectively, are fixedly arranged on the main frame 60 to make system fan 64 and radiator 65 by this ELECTROMAGNETIC OBSCURANT spare 67.

The outer periphery of this radiator 65 is equipped with a shielding 69, please refer to shown in Figure 7, for shielding 69 schematic diagram.This shielding 69 is one to be arranged at the box body of radiator 65 peripheries, it includes several blades that be arranged in parallel 691, and each blade 691 box body therewith is an angle to form several vents, and the air-flow that produces when making 64 operations of power supply unit fan 621 and system fan can be discharged by this vent, and keeps the attractive in appearance of main frame 60 rear ends.

Certainly, this shielding 69 is not limited in and is arranged on outside the radiator 65, and also can be arranged at the periphery that other protrudes the assembly of main frame 60 rear ends, ventilates and purpose attractive in appearance and can reach equally.

When desiring to assemble in addition, directly modular water-cooled module 63, water pipe 631, system fan 64 and radiator 65 are penetrated and are installed in the main frame 60 by perforate 66 places, and will shield 69 and be locked in main frame 60 rear ends and get final product.Therefore, need not change the allocation position of conversion intraware, even assemblies such as the power supply units 20 of dismounting main frame 60 inner scripts and motherboard, the utility model obviously has the easy advantage of assembling by contrast.

The above only is the utility model preferred embodiment wherein, is not to be used for limiting practical range of the present utility model; Be that all equivalences of doing according to the utility model change and modification, be all the utility model claim and contain.

Claims (9)

1. heat abstractor, be installed on a main frame, this main frame includes an electronic building brick of object computer preset function, wherein have one in this main frame in order to the power supply unit of electric energy to be provided, and has a power supply unit fan in this power supply unit, be arranged at the rear side of this main frame, one water-cooled module is provided with corresponding to this electronic building brick, this water-cooled module includes a water pipe, one radiator is attached at the rear side of this main frame, this power supply unit fan is corresponding to the first half of this radiator, and this water pipe is arranged in this radiator agley, it is characterized in that:
Have a system fan that is listed in this power supply unit fan in this main frame, and this system fan is corresponding to the Lower Half of this radiator, the wind of being discharged by this power supply unit fan and this system fan blows in the lump to this radiator and this water pipe.
2. heat abstractor as claimed in claim 1 is characterized in that, this electronic building brick is a central processing unit.
3. heat abstractor as claimed in claim 1 is characterized in that, this water-cooled module also includes a cold plate and is attached at this electronic building brick.
4. heat abstractor as claimed in claim 1 is characterized in that, this water-cooled module also includes a pump and a water leg, and the liquid that this pump drives in this water pipe circulates in this water pipe.
5. heat abstractor as claimed in claim 1 is characterized in that, this radiator includes several radiating fins parallel and that be provided with at interval, and this water pipe is arranged at respectively between this radiating fin agley.
6. heat abstractor as claimed in claim 1 is characterized in that, this main frame also is provided with a perforate corresponding to this system fan place.
7. heat abstractor as claimed in claim 6 is characterized in that, also includes an ELECTROMAGNETIC OBSCURANT spare corresponding to this tapping, and is arranged between this radiator and this system fan, and this ELECTROMAGNETIC OBSCURANT spare includes several ventilation holes.
8. heat abstractor as claimed in claim 1 is characterized in that, also includes a shielding, and this shielding is one to be arranged at the outer box body of this radiator, and has more than one vent.
9. shielding as claimed in claim 8 is characterized in that this shielding also includes the blade that be arranged in parallel more than, and respectively this blade and this box body are an angle.
CN 200420084739 2004-08-05 2004-08-05 Heat sink CN2713643Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
CN2713643Y true CN2713643Y (en) 2005-07-27

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Country Status (1)

Country Link
CN (1) CN2713643Y (en)

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