CN217543787U - Heat radiator - Google Patents

Heat radiator Download PDF

Info

Publication number
CN217543787U
CN217543787U CN202221551162.0U CN202221551162U CN217543787U CN 217543787 U CN217543787 U CN 217543787U CN 202221551162 U CN202221551162 U CN 202221551162U CN 217543787 U CN217543787 U CN 217543787U
Authority
CN
China
Prior art keywords
heat
heat dissipation
conducting
spare
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202221551162.0U
Other languages
Chinese (zh)
Inventor
游亮明
汪励
熊何
徐建平
叶继丰
杨国军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Chuangzhicheng Technology Co ltd
Original Assignee
Shenzhen Chuangzhicheng Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Chuangzhicheng Technology Co ltd filed Critical Shenzhen Chuangzhicheng Technology Co ltd
Priority to CN202221551162.0U priority Critical patent/CN217543787U/en
Application granted granted Critical
Publication of CN217543787U publication Critical patent/CN217543787U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses the application relates to the computer equipment field especially relates to a heat abstractor, including outer shell spare, heat source spare and radiator unit, wherein, one side of outer shell spare is kept flat in ground, and the installation cavity has been seted up to outer shell spare, and heat source spare sets up in the installation cavity. During the working process of the notebook computer, the heat source element can generate a large amount of heat, and the heat dissipation assembly is used for conducting out the heat. And the shell part is provided with a heat dissipation port, wherein the heat dissipation port is positioned below the heat source part, the output end of the heat dissipation assembly is communicated with the heat dissipation port, the horizontal projection of the heat dissipation port forms an included angle with the horizontal direction, and the heat dissipation port faces the ground. Therefore, the heat dissipation assembly can lead out heat generated in the notebook computer from the heat dissipation port, and because the heat dissipation port faces to the bottom surface, air with heat cannot be gathered at the heat dissipation port, the effect of rapid heat dissipation is achieved, and warping of the shell B is reduced.

Description

Heat radiator
Technical Field
The application relates to the field of computer equipment, in particular to a heat dissipation device.
Background
At present, the notebook computer is more widely applied to daily study, work and life due to small volume and convenient carrying, and compared with a desktop computer, the internal space of the notebook computer is smaller, and heat generated by heat source components such as a CPU (central processing unit), a display card, a memory bank, a hard disk and the like is more difficult to discharge in the notebook computer.
In the related art, a fan is arranged in the notebook computer to blow heat from a side heat sink to the outside of the notebook computer, however, the side air outlet of the notebook computer has many disadvantages, for example, the side interface position of the notebook computer is occupied, and the user experience is affected; and the use of the notebook computer under high load for a long time may cause the B-case to warp.
The problem that the heat dissipation effect of the notebook computer is poor in the related technology exists.
SUMMERY OF THE UTILITY MODEL
In order to improve the heat dissipation effect of the notebook computer, the application provides a heat dissipation device.
The utility model provides a heat abstractor, includes shell spare, heat source spare and radiator unit, one side of shell spare is kept flat in ground, the installation cavity has been seted up to shell spare, heat source spare and radiator unit all set up in the installation cavity, radiator unit set up in the below of heat source spare, radiator unit is used for deriving the heat that heat source spare produced, the thermovent has been seted up to shell spare, the thermovent is located the below of heat source spare, the opening of thermovent is towards ground, the lateral wall and the ground of thermovent have the interval.
Through adopting above-mentioned technical scheme, the lateral wall and the ground of thermovent have the interval, so, the heat that heat source spare produced is under radiator unit's driving, derives the heat from the thermovent, and has thermal air weight less, consequently, has thermal air can not gather in thermovent department, reaches quick radiating effect, reduces the warpage of B shell. In addition, the heat dissipation opening of the notebook computer is arranged to be open towards the ground, so that the space of the side interface of the notebook computer is increased, and the side interface of the notebook computer is convenient to install.
Optionally, the heat dissipation assembly includes a heat dissipation member, the heat dissipation member includes an air inlet and an air outlet, the air inlet is used for driving external air to enter the heat dissipation member, and the air outlet is used for driving air in the heat dissipation member to be discharged; the air inlet of the heat dissipation piece faces the heat source piece, and the air outlet of the heat dissipation piece faces the heat dissipation opening.
By adopting the technical scheme, the heat radiating piece has a guiding function, so that heat generated by the heat source piece is guided; the heat of the heat source part can not stay in the notebook computer, so that the heat dissipation effect of the whole notebook computer can be improved.
Optionally, the heat dissipation assembly further includes a first heat conduction member, one end of the first heat conduction member is communicated with the air outlet, and a distance between the first heat conduction member and the bottom of the mounting cavity is gradually reduced along a direction close to the heat dissipation opening.
Through adopting above-mentioned technical scheme, place when first heat-conducting piece level, its thermovent also needs the level to place to the thickness of the shell of computer needs bigger, can lead to whole computer volume grow to use inconvenient. Therefore, the bending arrangement of the first heat-conducting piece enables the volume of the whole notebook computer to be smaller, and the heat-conducting effect is better.
Optionally, the heat dissipation assembly further includes a second heat conduction member, one end of the second heat conduction member abuts against the cavity bottom of the mounting cavity, and the other end of the second heat conduction member abuts against the lower surface of the first heat conduction member.
Through adopting above-mentioned technical scheme, in order to maintain first heat-conducting piece and continue work under long-time load, set up the second heat-conducting piece in the below of first heat-conducting piece, wherein, the second heat-conducting piece can set up to water-cooling pipeline or air-cooled pipeline, and the surface through the second heat-conducting piece and the mutual butt of surface of first heat-conducting piece to increase the radiating effect.
Optionally, the first heat-conducting members are provided with multiple groups, the multiple groups of first heat-conducting members are arranged in parallel, and the multiple groups of first heat-conducting members are all communicated with the air outlet.
Through adopting above-mentioned technical scheme, when first heat conduction piece sets up to a set of, the opening of first heat conduction piece needs to set up greatly, sets up the cross sectional area that can lead to the wind path of heat air great like this to form comparatively chaotic wind path, produce even and flow against the current and then lead to the heat conduction effect not good. The multi-group first heat-conducting piece can change a single group of large air paths into a plurality of groups of small air paths, so that the stability of the whole air path is maintained, and the whole heat dissipation effect is improved.
Optionally, still include screen spare and rotation piece, screen spare is used for the display screen, rotate the piece connect in screen spare, it connects to rotate the piece pivot in shell spare, the least significant side of rotating the piece is located the top of first heat-conducting piece upper surface.
Through adopting above-mentioned technical scheme, the spatial position of rotating the piece staggers with first heat-conducting piece, and first heat-conducting piece is difficult for deriving to rotating the piece when the heat is conducted, because it can produce the deformation to rotate the piece when being heated too much to influence the screen piece and rotate, and then influence notebook computer's use.
Optionally, the heat dissipation opening is attached to one side of the first heat conduction member.
Through adopting above-mentioned technical scheme, maintain good heat conduction effect, heat exhaust's wind path is more stable promptly, reduces the condition that rotates piece and shell spare thermal deformation.
Optionally, the bottom of radiating piece is provided with the installation department, the installation department is provided with four groups, four groups the installation department set up in the four corners of radiating piece, and four groups the installation department is followed the centre of a circle circumference evenly distributed of radiating piece.
Through adopting above-mentioned technical scheme, at radiating in-process, the radiating piece can produce vibrations, probably influences the stability of placing and the heat conduction wind path of radiating piece. Through setting up the installation department to maintain radiating stability and notebook computer stability in the use.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the side wall of the heat dissipation opening is spaced from the ground, so that heat generated by the heat source part is guided out from the heat dissipation opening under the driving of the heat dissipation assembly, and the weight of air with heat is smaller, so that the air with heat cannot be gathered at the heat dissipation opening, the effect of rapid heat dissipation is achieved, and the warping of the shell B is reduced. In addition, the heat dissipation opening of the notebook computer is arranged to be open towards the ground, so that the space of the side interface of the notebook computer is increased, and the side interface of the notebook computer is convenient to install.
2. The heat dissipation part has a guiding function, so that heat generated by the heat source part is guided; the heat of the heat source part can not stay in the notebook computer, so that the heat dissipation effect of the whole notebook computer can be improved.
3. In order to maintain the first heat conducting member to continue working under long-time load, a second heat conducting member is arranged below the first heat conducting member, wherein the second heat conducting member can be arranged as a water cooling pipeline or an air cooling pipeline, and the surface of the second heat conducting member is abutted against the surface of the first heat conducting member, so that the heat dissipation effect is increased.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.
Fig. 2 is a schematic view of the internal structure of the embodiment of the present application.
Description of reference numerals: 1. a housing member; 11. a mounting cavity; 12. a heat dissipation port; 2. a heat source element; 3. a heat dissipating component; 31. a heat sink; 311. an air inlet; 312. an air outlet; 313. an installation part; 32. a first heat-conducting member; 33. a second heat-conducting member; 4. a screen member; 5. and a rotating member.
Detailed Description
The present application is described in further detail below with reference to fig. 1-2.
The application example discloses a heat dissipation device which is used for improving the heat dissipation effect of a notebook computer.
Referring to fig. 1 and 2, a heat dissipation device includes a housing member 1, a heat source member 2 and a heat dissipation assembly 3, wherein one side of the housing member 1 is flatly placed on the ground, a mounting cavity 11 is formed in the housing member 1, and the heat source member 2 is disposed in the mounting cavity 11. In the working process of the notebook computer, the heat source element 2 can generate a large amount of heat, and the heat dissipation assembly 3 is used for conducting out the heat. Furthermore, the casing member 1 is provided with a heat dissipating opening 12, wherein the heat dissipating opening 12 is located below the heat source member 2, the output end of the heat dissipating assembly 3 is communicated with the heat dissipating opening 12, an included angle is formed between the horizontal projection of the heat dissipating opening 12 and the horizontal direction, and the heat dissipating opening 12 faces the ground. Therefore, the heat dissipation component 3 can conduct heat generated in the notebook computer out from the heat dissipation port 12, and because the heat dissipation port 12 faces the bottom surface, air with heat cannot be gathered at the heat dissipation port 12, so that the effect of rapid heat dissipation is achieved, and the warping of the shell B is reduced.
Referring to fig. 1 and 2, the heat dissipation assembly 3 includes a heat dissipation member 31, a first heat conduction member 32, and a second heat conduction member 33, wherein the heat dissipation member 31 includes an air inlet 311 and an air outlet 312, the air inlet 311 faces the heat source member 2, and the air outlet 312 faces one side of the first heat conduction member 32; the other side of the first heat-conducting member 32 faces the heat-dissipating opening 12; the second heat-conducting member 33 is disposed below the first heat-conducting member 32. In the present embodiment, the heat sink 31 is an electric fan, so that heat generated by the heat source device 2 is combined with air, and the heat sink 31 can guide the heat to enter the electric fan from the air inlet 311 and then to be discharged from the air outlet 312, thereby forming a stable air path. The hot air exhausted from the air outlet 312 passes through the first heat-conducting member 32 and then is exhausted from the heat-dissipating outlet 12.
Referring to fig. 1 and 2, the distance between the first heat conduction members 32 and the bottom of the mounting cavity 11 gradually decreases along the direction close to the heat dissipation opening 12, the first heat conduction members 32 are provided with a plurality of groups, the plurality of groups of first heat conduction members 32 are closely attached in parallel, and one side of each group of first heat conduction members 32 faces the air outlet 312. The purpose of this is that the heat sink 31 has a guiding function, and thus guides the heat generated by the heat source element 2; the heat of the heat source 2 does not stay in the notebook computer for a long time, so that the heat dissipation effect of the whole notebook computer can be improved.
Referring to fig. 1 and 2, one side of the lower portion of the second heat conducting member 33 abuts against the bottom of the mounting cavity 11 through a bolt, and one side of the upper portion of the second heat conducting member 33 abuts against the outer surface of the first heat conducting member 32 and is attached to the lower surface of the first heat conducting member 32, so that the second heat conducting member 33 can conduct heat out of the first heat conducting member 32 under the long-time heat conducting effect, and the warping of the first heat conducting member 32 is reduced.
Referring to fig. 1 and 2, there may be a change in the position of the first heat conduction member 32 due to strong vibration of the heat dissipation member 31 during heat dissipation. Therefore, in the present embodiment, the bottom of the heat sink 31 is provided with the mounting portions 313, the mounting portions 313 are provided in four groups, the four groups of mounting portions 313 are respectively located at four corners of the heat sink 31, and the four groups of mounting portions 313 are uniformly distributed along the circumferential direction of the center of the heat sink 31.
Referring to fig. 1 and 2, the portable electronic device further includes a screen member 4 and a rotation member 5, wherein the screen member 4 is used for displaying a screen, the rotation member 5 is connected to the screen member 4, the rotation member 5 is rotatably connected to the housing member 1, a lowest side of the rotation member 5 is located above an upper surface of the first heat conductive member 32, and further, one side of the rotation member 5 is smoothly transitionally disposed. The purpose of this setting is, reduce the computer size of whole notebook.
The implementation principle of the embodiment is as follows: the heat sink 31 has a guiding function, and further guides heat generated by the heat source element 2; the heat of the heat source 2 does not stay in the notebook computer, so that the heat dissipation effect of the whole notebook computer can be improved. The side wall of the heat dissipation opening 12 has a distance with the ground, so that the heat generated by the heat source part 2 is driven by the heat dissipation assembly 3 to be led out from the heat dissipation opening 12, and the weight of the air with the heat is smaller, so that the air with the heat cannot be gathered at the heat dissipation opening 12, the effect of rapid heat dissipation is achieved, and the warping of the shell B is reduced. In addition, the heat dissipation opening of the notebook computer is arranged to be open towards the ground, so that the space of the side interface of the notebook computer is increased, and the side interface of the notebook computer can be conveniently installed.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides a heat abstractor, its characterized in that, includes shell spare (1), heat source spare (2) and radiator unit (3), one side of shell spare (1) is kept flat in ground, installation cavity (11) have been seted up in shell spare (1), heat source spare (2) and radiator unit (3) all set up in installation cavity (11), radiator unit (3) set up in the below of heat source spare (2), radiator unit (3) are used for deriving the heat that heat source spare (2) produced, thermovent (12) have been seted up in shell spare (1), thermovent (12) are located the below of heat source spare (2), the opening of thermovent (12) is towards ground, the lateral wall and the ground of thermovent (12) have the interval.
2. A heat dissipating arrangement according to claim 1, wherein the heat dissipating component (3) comprises a heat dissipating member (31), the heat dissipating member (31) comprises an air inlet (311) and an air outlet (312), the air inlet (311) is used for driving external air into the heat dissipating member (31), and the air outlet (312) is used for driving air in the heat dissipating member (31) to exhaust; an air inlet (311) of the heat dissipation member (31) faces the heat source member (2), and an air outlet (312) of the heat dissipation member (31) faces the heat dissipation opening (12).
3. The heat dissipating device according to claim 2, wherein the heat dissipating assembly (3) further comprises a first heat conducting member (32), one end of the first heat conducting member (32) is connected to the air outlet (312), and a distance between the first heat conducting member (32) and the bottom of the mounting cavity (11) decreases in a direction approaching the heat dissipating port (12).
4. A heat sink according to claim 3, wherein the heat sink assembly (3) further comprises a second heat-conducting member (33), one end of the second heat-conducting member (33) is pressed against the bottom of the mounting cavity (11), and the other end of the second heat-conducting member (33) is pressed against the lower surface of the first heat-conducting member (32).
5. A heat dissipating device according to claim 3, wherein the first heat-conducting members (32) are provided in a plurality of sets, the plurality of sets of first heat-conducting members (32) are arranged in parallel, and the plurality of sets of first heat-conducting members (32) are all communicated with the air outlet (312).
6. A heat dissipating device according to claim 3, further comprising a screen member (4) and a rotating member (5), wherein the screen member (4) is used for displaying a screen, the rotating member (5) is connected to the screen member (4), the rotating member (5) is rotatably connected to the housing member (1), and the lowest side of the rotating member (5) is located above the upper surface of the first heat conducting member (32).
7. A heat sink according to claim 5, characterised in that the heat-dissipating opening (12) is arranged adjacent to one side of the first heat-conducting member (32).
8. A heat sink according to claim 2, wherein the bottom of the heat sink (31) is provided with four mounting portions (313), the four mounting portions (313) are arranged in four groups, the four mounting portions (313) are arranged in four corners of the heat sink (31), and the four mounting portions (313) are circumferentially and uniformly distributed along the center of the heat sink (31).
CN202221551162.0U 2022-06-20 2022-06-20 Heat radiator Active CN217543787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221551162.0U CN217543787U (en) 2022-06-20 2022-06-20 Heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221551162.0U CN217543787U (en) 2022-06-20 2022-06-20 Heat radiator

Publications (1)

Publication Number Publication Date
CN217543787U true CN217543787U (en) 2022-10-04

Family

ID=83419343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221551162.0U Active CN217543787U (en) 2022-06-20 2022-06-20 Heat radiator

Country Status (1)

Country Link
CN (1) CN217543787U (en)

Similar Documents

Publication Publication Date Title
US6875101B1 (en) Computer housing ventilation arrangement
CN108153401A (en) A kind of computer server radiator
CN203433456U (en) Water-cooling heat dissipation device for notebook computer
CN217543787U (en) Heat radiator
CN212515678U (en) Computer hardware fixing device that dispels heat fast
CN108227883A (en) A kind of huge computer servers radiator
CN216871165U (en) Heat dissipation assembly and computer
CN212411147U (en) Small-space high-performance heat dissipation module and tablet computer
CN210402260U (en) Radiating fin with good radiating efficiency
CN207909065U (en) A kind of huge computer servers radiator
CN207833446U (en) A kind of pluggable finned radiator for inside computer cabinet
CN207909067U (en) A kind of computer server radiator
CN207352542U (en) A kind of dust-proof radiating industrial control mainboard
CN213276565U (en) Water circulation computer heat dissipation module
CN216210876U (en) Multiple heat radiation structure of computer chip
CN210742863U (en) Water cooling system with heat dissipation device
CN214795842U (en) Automatic change computer constant temperature equipment
US6695045B2 (en) Bladed heat sink
CN211956398U (en) Noise-free computer heat dissipation device special for computer
JP2880646B2 (en) Heat sink with fan
CN221303946U (en) 1U extension machine case heat radiation structure and 1U extension machine case
CN220191287U (en) Radiating device of portable control terminal
CN218866413U (en) Multi-air-duct heat dissipation case for industrial personal computer
CN219042299U (en) Mainboard heat radiation structure
CN210109735U (en) Computer peripheral heat abstractor

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant