TWI232368B - Miniaturized computer and heat dissipation method thereof - Google Patents

Abstract

A miniaturized computer is disclosed, which is to reallocate each component of the computer, so as to form a miniaturized computer comprising a motherboard, a low-speed interface, a high-speed interface and an input/output interface. The well-known heat dissipation mechanism is modified to separate the heat dissipation device from a fan for miniaturizing the computer, and the heat dissipation problem after miniaturizing the computer can be solved by the heat dissipation method using a flow-conduction device in cooperation with a separated heat dissipation mechanism.

Description

1232368 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a miniaturized computer and a method for dissipating heat, particularly a miniaturized computer that uses a stacked board and a separate heat dissipation mechanism, and uses a separate type Miniaturizing computer heat dissipation method of heat dissipation mechanism and flow guide device. [Previous technology] Traditional computer systems use a flat single-chip motherboard configuration, so the plane area is large. Although there are currently multiple motherboard configurations using a motherboard, low-speed interface, high-speed interface, and input / output interface, such as The miniaturized computer disclosed in US Patent No. US6229700 and made by the applicant based on the patent (Sang Sang Co., Ltd. US Patent No. US 6 2 297 7 0). However, there are still two shortcomings of this miniaturized computer. One is the traditional cooling mechanism that uses a fan and cooling fins stacked. Therefore, the thickness of the stacked board cannot be reduced, that is, the volume is relatively large; the second is simple. The traditional heat dissipation mechanism is used, so the problem of heat concentration caused by miniaturization of the computer cannot be solved. The present invention uses a motherboard, a low-speed interface, a high-speed interface, and an input / output interface to stack the motherboard, greatly reducing the area of the motherboard, and using a separate heat dissipation mechanism to reduce the height of the motherboard by half, so the volume is much larger than traditional There are few computer hosts, only half the volume of the miniaturized computer currently made according to the above-mentioned US Patent No. US 6 2297 700. In addition, the use of a deflector and a separate heat dissipation mechanism completely solve the problem of heat dissipation. [Objective of the Invention] An object of the present invention is to provide a miniaturized computer.

1232368 V. Description of the invention (2) Another object of the present invention is to provide a method for miniaturizing computer heat dissipation. Still another object of the present invention is to provide a miniaturized computer composed of a stacked machine board and a separate heat dissipation mechanism. Still another object of the present invention is to provide a miniaturized computer with a stacked machine board and a current guiding device. Yet another object of the present invention is to provide a miniaturized computer heat dissipation method using a deflector and a separate heat dissipation mechanism. Yet another object of the present invention is to provide a miniaturized computer composed of a stacked machine plate, a separate heat dissipation mechanism, and a flow guiding device. [Summary] The miniaturized computer of the present invention includes: a motherboard; a low-speed interface connected to the motherboard; a high-speed interface connected to the motherboard; an input / output interface; Connected to the motherboard; a chassis to cover the motherboard, low-speed interface, high-speed interface, and input / output interface; where the motherboard contains: a heat sink for direct or direct connection with the heat source on the motherboard Indirect contact; a fan for sending airflow to help remove the heat accumulated by the heat sink; characterized in that the miniaturized computer further includes a deflector, which is substantially covered by the heat sink and the fan Peripheral to make the

Page 7 1232368 V. Description of the invention (3) The air flow of the fan follows the direction of the guide of the guide device, and the heat energy stored in the heat sink is taken away. The above-mentioned case is similar to a general computer case, except that its size varies depending on the size of the miniaturized computer. The above-mentioned motherboard may be a motherboard commonly used in any miniaturized computer. The motherboard may include, for example, CPU, Northbridge chipset, Southbridge chipset, memory, USB, 1 394, main controller, and other components. The above-mentioned low-speed interface may include, for example, output ports such as a disk drive, a printer, a keyboard, a mouse, an audio and video, and a wireless interface.

The above-mentioned high-speed interface may include output ports such as a hard disk drive, TV output, UBS, 1 3 9 9 4 and sound. The input / output interface described above may include output ports such as power control, speakers, UBS, 13994, and sound. The above-mentioned heat dissipation device can be any conventional heat dissipation device for a computer, for example, three types of fins of aluminum extrusion type, die casting type and folding type. The above-mentioned fan can be a fan used by any computer host or a similar fan.

The above-mentioned flow guiding device may be any conventional ring column shape or the surrounding environment to form a ring column shape with substantially one or more gaps, such as a door cover (which is formed into a ring column shape in cooperation with the motherboard) and the motherboard Form a door or L-shaped cover / (cooperate with the main board and the case side plate to form a substantially circular column shape).

The heat dissipating mechanism formed by the above-mentioned fan and heat dissipating device may be a traditional top-down type or a separate type, and it is better to adopt a separate type. When using a separate heat sink, the heat sink is set to a main heat source (such as C P U

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m 1 page 8 1232368 5. The invention description (4)) is better, and the fan is preferably located at a secondary heat source (such as a Northbridge chip). In addition, a thermally conductive device, such as a thermally conductive metal sheet, can be added between the fan and the secondary heat source to increase the heat dissipation effect of the secondary heat source. When a separate heat dissipation mechanism is used, the fan is preferably a side-blown fan, and a side-blown fan with a single air inlet is more preferred; and the heat-dissipating device is preferably a parallel heat-dissipating fin. Furthermore, when a single air-supply side-blown fan and parallel fins are used, the air-supply direction of the fan and the direction of the parallel fins are substantially the same or parallel to the flow direction of the air-guiding device. The invention can also be a miniaturized computer, which includes: a motherboard; a low-speed interface; a high-speed interface; and an input / output interface; wherein the low-speed interface, the high-speed interface, and an input / output interface are separately from the host Board connection; where the motherboard contains: a heat sink fin for direct or indirect contact with the heat source; a fan to send airflow to help remove the heat accumulated by the heat sink fin; its features are: the heat sink fin It is separated from the fan. The fins of the radiating fins are substantially parallel fins. The fan has a single air supply port, and the air supply direction of the air supply ports is substantially the same as the direction of the parallel fins in the parallel fins. It is essentially the same direction or parallel. The aforementioned motherboard, low-speed interface, high-speed interface, input / output interface, chassis, heat sink, and fan are all as described above. The above miniaturized computer may further include a diversion device, and the diversion device is also as described above.

1232368 V. Description of the invention (5) The method for dissipating heat of a miniaturized computer according to the present invention comprises: directly or indirectly contacting a fan and a secondary heat source of the miniaturized computer motherboard, and transmitting the heat of the secondary heat source by the fan. The air port is taken away; the parallel fins are in direct or indirect contact with the main heat source of the miniaturized computer motherboard, and all or part of the heat generated by the fan is taken away by the air flow from the fan air outlet; its characteristics are: the fan and the heat dissipation The fins are separated, and the air supply direction of the fan air supply port and the parallel fin direction of the heat dissipation fins are substantially the same or parallel. The above-mentioned motherboard, cooling fins, fans, and guides are as described above.

The above casing should preferably have an air outlet at the end in the direction of the diversion of the diversion device to enhance the diversion and heat dissipation effect. [Embodiment] The first picture of the present invention is a related patent. However, the miniaturized computer still has two shortcomings. One is the traditional heat dissipation mechanism that uses a fan and a heat sink to fold together. Therefore, it is impossible to make a stacked machine. The thickness of the board is reduced, that is, the volume is relatively large; the second is that the traditional heat dissipation mechanism is simply used, so the problem of heat concentration caused by the miniaturization of the computer cannot be solved.

Please refer to the second, third, fourth, fifth, sixth, seventh and eighth figures of the preferred embodiments of the present invention. The present invention provides a miniaturized computer, a motherboard 1 1; a low-speed interface 7 0; --high-speed interface 60; chassis 14 and an input / output interface 80; wherein the low-speed interface 70, high-speed interface 60 and an input / output 80 interface are respectively connected to the motherboard 1 1 connection; wherein the motherboard 1 1 contains a heat dissipation mechanism

Page 10 1232368 V. Description of the invention (6) 2 0, especially a computer heat dissipation mechanism 20, which is arranged on the motherboard 1 1 inside the computer main body 10, and can be used to assist the heat dissipation of the two heat sources 1 2 and 1 3 at the same time. Among them, the main heat source 12 is a heat source such as a central processing unit (CPU), and the secondary heat source 13 is a heat source such as a Northbridge (North Bridge) chipset. The temperature generated by the secondary heat source 13 is mainly The temperature generated by the heat source 1 2 is low. The computer heat dissipation structure 20 includes a heat dissipation device 21 and a fan 22, wherein the heat dissipation device 21 may be an aluminum dial type, a die casting type, and a folding type.

The type of the heat dissipation device 21 is not limited. The heat dissipation device 21 is made of a material with good heat conduction such as copper or aluminum. The heat dissipation device 21 has a body 2 3 on the body 23. A plurality of fins 2 4 are connected, and fin grooves 2 5 are formed between the fins 2 4 to facilitate air flow. The bottom surface of the main body 2 3 of the heat dissipation device 21 is bonded to the surface of the main heat source 12. An appropriate fastener 2 6 may also be provided for attaching the stable buckle of the heat dissipating device 21 to the surface of the main heat source 12. The heat dissipating device 21 may be used to assist the main heat source 12 in dissipating heat. The fan 2 2 is arranged beside the heat dissipation device 21 and is in the same direction or parallel to the fins 24. The fan 2 2 includes a lower cover 2 7, an upper cover 2 8 and a fan body 2 9. The lower cover 2 7 is made of copper or aluminum.

The upper cover 2 8 is made of a metal material with good conductivity, and the material of the upper cover 2 8 is not limited. The upper cover 2 8 is provided above the lower cover 2 7 and the lower cover 2 7 and the upper cover 2 8 are combined into a whole by means of fastening or screwing, etc., so that they form a casing 40 of the air supply device, and the top of the casing 40 (the top of the upper cover 2 8) is provided with an inlet.

Page 11 1232368 V. Description of the invention (7) The air outlet 3 0, the shell 40-side (ie, the lower cover 27 and the upper cover 2 8-side) is provided with a protruding air outlet 3 1, and the interior of the housing 40 is There is an accommodating room 32, which is in communication with the air inlet 30 and the air outlet 31. The bottom surface of the lower cover 2 7 of the fan 22 is connected to the surface of the secondary heat source 13, and the lower cover 2 7 of the fan 2 is properly fixed on the main board 11 and the air outlet 3 1 is outside. It is in the same direction or parallel to the heat dissipation direction of the heat dissipation device 21.

The fan body 2 9 is pivotally arranged inside the housing chamber 3 2 of the casing 40, and an appropriate motor (illustration omitted) is provided between the fan body 29 and the casing 40 to control and drive the fan body 29 is for one operation, and the fan body 29 is inhaled by the air inlet 30 and the air is exhausted through the air outlet 31, so that the fan 22 forms a side blower fan; a deflector device 50 outer cover At the periphery of the heat dissipating device 21 and the fan 22, the airflow of the fan 2 2 is discharged in the direction of the flow guiding device 50 to discharge the accumulated heat energy of the heat dissipating device 21, and the composition of the present invention is formed by the above composition. Thermal structure.

The heat dissipation structure of the present invention can be installed inside the computer main body 10, and the heat dissipation device 21 and the fan 22 are designed separately, so that the heat dissipation device 21 and the fan 22 are respectively attached to the main heat source 12 and Secondary heat source 1 3. The heat generated during the operation of the secondary heat source 1 3, such as the Northbridge chipset, which has a relatively low heat generation, can be transferred to the fan 2 2 under the cover 2 7, and by the operation of the fan body 2 9, the housing 40 of the fan 22 The top air inlet 30 introduces cold air, and the warm air is sent out from the air outlet 31 on the side of the casing 40 of the fan 22 to dissipate the secondary heat source 13. The heat generated by the main heat source such as the central processing unit 12 can be

Page 12123368 V. Description of the invention (8) Passed to the heat sink 21, which has a plurality of fins 24, which can increase the heat dissipation area in response to the main heat source 1 2 with higher heat generation. Its heat dissipation efficiency, and the warm air sent from the air outlet 31 on the side of the casing 40-can radiate the main heat source 12 and the heat dissipation device 21 which are located at the outer side of the air outlet 3 1 with high temperature. The warm air sent from the air outlet 3 1 of the body 40 can pass through the fin groove 2 5, and then the hot air is discharged to the outside through the preset exhaust port 15 on the side of the casing 1 4 of the computer main body 10. The shape of the exhaust port 15 is not limited, and may be appropriately changed as needed.

In addition, an appropriate air inlet 16 can also be provided on the chassis 14 of the computer main body 10, so that cold air can be drawn into the computer main body 10. The shape of the air inlet 16 is not limited, and can be determined according to It can be changed as needed, and another fan (not shown in the figure) can be provided on the air inlet 16 to forcibly draw in the cold air from outside to have better air convection effect. The lower cover 2 7 of the fan 22 of the present invention has a heat conduction and heat dissipation effect, and the fan 22 uses a side-blow method to dissipate heat, and the generated wind pressure is small, so that the heat can be quickly discharged to obtain better heat dissipation. Efficiency, play a large heat dissipation capacity, and the computer heat dissipation structure of the present invention adopts a separate design, which can simultaneously dissipate heat for the two heat sources 1 2 and 1 3, so as to obtain more

Good heat dissipation efficiency, and its simple structure will not cause increase in manufacturing costs and occupy a large space. Furthermore, the fan 22 of the present invention is disposed beside the heat dissipation device 21, so that the height of the entire heat dissipation mechanism 20 can be reduced, so it is particularly suitable for computers with height restrictions.

Page 13123368 V. Description of the invention (9) In addition, the present invention can exhaust the high-temperature air that is trapped in the heat source such as the central processing unit of the computer host and the Northbridge chipset from the side of the computer host, and can be exhausted through the air inlet 1 6. The outside cold air is sucked into the inside of the host computer 10, which has better air convection effect. In addition, a diversion device 50 covers the periphery of the heat dissipation device 21 and the fan 22 so that the airflow of the fan 2 2. Follows the direction of the diversion device 50 to discharge the heat energy accumulated in the heat dissipation device 21 In order to improve the lack of poor heat dissipation in the host computer, better heat dissipation efficiency is achieved. ❿

Page 14 1232368 Brief description of the diagram The first diagram is a three-dimensional exploded view of a conventional miniaturized computer. The second figure is an exploded perspective view of the present invention. The third figure is a front view of the present invention. The fourth figure is a rear view of the present invention. The fifth figure is a right side view of the present invention. The sixth figure is a left side view of the present invention. The seventh figure is a top view of the present invention. The eighth figure is a bottom view of the present invention. [Comparison of main component symbols] 10 Computer host 11 Motherboard 12 Main heat source 13 Secondary heat source 14 Chassis 1 5 Exhaust port 16 Air inlet 2 0 Computer cooling mechanism 2 1 Cooling device 2 2 Fan 2 3 Body 2 4 Fin Sheet 2 5 Fin groove 2 6 Buckle 2 7 Under cover

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Claims (1)

6. Scope of Patent Application 1. A miniaturized computer, comprising: a motherboard including a main heat source and a secondary heat source; a low-speed interface connected to the motherboard; a high-speed interface connected to the motherboard Connection; an input / output interface, which is connected to the motherboard; a casing to cover the motherboard, a low-speed interface, a high-speed interface, and an input / output interface; wherein the motherboard includes: a heat sink, It is used for direct or indirect contact with the main heat source; a fan is used to send out airflow to help remove the heat accumulated by the heat dissipation device; a deflector device is used to make the airflow of the fan follow the direction of the diversion device, The heat energy stored in the heat dissipating device is taken away; it is characterized in that the heat dissipating device is arranged on the main heat source and the fan is arranged on the secondary heat source. 2. The miniaturized computer as described in item 1 of the scope of the patent application, wherein the heat dissipation device is a heat dissipation fin; the fan is a side-blow fan, and the fan has substantially an air inlet and a single air inlet. The air port is located on the secondary heat source, and the air supply port is aligned with the heat sink. 3. The miniaturized computer according to item 2 of the scope of the patent application, wherein the heat dissipation fins are parallel heat dissipation fins, and the parallel direction of the parallel fins and the air supply direction of the single air supply port of the fan, and the guide of the flow guide device The direction of flow is essentially the same or parallel. 4. The miniaturized computer according to item 1, 2, or 3 of the scope of patent application, wherein the flow guiding device is a door-type cover or an L-type cover. Page 17 6. Scope of Patent Application 5. A miniaturized computer, including: a motherboard; a low-speed interface; a high-speed interface; and an input / output interface; wherein the low-speed interface, high-speed interface, and an input / output interface are respectively The motherboard is connected; the motherboard contains: a main heat source; a primary heat source; a heat sink fin for direct or indirect contact with the main heat source; a fan for sending airflow to assist in removing the heat sink fin accumulation Heat It is characterized in that the heat dissipation device is arranged on the main heat source, and the fan is arranged on the secondary heat source; the fan is a side-blow type fan, and the fan has a single air supply port, and the air supply port is aligned with the heat dissipation device . 6. The miniaturized computer as described in item 5 of the scope of patent application; wherein the fan and the secondary heat source further include a heat conducting device. 7. The miniaturized computer as described in item 6 of the scope of patent application; wherein the heat dissipation fins are in direct contact with the primary heat source, and the heat conducting device is in direct contact with the secondary heat source. 8. The miniaturized computer described in item 7 of the scope of patent application further includes a flow guiding device, which is substantially covered by the heat sink fin and the periphery of the fan, so that the airflow of the fan follows the flow guiding The flow direction of the device takes away the heat accumulated by the fins. 9. The miniaturized computer according to item 8 of the scope of patent application, wherein the flow guiding device is a door-type cover or an L-shaped cover. 10. A cooling method for miniaturized computers, including: Page 18 Jian 3Sf3 # 8 Page VI. The scope of the patent application is parallel fins and contacts; and the characteristics of the wind or part of the heat are: indirect contact and 11. If applying for a special law, where the wind-heated fins And the main 12, such as the application of the mini fan of the computer fan air outlet and the mini fan of the secondary heat source profit range No. 10 fan and the secondary heat source is the direct profit range No. 11 method, which further includes a diversion device Wherein the fan sends, in essence, 13. If applying for a special law, where the air supply of the air guide is the first range of the flow guide device, the second flow device is the main heat source of the door main board directly or indirectly connected to the air flow to take away the parallel fins. The secondary heat source of the computer motherboard produced by the film is directly or heat taken away by the air outlet of the fan. A heat-conducting device is arranged between the heat sources of the miniaturized computer's heat-dissipating device as described in the item, and the scattered contact is made. The cooling method of the miniaturized computer described in the item is used to guide the direction of the cooling airflow, and the direction is the same as or parallel to the direction of the parallel fins of the cooling fin. The heat-dissipating square cover or L-shaped cover of the miniaturized computer described in the item above. Page 19