1305879 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電腦主機散熱方法，及一種散熱 機構，由指一種利用導引裝置導引散熱流方向的電腦主機 板散熱方法，及一種電腦主機用散熱機構。 【先前技術】 隨著電腦產業的快速升級，使得電腦具有更強大的運 算能力，而中央處理器（C P U)及晶片組之運作速度也 日益增加，且中央處理器及晶片組所產生之熱量也隨之增 加，為了維持中央處理器及晶片組等熱源可於許可之溫度 下正常運作，即設計了許多種增加散熱面積之散熱器，以 因應發熱量較高之熱源。 習知電腦散熱器主要有鋁擠型、壓鑄型及摺疊型三種 ，鋁擠型及壓鑄型散熱器之製造由於受限於機械加工能力 ，其密緻度（單位體積之總散熱面積）有限，因此用於發 熱量愈來愈高之熱源，其體積及重量亦隨之增加，而摺疊 型散熱器係利用金屬片作為鰭片連續堆疊，其密緻度較高 ，因此散熱效率較佳，且體積、重量亦較容易被業界所接 受。 為了使散熱器能獲得較佳的散熱效率，一般可於散熱 器上結合一風扇，用以協助散熱，該風扇係藉由適當的固 定結構固定於散熱器上。當風扇被驅動時，可鼓動四周的 冷空氣吹向散熱器，用以協助散熱，藉以組成一散熱效率 更佳之散熱結構。 請參閱第一圖，習知的電腦散熱結構係包括有一散熱 1305879 器1 0 a及一風扇2 0 a，其中該散熱器1 〇 a係以銅或 鋁等材料所製成，該散熱器1 0 a係具有一本體1 1 a， 該本體1 1 a上連接多數個鰭片1 2 a。該散熱器1 〇 a 之本體1 1 a底面可接合於中央處理器等熱源3 0 a表面 上，用以協助散熱。 該風扇2 0 a係以螺絲2 1 a鎖附固定於該散熱器1 0 a上，當該風扇2 0 a被驅動時，可鼓動上方的冷空氣 向下吹向該散熱器1 0 a，用以協助該散熱器1 〇 a散熱。 惟，上述習知之散熱結構，其風扇係採下吹方式散熱， 會產生的風壓較大，使熱量無法迅速的排出，因此難以得 到較佳的散熱效率，無法發揮較大的散熱能力。 再者，上述習知之散熱結構，其僅能針對單一熱源進 行散熱，無法同時針對二個熱源進行散熱，然而一般的電 腦内部均具有如中央處理器（CPU)及北橋（North Bridge)晶片組等熱源，若僅針對單一熱源進行散熱，則另 一熱源產生之熱量，仍會對電腦產生不良的影響。若要針 對二個熱源個別設置散熱結構，則又會造成製造成本的增 加，且需佔用較大的空間。 另，上述習知之散熱結構，其風扇固定於散熱器上， 使得整個散熱結構具有較高的高度，因此對於有高度限制 的電腦而言，即難以適用。 又，上述習知之散熱結構，由於風扇吹散之高溫大部 份仍滯留於電腦主機内，因此即使藉風扇驅動空氣對中央 處理器散熱，但電腦内部高溫的空氣勢必使得散熱效果降 低許多，且會導致風扇不停的運作，耗用較多電力能源。 1305879 另’在中華民國專利TW4 9 〇工2 7號中其揭露有 -進風口 ’封閉侧邊也有出風σ裝置，可以使導流方向吹 向縛片散熱裝置，但其出風口不為單—方向而也沒有本發 明之導流裝置可以改善散熱之效果，而在美國專利us2 002/0071250中其内容係揭露有側吹導流風甸 平行散熱ϋ但其風扇結構时複數導流#與故本發明人之 散熱風扇不盡相同。 所以’由上可知’上述習知的電腦散熱結構，在實際 使用上’顯然具有不便與缺失存在，而可待加以改善I。 有鑑於此，本發明人有感上述缺失之可改善，乃特濟 =九並配合學理之運用，終於提出—種設計合理且有妹 改善上述缺失之本發明。 【發明内容】 本發明之一目的 電腦㈣上設置種電腦主機散熱料，其係? 部份或全部㈣至散使該cpu之產生热ί 氣震置，用以帶走北fj，同時在北橋晶片上設置，这 由該送氣裝置所產生的部份或全部熱量^ 熱裝置。 ”，將送氣裝置產生之氣流吹向該散 本發明另一目的，士 巢置係以侧吹方式h在於可提供—種散熱機構，其送氣 迷的排出，獲得較#二血會產生的風壓較小，可使熱量迅 本發明之在-=散熱效率’發揮較大的散熱能力。 採分離式設計，能同眛，在於可提供一種散熱機構，其係 隹的散熱效率，且:f針對二個熱源進行散熱，俾獲得更 吕造成製造成本的增加，亦不需佔用 1305879 較大的空間。 本發明之再另一目的，在於 一 送氣襄置係設置於散_ fA、、—種政熱機構，其 成回心七乐- 文”、置方側且與散熱裝置的散熱方向 適用二i右了库使得整個散熱機構的高度得以降低’、故尤 化的^〜限制的電腦’使電腦產品可達到輕薄微小 可將、、m在於可提供—種電腦散熱機構， ==主機内部中央處理器產生之高溫二 得更佳的散熱效率 0 " ' 全㈣^=.、、、襄 該CPU之產生熱量部份或 i 置；同時在北橋晶片上設置-送氣襄 ΐίίί:氧口：！送氣裝置產生之氣流吹向該散熱裝 ^ .該送氣裝置和該散熱裝置外圍設有一導# ==引該氣流之方向，該導引方向和該送氣C 。0 κ貝上係成平行方向，且該散熱裝置在該送氣方 μ今述之散熱裝置可為任4電腦習用之散熱裝置，例如 =型、_型及摺疊型三_片，以制平賴片= 之送氣裴置可為任意電腦主機習用之風扇，以伽 吹式風扇為較佳及，·吹具有-送氣口風扇為更力“側 上述送氣襞置之單一送氣口以和該平行鰭片間的鰭槽 1305879 方向實質上為同向或平行，以同向或平行為較佳。 上述之導流裝置可為任意習知之環柱狀或週邊環境形 成實質上具有一或多個缺口之環柱狀，例如门型環柱狀和 主機板形成门狀之導流裝置，以门型和L型為最佳。 本發明之散熱機構，其包括： 一散熱裝置，用以和熱源直接或間接接觸； 一送氣裝置，用以送出氣流，協助去除該散熱裝置蓄 積的熱量； 其特徵在於：其進一步含一導流裝置，該導流裝置實 質上外罩於該散熱裝置及該送氣裝置外圍，用以使該送氣 裝置之氣流循該導流裝置之導流方向，將該散熱裝置蓄積 的熱量帶走。 上述之散熱裝置及導流裝置均如前述。 上述之送氣裝置，其又為任意習知之風扇，例如冷氣、 風扇等等，以風扇為較佳，如風扇配合導熱片其效果更佳 可以帶走北橋晶片所產生的部份或全部熱量，並由該風扇 之送氣口，將風扇產生之氣流吹向該散熱裝置。 上述之散熱裝置均如前述。 本發明散熱機構亦可為： 一散熱鰭片，用以和熱源直接或間接接觸； 一送氣裝置，用以送出氣流，協助去除該散熱鰭片蓄 積的熱量； 其特徵在：該散熱鰭片和送氣裝置係成分離式，該散 熱鰭片之鰭片實質為一平行鰭片，該送氣裝置具有單一送 氣口，且該送氣口之送氣方向實質上和該散熱鰭片中鰭片 1305879 間的‘m，實質為同向或平行。 太：ί! 欠熱鰭片、送氣裝置均如前述。 ^明散熱機構亦可為： -：以和—主要熱源直接或間接接觸； 協助去裝=積源直接或間— 裝置Πί和；，且該送氣 源直接朗 裝置，威斜齡置和該次要熱 上述之散熱裝置、送氣裝置均如前述。 【實施方式】 租參閱第二圖、第三圖、第四圖、第五圖及第六圖， 本發明係提供一種電腦散熱結構，尤指一種設置於電腦主 機1 0内部之主機板1 1上，可用以同時協助二熱源工 2、1 3散熱之電腦散熱機構2 〇，其中之主要熱源工2 係為如中央處理器（CPU)等熱源，次要熱源i 3係為 如北橋（North Bridge)晶片組等熱源’該次要熱源丄3產 生的溫度較主要熱源12產生的溫度為低。 該電腦散熱結構2 0包括有一散熱裝置2 1及一送氣 裝置2 2，其中之散熱裝置2 1可為銘擠型、壓鑄型及摺 疊型等型式，該散熱裝置21之型式並不限制，該散熱裝 置2 1係以銅或鋁等熱傳導良好的材料所製成，該散熱裴 置2 1係具有一本體2 3 ’該本體2 3上連接複數個鰭片 2 4，且該等鰭片2 4之間形成有鰭槽2 5，以便於空氣 的流動。該散熱裝置2 1之本體2 3底面係接合於主要熱 1305879 源1 2表面上。另亦可設置有適當的扣具2 6，用以將該 散，裝置2 1穩定的扣壓貼附於該主要熱源i 2表面上，Λ 可藉該散熱裝置2 1協助該主要熱源i 2散熱。 送氣裝置2 2係設置於散熱裝置2 i旁側且與該些韓 片24成同向或平行，該送氣裝置22包括有—下H 7、一上蓋2 8及一扇葉體2 9，其中之下蓋2 γ係以銅 或鋁等熱傳導良好的金屬材料所製成，該上蓋2 8的材料 則不限制，可為金屬或塑膠等材料所製成，該上蓋2 8係 設置於該下蓋2 7上方，並將該下蓋2 7及該上蓋2 8利 ，卡合或螺絲鎖固等固接方式結合為一體，使其^成一送 氣裝置的外殼4 0，該外殼4 0頂部（即上蓋2 8頂部）' 係具有一進風口 3 0，該外殼4 0—側（即下蓋2 7與上 蓋2 8—侧）係具有一突出之出風口 3丄，該外殼4〇'内 部係具有一容置室3 2，該容置室3 2係與該進風口 3 〇 及該出風口 3 1相通。該送氣裝置2 2之下蓋2 7底面係 接合於次要熱源1 3表面上，且該送氣裝置2 2之下蓋2 7係適當固定於該主機板1 1上，並令該出風口 3 1外側 與該散熱裝置2 1之散熱方向成同向或平行。 扇葉體2 9係樞設於該外殼4 0之容置室3 2内部， 且於該扇葉體2 9與外殼4 0間設有適當的馬達（圖略）， 可控制驅動扇葉體2 9作一運轉’該扇葉體2 9運轉時由 進風口 3 0吸入空氣，並由出風口31排出空氣，使該送 氣裝置2 2形成一側吹式風扇；一導流裝置5 0外罩於該 散熱裝置2 1與該送氣裝置2 2之外圍使送氣裝置2 2 = 氣流循該導流裝置5 0之導流方向將散熱裝置2 1蓄積的 1305879 熱旎排出，藉由上述之組成以形成本發明之散熱結構。 本發明之散熱結構可裝設於電腦主機i 〇内部，並人 散熱裝置21及送氣裝置2 2採分離式設計，使該散熱^ 置2 1及該送氣裝置2 2分別貼附於主要熱源丄2及次要 熱源1 3。北橋晶片組等發熱量較低的次要熱源1 3運作 時所產生之熱量可傳遞至送氣裝置2 2之下蓋2 7，並_ 由扇葉體2 9的運轉，由送氣裝置2 2之殼體4 〇頂部^ 進風口 3 0引進冷空氣，並由送氣裝置2 2之殼體4 〇_ 侧的出風口 3 1將溫空氣送出，俾對次要熱3進行 熱。 該中央處理器荨主要熱源12運作時所產生之熱量可 傳遞至散熱裝置2 1，該散熱裝置2 1係具有複數個鰭片 2 4，可增加散熱面積，以因應發熱量較高之主要熱源工 2，增加其散熱效率，且由殼體4 〇 —側之出風口 3丄送 出的溫空氣可對置於出風口 3 1外側處溫度較高的主要熱 源1 2及散熱裝置2 1進行散熱，且由殼體4 〇之出風口 ^1送出的溫空氣可穿過鰭槽2 5，而後將熱空氣經由電 腦主機1 〇之機殼1 4侧面上所預設相對之排氣口 1 5排 出於外部，該排氣口 i 5的形狀並不限制，可依需要而 當的變化。 产另，該電腦主機10之機殼14上亦可設有適當的進 氣口 1 6 ’以便將冷空氣吸入電腦主機1 〇内部，該進氣 =1 6的开^狀並不限制，可依需要而適當的變化，且該進 1 6上亦可設置有另一風扇（圖略），強制將外部的冷 空氣吸入’以具有較佳的空氣對流效果。 12 1305879 本發明之送氣裝置2 2的下蓋2 7本身具有導熱散熱 效果，且該送氣裝置2 2係採側吹方式散熱，會產生的風 塵較小，使熱量可迅速的排出，以獲得較佳的散熱效率， 發揮較大散熱能力，且本發明之電腦散熱結構係採分離式 設計，能同時針對二個熱源1 2、1 3進行散熱，俾獲得 更佳的散熱效率，且其結構簡單，不會造成製造成本的增 加及佔用較大的空間。 再者，本發明之送氣裝置2 2係設置於散熱裝置2 1 旁側，使得整個散熱機構2 0的高度得以降低，故尤適用 於具有高度限制的電腦。 另，本發明可將滯留於電腦主機内部中央處理器及北 橋晶片組等熱源產生之高溫空氣從電腦主機側面確實的排 出外部，且可由進氣口1 6將外部冷空氣吸入電腦主機1 0内部，具有較佳的空氣對流效果。 又，一導流裝置5 0外罩於該散熱裝置2 1與該送氣裝置 2 2之外圍使送氣裝置2 2之氣流循該導流裝置5 0之導 流方向將散熱裝置2 1蓄積的熱能排出用以改善電腦主機 内散熱不佳之缺失，俾獲得更佳的散熱效率。 13 1305879 【圖式簡單說明】 第一圖係習知散熱結構之立體分解圖； 第二圖係本發明之立體分解圖； 第三圖係本發明之立體組合圖； 第四圖係本發明另一角度之立體組合圖； 第五圖係本發明之俯視圖； 第六圖係本發明之導流裝置。 【主要元件符號說明】 10 a 散熱器 11 a 本體 12 3 縛片 2 0 a 風扇 2 1 a 螺絲 3 0 a 熱源 10 電腦主機 11 主機板 12 主要熱源 13 次要熱源 14 機殼 15 排氣口 16 進氣口 2 0 電腦散熱機構 2 1 散熱裝置 2 2 送氣裝置 2 3 本體 14 籍片 鰭槽 扣具 下蓋 上蓋 扇葉體 進風口 出風口 容置室 外殼 導流裝置 151305879 IX. Description of the Invention: [Technical Field] The present invention relates to a method for dissipating heat of a computer mainframe, and a heat dissipating mechanism, which is directed to a method for dissipating heat of a computer main board by using a guiding device to guide a direction of heat dissipating flow, and a method The computer host uses a heat dissipation mechanism. [Prior Art] With the rapid upgrade of the computer industry, the computer has more powerful computing power, and the operating speed of the central processing unit (CPU) and the chipset is also increasing, and the heat generated by the central processing unit and the chipset is also Increasingly, in order to maintain the heat source of the central processing unit and the chipset to operate normally at the permissible temperature, a variety of heat sinks with increased heat dissipation area are designed to cope with the heat source with higher heat generation. The conventional computer radiators are mainly aluminum extrusion type, die-casting type and folding type. The manufacture of aluminum extrusion type and die-casting type heat sinks is limited by the machining ability, and the density (the total heat dissipation area per unit volume) is limited. Therefore, the heat source for increasing heat generation is increased in volume and weight, and the folded heat sink is continuously stacked by using metal sheets as fins, and the heat dissipation efficiency is higher, so heat dissipation efficiency is better, and Volume and weight are also more easily accepted by the industry. In order to achieve better heat dissipation efficiency of the heat sink, a fan can be generally coupled to the heat sink for assisting heat dissipation. The fan is fixed to the heat sink by a suitable fixing structure. When the fan is driven, the surrounding cold air can be blown to the heat sink to assist in heat dissipation, thereby forming a heat dissipation structure with better heat dissipation. Referring to the first figure, the conventional computer heat dissipation structure includes a heat dissipation 1305879 device 10 a and a fan 20 a, wherein the heat sink 1 〇a is made of a material such as copper or aluminum. The 0a has a body 1 1 a, and the body 1 1 a is connected to a plurality of fins 1 2 a. The bottom surface of the body 1 1 a of the heat sink 1 可 a can be bonded to a surface of a heat source 30 a such as a central processing unit to assist heat dissipation. The fan 20a is fixed to the heat sink 110a by a screw 2 1 a. When the fan 20 a is driven, the upper cold air can be blown downward to the radiator 10 a, Used to assist the heat sink 1 〇a to dissipate heat. However, in the conventional heat dissipation structure, the fan is cooled by the blowing method, and the generated wind pressure is large, so that the heat cannot be quickly discharged, so that it is difficult to obtain a better heat dissipation efficiency and a large heat dissipation capability cannot be exerted. Furthermore, the conventional heat dissipation structure can only dissipate heat for a single heat source, and cannot dissipate heat for two heat sources at the same time. However, a general computer has a central processing unit (CPU) and a North Bridge chip set, and the like. If the heat source only dissipates heat for a single heat source, the heat generated by the other heat source will still have a bad influence on the computer. If the heat dissipation structure is separately set for the two heat sources, the manufacturing cost is increased and a large space is required. In addition, in the above-mentioned conventional heat dissipating structure, the fan is fixed on the heat sink, so that the entire heat dissipating structure has a high height, and thus it is difficult to apply to a computer having a height limitation. Moreover, in the above-mentioned conventional heat dissipation structure, since most of the high temperature of the fan blows is still retained in the computer main body, even if the air is driven by the fan to dissipate heat to the central processing unit, the high temperature air inside the computer is bound to reduce the heat dissipation effect, and It will cause the fan to operate continuously and consume more power. 1305879 In addition, in the Republic of China patent TW4 9 Completion No. 27, it reveals that there is also a wind σ device on the closed side, which can blow the direction of the flow to the heat sink of the die, but the air outlet is not single. - the direction without the flow guiding device of the present invention can improve the effect of heat dissipation, and in the U.S. Patent No. 2,002/0071250, the disclosure discloses a side-blown wind deflector parallel heat sink but its fan structure is a complex diversion # Therefore, the inventor's cooling fan is not the same. Therefore, it can be seen from the above that the conventional computer heat dissipating structure is obviously inconvenient and lacking in actual use, and can be improved. In view of this, the present inventors have felt that the above-mentioned deficiencies can be improved, and that the combination of ethic and nine is combined with the application of the theory, and finally the present invention which is rationally designed and has a sister to improve the above-mentioned defects is finally proposed. SUMMARY OF THE INVENTION A computer (four) of the present invention is provided with a computer host heat dissipating material, which is partially or wholly (four) to dissipate the cpu to generate a hot smear, to take away the north fj, and at the north bridge. The wafer is provided with some or all of the heat generating means generated by the air supply means. The airflow generated by the air supply device is blown toward the other object of the invention. The side nesting method is to provide a kind of heat dissipating mechanism, and the air blowing fan can discharge the wind which is generated by the #二血. The pressure is small, so that the heat can quickly exert a large heat dissipation capability in the invention--heat dissipation efficiency. The separation design can provide the same heat dissipation mechanism, the heat dissipation efficiency of the system, and: f For the heat dissipation of the two heat sources, the increase in manufacturing cost is achieved, and the larger the space of 1305879 is not required. Another object of the present invention is that a gas supply system is disposed in the scatter_fA, The political heat institution, which is back to the heart of the seven music - text", the side of the side and the heat dissipation direction of the heat sink is applied to the second right library so that the height of the entire heat dissipation mechanism can be reduced ', so the simplified ^ ~ limited computer' The computer products can be made light and thin, and the m is available - a computer cooling mechanism, == the high temperature generated by the internal CPU of the host is better. 0 " 'All (4)^=.,,,襄The CPU is generated The heat part or i is set; at the same time, set on the north bridge wafer - air supply 襄 ΐ ί ί ί ί ί ί ί ί ί The airflow generated by the air supply device is blown toward the heat dissipation device. The air supply device and the heat dissipation device are provided with a guide #== direction of the air flow, the guiding direction and the air supply C. The 0 κ shell is connected in a parallel direction, and the heat sink of the heat sink in the air supply side can be used as a heat sink for any computer, such as a type, a _ type, and a folded type, to make a flat The air supply device can be a fan for any computer mainframe, and the gamma-blower fan is preferred, and the air-supply fan is used to force the side of the single air supply port of the air supply device and the parallel fin. The direction of the fin slots 1305879 between the sheets is substantially the same direction or parallel, preferably in the same direction or in parallel. The above-mentioned flow guiding device may form substantially one or more notches for any conventional ring column or surrounding environment. The ring-shaped column, for example, the door-shaped ring-shaped column and the main plate form a gate-like flow guiding device, and the door type and the L-shape are optimal. The heat dissipating mechanism of the present invention comprises: a heat dissipating device for directly or with a heat source Indirect contact; a gas supply device for sending out airflow to assist in removing heat accumulated by the heat dissipation device; and further characterized by: further comprising: a flow guiding device substantially covering the heat dissipation device and the periphery of the air supply device Used to make The airflow of the air supply device follows the direction of the flow of the flow guiding device, and the heat accumulated by the heat sink is removed. The heat sink and the flow guiding device are as described above. The airing device is any conventional fan, for example. For air conditioners, fans, etc., it is better to use a fan. For example, if the fan is combined with a heat-conducting sheet, the effect is better, and some or all of the heat generated by the north bridge chip can be taken away, and the airflow generated by the fan is blown toward the air outlet of the fan. The heat dissipating device is as described above. The heat dissipating mechanism of the present invention may also be: a heat dissipating fin for directly or indirectly contacting the heat source; and a gas supply device for sending out the air flow to assist in removing the heat sink fin accumulation The heat is characterized in that: the heat dissipating fin and the air supply device are separated, the fin of the heat dissipating fin is substantially a parallel fin, the air supply device has a single air supply port, and the air supply direction of the air supply port is substantially And the 'm between the fins 1305879 in the heat sink fins are substantially in the same direction or parallel. Too: ί! The underheat fins and the air supply device are as described above. Can be: -: directly or indirectly contact with the main heat source; assist in the installation = direct source or inter-device - Πί and; and the gas supply source is directly installed, the slanting age and the secondary heat The device and the air supply device are as described above. [Embodiment] Referring to the second, third, fourth, fifth and sixth figures, the present invention provides a computer heat dissipation structure, especially a computer host. 1 0 The internal motherboard 1 1 can be used to assist the two heat source 2, 1 3 heat dissipation computer cooling mechanism 2, wherein the main heat source 2 is a heat source such as a central processing unit (CPU), secondary heat source The i 3 system is a heat source such as a North Bridge chipset. The secondary heat source 丄3 generates a temperature lower than that generated by the main heat source 12. The computer heat dissipation structure 20 includes a heat sink 2 1 and a gas supply device. 2, wherein the heat dissipating device 21 can be of the type of extrusion type, die-casting type and folding type, and the type of the heat dissipating device 21 is not limited, and the heat dissipating device 21 is made of a material with good heat conduction such as copper or aluminum. Cheng, the heat sink 21 system has a body 23 'of the body 24 connected to the plurality of fins 23, these fins and fin 25 is formed between the grooves 24, so that the flow of air. The bottom surface of the body 2 3 of the heat sink 2 1 is bonded to the surface of the main heat 1305879 source 112. A suitable fastening device 2 6 can also be provided for attaching the device 2 1 to the surface of the main heat source i 2 , and the heat dissipation device 2 1 can assist the main heat source i 2 to dissipate heat. . The air supply device 2 is disposed on the side of the heat sink 2 i and is in the same direction or parallel to the Korean pieces 24, and the air supply device 22 includes a lower H 7 , an upper cover 28 and a blade body 2 9 . The lower cover 2 γ is made of a metal material having good heat conduction such as copper or aluminum, and the material of the upper cover 28 is not limited, and may be made of a material such as metal or plastic, and the upper cover 28 is disposed under the cover. The top of the cover 2 7 and the lower cover 27 and the upper cover 28, the snap-fit or the screw-locking and the like are integrated into one body, so that the outer casing 40 of the air supply device is formed. That is, the top cover of the upper cover 28 has an air inlet 30, and the side of the outer casing 40 (ie, the lower cover 27 and the upper cover 28 side) has a protruding air outlet 3丄, and the outer casing 4〇' interior The accommodating chamber 32 has a receiving chamber 32, and the accommodating chamber 32 is connected to the air inlet 3 and the air outlet 31. The bottom surface of the lower cover 27 of the air supply device 2 is coupled to the surface of the secondary heat source 13 , and the lower cover 7 of the air supply device 2 is properly fixed to the motherboard 1 1 , and the air outlet 3 is 1 outside is in the same direction or parallel to the heat dissipation direction of the heat sink 2 1 . The blade body 2 9 is pivotally disposed inside the accommodating chamber 32 of the outer casing 40, and a suitable motor (not shown) is disposed between the blade body 29 and the outer casing 40, and the blade body can be controlled to be driven. 2 9 as a running 'When the blade body 2 9 is in operation, the air is taken in by the air inlet 30, and the air is exhausted from the air outlet 31, so that the air supply device 2 2 forms a side blowing fan; a flow guiding device 50 cover The heat-dissipating device 2 1 and the periphery of the air-sending device 2 2 are configured such that the air-sending device 2 2 = airflow circulates the heat-dissipating device 2 1 in the direction of the flow guiding device 50 to accumulate the heat-dissipating device 2 1 , which is composed of the above-mentioned components The heat dissipation structure of the present invention is formed. The heat dissipating structure of the present invention can be installed inside the computer main body i, and the human heat dissipating device 21 and the air supply device 22 are separated and designed, so that the heat dissipating device 21 and the air supplying device 2 2 are respectively attached to the main heat source. 2 and secondary heat source 1 3. The heat generated by the secondary heat source 13 with a lower heat generation such as the North Bridge chip set can be transferred to the lower cover 2 of the air supply device 2 2 and operated by the blade body 2 9 by the air supply device 2 The casing 4 〇 top ^ air inlet 30 introduces cold air, and the warm air is sent out by the air outlet 31 of the casing 4 〇 _ side of the air supply device 2, and the secondary heat 3 is heated. The heat generated by the central processing unit when the main heat source 12 is operated can be transferred to the heat dissipating device 2 1. The heat dissipating device 2 1 has a plurality of fins 24, which can increase the heat dissipating area to cope with the main heat source with higher heat generation. Working 2, increasing the heat dissipation efficiency, and the warm air sent from the air outlet 3 of the casing 4 side can dissipate heat to the main heat source 12 and the heat sink 2 1 which are placed at the outside of the air outlet 31 And the warm air sent from the air outlet ^1 of the casing 4 can pass through the fin slot 25, and then the hot air is passed through the computer main body 1 to the opposite side of the casing 1 4 to be opposite to the exhaust port 1 5 Exhausted from the outside, the shape of the exhaust port i 5 is not limited, and may be changed as needed. Alternatively, the casing 14 of the computer main body 10 may be provided with an appropriate air inlet 16' to suck cold air into the interior of the computer main body 1 , and the opening of the air intake is not limited. Appropriate changes are made as needed, and another fan (not shown) may be provided on the inlet 16 to force the external cold air to be sucked in to have a better air convection effect. 12 1305879 The lower cover 27 of the air supply device 2 2 of the present invention has a heat-dissipating heat-dissipating effect, and the air-sending device 22 is cooled by the side-blown method, and the generated dust is small, so that the heat can be quickly discharged to obtain a comparison. Good heat dissipation efficiency, great heat dissipation capability, and the computer heat dissipation structure of the invention adopts a separate design, can simultaneously dissipate heat for two heat sources 1 2, 1 3, obtain better heat dissipation efficiency, and has a simple structure It will not cause an increase in manufacturing costs and take up a large space. Further, the air supply device 2 2 of the present invention is disposed on the side of the heat sink 2 1 so that the height of the entire heat dissipating mechanism 20 is lowered, so that it is particularly suitable for a computer having a height restriction. In addition, the present invention can reliably discharge the high-temperature air generated by the heat source such as the central processing unit and the north bridge chipset of the computer main body from the side of the computer main body, and the external cold air can be sucked into the computer main body 10 by the air inlet 16 . It has better air convection effect. Further, a flow guiding device 50 is disposed on the periphery of the heat dissipating device 2 1 and the air supplying device 2 2 such that the air flow of the air supplying device 2 2 discharges the heat energy accumulated in the heat dissipating device 2 according to the guiding direction of the guiding device 50 It is used to improve the lack of heat dissipation in the computer mainframe and to achieve better heat dissipation efficiency. 13 1305879 BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective exploded view of a conventional heat dissipating structure; the second drawing is an exploded perspective view of the present invention; the third drawing is a three-dimensional combination drawing of the present invention; A perspective view of the present invention; a fifth view is a plan view of the present invention; and a sixth view is a flow guide of the present invention. [Main component symbol description] 10 a Heat sink 11 a Body 12 3 Binder 2 0 a Fan 2 1 a Screw 3 0 a Heat source 10 Computer main unit 11 Main board 12 Main heat source 13 Secondary heat source 14 Case 15 Exhaust port 16 Air inlet 2 0 Computer cooling mechanism 2 1 Heat sink 2 2 Air supply unit 2 3 Body 14 Finned fin slot buckle Lower cover Upper cover Fan blade body air inlet venting accommodating chamber Shell deflector 15