CN1412645A - Miniature computer and its radiating method - Google Patents
Miniature computer and its radiating method Download PDFInfo
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- CN1412645A CN1412645A CN 02148967 CN02148967A CN1412645A CN 1412645 A CN1412645 A CN 1412645A CN 02148967 CN02148967 CN 02148967 CN 02148967 A CN02148967 A CN 02148967A CN 1412645 A CN1412645 A CN 1412645A
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- fan
- microminiaturization
- heat
- radiating fin
- motherboard
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a miniature computer, and is characterized by that all the components of computer are rearranged to form miniature computer containing host board, high-speed interface, low-speed interface and input/output interface, and its radiation mechanism adopts the mode of the the radiation device is separated from fan so as to attain the goal of implementing minialurization of computer.
Description
Technical field
The present invention relates to computer and heat dissipating method thereof, refer to a kind of microminiaturization computer that adopts stack machine plate and separate type cooling mechanism especially, and utilize the microminiaturization computer heat radiation method of separate type cooling mechanism and guiding device.
Background technology
Traditional computer adopts the configuration of plane formula monolithic motherboard, therefore the area of plane is big, though the configuration mode that adopts motherboard, low speed interface, high speed interface and I/O interface multi-disc stack machine plate is arranged at present, for example US6229700 number institute of United States Patent (USP) discloses and the applicant complies with the microminiaturization computer that this patent is made.But this microminiaturization computer still has two shortcomings, and one adopts fan and the superimposed traditional type cooling mechanism of radiating fin, and the thickness of stack machine plate is reduced, and promptly volume is relatively large; Its two simple traditional heat-dissipating mechanism that adopts can't solve the heat concentration problem that is caused because of the computer microminiaturization.
Summary of the invention
A purpose of the present invention is to provide a kind of microminiaturization computer.
Another object of the present invention is to provide a kind of microminiaturization computer heat radiation method.
Another purpose of the present invention is to provide a kind of microminiaturization computer that cooperates the separate type cooling mechanism to be constituted by stack machine plate.
A further object of the present invention is to provide a kind of and cooperates guiding device microminiaturization computer by stack machine plate.
Another purpose of the present invention is to provide a kind of microminiaturization computer heat radiation method of utilizing guiding device to cooperate the separate type cooling mechanism.
A further object of the present invention is to provide a kind of and cooperates the microminiaturization computer that guiding device constituted by stack machine plate, separate type cooling mechanism.
For reaching above-mentioned purpose, microminiaturization computer of the present invention, it comprises: a motherboard, a low speed interface, it is connected with this motherboard; One high speed interface, it is connected with this motherboard; One I/O interface, it is connected with this motherboard; One casing is in order to coat this motherboard, low speed interface, high speed interface and I/O interface; Wherein contain on this motherboard: a heat abstractor, in order to motherboard on thermal source directly or indirectly contact; One fan in order to send air-flow, assists to remove the heat that this heat abstractor is accumulated; It is characterized in that:
This microminiaturization computer further contains a guiding device, and this this heat abstractor of guiding device outer cover what and this fan periphery with so that the air-flow of this fan follows the water conservancy diversion direction of this guiding device, are taken away the heat energy that this heat abstractor is accumulated.
Above-mentioned casing, roughly the same general computer chassis, its size becomes according to the size of microminiaturization computer.
Above-mentioned motherboard can be the motherboard that any microminiaturization computer is commonly used, and this motherboard for example can contain parts such as CPU, north bridge wafer set, south bridge wafer set, memory body, USB, 13994, major control device.
Above-mentioned low speed interface for example can contain output ports such as disk drive, printer, keyboard, slide-mouse, audio-visual, wireless interface.
Above-mentioned high speed interface for example can contain output ports such as Hard Disk Drive, TV output, UBS, 13994, sound.
Above-mentioned I/O interface for example can contain output ports such as power supply control, loudspeaker, UBS, 13994, sound.
Above-mentioned heat abstractor can be the heat abstractor that any computer is commonly used, for example aluminium extruded type, die-casting die and the three kinds of fins of type that fold.
Above-mentioned fan can be fan that any host computer commonly uses or fan roughly the same.
Above-mentioned guiding device can be known arbitrarily central column or surrounding enviroment form the central column that has one or more breach in fact, for example ㄇ type cover cap (cooperate motherboard to form and be essentially central column) and motherboard form ㄇ or L type cover cap/(cooperate motherboard and housing side wall, form and be essentially central column).
The above-mentioned cooling mechanism that fan and heat abstractor constituted can be traditional superposed type up and down or separate type, is preferable to adopt separate type.When adopting the separate type cooling mechanism, this heat abstractor is gone up to preferable to be arranged on main thermal source (for example CPU), and this fan is to be located at secondary heat source (for example north bridge wafer) for preferable.In addition, can add a heat-transfer device between this fan and secondary heat source, for example thermal conductive metal plate increases the radiating effect of this secondary heat source.
When adopting the separate type cooling mechanism, this fan is preferable with side-blowing fan, with side-blowing fan with single air taking port for better; And this heat abstractor is preferable to adopt parallel radiating fin.
Moreover, when adopting single air taking port side-blowing fan with parallel radiating fin, this fan air taking port parallel radiating fin direction of direction of supplying gas with this, in fact with the water conservancy diversion direction of this guiding device in the same way or parallel.
The present invention also can be a kind of microminiaturization computer, and it comprises: a motherboard; One low speed interface; One high speed interface; An and I/O interface; Wherein this low speed interface, high speed interface and an I/O interface are connected with this motherboard respectively; Wherein contain on this motherboard: a radiating fin, in order to directly or indirectly to contact with thermal source; One fan in order to send air-flow, assists to remove the heat that this radiating fin is accumulated; It is characterized in that: this radiating fin is into separate type with fan, the fin essence of this radiating fin is parallel radiating fin, this fan has single air taking port, and the parallel fins direction in parallel with this in fact radiating fin of the direction of supplying gas of this air taking port, and essence is in the same way or parallel.
Above-mentioned motherboard, low speed interface, high speed interface, I/O interface, casing, heat abstractor, fan are all as described above.
Above-mentioned microminiaturization computer can further contain a guiding device, and this guiding device also as described above.
The heat dissipating method of microminiaturization computer of the present invention, it comprises: directly or indirectly contact with the secondary heat source of fan with the microminiaturization computer motherboard, and the heat of secondary heat source is taken away by the air taking port of this fan; Main thermal source with parallel fins and microminiaturization computer motherboard directly or indirectly contacts, and takes away all or part of heat that this fan produces by the air-flow of fan air taking port; It is characterized in that:
This fan and this radiating fin adopt separate type, and the parallel fins direction of supply gas direction and this radiating fin of this fan air taking port in fact in the same way or parallel.
Above-mentioned motherboard, radiating fin, fan and guiding device are as described above.
Said machine casing should be established a gas outlet in the water conservancy diversion direction end of this guiding device, in order to strengthen water conservancy diversion and radiating effect.
Because the present invention adopts motherboard, low speed interface, high speed interface and I/O interface multi-disc stack machine plate, so can significantly reduce the motherboard area, add and adopt the separate type cooling mechanism, make the motherboard height reduce half, therefore volume is few more than the traditional electrical brain server, have only half of microminiaturization computer volume that above-mentioned United States Patent (USP) US6229700 patent makes, in addition, adopt guiding device to cooperate the separate type cooling mechanism, solved the heat concentration problem that heat dissipation problem and computer microminiaturization are caused fully.
Description of drawings
Fig. 1, be the three-dimensional exploded view of known microminiaturization computer.
Fig. 2, be three-dimensional exploded view of the present invention.
Fig. 3, be front view of the present invention.
Fig. 4, be rear view of the present invention.
Fig. 5, be right side view of the present invention.
Fig. 6, be left side view of the present invention.
Fig. 7, be vertical view of the present invention.
Fig. 8, be upward view of the present invention.
Embodiment
Referring to Fig. 2-8, a kind of microminiaturization computer, mainly comprise a motherboard 11, a low speed interface 70, a high speed interface 60, casing 14 and an I/O interface 80; Wherein this low speed interface 70, high speed interface 60 and an I/O 80 interfaces are connected with this motherboard 11 respectively; Contain a cooling mechanism 20 on this motherboard 11, especially refer on a kind of motherboard 11 that is arranged on host computer 10 inside, can be in order to assist the computer heat radiation mechanism 20 of two thermals source, 12,13 heat radiations simultaneously, main thermal source 12 wherein is as central processing unit thermals source such as (CPU), secondary heat source 13 is as thermals source such as north bridge (North Bridge) wafer set, and the temperature that the main thermal source 12 of the temperature that this secondary heat source 13 produces produces is low.
This computer heat radiation structure 20, include a heat abstractor 21 and a fan 22, heat abstractor 21 wherein can be patterns such as aluminium extruded type, die-casting die and the type that folds, the pattern of this heat abstractor 21 does not limit, this heat abstractor 21 is made with the good material of heat conduction such as copper or aluminium, and this heat abstractor 21 has a body 23, connects a plurality of fins 24 on this body 23, and be formed with fin groove 25 between these fins 24, so that the what air is mobile.Body 23 bottom surfaces of this heat abstractor 21 are bonded on main thermal source 12 surfaces.In addition also can be provided with suitable fastener 26, in order to these heat abstractor 21 stable withholding are attached on what this main thermal source 12 surfaces, but this heat abstractor 21 of mat assists this main thermal source 12 to dispel the heat.
Flabellum body 29 is hubbed on accommodation chamber 32 inside of this shell 40, and this flabellum body 29 of what and 40 on shell are provided with suitable motor (figure slightly), may command drives flabellum body 29 and does a running, suck air by air inlet 30 during these flabellum body 29 runnings, and, make this fan 22 form a side-blowing fan by air outlet 31 discharge air; One guiding device 50 is outer to cover on the peripheries of heat abstractor 21 and fan 22, and the heat energy that the water conservancy diversion direction that makes the air-flow of fan 22 follow this guiding device 50 is accumulated heat abstractor 21 is discharged, by above-mentioned composition to form radiator structure of the present invention.
Radiator structure of the present invention can be installed in host computer 10 inside, and makes heat abstractor 21 and fan 22 adopt the separate type design, makes this heat abstractor 21 and this fan 22 be attached to main thermal source 12 and secondary heat source 13 respectively.The heat that the secondary heat source 13 that thermal values such as north bridge wafer set are lower is produced when operating can be passed to the lower cover 27 of fan 22, and by the running of flabellum body 29, air inlet 30 by housing 40 tops of fan 22 is introduced cold airs, and by the air outlet 31 of housing 40 1 sides of fan 22 warm air is sent, so that secondary heat source 13 is dispelled the heat.
The heat that main thermal source 12 such as this central processing unit is produced when operating can be passed to heat abstractor 21, this heat abstractor 21 has a plurality of fins 24, can increase area of dissipation, with in response to the higher main thermal source 12 of thermal value, increase its radiating efficiency, and can dispel the heat by higher main thermal source 12 and the heat abstractor 21 of opposed what air outlet 31 outside temperature by the warm air that the air outlet 31 of housing 40 1 sides is sent, and the warm air of being sent by the air outlet 31 of housing 40 can pass fin groove 25, then with hot-air via on casing 14 sides of host computer 10 the relative exhausr port of presetting 15 discharge the what outsides, the shape of this exhausr port 15 does not limit, can be according to need and suitable variation.
In addition, also can be provided with suitable air intake opening 16 on the casing 14 of this host computer 10, so that cold air is sucked host computer 10 inside, the shape of this air intake opening 16 does not limit, can be according to need and suitable variation, and also can be provided with another fan (figure slightly) on this air intake opening 16, force the cold air of outside is sucked, to have preferable cross-ventilation effect.
The lower cover 27 of fan 22 of the present invention itself has the heat conduction and heat radiation effect, and this fan 22 adopts the side-blown mode to dispel the heat, the blast that can produce is less, heat can be discharged rapidly, to obtain preferable radiating efficiency, the big heat-sinking capability of performance, and computer heat radiation structure of the present invention adopts the separate type design, can dispel the heat at two thermals source 12,13 simultaneously, to obtain better radiating efficiency, and it is simple in structure, can not cause the increase of manufacturing cost and take bigger space.
Moreover fan 22 of the present invention is arranged on heat abstractor 21 sides, makes the height of entire heat dissipation mechanism 20 be minimized, so be suitable for the computer that what has limitation in height.
In addition, the present invention can will be trapped in the high temperature air discharge outside certain from the host computer side that thermals source such as host computer central interior processor and north bridge wafer set produce, and can cool exterior air be sucked host computer 10 inside by air intake opening 16, have preferable cross-ventilation effect.
Again, the heat energy that the water conservancy diversion direction that the periphery of this heat abstractor 21 of one guiding device, 50 outer cover whats and this fan 22 makes the air-flow of fan 22 follow this guiding device 50 is accumulated heat abstractor 21 is discharged, in order to improve the disappearance of poor heat radiation in the host computer, to obtain better radiating efficiency.
Claims (15)
1, a kind of microminiaturization computer, it comprises: a motherboard; One low speed interface, it is connected with this motherboard; One high speed interface, it is connected with this motherboard; One I/O interface, it is connected with this motherboard; One casing is in order to coat this motherboard, low speed interface, high speed interface and I/O interface; Wherein contain on this motherboard: a heat abstractor, in order to motherboard on thermal source directly or indirectly contact; One fan in order to send air-flow, assists to remove the heat that this heat abstractor is accumulated; It is characterized in that:
This microminiaturization computer further contains a guiding device, and this this heat abstractor of guiding device outer cover what and this fan periphery with so that the air-flow of this fan follows the water conservancy diversion direction of this guiding device, are taken away the heat energy that this heat abstractor is accumulated.
2, microminiaturization computer according to claim 1 is characterized in that: this heat abstractor and fan are separate type, and this heat abstractor is arranged on the main thermal source, and this fan is arranged on the secondary heat source.
3, microminiaturization computer according to claim 2 is characterized in that: this heat abstractor is a radiating fin; This fan is a side-blowing fan, and this fan has an air intake opening and single air taking port.
4, microminiaturization computer according to claim 3 is characterized in that: this radiating fin is parallel radiating fin, and this parallel fins parallel direction and the single air taking port of this fan direction of supplying gas, and the water conservancy diversion direction of this guiding device in the same way or parallel.
5, according to claim 1,2,3 or 4 one of described microminiaturization computers, it is characterized in that: this guiding device is ㄇ type cover cap or L type cover cap.
6, a kind of microminiaturization computer, it comprises: a motherboard, a low speed interface, a high speed interface, an and I/O interface; Wherein this low speed interface, high speed interface and an I/O interface are connected with this motherboard respectively; Contain on this motherboard: a radiating fin, in order to directly or indirectly to contact with thermal source; One fan in order to send air-flow, assists to remove the heat that this radiating fin is accumulated; It is characterized in that:
This radiating fin and fan are separate type, and the fin of this radiating fin is a parallel fins, and this fan has single air taking port, and the parallel fins direction in the parallel radiating fin with this of the direction of supplying gas of this air taking port is in the same way or parallel.
7, microminiaturization computer according to claim 6 is characterized in that: this fan directly or indirectly contacts with a less important thermal source, and the thermal source that this radiating fin contacted is main thermal source.
8, microminiaturization computer according to claim 7 is characterized in that: further contain a heat-transfer device between this fan and the secondary heat source.
9, microminiaturization computer according to claim 8 is characterized in that: this radiating fin directly contacts with main thermal source, and this heat-transfer device directly contacts with this secondary heat source.
10, microminiaturization computer according to claim 9, it is characterized in that: it further contains guiding device, this this radiating fin of guiding device outer cover what and this fan periphery make the air-flow of this fan follow the water conservancy diversion direction of this guiding device, and the heat that this radiating fin is accumulated is taken away.
11, microminiaturization computer according to claim 10 is characterized in that: this guiding device is a ㄇ type cover cap or a L type cover cap.
12, a kind of heat dissipating method of microminiaturization computer, it comprises: directly or indirectly contact with the secondary heat source of fan with the microminiaturization computer motherboard, and the heat of secondary heat source is taken away by the air taking port of this fan; Main thermal source with parallel fins and microminiaturization computer motherboard directly or indirectly contacts, and takes away all or part of heat that this fan produces by the air-flow of fan air taking port; It is characterized in that:
This fan and this radiating fin adopt separate type, and the parallel fins direction of supply gas direction and this radiating fin of this fan air taking port is in the same way or parallel.
13, microminiaturization computer according to claim 12 is characterized in that: between this fan and this secondary heat source one heat-transfer device is set, and this radiating fin contacts directly with this main thermal source.
14, microminiaturization computer according to claim 13, it is characterized in that: it further contains a guiding device, in order to the direction of guiding radiating airflow, wherein the water conservancy diversion direction of the parallel fins direction of supply gas direction and this radiating fin of this fan air taking port and this guiding device is identical or parallel.
15, microminiaturization computer according to claim 14 is characterized in that: this guiding device is ㄇ type cover cap or the capable cover cap of L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02148967 CN1412645A (en) | 2002-11-14 | 2002-11-14 | Miniature computer and its radiating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02148967 CN1412645A (en) | 2002-11-14 | 2002-11-14 | Miniature computer and its radiating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1412645A true CN1412645A (en) | 2003-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02148967 Pending CN1412645A (en) | 2002-11-14 | 2002-11-14 | Miniature computer and its radiating method |
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| Country | Link |
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| CN (1) | CN1412645A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466894C (en) * | 2005-07-15 | 2009-03-04 | 撼讯科技股份有限公司 | Auxiliary radiator |
| CN102789272A (en) * | 2011-05-20 | 2012-11-21 | 华擎科技股份有限公司 | Motherboard and electronic device using same |
| CN103188918A (en) * | 2011-12-30 | 2013-07-03 | 英业达股份有限公司 | Electronic device |
-
2002
- 2002-11-14 CN CN 02148967 patent/CN1412645A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466894C (en) * | 2005-07-15 | 2009-03-04 | 撼讯科技股份有限公司 | Auxiliary radiator |
| CN102789272A (en) * | 2011-05-20 | 2012-11-21 | 华擎科技股份有限公司 | Motherboard and electronic device using same |
| CN103188918A (en) * | 2011-12-30 | 2013-07-03 | 英业达股份有限公司 | Electronic device |
| CN103188918B (en) * | 2011-12-30 | 2016-06-01 | 英业达股份有限公司 | Electronic installation |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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