CN2713533Y

CN2713533Y - Radiating device for micro-computer

Info

Publication number: CN2713533Y
Application number: CN 200420066836
Authority: CN
Inventors: 郑万成
Original assignee: QINGANG ZIXUN CO Ltd
Current assignee: QINGANG ZIXUN CO Ltd
Priority date: 2004-06-11
Filing date: 2004-06-11
Publication date: 2005-07-27
Anticipated expiration: 2014-06-11

Abstract

The utility model relates to a radiating device for micro-computers, which is installed in a micro-computer body composed of a host module and a cartridge. The host module is provided with at least one radiator on a central processing unit, wherein, the cartridge is made from materials having good heat conduction performance. The external surface of the cartridge is provided with a plurality of radiation fins, and the internal surface of the cartridge is contacted with the top surface of the radiator. Thus, the utility model without setting a fan inside can transfer the heat generated from working from the radiator to the cartridge, and then the heat can be sent out by a plurality of radiation fins on the external surface of the cartridge.

Description

The microcomputer heat abstractor

Technical field

The utility model relates to the microcomputer heat abstractor, refers to that especially a kind of heating radiator that utilizes host module is contacted with the casket shell with a plurality of radiating fins and dispels the heat, to promote the microcomputer heat abstractor of radiating efficiency.

Background technology

Under science and technology is constantly brought forth new ideas development now, computing machine almost becomes indispensable helper in people's life, and computer product and interfacing equipment thereof are also more done littler, and the design concept that is easy to carry about with one to not taking up space development, under so strict requirement, its internal host plate and be arranged on that electronic component on the motherboard is also corresponding more to be done forr a short time and is arranged in also crypto set more of mode on the motherboard, and multidirectional thin, light, little direction develops.

For example: I have obtained patent, No. the 91207211st, Taiwan patent, and " micro-mainframe computer " comprises a casket shell, a motherboard, a switching circuit board, a bracing frame and hard disk of being arranged in pairs or groups and CD-ROM drive; Wherein, this casket shell, be provided with a CD-ROM drive and release the perforate of mouth and a plurality of each connector of respective hosts front edge of board, and a movable cover plate is set at least overleaf, and cover plate is provided with perforate and a plurality of vent port of several each connectors of respective hosts plate rear end, and the setting of vent port is in order to satisfy microminiaturized main frame framework needs, so that utilize the radiator fan forced heat radiation, and the guiding heat is by each vent port discharge, so can improve its radiating efficiency.

Therefore, commonly use all installing one fans on radiating fin of micro-mainframe computer, by the fan forced heat radiation, and the guiding heat is by default vent port discharge on the casing, to improve its radiating efficiency.

But, the above-mentioned micro-mainframe computer fan that on radiating fin, locks of commonly using, make the thickness of microcomputer casing must add the thickness of fan greater than radiating fin, therefore, the thickness of micro-mainframe computer plate is restricted, cause the gross thickness of commonly using microcomputer to seem blocked up, and can't reach ultra-thin ideal state.

Summary of the invention

Fundamental purpose of the present utility model, be to provide a kind of have the casket shell of a plurality of radiating fins and the heating radiator that inside surface directly contacts with host module thereof, fan need not be installed, directly the heat that is produced in the absorption work dispels the heat, and can reduce cost, promote the microcomputer heat abstractor of radiating efficiency.

A kind of microcomputer heat abstractor is installed in the micro-mainframe computer of being made up of host module and casket shell, to being less than a heating radiator is set on the central processing unit in this host module, it is characterized in that:

This casket shell is made by the good material of heat conductivity, and its outside surface is provided with a plurality of radiating fins, and this casket shell inside surface contacts with the heating radiator end face.Wherein:

Described heating radiator apical side height is higher than the height of other assembly in the host module.

Described radiating fin is thin lengthy motion picture shape, and parallel interval is arranged on the casket shell outside surface.

Advantage of the present utility model is:

1, because the heating radiator end face is direct and the casket shell joint touches, has better heat radiating effect,, can relatively significantly reduce cost so need not to install fan.

2, because casket shell outside surface is provided with a plurality of radiating fins, area of dissipation is significantly increased, so can significantly promote radiating efficiency and effect.

3, owing to need not to install fan, can make the volume of micro-mainframe computer become smaller and more exquisite, more frivolous.

Description of drawings

Fig. 1, be three-dimensional exploded view of the present utility model.

Fig. 2, be the cut-open view of the utility model casket shell.

Fig. 3, be cut-open view of the present utility model.

Embodiment

For to structure of the present utility model, feature and effect thereof, can have and further understand and be familiar with, lift a preferred embodiment now, and conjunction with figs. is described in detail as follows:

Shown in Fig. 1-3, a kind of microcomputer heat abstractor, be installed in the micro-mainframe computer of forming by host module 1 and casket shell 2, an opening 22 that supplies host module 1 to insert is offered in these casket shell 2 one sides, and a heating radiator 11 is set on central processing unit (CPU) in this host module 1 at least; Around this casket shell 2 on the outside surface parallel interval be provided with a plurality of radiating fins 21 (as shown in Figure 2), each radiating fin 21 is thin lengthy motion picture shape, this casket shell 2 is made by the good material of heat conductivity, these casket shell 2 inside surfaces contact (as shown in Figure 3) with the end face of heating radiator 11, and these heating radiator 11 apical side heights are greater than the height of other assembly in the host module 1.

Therefore, the heat that is produced in micro-mainframe computer module 1 (mainly the being CPU) work is directly absorbed by the heating radiator on the host module 1 11, and be passed to casket shell 2, radiating fin 21 by casket shell 2 outside surfaces dispels the heat again, so fan need not be installed can discharge the heat that produces in the work, not only can reduce cost, also can simplify space in the main frame, make micro-mainframe computer more frivolous.

Because the outside surface parallel interval is covered with a plurality of radiating fins 21 around the casket shell 2, cooling surface area is increased greatly, so can significantly promote radiating efficiency again.

In addition, the utility model casket shell 2 is not the outside surface parallel interval to be covered with a plurality of radiating fins 21 around casket shell 2, also can with a outside surface that heating radiator 11 contacts on parallel interval a plurality of radiating fins 21 are set, so casket shell 2 can be according to actual demand, a plurality of radiating fins 21 only are set, and the shape of each radiating fin 21 and arrangement mode also can the different variations according to different demands on a side or the outside surface more than the side.

The above only is preferred embodiment of the present utility model; be not to limit practical range of the present utility model with this; such as those who are familiar with this art; use principle of the present utility model and technical characterictic; various changes and the decoration done all should be covered by within the category that these claims protect.

Claims

1, a kind of microcomputer heat abstractor is installed in the micro-mainframe computer of being made up of host module and casket shell, to being less than a heating radiator is set on the central processing unit in this host module, it is characterized in that:

This casket shell is made by the good material of heat conductivity, and its outside surface is provided with a plurality of radiating fins, and this casket shell inside surface contacts with the heating radiator end face.

2, microcomputer heat abstractor according to claim 1 is characterized in that: described heating radiator apical side height is higher than the height of other assembly in the host module.

3, microcomputer heat abstractor according to claim 1 is characterized in that: described radiating fin is thin lengthy motion picture shape, and parallel interval is arranged on the casket shell outside surface.